CN117712049B - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN117712049B
CN117712049B CN202311773081.4A CN202311773081A CN117712049B CN 117712049 B CN117712049 B CN 117712049B CN 202311773081 A CN202311773081 A CN 202311773081A CN 117712049 B CN117712049 B CN 117712049B
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China
Prior art keywords
conductive
resin
main surface
semiconductor
semiconductor module
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CN202311773081.4A
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Chinese (zh)
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CN117712049A (zh
Inventor
谷川昂平
林健二
福田谅介
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to CN202311773081.4A priority Critical patent/CN117712049B/zh
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    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
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    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202311773081.4A 2020-10-14 2021-09-14 半导体模块 Active CN117712049B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311773081.4A CN117712049B (zh) 2020-10-14 2021-09-14 半导体模块

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Application Number Priority Date Filing Date Title
JP2020-173335 2020-10-14
JP2020173335 2020-10-14
CN202180055785.0A CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块
PCT/JP2021/033676 WO2022080063A1 (ja) 2020-10-14 2021-09-14 半導体モジュール
CN202311773081.4A CN117712049B (zh) 2020-10-14 2021-09-14 半导体模块

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CN202180055785.0A Division CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块

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CN117712049A CN117712049A (zh) 2024-03-15
CN117712049B true CN117712049B (zh) 2024-06-07

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CN202180055785.0A Pending CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块
CN202511152699.8A Pending CN120998881A (zh) 2020-10-14 2021-09-14 半导体模块
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