CN1225952C - 填充印刷电路板中的通路盲孔的孔填充方法 - Google Patents

填充印刷电路板中的通路盲孔的孔填充方法 Download PDF

Info

Publication number
CN1225952C
CN1225952C CN02102088.4A CN02102088A CN1225952C CN 1225952 C CN1225952 C CN 1225952C CN 02102088 A CN02102088 A CN 02102088A CN 1225952 C CN1225952 C CN 1225952C
Authority
CN
China
Prior art keywords
hole
board
printed circuit
circuit board
squeegee
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02102088.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN1391431A (zh
Inventor
李圣揆
赵成植
金容一
张容舜
崔浩晟
孔相镇
永焕金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2001-0051853A external-priority patent/KR100425728B1/ko
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of CN1391431A publication Critical patent/CN1391431A/zh
Application granted granted Critical
Publication of CN1225952C publication Critical patent/CN1225952C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN02102088.4A 2001-06-07 2002-01-21 填充印刷电路板中的通路盲孔的孔填充方法 Expired - Fee Related CN1225952C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20010031752 2001-06-07
KR31752/2001 2001-06-07
KR51853/2001 2001-08-27
KR10-2001-0051853A KR100425728B1 (ko) 2001-06-07 2001-08-27 인쇄회로기판의 홀 충진방법 및 그 장치 및인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
CN1391431A CN1391431A (zh) 2003-01-15
CN1225952C true CN1225952C (zh) 2005-11-02

Family

ID=26639129

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02102088.4A Expired - Fee Related CN1225952C (zh) 2001-06-07 2002-01-21 填充印刷电路板中的通路盲孔的孔填充方法

Country Status (4)

Country Link
US (2) US6954985B2 (enExample)
JP (1) JP4505623B2 (enExample)
CN (1) CN1225952C (enExample)
TW (1) TW552832B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103002672A (zh) * 2012-12-04 2013-03-27 南昌欧菲光科技有限公司 一种基材的塞孔装置及其应用
CN110392491A (zh) * 2019-07-26 2019-10-29 生益电子股份有限公司 一种防止盲孔内残留油墨的pcb阻焊制作方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW552832B (en) * 2001-06-07 2003-09-11 Lg Electronics Inc Hole plugging method for printed circuit boards, and hole plugging device
KR100481216B1 (ko) * 2002-06-07 2005-04-08 엘지전자 주식회사 볼 그리드 어레이 패키지 및 그의 제조 방법
JP3690378B2 (ja) * 2002-07-26 2005-08-31 株式会社 日立ディスプレイズ 表示装置
US7231688B2 (en) * 2002-10-18 2007-06-19 Panasonic Corporation Of North America Dirt cup for vacuum cleaner
KR100584965B1 (ko) * 2003-02-24 2006-05-29 삼성전기주식회사 패키지 기판 및 그 제조 방법
US6940209B2 (en) * 2003-09-08 2005-09-06 New Scale Technologies Ultrasonic lead screw motor
US7309943B2 (en) * 2003-09-08 2007-12-18 New Scale Technologies, Inc. Mechanism comprised of ultrasonic lead screw motor
US7608484B2 (en) * 2006-10-31 2009-10-27 Texas Instruments Incorporated Non-pull back pad package with an additional solder standoff
CN101170897B (zh) * 2007-11-21 2010-06-09 健鼎（无锡）电子有限公司 用于安装电子组件的无空洞安装方法
US8405115B2 (en) * 2009-01-28 2013-03-26 Maxim Integrated Products, Inc. Light sensor using wafer-level packaging
JP5419514B2 (ja) * 2009-03-30 2014-02-19 太陽ホールディングス株式会社 穴埋め用樹脂組成物及びこの樹脂組成物を充填したプリント配線板
US20120279774A1 (en) * 2009-11-27 2012-11-08 Bae Systems Plc Circuit board
KR101089923B1 (ko) 2009-12-01 2011-12-05 삼성전기주식회사 인쇄회로기판의 제조방법
CN102036510B (zh) * 2010-12-28 2012-07-04 东莞生益电子有限公司 Pcb板的控深塞孔方法
JP2012142226A (ja) * 2011-01-05 2012-07-26 Fujitsu Component Ltd 伝送コネクタ用の中継基板
CN102162991A (zh) * 2011-04-02 2011-08-24 深南电路有限公司 阻焊曝光底片及线路板制作工艺
US8960934B2 (en) * 2013-04-08 2015-02-24 Samsung Electronics Co., Ltd. Refrigerator and method of manufacturing the same
CN103415164B (zh) * 2013-08-30 2016-04-27 武汉七零九印制板科技有限公司 一种PCB板孔径大于1.0mm过孔油墨塞孔的方法
CN103517564B (zh) * 2013-11-08 2016-04-20 东莞生益电子有限公司 电路板制作中的塞孔方法
CN106550550A (zh) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 一种防焊单面开窗过孔制作方法
TWI626872B (zh) * 2017-01-13 2018-06-11 元鼎音訊股份有限公司 印刷電路板製程之方法及其印刷電路板
CN107413585B (zh) * 2017-08-03 2023-11-10 深圳镭华科技有限公司 一种线路板阻焊剂涂覆装置
CN109803481B (zh) * 2017-11-17 2021-07-06 英业达科技有限公司 多层印刷电路板及制作多层印刷电路板的方法
EP3780916B1 (en) * 2018-04-12 2025-03-05 Fuji Corporation Printed substrate forming method, and printed substrate forming device
CN109257885B (zh) * 2018-10-31 2020-03-27 广州兴森快捷电路科技有限公司 线路板塞孔方法及线路板塞孔设备
TWI865510B (zh) * 2019-03-27 2024-12-11 日商味之素股份有限公司 印刷方法，以及填孔基板及電路基板之製造方法
CN110602894B (zh) * 2019-08-26 2021-07-23 江门崇达电路技术有限公司 一种提高线路板丝印阻焊效率的方法
CN116368262B (zh) 2020-10-20 2026-02-13 三星电子株式会社 包括镀覆有导电构件的外壳体的电子装置及其制造方法
CN113163604B (zh) * 2021-04-21 2023-07-07 深圳市祺利电子有限公司 一种电路板阻焊塞孔制作方法
KR102954725B1 (ko) 2021-09-23 2026-04-21 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506004A (en) * 1982-04-01 1985-03-19 Sullivan Donald F Printed wiring board
JPS61229389A (ja) * 1985-04-03 1986-10-13 イビデン株式会社 セラミツク配線板およびその製造方法
JPS6293999A (ja) 1985-10-19 1987-04-30 大日本スクリ−ン製造株式会社 プリント基板のスル−ホ−ル穴埋め方法
JPH0278293A (ja) * 1988-09-14 1990-03-19 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
JPH02230792A (ja) * 1989-03-03 1990-09-13 Cmk Corp プリント配線板の製造方法におけるソルダランドの形成方法
JPH0349293A (ja) * 1989-07-17 1991-03-04 Toshiba Corp 配線基板用印刷装置
JPH0494592A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールに対する充填材の充填方法
JPH0786727A (ja) 1993-09-20 1995-03-31 Ibiden Co Ltd プリント配線板及びその製造方法
JPH07162132A (ja) 1993-12-07 1995-06-23 Rohm Co Ltd 絶縁層の形成方法
US5591353A (en) * 1994-08-18 1997-01-07 Texas Instruments Incorporated Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method
JPH10215066A (ja) * 1997-01-28 1998-08-11 Ibiden Co Ltd プリント配線板の製造方法
US6272745B1 (en) * 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings
JPH11145592A (ja) 1997-11-11 1999-05-28 Sumitomo Metal Smi Electron Devices Inc 回路基板のスルーホール充填方法
JP2000059010A (ja) * 1998-08-03 2000-02-25 Nippon Carbide Ind Co Inc プリント配線板およびその製造方法
US6276055B1 (en) * 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
JP3577421B2 (ja) * 1999-01-25 2004-10-13 新光電気工業株式会社 半導体装置用パッケージ
JP2000261140A (ja) 1999-03-05 2000-09-22 Ibiden Co Ltd プリント配線板の製造方法
JP2000353878A (ja) 1999-06-11 2000-12-19 Ibiden Co Ltd 充填材印刷用マスクおよびそれを用いたプリント配線板の製造方法
JP4334705B2 (ja) 1999-10-26 2009-09-30 イビデン株式会社 プリント配線板の穴埋め印刷方法およびそのための版
KR100509058B1 (ko) * 2000-04-11 2005-08-18 엘지전자 주식회사 인쇄회로기판의 제조방법
TW552832B (en) * 2001-06-07 2003-09-11 Lg Electronics Inc Hole plugging method for printed circuit boards, and hole plugging device
TW569653B (en) * 2001-07-10 2004-01-01 Fujikura Ltd Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103002672A (zh) * 2012-12-04 2013-03-27 南昌欧菲光科技有限公司 一种基材的塞孔装置及其应用
CN103002672B (zh) * 2012-12-04 2017-07-07 南昌欧菲光科技有限公司 一种基材的塞孔装置及其应用
CN110392491A (zh) * 2019-07-26 2019-10-29 生益电子股份有限公司 一种防止盲孔内残留油墨的pcb阻焊制作方法
CN110392491B (zh) * 2019-07-26 2021-06-04 生益电子股份有限公司 一种防止盲孔内残留油墨的pcb阻焊制作方法

Also Published As

Publication number Publication date
US20040154166A1 (en) 2004-08-12
US20020184757A1 (en) 2002-12-12
CN1391431A (zh) 2003-01-15
JP2002368390A (ja) 2002-12-20
JP4505623B2 (ja) 2010-07-21
TW552832B (en) 2003-09-11
US7337535B2 (en) 2008-03-04
US6954985B2 (en) 2005-10-18

Similar Documents

Publication Publication Date Title
CN1391431A (zh) 印刷电路板的孔填充方法和孔填充设备
JP3177211B2 (ja) プリント配線基板内のホールを充填する方法
CN1189068C (zh) 多层印刷电路板及其制造方法
US8240036B2 (en) Method of producing a circuit board
CN1790684A (zh) 具有窗的球栅阵列基板及其制造方法
KR100645643B1 (ko) 수동소자칩 내장형의 인쇄회로기판의 제조방법
CN1750737A (zh) 其上安装有芯片封装模块的印刷电路板及其制造方法
CN1798479A (zh) 包括嵌入式芯片的印刷电路板及其制造方法
CN1575109A (zh) 形成抗焊剂图形的方法
JPH11121645A (ja) セラミック多層基板及びその製造方法
CN102413641A (zh) 多层型线路板及其制造方法
CN1141570A (zh) 多层印刷电路板及其制造方法
CN1812696A (zh) 制造印刷电路板的方法
CN1825581A (zh) 印刷电路板,倒装芯片球栅阵列板及其制造方法
CN1864254A (zh) 电子器件及其制造方法
CN1933703A (zh) 具有精细图案的印刷电路板及其制造方法
WO2000035260A1 (en) Method of manufacturing ceramic substrate
CN1747630A (zh) 基板制造方法和电路板
CN1505123A (zh) 电路装置的制造方法
CN1364051A (zh) 柔性布线板及其制造方法
KR20040001048A (ko) 인쇄회로기판의 미세회로패턴 제조방법
CN1301048C (zh) 配线基板的制造方法
CN1237855C (zh) 用印刷方式制作电路基板导通孔及线路的方法
JP4089198B2 (ja) 半導体装置用基板の製造方法
CN1968564A (zh) 具有双型内部结构的印刷电路板

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: LG INNOTEK CO., LTD.

Free format text: FORMER OWNER: LG ELECTRONIC CO., LTD.

Effective date: 20100603

C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: Seoul, South Kerean

Patentee after: LG ELECTRONICS Inc.

Address before: Seoul

Patentee before: LG Electronics Inc.

TR01 Transfer of patent right

Effective date of registration: 20100603

Address after: Seoul, South Kerean

Patentee after: LG INNOTEK Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG Electronics Inc.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20051102

Termination date: 20120121