CN1086639C - 感热式打印头、打印头中所用基板及该基板的制造方法 - Google Patents

感热式打印头、打印头中所用基板及该基板的制造方法 Download PDF

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Publication number
CN1086639C
CN1086639C CN95193355A CN95193355A CN1086639C CN 1086639 C CN1086639 C CN 1086639C CN 95193355 A CN95193355 A CN 95193355A CN 95193355 A CN95193355 A CN 95193355A CN 1086639 C CN1086639 C CN 1086639C
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CN
China
Prior art keywords
mentioned
substrate
perforated
raw material
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95193355A
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English (en)
Chinese (zh)
Other versions
CN1149855A (zh
Inventor
谷口秀夫
小畠忍
木下博志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6201845A external-priority patent/JPH0890808A/ja
Priority claimed from JP7016395A external-priority patent/JPH0848050A/ja
Priority claimed from JP7016295A external-priority patent/JPH0848049A/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN1149855A publication Critical patent/CN1149855A/zh
Application granted granted Critical
Publication of CN1086639C publication Critical patent/CN1086639C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33585—Hollow parts under the heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Electronic Switches (AREA)
CN95193355A 1994-05-31 1995-05-24 感热式打印头、打印头中所用基板及该基板的制造方法 Expired - Fee Related CN1086639C (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP119003/94 1994-05-31
JP11900394 1994-05-31
JP179237/94 1994-07-29
JP17923794 1994-07-29
JP201845/94 1994-08-26
JP6201845A JPH0890808A (ja) 1994-07-29 1994-08-26 サーマルプリントヘッド
JP70162/95 1995-03-28
JP70163/95 1995-03-28
JP7016395A JPH0848050A (ja) 1994-05-31 1995-03-28 サーマルプリントヘッド
JP7016295A JPH0848049A (ja) 1994-05-31 1995-03-28 サーマルプリントヘッド及びその基板の製造方法

Publications (2)

Publication Number Publication Date
CN1149855A CN1149855A (zh) 1997-05-14
CN1086639C true CN1086639C (zh) 2002-06-26

Family

ID=27524230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95193355A Expired - Fee Related CN1086639C (zh) 1994-05-31 1995-05-24 感热式打印头、打印头中所用基板及该基板的制造方法

Country Status (7)

Country Link
US (1) US5940109A (https=)
EP (1) EP0763431B1 (https=)
KR (1) KR100225259B1 (https=)
CN (1) CN1086639C (https=)
DE (1) DE69513021T2 (https=)
TW (1) TW468783U (https=)
WO (1) WO1995032866A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026787A1 (en) * 1997-11-26 1999-06-03 Rohm Co., Ltd. Thermal print head and method of manufacturing the same
TW455547B (en) * 1998-09-09 2001-09-21 Rohm Co Ltd Thermal printing head
JP3868755B2 (ja) * 2001-04-05 2007-01-17 アルプス電気株式会社 サーマルヘッド及びその製造方法
JP4137544B2 (ja) 2002-07-17 2008-08-20 セイコーインスツル株式会社 サーマルヘッドおよび感熱性粘着ラベルの熱活性化装置並びにプリンタ装置
JP2004345237A (ja) * 2003-05-22 2004-12-09 Fuji Photo Film Co Ltd サーマルヘッド
JP5039940B2 (ja) * 2005-10-25 2012-10-03 セイコーインスツル株式会社 発熱抵抗素子、サーマルヘッド、プリンタ、及び発熱抵抗素子の製造方法
JP5181107B2 (ja) * 2007-10-10 2013-04-10 セイコーインスツル株式会社 発熱抵抗素子部品およびプリンタ
US7768541B2 (en) * 2007-10-23 2010-08-03 Seiko Instruments Inc. Heating resistor element, manufacturing method for the same, thermal head, and printer
JP5266519B2 (ja) * 2008-03-17 2013-08-21 セイコーインスツル株式会社 発熱抵抗素子部品およびサーマルプリンタ、並びに発熱抵抗素子部品の製造方法
JP5181152B2 (ja) * 2008-04-25 2013-04-10 セイコーインスツル株式会社 サーマルヘッドの製造方法
JP5273785B2 (ja) 2008-10-03 2013-08-28 セイコーインスツル株式会社 サーマルヘッドおよびプリンタ
JP5200256B2 (ja) * 2008-10-20 2013-06-05 セイコーインスツル株式会社 サーマルヘッドの製造方法
JP5590648B2 (ja) * 2009-12-14 2014-09-17 セイコーインスツル株式会社 サーマルヘッドおよびプリンタ
JP5787248B2 (ja) * 2010-09-24 2015-09-30 セイコーインスツル株式会社 サーマルヘッドの製造方法
WO2012157641A1 (ja) * 2011-05-16 2012-11-22 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP2019084702A (ja) * 2017-11-02 2019-06-06 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
CN107901613A (zh) * 2017-11-27 2018-04-13 山东华菱电子股份有限公司 一种新型热敏打印头用发热基板及其制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS606478A (ja) * 1983-06-24 1985-01-14 Hitachi Ltd 感熱記録ヘツド
JPS6013565A (ja) * 1983-07-05 1985-01-24 Oki Electric Ind Co Ltd サ−マルヘツド
JPS6295240A (ja) * 1985-10-23 1987-05-01 Alps Electric Co Ltd サ−マルヘツド
US4742362A (en) * 1985-10-23 1988-05-03 Alps Electric Co., Ltd. Thermal head
JPH03290268A (ja) * 1990-04-06 1991-12-19 Seiko Instr Inc サーマルヘッド
US5285216A (en) * 1989-09-27 1994-02-08 Kyocera Corporation Thermal head

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764576A (en) * 1980-10-06 1982-04-19 Mitsubishi Electric Corp Thermal head
JPS5973973A (ja) * 1982-10-22 1984-04-26 Nec Corp 感熱記録ヘツド
JPS5983682A (ja) * 1982-11-04 1984-05-15 Nec Corp セラミツクサ−マルヘツド
JPS61227068A (ja) * 1985-04-01 1986-10-09 Tdk Corp サ−マルヘツド
JPS61261068A (ja) * 1985-05-15 1986-11-19 Tdk Corp サ−マルヘツド用基板
JPS61283572A (ja) * 1985-06-10 1986-12-13 Oki Electric Ind Co Ltd 電子写真プリンタ用記録ヘッド
JPS61283573A (ja) * 1985-06-10 1986-12-13 Oki Electric Ind Co Ltd 熱線放射ヘツドの製造方法
DE3906484A1 (de) * 1989-03-01 1990-09-20 Siemens Ag Thermodruckerkopf
JPH03261565A (ja) * 1990-03-12 1991-11-21 Ngk Spark Plug Co Ltd サーマルヘッド用基板
JP3057813B2 (ja) * 1991-05-23 2000-07-04 富士ゼロックス株式会社 サーマルヘッドおよびその製造方法
US5335002A (en) * 1991-09-30 1994-08-02 Rohm Co., Ltd. Printing head and printer incorporating the same
US5357271A (en) * 1993-01-19 1994-10-18 Intermec Corporation Thermal printhead with enhanced laterla heat conduction

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS606478A (ja) * 1983-06-24 1985-01-14 Hitachi Ltd 感熱記録ヘツド
JPS6013565A (ja) * 1983-07-05 1985-01-24 Oki Electric Ind Co Ltd サ−マルヘツド
JPS6295240A (ja) * 1985-10-23 1987-05-01 Alps Electric Co Ltd サ−マルヘツド
US4742362A (en) * 1985-10-23 1988-05-03 Alps Electric Co., Ltd. Thermal head
US5285216A (en) * 1989-09-27 1994-02-08 Kyocera Corporation Thermal head
JPH03290268A (ja) * 1990-04-06 1991-12-19 Seiko Instr Inc サーマルヘッド

Also Published As

Publication number Publication date
EP0763431A4 (https=) 1997-03-26
DE69513021D1 (de) 1999-12-02
TW468783U (en) 2001-12-11
EP0763431B1 (en) 1999-10-27
US5940109A (en) 1999-08-17
KR970703244A (ko) 1997-07-03
WO1995032866A1 (fr) 1995-12-07
DE69513021T2 (de) 2000-10-12
KR100225259B1 (ko) 1999-10-15
EP0763431A1 (en) 1997-03-19
CN1149855A (zh) 1997-05-14

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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20020626