JP7385483B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP7385483B2 JP7385483B2 JP2020011131A JP2020011131A JP7385483B2 JP 7385483 B2 JP7385483 B2 JP 7385483B2 JP 2020011131 A JP2020011131 A JP 2020011131A JP 2020011131 A JP2020011131 A JP 2020011131A JP 7385483 B2 JP7385483 B2 JP 7385483B2
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Description
図1は、第1実施形態による半導体装置1の構成を示す断面図である。半導体装置1は、配線基板11と、接着層21と、半導体チップCH1と、ワイヤW1と、接着層22と、樹脂23と、金属バンプBと、を備える。
図6は、第2実施形態による半導体装置1の構成を示す断面図である。第2実施形態は、半導体チップCH2が設けられる点で、第1実施形態と異なる。
なお、第1、第2実施形態において接着層21にフィルムではなく、液状またはペースト状の接着層21を使用することができる。このときの製造方法は、まず、液状またはペースト状の接着層21を配線基板11の基板上面F1上方にポッティング、スクリーン印刷、インクジェット等種々の手法により塗布する。その後、接着層21を介して配線基板11に半導体チップCH1をマウントし、キュアをする。すなわち、基板上面F1に接着層21を設け、接着層21を介して、基板上面F1に対向するように半導体チップCH1のチップ下面F2を基板上面F1上に設ける。このように液状またはペースト状の接着層21を使用しても隙間24、25に接着層22を分離させることが可能であり、第1、第2実施形態と同様の効果を得ることができる。
Claims (8)
- 基板と、
前記基板の第1面上方に設けられ、分子量が異なる複数種類の樹脂とフィラーとを含み、前記基板とその一部が直接接触する第1層と、
前記第1層の上方に設けられ、前記第1層と直接接触する第1半導体チップと、
前記基板と前記第1層との間の少なくとも一部の第1領域に設けられ、複数種類の前記樹脂のうち分子量が他の種類の前記樹脂よりも小さい少なくとも1種類の前記樹脂、および、前記第1層よりも低濃度の前記フィラーを含む第2層と、
前記第1層と前記第2層と前記基板とを覆い、前記基板および前記第1層と直接接触する第3層と、を備える、半導体装置。 - 基板と、
前記基板の第1面上方に設けられ、分子量が異なる複数種類の樹脂とフィラーとを含む第1層と、
前記第1層の上方に設けられる第1半導体チップと、
前記基板と前記第1層との間の少なくとも一部の第1領域に設けられ、複数種類の前記樹脂のうち分子量が他の種類の前記樹脂よりも小さい少なくとも1種類の前記樹脂、および、前記第1層よりも低濃度の前記フィラーを含む第2層と、を備え、
前記第2層は、前記基板の凹部と前記第1層との間の第2領域に設けられる、半導体装置。 - 前記基板と前記第1層との間に設けられる第2半導体チップと、
前記基板と前記第2半導体チップとを電気的に接続するワイヤと、をさらに備え、
前記第2層は、前記ワイヤと該ワイヤ下方の前記基板、前記第1層および前記第2半導体チップの少なくとも1つとの間の第3領域に設けられる、請求項1に記載の半導体装置。 - 分子量が異なる複数種類の前記樹脂のうち、分子量の最大値に対する最小値の比率が所定値以下である、請求項1から請求項3のいずれか一項に記載の半導体装置。
- 前記第1層は、アクリルゴムおよびポリイミドの少なくとも1つと、エポキシ樹脂およびフェノール樹脂の少なくとも1つと、を含み、
前記第2層は、エポキシ樹脂およびフェノール樹脂の少なくとも1つを含む、請求項1から請求項4のいずれか一項に記載の半導体装置。 - 基板の第1面に分子量が異なる複数の樹脂とフィラーとを含む第1層を設け、
前記第1層を介して、前記第1面に対向するように第1半導体チップの第2面を前記第1面上に設け、
前記第1層の加圧により、前記基板と前記第1層との間の第1隙間内に、複数種類の前記樹脂のうち分子量が他の種類の前記樹脂よりも小さい少なくとも1種類の前記樹脂、および、前記第1層よりも低濃度の前記フィラーを含む第2層を形成する、ことを具備する、半導体装置の製造方法。 - 前記第1層はフィルムである、請求項6に記載の半導体装置の製造方法。
- 前記第1層は液体である、請求項6に記載の半導体装置の製造方法。
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JP2011071486A (ja) | 2009-08-31 | 2011-04-07 | Nitto Denko Corp | ダイシングシート付き接着フィルム及びその製造方法 |
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