CN112219455A - 布线电路基板 - Google Patents

布线电路基板 Download PDF

Info

Publication number
CN112219455A
CN112219455A CN201980036057.8A CN201980036057A CN112219455A CN 112219455 A CN112219455 A CN 112219455A CN 201980036057 A CN201980036057 A CN 201980036057A CN 112219455 A CN112219455 A CN 112219455A
Authority
CN
China
Prior art keywords
metal
wiring
circuit board
thickness direction
wired circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980036057.8A
Other languages
English (en)
Chinese (zh)
Inventor
柴田直树
笹冈良介
大薮恭也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN112219455A publication Critical patent/CN112219455A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
CN201980036057.8A 2018-05-31 2019-05-10 布线电路基板 Pending CN112219455A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板
JP2018-104652 2018-05-31
PCT/JP2019/018713 WO2019230334A1 (ja) 2018-05-31 2019-05-10 配線回路基板

Publications (1)

Publication Number Publication Date
CN112219455A true CN112219455A (zh) 2021-01-12

Family

ID=68697476

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036057.8A Pending CN112219455A (zh) 2018-05-31 2019-05-10 布线电路基板

Country Status (5)

Country Link
JP (2) JP6985211B2 (ja)
KR (1) KR20210015809A (ja)
CN (1) CN112219455A (ja)
TW (1) TWI823937B (ja)
WO (1) WO2019230334A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
JP2022147128A (ja) * 2021-03-23 2022-10-06 日東電工株式会社 配線回路基板の製造方法
JP2023024322A (ja) 2021-08-06 2023-02-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023034728A (ja) 2021-08-31 2023-03-13 日東電工株式会社 配線回路基板
JP2023042068A (ja) 2021-09-14 2023-03-27 日東電工株式会社 配線回路基板
JP2024046955A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046956A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板
JP2024046954A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法
JP2024046953A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140255A (en) 1979-04-18 1980-11-01 Nec Corp Heat sink structure
JP2001110951A (ja) 1999-10-08 2001-04-20 Hitachi Ltd 半導体装置およびその製造方法
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法
JPWO2010007704A1 (ja) * 2008-07-16 2012-01-05 イビデン株式会社 フレックスリジッド配線板及び電子デバイス
JP2011198402A (ja) 2010-03-18 2011-10-06 Dainippon Printing Co Ltd サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
KR101297904B1 (ko) * 2011-05-23 2013-08-22 스미토모 덴키 고교 가부시키가이샤 배선판
JP5747764B2 (ja) * 2011-09-26 2015-07-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6152677B2 (ja) * 2013-03-27 2017-06-28 大日本印刷株式会社 サスペンション用基板
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板

Also Published As

Publication number Publication date
TWI823937B (zh) 2023-12-01
TW202005483A (zh) 2020-01-16
JP7411621B2 (ja) 2024-01-11
JP2019212656A (ja) 2019-12-12
JP2022020857A (ja) 2022-02-01
JP6985211B2 (ja) 2021-12-22
KR20210015809A (ko) 2021-02-10
WO2019230334A1 (ja) 2019-12-05

Similar Documents

Publication Publication Date Title
CN112219455A (zh) 布线电路基板
JP5007281B2 (ja) 誘電体導波管スロットアンテナ
US10164417B2 (en) Circuit assembly and electrical junction box
JP2017188601A (ja) 電子機器
WO2016163135A1 (ja) 電子モジュール及び電子装置
CN112204660A (zh) 布线电路基板
JP6070977B2 (ja) 電子回路装置
JP2008218618A (ja) プリント配線板
CN102223753A (zh) 电路板及其制作方法
JP6256364B2 (ja) 回路構成体
JP4203499B2 (ja) チップ抵抗器及びチップ抵抗器の製造方法
US11076503B2 (en) Thermally conductive insert element for electronic unit
US9232629B2 (en) Metal core board for vehicle-mountable junction box
JP5590713B2 (ja) 配線基板及びその製造方法
US9814129B2 (en) Printed circuit board and method of fabricating the same
JP2007200977A (ja) 電子回路ユニット
CN220895301U (zh) 一种立体电感
KR20230022114A (ko) 배선 회로 기판 및 그 제조 방법
JP4322075B2 (ja) 電源装置の大電流導電構造
JP2010073716A (ja) フィルタ装置
JP2006135450A (ja) 高周波モジュール
KR20230022115A (ko) 배선 회로 기판의 제조 방법
JP5291017B2 (ja) 車載電気接続箱用メタルコア基板のコア板構造及びメタルコア基板
JP5007959B2 (ja) 誘電体共振部品及び誘電体共振装置
JP2015156255A (ja) 伝送線路の基板への固定構造

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination