JP7352754B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP7352754B2
JP7352754B2 JP2022557285A JP2022557285A JP7352754B2 JP 7352754 B2 JP7352754 B2 JP 7352754B2 JP 2022557285 A JP2022557285 A JP 2022557285A JP 2022557285 A JP2022557285 A JP 2022557285A JP 7352754 B2 JP7352754 B2 JP 7352754B2
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Japan
Prior art keywords
conductive
resin
semiconductor element
semiconductor
main surface
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JP2022557285A
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English (en)
Japanese (ja)
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JPWO2022080063A1 (https=
Inventor
昂平 谷川
健二 林
諒介 福田
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Rohm Co Ltd
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Rohm Co Ltd
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Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of JPWO2022080063A1 publication Critical patent/JPWO2022080063A1/ja
Priority to JP2023126991A priority Critical patent/JP7352763B1/ja
Priority to JP2023150336A priority patent/JP7411849B2/ja
Application granted granted Critical
Publication of JP7352754B2 publication Critical patent/JP7352754B2/ja
Priority to JP2023218317A priority patent/JP7708844B2/ja
Priority to JP2025112970A priority patent/JP7731523B1/ja
Priority to JP2025136571A priority patent/JP7757566B1/ja
Priority to JP2025170316A priority patent/JP7776695B1/ja
Priority to JP2025194203A priority patent/JP7795042B1/ja
Priority to JP2025265824A priority patent/JP2026048909A/ja
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
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    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022557285A 2020-10-14 2021-09-14 半導体モジュール Active JP7352754B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2023126991A JP7352763B1 (ja) 2020-10-14 2023-08-03 半導体モジュール
JP2023150336A JP7411849B2 (ja) 2020-10-14 2023-09-15 半導体モジュール
JP2023218317A JP7708844B2 (ja) 2020-10-14 2023-12-25 半導体モジュール
JP2025112970A JP7731523B1 (ja) 2020-10-14 2025-07-03 半導体モジュール
JP2025136571A JP7757566B1 (ja) 2020-10-14 2025-08-19 半導体モジュール
JP2025170316A JP7776695B1 (ja) 2020-10-14 2025-10-08 半導体モジュール
JP2025194203A JP7795042B1 (ja) 2020-10-14 2025-11-13 半導体モジュール
JP2025265824A JP2026048909A (ja) 2020-10-14 2025-12-18 半導体モジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
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