KR102791341B1 - 배선 회로 기판 - Google Patents

배선 회로 기판 Download PDF

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Publication number
KR102791341B1
KR102791341B1 KR1020207033984A KR20207033984A KR102791341B1 KR 102791341 B1 KR102791341 B1 KR 102791341B1 KR 1020207033984 A KR1020207033984 A KR 1020207033984A KR 20207033984 A KR20207033984 A KR 20207033984A KR 102791341 B1 KR102791341 B1 KR 102791341B1
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KR
South Korea
Prior art keywords
wiring
metal
thickness direction
section
length
Prior art date
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KR1020207033984A
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English (en)
Korean (ko)
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KR20210015809A (ko
Inventor
나오키 시바타
료스케 사사오카
야스나리 오야부
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20210015809A publication Critical patent/KR20210015809A/ko
Application granted granted Critical
Publication of KR102791341B1 publication Critical patent/KR102791341B1/ko
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
KR1020207033984A 2018-05-31 2019-05-10 배선 회로 기판 Active KR102791341B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-104652 2018-05-31
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板
PCT/JP2019/018713 WO2019230334A1 (ja) 2018-05-31 2019-05-10 配線回路基板

Publications (2)

Publication Number Publication Date
KR20210015809A KR20210015809A (ko) 2021-02-10
KR102791341B1 true KR102791341B1 (ko) 2025-04-03

Family

ID=68697476

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207033984A Active KR102791341B1 (ko) 2018-05-31 2019-05-10 배선 회로 기판

Country Status (5)

Country Link
JP (2) JP6985211B2 (enExample)
KR (1) KR102791341B1 (enExample)
CN (1) CN112219455B (enExample)
TW (1) TWI823937B (enExample)
WO (1) WO2019230334A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
JP7651335B2 (ja) * 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP2023024322A (ja) 2021-08-06 2023-02-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023034728A (ja) 2021-08-31 2023-03-13 日東電工株式会社 配線回路基板
JP7769497B2 (ja) * 2021-09-14 2025-11-13 日東電工株式会社 配線回路基板
JP2024046953A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046956A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板
JP2024046954A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法
JP2024046955A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2025101669A (ja) 2023-12-25 2025-07-07 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法
JP2025113054A (ja) 2024-01-22 2025-08-01 日東電工株式会社 配線回路基板
KR20250114906A (ko) 2024-01-22 2025-07-29 닛토덴코 가부시키가이샤 배선 회로 기판

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321796A (ja) 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法
JP2013069390A (ja) 2011-09-26 2013-04-18 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140255A (en) 1979-04-18 1980-11-01 Nec Corp Heat sink structure
JP2001110951A (ja) * 1999-10-08 2001-04-20 Hitachi Ltd 半導体装置およびその製造方法
JP2009152238A (ja) * 2007-12-18 2009-07-09 Nitto Denko Corp 配線回路基板の製造方法
JPWO2010007704A1 (ja) * 2008-07-16 2012-01-05 イビデン株式会社 フレックスリジッド配線板及び電子デバイス
JP2011176075A (ja) * 2010-02-24 2011-09-08 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
JP2011198402A (ja) * 2010-03-18 2011-10-06 Dainippon Printing Co Ltd サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
TWI426835B (zh) * 2011-05-23 2014-02-11 Sumitomo Electric Industries 配線板
JP2015126112A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 配線回路基板、配線回路基板の製造方法および配線回路基板の検査方法
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板
JP2016018577A (ja) * 2014-07-08 2016-02-01 日東電工株式会社 配線回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321796A (ja) 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法
JP2013069390A (ja) 2011-09-26 2013-04-18 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Also Published As

Publication number Publication date
TW202005483A (zh) 2020-01-16
JP2022020857A (ja) 2022-02-01
KR20210015809A (ko) 2021-02-10
JP6985211B2 (ja) 2021-12-22
JP2019212656A (ja) 2019-12-12
TWI823937B (zh) 2023-12-01
CN112219455B (zh) 2025-10-28
JP7411621B2 (ja) 2024-01-11
CN112219455A (zh) 2021-01-12
WO2019230334A1 (ja) 2019-12-05

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