CN110028666B - 聚酰亚胺前体和含有其的树脂组合物 - Google Patents

聚酰亚胺前体和含有其的树脂组合物 Download PDF

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Publication number
CN110028666B
CN110028666B CN201910054325.0A CN201910054325A CN110028666B CN 110028666 B CN110028666 B CN 110028666B CN 201910054325 A CN201910054325 A CN 201910054325A CN 110028666 B CN110028666 B CN 110028666B
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dianhydride
polyimide
tetracarboxylic dianhydride
pmda
film
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CN110028666A (zh
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宫本佳季
米谷昌树
饭塚康史
金田隆行
奥田敏章
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Asahi Kasei Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
CN201910054325.0A 2014-02-14 2014-06-25 聚酰亚胺前体和含有其的树脂组合物 Active CN110028666B (zh)

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JP2014026601 2014-02-14
JP2014-026601 2014-02-14
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JP (2) JP6254197B2 (ko)
KR (2) KR101980506B1 (ko)
CN (2) CN110028666B (ko)
TW (1) TWI567135B (ko)
WO (1) WO2015122032A1 (ko)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122032A1 (ja) * 2014-02-14 2015-08-20 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
KR102277807B1 (ko) * 2014-10-17 2021-07-15 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지 조성물, 폴리이미드 필름 및 적층체
JP6476278B2 (ja) * 2015-03-13 2019-02-27 旭化成株式会社 ポリイミド前駆体樹脂組成物
CN107531996B (zh) * 2015-04-17 2021-03-30 旭化成株式会社 树脂组合物、聚酰亚胺树脂膜及其制造方法
KR102133559B1 (ko) * 2015-09-24 2020-07-13 아사히 가세이 가부시키가이샤 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
JP6787330B2 (ja) * 2015-09-25 2020-11-18 三菱瓦斯化学株式会社 ポリイミド樹脂、およびポリイミドフィルム
JP6634801B2 (ja) * 2015-12-03 2020-01-22 Jsr株式会社 液晶配向剤
KR102417428B1 (ko) * 2015-12-21 2022-07-06 주식회사 두산 지환족 모노머가 적용된 폴리아믹산 조성물 및 이를 이용한 투명 폴리이미드 필름
KR102460588B1 (ko) * 2016-03-09 2022-10-28 주식회사 두산 금속 적층체 및 이를 포함하는 인쇄회로기판
US11332578B2 (en) 2016-05-02 2022-05-17 Mitsubishi Gas Chemical Company, Inc. Polyimide resin, polyimide resin composition, and polyimide film
US10920018B2 (en) 2016-05-09 2021-02-16 Mitsubishi Gas Chemical Company, Inc. Polyimide resin and polyimide resin composition
JP6693676B2 (ja) * 2016-05-09 2020-05-13 三菱瓦斯化学株式会社 ポリイミド及びポリイミドフィルム
KR102339091B1 (ko) * 2016-05-20 2021-12-15 에스케이이노베이션 주식회사 폴리아믹산 조성물, 이로부터 제조된 폴리아미드이미드 필름 및 이의 제조방법
WO2017204178A1 (ja) * 2016-05-23 2017-11-30 日産化学工業株式会社 剥離層形成用組成物及び剥離層
JP6705583B2 (ja) * 2016-08-08 2020-06-03 Jxtgエネルギー株式会社 ポリイミド、ポリアミド酸、ポリアミド酸溶液、及び、ポリイミドフィルム
JP7079076B2 (ja) * 2016-08-10 2022-06-01 日鉄ケミカル&マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド
JP6890999B2 (ja) * 2016-08-10 2021-06-18 日鉄ケミカル&マテリアル株式会社 ポリイミド前駆体及びポリイミド
KR101899902B1 (ko) * 2016-08-23 2018-09-18 주식회사 대림코퍼레이션 수지안정성, 내열성이 향상되고 투명성을 갖는 폴리이미드 전구체 수지 조성물, 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름
WO2018062296A1 (ja) * 2016-09-30 2018-04-05 住友化学株式会社 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム
WO2018097143A1 (ja) * 2016-11-24 2018-05-31 日産化学工業株式会社 フレキシブルデバイス基板形成用組成物
JP7011230B2 (ja) * 2016-11-24 2022-01-26 日産化学株式会社 フレキシブルデバイス基板形成用組成物
JP6944784B2 (ja) * 2017-02-03 2021-10-06 東京応化工業株式会社 積層体、フレキシブルデバイスおよび積層体の製造方法
KR20200026191A (ko) * 2017-05-10 2020-03-10 듀폰 일렉트로닉스, 인크. 전자 장치의 가요성 기판용 저색도 중합체
TW201920364A (zh) * 2017-08-11 2019-06-01 美商杜邦股份有限公司 用於電子裝置中之可撓性基板之低色度聚合物
US11970579B2 (en) 2017-09-12 2024-04-30 Sk Innovation Co., Ltd. Polyamic acid resin and polyamideimide film
WO2019073972A1 (ja) * 2017-10-11 2019-04-18 株式会社カネカ ポリイミド樹脂およびその製造方法、ポリイミド溶液、ならびにポリイミドフィルムおよびその製造方法
KR20200089287A (ko) * 2017-12-15 2020-07-24 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
WO2019131294A1 (ja) * 2017-12-26 2019-07-04 株式会社カネカ ポリアミド酸組成物およびその製造方法、ポリイミドフィルム、積層体およびその製造方法、ならびにフレキシブルデバイス
KR102271028B1 (ko) * 2017-12-29 2021-06-29 코오롱인더스트리 주식회사 폴리아믹산의 제조방법, 이로부터 제조된 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름
KR102015769B1 (ko) 2018-01-12 2019-08-29 경희대학교 산학협력단 폴리아믹산 공중합체, 이를 이용하여 제조된 고내열성 투명 폴리이미드 필름 및 이의 제조방법
JP7371621B2 (ja) * 2018-04-10 2023-10-31 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP2019215394A (ja) * 2018-06-11 2019-12-19 株式会社ジャパンディスプレイ 表示装置
JP7120819B2 (ja) * 2018-06-12 2022-08-17 旭化成株式会社 ポリイミドフィルムとフレキシブルガラスとの積層体
JP7158914B2 (ja) * 2018-06-26 2022-10-24 株式会社ジャパンディスプレイ 表示装置
JP7323522B2 (ja) * 2018-06-28 2023-08-08 株式会社カネカ ポリイミド樹脂およびその製造方法、ならびにポリイミドフィルムおよびその製造方法
CN110933949A (zh) * 2018-07-18 2020-03-27 住友电气工业株式会社 树脂清漆、绝缘电线以及绝缘电线的制造方法
JP7298141B2 (ja) * 2018-11-30 2023-06-27 株式会社リコー 硬化型組成物、組成物収容容器、2次元又は3次元の像の形成方法及び形成装置、硬化物、構造体、並びに成形加工品
CN109824894B (zh) * 2019-01-29 2021-08-10 西北工业大学 一种分子主链由两种酸酐交替组成的聚酰亚胺薄膜制备方法
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CN112521603B (zh) 2019-09-19 2023-06-02 臻鼎科技股份有限公司 聚酰胺酸嵌段共聚物及其制备方法、聚酰亚胺覆铜板及电路板
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WO2022070617A1 (ja) * 2020-09-29 2022-04-07 東洋紡株式会社 無機基板とポリアミック酸硬化物の積層体
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WO2022211086A1 (ja) * 2021-04-02 2022-10-06 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043419A (en) * 1987-10-23 1991-08-27 Mitsui Toatsu Chemicals, Inc. Process for preparing a polyimide and a composite material containing the same
TW457273B (en) * 1997-12-29 2001-10-01 Chisso Corp Polyamic acid composition
CN101490607A (zh) * 2006-07-21 2009-07-22 东丽株式会社 相位差薄膜用树脂组合物、液晶显示装置用滤色器基板和液晶显示装置,以及带有相位差薄膜的液晶显示装置用滤色器基板的制造方法
CN101580637A (zh) * 2009-06-12 2009-11-18 东华大学 含脂环聚酰亚胺薄膜及其制备方法
CN101959935A (zh) * 2008-02-25 2011-01-26 日立化成杜邦微系统股份有限公司 聚酰亚胺前体组合物、聚酰亚胺薄膜及透明挠性薄膜
CN102093558A (zh) * 2009-12-14 2011-06-15 辽宁科技大学 一种可用作柔性透明导电膜衬底的聚酰亚胺膜材料及其制备方法
CN102382661A (zh) * 2010-08-27 2012-03-21 Jsr株式会社 液晶取向剂、液晶取向膜、液晶显示元件、聚酰胺酸以及聚酰亚胺
CN102382303A (zh) * 2011-08-16 2012-03-21 中国科学院宁波材料技术与工程研究所 无色透明的聚酰亚胺树脂材料及其制备方法
CN102498155A (zh) * 2009-09-16 2012-06-13 Solpit工业株式会社 含有pmda、dade、bpda及bcd的可溶于有机溶剂的聚酰亚胺
CN102597862A (zh) * 2009-08-28 2012-07-18 国立大学法人九州大学 液晶显示元件以及该元件使用的基板
CN103319714A (zh) * 2013-02-08 2013-09-25 长兴化学工业股份有限公司 聚酰亚胺及由此形成的涂料组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486358B2 (ja) 1998-12-28 2004-01-13 日本電信電話株式会社 光学用ポリイミド基板
JP2003155342A (ja) 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
JP2004252373A (ja) * 2003-02-21 2004-09-09 Kanegafuchi Chem Ind Co Ltd 液晶配向膜用ポリイミド樹脂
JP2004307857A (ja) * 2003-03-26 2004-11-04 Rikogaku Shinkokai 蛍光性ポリイミド
JP4678142B2 (ja) 2004-05-25 2011-04-27 日産化学工業株式会社 高透明性を有するポリ(アミド酸−イミド)共重合体の感光性樹脂組成物およびその硬化膜
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
JP2007063417A (ja) * 2005-08-31 2007-03-15 Fujifilm Corp フィルムおよびフィルムの製造方法、ガスバリア層付フィルム、透明導電層付フィルム、並びに、画像表示装置
KR101505899B1 (ko) * 2007-10-23 2015-03-25 제이엔씨 주식회사 잉크젯용 잉크
WO2009116500A1 (ja) * 2008-03-19 2009-09-24 Jsr株式会社 ポリイミド系材料、ポリイミドフィルム及びそれらの製造方法
JP2013082774A (ja) * 2011-10-06 2013-05-09 Kaneka Corp 透明ポリイミドフィルムおよびその製造方法
KR101339664B1 (ko) * 2011-12-30 2013-12-10 웅진케미칼 주식회사 저열팽창성 투명 폴리이미드
KR101339663B1 (ko) 2011-12-30 2013-12-10 웅진케미칼 주식회사 저열팽창성 투명 폴리이미드
JP6257302B2 (ja) * 2012-12-20 2018-01-10 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP6477469B2 (ja) * 2013-07-05 2019-03-06 三菱瓦斯化学株式会社 ポリイミド樹脂
WO2015122032A1 (ja) * 2014-02-14 2015-08-20 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043419A (en) * 1987-10-23 1991-08-27 Mitsui Toatsu Chemicals, Inc. Process for preparing a polyimide and a composite material containing the same
TW457273B (en) * 1997-12-29 2001-10-01 Chisso Corp Polyamic acid composition
CN101490607A (zh) * 2006-07-21 2009-07-22 东丽株式会社 相位差薄膜用树脂组合物、液晶显示装置用滤色器基板和液晶显示装置,以及带有相位差薄膜的液晶显示装置用滤色器基板的制造方法
CN101959935A (zh) * 2008-02-25 2011-01-26 日立化成杜邦微系统股份有限公司 聚酰亚胺前体组合物、聚酰亚胺薄膜及透明挠性薄膜
CN101580637A (zh) * 2009-06-12 2009-11-18 东华大学 含脂环聚酰亚胺薄膜及其制备方法
CN102597862A (zh) * 2009-08-28 2012-07-18 国立大学法人九州大学 液晶显示元件以及该元件使用的基板
CN102498155A (zh) * 2009-09-16 2012-06-13 Solpit工业株式会社 含有pmda、dade、bpda及bcd的可溶于有机溶剂的聚酰亚胺
CN102093558A (zh) * 2009-12-14 2011-06-15 辽宁科技大学 一种可用作柔性透明导电膜衬底的聚酰亚胺膜材料及其制备方法
CN102382661A (zh) * 2010-08-27 2012-03-21 Jsr株式会社 液晶取向剂、液晶取向膜、液晶显示元件、聚酰胺酸以及聚酰亚胺
CN102382303A (zh) * 2011-08-16 2012-03-21 中国科学院宁波材料技术与工程研究所 无色透明的聚酰亚胺树脂材料及其制备方法
CN103319714A (zh) * 2013-02-08 2013-09-25 长兴化学工业股份有限公司 聚酰亚胺及由此形成的涂料组合物

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