CN1170314C - 聚合物-陶瓷复合电子衬底 - Google Patents
聚合物-陶瓷复合电子衬底 Download PDFInfo
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- CN1170314C CN1170314C CNB011218142A CN01121814A CN1170314C CN 1170314 C CN1170314 C CN 1170314C CN B011218142 A CNB011218142 A CN B011218142A CN 01121814 A CN01121814 A CN 01121814A CN 1170314 C CN1170314 C CN 1170314C
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Landscapes
- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
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- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Optical Integrated Circuits (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
Claims (65)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/606,359 | 2000-06-29 | ||
US09/606,359 US6528145B1 (en) | 2000-06-29 | 2000-06-29 | Polymer and ceramic composite electronic substrates |
Publications (2)
Publication Number | Publication Date |
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CN1330403A CN1330403A (zh) | 2002-01-09 |
CN1170314C true CN1170314C (zh) | 2004-10-06 |
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US (1) | US6528145B1 (zh) |
EP (1) | EP1168436A3 (zh) |
JP (1) | JP3745653B2 (zh) |
KR (1) | KR100462451B1 (zh) |
CN (1) | CN1170314C (zh) |
MY (1) | MY117336A (zh) |
TW (1) | TW515055B (zh) |
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US6613986B1 (en) * | 1998-09-17 | 2003-09-02 | Ibiden Co., Ltd. | Multilayer build-up wiring board |
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US6800815B1 (en) * | 2001-01-16 | 2004-10-05 | National Semiconductor Corporation | Materials and structure for a high reliability bga connection between LTCC and PB boards |
US6656313B2 (en) * | 2001-06-11 | 2003-12-02 | International Business Machines Corporation | Structure and method for improved adhesion between two polymer films |
US6682619B2 (en) * | 2001-07-17 | 2004-01-27 | Sikorsky Aircraft Corporation | Composite pre-preg ply having tailored dielectrical properties and method of fabrication thereof |
US20030137815A1 (en) * | 2002-01-18 | 2003-07-24 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and method of manufacturing the same |
US7714432B2 (en) * | 2002-07-26 | 2010-05-11 | Intel Corporation | Ceramic/organic hybrid substrate |
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KR100483622B1 (ko) * | 2002-08-16 | 2005-04-19 | 삼성전기주식회사 | 광도파로 소자를 인쇄회로기판에 부착하는 방법 |
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JP4426805B2 (ja) * | 2002-11-11 | 2010-03-03 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
TWI234210B (en) * | 2002-12-03 | 2005-06-11 | Sanyo Electric Co | Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet |
KR100451635B1 (ko) * | 2002-12-10 | 2004-10-08 | 삼성전기주식회사 | 섬유 블록과 파이프 블록, 및 이를 이용하여 다층인쇄회로기판의 층간 광신호를 연결하는 방법 |
DE60332278D1 (de) * | 2002-12-25 | 2010-06-02 | Daikin Ind Ltd | Fluorpolymer und zusammensetzung |
DE10302104A1 (de) * | 2003-01-21 | 2004-08-05 | Friwo Gerätebau Gmbh | Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen |
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- 2001-06-21 MY MYPI20012928A patent/MY117336A/en unknown
- 2001-06-26 JP JP2001193284A patent/JP3745653B2/ja not_active Expired - Fee Related
- 2001-06-26 TW TW090115463A patent/TW515055B/zh not_active IP Right Cessation
- 2001-06-28 CN CNB011218142A patent/CN1170314C/zh not_active Expired - Fee Related
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US6528145B1 (en) | 2003-03-04 |
KR100462451B1 (ko) | 2004-12-17 |
TW515055B (en) | 2002-12-21 |
JP2002134926A (ja) | 2002-05-10 |
CN1330403A (zh) | 2002-01-09 |
JP3745653B2 (ja) | 2006-02-15 |
KR20020002216A (ko) | 2002-01-09 |
EP1168436A3 (en) | 2008-11-19 |
MY117336A (en) | 2004-06-30 |
EP1168436A2 (en) | 2002-01-02 |
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