CN114402207A - 检查夹具 - Google Patents

检查夹具 Download PDF

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Publication number
CN114402207A
CN114402207A CN201980100494.1A CN201980100494A CN114402207A CN 114402207 A CN114402207 A CN 114402207A CN 201980100494 A CN201980100494 A CN 201980100494A CN 114402207 A CN114402207 A CN 114402207A
Authority
CN
China
Prior art keywords
inspection
hole
terminal
external connection
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201980100494.1A
Other languages
English (en)
Chinese (zh)
Inventor
冈俊英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN114402207A publication Critical patent/CN114402207A/zh
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2844—Fault-finding or characterising using test interfaces, e.g. adapters, test boxes, switches, PIN drivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201980100494.1A 2019-09-30 2019-09-30 检查夹具 Withdrawn CN114402207A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/038500 WO2021064788A1 (ja) 2019-09-30 2019-09-30 検査治具

Publications (1)

Publication Number Publication Date
CN114402207A true CN114402207A (zh) 2022-04-26

Family

ID=75337763

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980100494.1A Withdrawn CN114402207A (zh) 2019-09-30 2019-09-30 检查夹具

Country Status (7)

Country Link
US (1) US11971320B2 (https=)
JP (2) JPWO2021064788A1 (https=)
KR (1) KR102688319B1 (https=)
CN (1) CN114402207A (https=)
DE (1) DE112019007764T5 (https=)
TW (1) TWI735294B (https=)
WO (1) WO2021064788A1 (https=)

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JPS5997482U (ja) * 1982-12-20 1984-07-02 株式会社フジクラ プリント回路板検査装置
JPS608882U (ja) * 1983-06-29 1985-01-22 富士通株式会社 インサ−キツトテスタ用フイクスチユア
JPH02109262U (https=) * 1989-02-16 1990-08-31
JPH05126891A (ja) * 1991-11-07 1993-05-21 Fujitsu Ltd プリント板の試験方法
JP2004071890A (ja) * 2002-08-07 2004-03-04 Sumitomo Electric Ind Ltd 光モジュール
JP2006190833A (ja) * 2005-01-06 2006-07-20 Fuji Electric Systems Co Ltd 半導体パッケージリード位置合わせ装置及び半導体パッケージリード位置合わせ方法
KR20060121416A (ko) * 2005-05-24 2006-11-29 주식회사 에이디피엔지니어링 기판 검사기 및 기판 검사방법
JP2007109563A (ja) * 2005-10-14 2007-04-26 Sharp Corp フレキシブルプリント基板の誤挿入防止装置及び誤挿入防止方法
CN101113948A (zh) * 2006-07-25 2008-01-30 三得利株式会社 粘接力检查装置及使用该装置的粘接力检查方法
JP2008309540A (ja) * 2007-06-13 2008-12-25 Renesas Technology Corp 半導体チップの検査方法及び検査用治具
CN101625394A (zh) * 2008-07-08 2010-01-13 恩益禧电子股份有限公司 半导体芯片的检查用夹具、检查装置及检查方法、半导体装置的制造方法
CN102053092A (zh) * 2009-10-27 2011-05-11 日东电工株式会社 布线电路基板的检查方法、制造方法和检查装置
JP2011211119A (ja) * 2010-03-30 2011-10-20 Fuji Electric Co Ltd ウェハ搬送装置およびウェハ搬送方法
CN102401874A (zh) * 2010-09-15 2012-04-04 东京毅力科创株式会社 晶片检查用接口和晶片检查装置
CN105074482A (zh) * 2014-03-11 2015-11-18 新东工业株式会社 被测试器件的检查系统及其操作方法
CN207083290U (zh) * 2017-07-26 2018-03-09 深圳市金亿莱科技有限公司 一种真空吸附检查治具
CN108475648A (zh) * 2015-12-17 2018-08-31 东京毅力科创株式会社 晶片检查装置及其维护方法
CN108628105A (zh) * 2017-03-26 2018-10-09 株式会社阿迪泰克工程 基板粘附防止薄膜、台板及基板输送方法

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Publication number Priority date Publication date Assignee Title
JPS53118055U (https=) 1977-02-28 1978-09-20
JPH03173146A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 検査装置
JPH05175633A (ja) 1991-12-24 1993-07-13 Matsushita Electric Works Ltd プリント基板用吸引固定装置
JPH1038970A (ja) * 1996-07-26 1998-02-13 Iwaki Electron Corp Ltd 検査治具および自動検査装置
DE19654404A1 (de) 1996-12-24 1998-06-25 Hewlett Packard Co Adaptationsvorrichtung zum elektrischen Test von Leiterplatten
JP2001296325A (ja) 2000-04-18 2001-10-26 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
JP4412143B2 (ja) * 2004-01-14 2010-02-10 セイコーエプソン株式会社 検査用治具の製造方法
JP2005345271A (ja) * 2004-06-03 2005-12-15 Akita Denshi Systems:Kk 検査ソケット及び半導体装置の製造方法
JP2007198861A (ja) 2006-01-25 2007-08-09 Japan Aviation Electronics Industry Ltd デバイス検査装置
JP2008135209A (ja) * 2006-11-27 2008-06-12 Fujifilm Corp クリップ式コネクタ
KR101192209B1 (ko) * 2008-09-05 2012-10-17 니혼덴산리드가부시키가이샤 기판검사용 검사치구
JP5236506B2 (ja) 2009-01-06 2013-07-17 日置電機株式会社 基板検査装置
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP2011228383A (ja) * 2010-04-16 2011-11-10 Sharp Corp 位置ずれ防止方法並びに装置
KR101838347B1 (ko) * 2012-04-17 2018-04-26 유니테크노 인코퍼레이티드 켈빈 접촉 프로브 및 이를 포함하는 켈빈 검사 지그
JP6553472B2 (ja) 2015-09-30 2019-07-31 株式会社ヨコオ コンタクタ
KR101876966B1 (ko) 2017-01-02 2018-07-11 주식회사디아이 극소형 소자용 번인 테스트기
JP6861580B2 (ja) * 2017-06-05 2021-04-21 東京エレクトロン株式会社 検査装置および検査システム
JP7281250B2 (ja) * 2018-05-11 2023-05-25 株式会社アドバンテスト 試験用キャリア

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997482U (ja) * 1982-12-20 1984-07-02 株式会社フジクラ プリント回路板検査装置
JPS608882U (ja) * 1983-06-29 1985-01-22 富士通株式会社 インサ−キツトテスタ用フイクスチユア
JPH02109262U (https=) * 1989-02-16 1990-08-31
JPH05126891A (ja) * 1991-11-07 1993-05-21 Fujitsu Ltd プリント板の試験方法
JP2004071890A (ja) * 2002-08-07 2004-03-04 Sumitomo Electric Ind Ltd 光モジュール
JP2006190833A (ja) * 2005-01-06 2006-07-20 Fuji Electric Systems Co Ltd 半導体パッケージリード位置合わせ装置及び半導体パッケージリード位置合わせ方法
KR20060121416A (ko) * 2005-05-24 2006-11-29 주식회사 에이디피엔지니어링 기판 검사기 및 기판 검사방법
JP2007109563A (ja) * 2005-10-14 2007-04-26 Sharp Corp フレキシブルプリント基板の誤挿入防止装置及び誤挿入防止方法
CN101113948A (zh) * 2006-07-25 2008-01-30 三得利株式会社 粘接力检查装置及使用该装置的粘接力检查方法
JP2008309540A (ja) * 2007-06-13 2008-12-25 Renesas Technology Corp 半導体チップの検査方法及び検査用治具
CN101625394A (zh) * 2008-07-08 2010-01-13 恩益禧电子股份有限公司 半导体芯片的检查用夹具、检查装置及检查方法、半导体装置的制造方法
CN102053092A (zh) * 2009-10-27 2011-05-11 日东电工株式会社 布线电路基板的检查方法、制造方法和检查装置
JP2011211119A (ja) * 2010-03-30 2011-10-20 Fuji Electric Co Ltd ウェハ搬送装置およびウェハ搬送方法
CN102401874A (zh) * 2010-09-15 2012-04-04 东京毅力科创株式会社 晶片检查用接口和晶片检查装置
CN105074482A (zh) * 2014-03-11 2015-11-18 新东工业株式会社 被测试器件的检查系统及其操作方法
CN108475648A (zh) * 2015-12-17 2018-08-31 东京毅力科创株式会社 晶片检查装置及其维护方法
CN108628105A (zh) * 2017-03-26 2018-10-09 株式会社阿迪泰克工程 基板粘附防止薄膜、台板及基板输送方法
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CN207083290U (zh) * 2017-07-26 2018-03-09 深圳市金亿莱科技有限公司 一种真空吸附检查治具

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Also Published As

Publication number Publication date
TW202115972A (zh) 2021-04-16
KR20220027188A (ko) 2022-03-07
US20220316980A1 (en) 2022-10-06
WO2021064788A1 (ja) 2021-04-08
JPWO2021064788A1 (https=) 2021-04-08
KR102688319B1 (ko) 2024-07-24
JP7364100B2 (ja) 2023-10-18
DE112019007764T5 (de) 2022-06-15
JP2023033418A (ja) 2023-03-10
US11971320B2 (en) 2024-04-30
TWI735294B (zh) 2021-08-01

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Application publication date: 20220426