CN118782546A - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN118782546A
CN118782546A CN202410802125.XA CN202410802125A CN118782546A CN 118782546 A CN118782546 A CN 118782546A CN 202410802125 A CN202410802125 A CN 202410802125A CN 118782546 A CN118782546 A CN 118782546A
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CN
China
Prior art keywords
conductive
main surface
semiconductor
resin
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410802125.XA
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English (en)
Chinese (zh)
Inventor
谷川昂平
林健二
福田谅介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118782546A publication Critical patent/CN118782546A/zh
Pending legal-status Critical Current

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    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
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    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/076—Connecting or disconnecting of strap connectors
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W72/641—Dispositions of strap connectors
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202410802125.XA 2020-10-14 2021-09-14 半导体模块 Pending CN118782546A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020173335 2020-10-14
JP2020-173335 2020-10-14
PCT/JP2021/033676 WO2022080063A1 (ja) 2020-10-14 2021-09-14 半導体モジュール
CN202180055785.0A CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块

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Application Number Title Priority Date Filing Date
CN202180055785.0A Division CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块

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CN118782546A true CN118782546A (zh) 2024-10-15

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Application Number Title Priority Date Filing Date
CN202410802125.XA Pending CN118782546A (zh) 2020-10-14 2021-09-14 半导体模块
CN202311044314.7A Active CN116936485B (zh) 2020-10-14 2021-09-14 半导体模块
CN202311044839.0A Active CN116936486B (zh) 2020-10-14 2021-09-14 半导体模块
CN202511152699.8A Pending CN120998881A (zh) 2020-10-14 2021-09-14 半导体模块
CN202311773081.4A Active CN117712049B (zh) 2020-10-14 2021-09-14 半导体模块
CN202511761006.5A Pending CN121532055A (zh) 2020-10-14 2021-09-14 半导体模块
CN202180055785.0A Pending CN116034465A (zh) 2020-10-14 2021-09-14 半导体模块

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