CN1225952C - 填充印刷电路板中的通路盲孔的孔填充方法 - Google Patents
填充印刷电路板中的通路盲孔的孔填充方法 Download PDFInfo
- Publication number
- CN1225952C CN1225952C CN02102088.4A CN02102088A CN1225952C CN 1225952 C CN1225952 C CN 1225952C CN 02102088 A CN02102088 A CN 02102088A CN 1225952 C CN1225952 C CN 1225952C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- blind hole
- hole
- squeegee
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20010031752 | 2001-06-07 | ||
KR31752/2001 | 2001-06-07 | ||
KR10-2001-0051853A KR100425728B1 (ko) | 2001-06-07 | 2001-08-27 | 인쇄회로기판의 홀 충진방법 및 그 장치 및인쇄회로기판의 제조방법 |
KR51853/2001 | 2001-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1391431A CN1391431A (zh) | 2003-01-15 |
CN1225952C true CN1225952C (zh) | 2005-11-02 |
Family
ID=26639129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02102088.4A Expired - Fee Related CN1225952C (zh) | 2001-06-07 | 2002-01-21 | 填充印刷电路板中的通路盲孔的孔填充方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6954985B2 (zh) |
JP (1) | JP4505623B2 (zh) |
CN (1) | CN1225952C (zh) |
TW (1) | TW552832B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103002672A (zh) * | 2012-12-04 | 2013-03-27 | 南昌欧菲光科技有限公司 | 一种基材的塞孔装置及其应用 |
CN110392491A (zh) * | 2019-07-26 | 2019-10-29 | 生益电子股份有限公司 | 一种防止盲孔内残留油墨的pcb阻焊制作方法 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552832B (en) * | 2001-06-07 | 2003-09-11 | Lg Electronics Inc | Hole plugging method for printed circuit boards, and hole plugging device |
KR100481216B1 (ko) * | 2002-06-07 | 2005-04-08 | 엘지전자 주식회사 | 볼 그리드 어레이 패키지 및 그의 제조 방법 |
JP3690378B2 (ja) * | 2002-07-26 | 2005-08-31 | 株式会社 日立ディスプレイズ | 表示装置 |
US7231688B2 (en) * | 2002-10-18 | 2007-06-19 | Panasonic Corporation Of North America | Dirt cup for vacuum cleaner |
KR100584965B1 (ko) * | 2003-02-24 | 2006-05-29 | 삼성전기주식회사 | 패키지 기판 및 그 제조 방법 |
US7309943B2 (en) * | 2003-09-08 | 2007-12-18 | New Scale Technologies, Inc. | Mechanism comprised of ultrasonic lead screw motor |
US6940209B2 (en) * | 2003-09-08 | 2005-09-06 | New Scale Technologies | Ultrasonic lead screw motor |
US7608484B2 (en) * | 2006-10-31 | 2009-10-27 | Texas Instruments Incorporated | Non-pull back pad package with an additional solder standoff |
CN101170897B (zh) * | 2007-11-21 | 2010-06-09 | 健鼎(无锡)电子有限公司 | 用于安装电子组件的无空洞安装方法 |
US8405115B2 (en) * | 2009-01-28 | 2013-03-26 | Maxim Integrated Products, Inc. | Light sensor using wafer-level packaging |
JP5419514B2 (ja) * | 2009-03-30 | 2014-02-19 | 太陽ホールディングス株式会社 | 穴埋め用樹脂組成物及びこの樹脂組成物を充填したプリント配線板 |
US20120279774A1 (en) * | 2009-11-27 | 2012-11-08 | Bae Systems Plc | Circuit board |
KR101089923B1 (ko) | 2009-12-01 | 2011-12-05 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
CN102036510B (zh) * | 2010-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Pcb板的控深塞孔方法 |
JP2012142226A (ja) * | 2011-01-05 | 2012-07-26 | Fujitsu Component Ltd | 伝送コネクタ用の中継基板 |
CN102162991A (zh) * | 2011-04-02 | 2011-08-24 | 深南电路有限公司 | 阻焊曝光底片及线路板制作工艺 |
US8960934B2 (en) * | 2013-04-08 | 2015-02-24 | Samsung Electronics Co., Ltd. | Refrigerator and method of manufacturing the same |
CN103415164B (zh) * | 2013-08-30 | 2016-04-27 | 武汉七零九印制板科技有限公司 | 一种PCB板孔径大于1.0mm过孔油墨塞孔的方法 |
CN103517564B (zh) * | 2013-11-08 | 2016-04-20 | 东莞生益电子有限公司 | 电路板制作中的塞孔方法 |
CN106550550A (zh) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | 一种防焊单面开窗过孔制作方法 |
TWI626872B (zh) * | 2017-01-13 | 2018-06-11 | 元鼎音訊股份有限公司 | 印刷電路板製程之方法及其印刷電路板 |
CN107413585B (zh) * | 2017-08-03 | 2023-11-10 | 深圳镭华科技有限公司 | 一种线路板阻焊剂涂覆装置 |
CN109803481B (zh) * | 2017-11-17 | 2021-07-06 | 英业达科技有限公司 | 多层印刷电路板及制作多层印刷电路板的方法 |
EP3780916A4 (en) | 2018-04-12 | 2021-04-14 | Fuji Corporation | METHOD FOR MANUFACTURING A PRINTED SUBSTRATE AND DEVICE FOR MANUFACTURING A PRINTED SUBSTRATE |
CN109257885B (zh) * | 2018-10-31 | 2020-03-27 | 广州兴森快捷电路科技有限公司 | 线路板塞孔方法及线路板塞孔设备 |
TW202106128A (zh) * | 2019-03-27 | 2021-02-01 | 日商味之素股份有限公司 | 印刷方法,以及填孔基板及電路基板之製造方法 |
CN110602894B (zh) * | 2019-08-26 | 2021-07-23 | 江门崇达电路技术有限公司 | 一种提高线路板丝印阻焊效率的方法 |
CN113163604B (zh) * | 2021-04-21 | 2023-07-07 | 深圳市祺利电子有限公司 | 一种电路板阻焊塞孔制作方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US4506004A (en) * | 1982-04-01 | 1985-03-19 | Sullivan Donald F | Printed wiring board |
JPS61229389A (ja) * | 1985-04-03 | 1986-10-13 | イビデン株式会社 | セラミツク配線板およびその製造方法 |
JPS6293999A (ja) * | 1985-10-19 | 1987-04-30 | 大日本スクリ−ン製造株式会社 | プリント基板のスル−ホ−ル穴埋め方法 |
JPH0278293A (ja) * | 1988-09-14 | 1990-03-19 | Matsushita Electric Ind Co Ltd | プリント配線板の製造方法 |
JPH02230792A (ja) * | 1989-03-03 | 1990-09-13 | Cmk Corp | プリント配線板の製造方法におけるソルダランドの形成方法 |
JPH0349293A (ja) * | 1989-07-17 | 1991-03-04 | Toshiba Corp | 配線基板用印刷装置 |
JPH0494592A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板におけるスルーホールに対する充填材の充填方法 |
JPH0786727A (ja) | 1993-09-20 | 1995-03-31 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JPH07162132A (ja) | 1993-12-07 | 1995-06-23 | Rohm Co Ltd | 絶縁層の形成方法 |
US5591353A (en) * | 1994-08-18 | 1997-01-07 | Texas Instruments Incorporated | Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method |
JPH10215066A (ja) * | 1997-01-28 | 1998-08-11 | Ibiden Co Ltd | プリント配線板の製造方法 |
US6272745B1 (en) * | 1997-03-14 | 2001-08-14 | Photo Print Electronics Gmbh | Methods for the production of printed circuit boards with through-platings |
JPH11145592A (ja) | 1997-11-11 | 1999-05-28 | Sumitomo Metal Smi Electron Devices Inc | 回路基板のスルーホール充填方法 |
JP2000059010A (ja) * | 1998-08-03 | 2000-02-25 | Nippon Carbide Ind Co Inc | プリント配線板およびその製造方法 |
US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
JP3577421B2 (ja) * | 1999-01-25 | 2004-10-13 | 新光電気工業株式会社 | 半導体装置用パッケージ |
JP2000261140A (ja) | 1999-03-05 | 2000-09-22 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2000353878A (ja) | 1999-06-11 | 2000-12-19 | Ibiden Co Ltd | 充填材印刷用マスクおよびそれを用いたプリント配線板の製造方法 |
JP4334705B2 (ja) | 1999-10-26 | 2009-09-30 | イビデン株式会社 | プリント配線板の穴埋め印刷方法およびそのための版 |
KR100509058B1 (ko) * | 2000-04-11 | 2005-08-18 | 엘지전자 주식회사 | 인쇄회로기판의 제조방법 |
TW552832B (en) * | 2001-06-07 | 2003-09-11 | Lg Electronics Inc | Hole plugging method for printed circuit boards, and hole plugging device |
TW569653B (en) * | 2001-07-10 | 2004-01-01 | Fujikura Ltd | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
-
2002
- 2002-01-02 TW TW091100003A patent/TW552832B/zh not_active IP Right Cessation
- 2002-01-14 US US10/043,146 patent/US6954985B2/en not_active Expired - Fee Related
- 2002-01-21 CN CN02102088.4A patent/CN1225952C/zh not_active Expired - Fee Related
- 2002-02-21 JP JP2002045113A patent/JP4505623B2/ja not_active Expired - Fee Related
-
2004
- 2004-02-09 US US10/773,267 patent/US7337535B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103002672A (zh) * | 2012-12-04 | 2013-03-27 | 南昌欧菲光科技有限公司 | 一种基材的塞孔装置及其应用 |
CN103002672B (zh) * | 2012-12-04 | 2017-07-07 | 南昌欧菲光科技有限公司 | 一种基材的塞孔装置及其应用 |
CN110392491A (zh) * | 2019-07-26 | 2019-10-29 | 生益电子股份有限公司 | 一种防止盲孔内残留油墨的pcb阻焊制作方法 |
CN110392491B (zh) * | 2019-07-26 | 2021-06-04 | 生益电子股份有限公司 | 一种防止盲孔内残留油墨的pcb阻焊制作方法 |
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JP4505623B2 (ja) | 2010-07-21 |
US7337535B2 (en) | 2008-03-04 |
CN1391431A (zh) | 2003-01-15 |
TW552832B (en) | 2003-09-11 |
US20020184757A1 (en) | 2002-12-12 |
US6954985B2 (en) | 2005-10-18 |
JP2002368390A (ja) | 2002-12-20 |
US20040154166A1 (en) | 2004-08-12 |
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