CN112219455B - 布线电路基板 - Google Patents

布线电路基板

Info

Publication number
CN112219455B
CN112219455B CN201980036057.8A CN201980036057A CN112219455B CN 112219455 B CN112219455 B CN 112219455B CN 201980036057 A CN201980036057 A CN 201980036057A CN 112219455 B CN112219455 B CN 112219455B
Authority
CN
China
Prior art keywords
metal
wiring
thickness direction
circuit board
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980036057.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN112219455A (zh
Inventor
柴田直树
笹冈良介
大薮恭也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN112219455A publication Critical patent/CN112219455A/zh
Application granted granted Critical
Publication of CN112219455B publication Critical patent/CN112219455B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
CN201980036057.8A 2018-05-31 2019-05-10 布线电路基板 Active CN112219455B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板
JP2018-104652 2018-05-31
PCT/JP2019/018713 WO2019230334A1 (ja) 2018-05-31 2019-05-10 配線回路基板

Publications (2)

Publication Number Publication Date
CN112219455A CN112219455A (zh) 2021-01-12
CN112219455B true CN112219455B (zh) 2025-10-28

Family

ID=68697476

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036057.8A Active CN112219455B (zh) 2018-05-31 2019-05-10 布线电路基板

Country Status (5)

Country Link
JP (2) JP6985211B2 (enExample)
KR (1) KR102791341B1 (enExample)
CN (1) CN112219455B (enExample)
TW (1) TWI823937B (enExample)
WO (1) WO2019230334A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
JP7651335B2 (ja) * 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP2023024322A (ja) 2021-08-06 2023-02-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023034728A (ja) 2021-08-31 2023-03-13 日東電工株式会社 配線回路基板
JP7769497B2 (ja) * 2021-09-14 2025-11-13 日東電工株式会社 配線回路基板
JP2024046953A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046954A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法
JP2024046955A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046956A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板
JP2025101669A (ja) 2023-12-25 2025-07-07 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法
KR20250114906A (ko) 2024-01-22 2025-07-29 닛토덴코 가부시키가이샤 배선 회로 기판
JP2025113054A (ja) 2024-01-22 2025-08-01 日東電工株式会社 配線回路基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140255A (en) 1979-04-18 1980-11-01 Nec Corp Heat sink structure
JP2001110951A (ja) * 1999-10-08 2001-04-20 Hitachi Ltd 半導体装置およびその製造方法
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法
JP2009152238A (ja) * 2007-12-18 2009-07-09 Nitto Denko Corp 配線回路基板の製造方法
CN102090159B (zh) * 2008-07-16 2013-07-31 揖斐电株式会社 刚挠性电路板以及其电子设备
JP2011176075A (ja) * 2010-02-24 2011-09-08 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
JP2011198402A (ja) * 2010-03-18 2011-10-06 Dainippon Printing Co Ltd サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
TWI426835B (zh) * 2011-05-23 2014-02-11 Sumitomo Electric Industries 配線板
JP5747764B2 (ja) * 2011-09-26 2015-07-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2015126112A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 配線回路基板、配線回路基板の製造方法および配線回路基板の検査方法
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板
JP2016018577A (ja) * 2014-07-08 2016-02-01 日東電工株式会社 配線回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Also Published As

Publication number Publication date
JP6985211B2 (ja) 2021-12-22
TWI823937B (zh) 2023-12-01
TW202005483A (zh) 2020-01-16
JP2019212656A (ja) 2019-12-12
CN112219455A (zh) 2021-01-12
WO2019230334A1 (ja) 2019-12-05
JP7411621B2 (ja) 2024-01-11
KR20210015809A (ko) 2021-02-10
JP2022020857A (ja) 2022-02-01
KR102791341B1 (ko) 2025-04-03

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