CN1116613C - 在使用单台设备的密闭环境中用作集成电路的探测、测试、老化、修复和编程的方法及设备 - Google Patents
在使用单台设备的密闭环境中用作集成电路的探测、测试、老化、修复和编程的方法及设备 Download PDFInfo
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- CN1116613C CN1116613C CN96195460A CN96195460A CN1116613C CN 1116613 C CN1116613 C CN 1116613C CN 96195460 A CN96195460 A CN 96195460A CN 96195460 A CN96195460 A CN 96195460A CN 1116613 C CN1116613 C CN 1116613C
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Human Computer Interaction (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/474,489 US6288561B1 (en) | 1988-05-16 | 1995-06-07 | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| US08/474,489 | 1995-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1191019A CN1191019A (zh) | 1998-08-19 |
| CN1116613C true CN1116613C (zh) | 2003-07-30 |
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| CN96195460A Expired - Fee Related CN1116613C (zh) | 1995-06-07 | 1996-05-31 | 在使用单台设备的密闭环境中用作集成电路的探测、测试、老化、修复和编程的方法及设备 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US6288561B1 (enExample) |
| EP (1) | EP0832438A4 (enExample) |
| JP (1) | JPH11512231A (enExample) |
| KR (1) | KR100424693B1 (enExample) |
| CN (1) | CN1116613C (enExample) |
| TW (1) | TW297145B (enExample) |
| WO (1) | WO1996041204A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103969945A (zh) * | 2013-01-25 | 2014-08-06 | 上海微电子装备有限公司 | 刮伤掩模修补装置及方法 |
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-
1995
- 1995-06-07 US US08/474,489 patent/US6288561B1/en not_active Expired - Lifetime
-
1996
- 1996-05-31 EP EP96919083A patent/EP0832438A4/en not_active Ceased
- 1996-05-31 JP JP9501330A patent/JPH11512231A/ja not_active Ceased
- 1996-05-31 KR KR1019970708733A patent/KR100424693B1/ko not_active Expired - Fee Related
- 1996-05-31 CN CN96195460A patent/CN1116613C/zh not_active Expired - Fee Related
- 1996-05-31 WO PCT/US1996/008856 patent/WO1996041204A1/en not_active Ceased
- 1996-06-06 TW TW085106781A patent/TW297145B/zh active
-
1997
- 1997-02-10 US US08/796,474 patent/US5749698A/en not_active Expired - Fee Related
-
2001
- 2001-09-06 US US09/946,552 patent/US6838896B2/en not_active Expired - Fee Related
-
2003
- 2003-01-31 US US10/355,558 patent/US20030151421A1/en not_active Abandoned
-
2004
- 2004-06-09 US US10/865,579 patent/US6891387B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103969945A (zh) * | 2013-01-25 | 2014-08-06 | 上海微电子装备有限公司 | 刮伤掩模修补装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0832438A4 (en) | 1998-09-09 |
| US20020005729A1 (en) | 2002-01-17 |
| US20030151421A1 (en) | 2003-08-14 |
| US6891387B2 (en) | 2005-05-10 |
| KR19990022254A (ko) | 1999-03-25 |
| US6838896B2 (en) | 2005-01-04 |
| US5749698A (en) | 1998-05-12 |
| KR100424693B1 (ko) | 2004-07-27 |
| TW297145B (enExample) | 1997-02-01 |
| US6288561B1 (en) | 2001-09-11 |
| CN1191019A (zh) | 1998-08-19 |
| US20040222809A1 (en) | 2004-11-11 |
| WO1996041204A1 (en) | 1996-12-19 |
| JPH11512231A (ja) | 1999-10-19 |
| EP0832438A1 (en) | 1998-04-01 |
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