CN107851616A - 布线基板以及电子装置 - Google Patents

布线基板以及电子装置 Download PDF

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Publication number
CN107851616A
CN107851616A CN201680042982.8A CN201680042982A CN107851616A CN 107851616 A CN107851616 A CN 107851616A CN 201680042982 A CN201680042982 A CN 201680042982A CN 107851616 A CN107851616 A CN 107851616A
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Prior art keywords
circuit board
conductive layer
wire portion
insulating barrier
electronic component
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CN201680042982.8A
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CN107851616B (zh
Inventor
舟桥明彦
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Kyocera Corp
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Kyocera Corp
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Abstract

目的在于提供能良好地维持布线基板的表面的平面度的布线基板以及电子装置。布线基板具备：板状的绝缘层，上表面平坦；和导电层，设置在绝缘层的上表面，且与绝缘层的外缘隔着间隔配置该导电层，该导电层具有沿着绝缘层的外缘而外周隆起的周缘区域、存在于周缘区域的内侧的中央区域和在中央区域隆起至周缘区域的高度位置的线状部。

Description

布线基板以及电子装置
技术领域
本发明涉及安装了电子元件例如CCD(Charge Coupled Device，电荷耦合器件)型或CMOS(Complementary Metal Oxide Semiconductor，互补金属氧化物半导体)型等的摄像元件、LED(Light Emitting Diode，发光二极管)等发光元件或集成电路等的布线基板以及电子装置。
背景技术
如日本特开平9-312471号公报公开的那样，已知一种布线基板，具有上表面平坦的板状的绝缘层；和形成于绝缘层的上表面且具有大的面积的导电层。另外已知在布线基板的上表面安装了电子元件的电子装置。这样的布线基板的导电层通过丝网印刷法形成，通过丝网印刷法形成的导电层在截面观察下具有变成两端隆起的形状的倾向。
一般，近几年来布线基板要求薄型化以及多层化，若导电层在截面观察时外周侧比中央侧更隆起，则导电层的形状会引起布线基板的上表面变形，难以安装电子元件，因此正在要求安装性的提升。
发明内容
本发明的一个方式所涉及的布线基板具有：上表面平坦的板状的绝缘层；和设于所述绝缘层的上表面且与所述绝缘层的外缘隔着间隔配置的导电层。所述导电层具有：沿着所述绝缘层的外缘外周隆起的周缘区域；存在于所述周缘区域的内侧的中央区域；和在该中央区域隆起至所述周缘区域的高度位置的线状部。
本发明的一个方式所涉及的电子装置具有上述布线基板和安装于该布线基板的电子元件。
附图说明
图1(a)是表示本发明的第1实施方式所涉及的布线基板外观的顶视图，(b)是与(a)的A-A线对应的纵截面图。
图2(a)是表示本发明的第1实施方式所涉及的布线基板以及电子装置的外观的顶视图，(b)是与(a)的A-A线对应的纵截面图。
图3(a)是表示本发明的第1实施方式的其他方式所涉及的布线基板的外观的顶视图，(b)是与(a)的A-A线对应的纵截面图。
图4(a)是表示本发明的第1实施方式的其他方式所涉及的布线基板以及电子装置的外观的顶视图，(b)是与(a)的A-A线对应的纵截面图。
图5(a)是表示图1的实施方式所涉及的布线基板的主要部分B的放大图，(b)是表示图3的实施方式所涉及的布线基板的主要部分B的放大图。
图6(a)以及(b)是本发明的第2实施方式所涉及的布线基板的顶视图。
图7是本发明的第2实施方式的其他方式所涉及的布线基板的顶视图。
图8(a)是表示本发明的第3实施方式所涉及的布线基板的外观的顶视图，(b)是与(a)的A-A线对应的纵截面图。
图9是表示本发明的第4实施方式所涉及的布线基板的主要部分B的放大图。
图10是表示本发明的第5实施方式所涉及的布线基板的主要部分B的放大图。
图11(a)以及(b)是用于说明本发明的布线基板的制作方法的概略的纵截面图。
图12(a)以及(b)是用于说明本发明的布线基板的其他制作方法的概略的纵截面图。
具体实施方式
以下，参照附图来说明本发明的几个示例性的实施方式。另外，在以下的说明中，将在布线基板安装了电子元件的构成作为电子装置。布线基板以及电子装置哪个方向都可以被设为上方或下方，为了便于说明，定义直角坐标系xyz，并将z方向的正侧作为上方，使用上表面或下表面的用语。
(第1实施方式)
参照图1～图5以及图11～图12来说明本发明的第1实施方式中的电子装置21以及布线基板1。本实施方式中的电子装置21具有布线基板1、电子元件10和盖体。另外，在图2、图4中省略了盖体。另外，在图1～图4中表示了本实施方式的顶视图或截面图的一例。另外，在图5中示出了图1以及图3所示的本实施方式的主要部分B的放大图。另外，在图11以及图12中示出了制作本实施方式的布线基板的方法的一例。另外，在图1～图5中，用点线表示可在内层看到的部分，另外用圆点阴影表示导电层4变凸的部分(截面观察下隆起的部分)。
在图1～图5所示的示例中，本实施方式的布线基板1具有：上表面平坦的板状的绝缘层5；和设于绝缘层5的上表面的出与绝缘层5的外缘隔着间隔配置的导电层4。并且导电层4具有：沿着绝缘层5的外缘，外周隆起的周缘区域4c；存在于周缘区域4c的内侧的中央区域4d；和在中央区域4d隆起至周缘区域4c的高度位置的线状部4a。
布线基板1具有：上表面平坦的板状的绝缘层5；和设于绝缘层5的上表面且与绝缘层5的外缘隔着间隔配置的导电层4。作为绝缘层5的材料，例如可使用电绝缘性陶瓷。作为电绝缘性陶瓷，例如可列举氧化铝质烧结体、莫来石质烧结体、碳化硅质烧结体、氮化铝质烧结体、氮化硅质烧结体或玻璃陶瓷烧结体等。另外，利用电绝缘性陶瓷的绝缘层5在制造工序中是比较柔软的陶瓷生片，通过在制造工序时经过烧成等工序，变成构成布线基板1的绝缘层5。
另外，作为绝缘层5的材料，例如可使用树脂等。作为树脂，例如可列举环氧树脂、聚酰亚胺树脂、丙烯酸树脂、苯酚树脂或氟系树脂等。作为氟系树脂，例如可列举聚酯树脂或四氟乙烯树脂。
在图1～图4所示的示例中，布线基板1将由前述的材料构成的绝缘层5上下层叠多个而形成。另外，构成布线基板1的绝缘层5可以是1层，但在构成布线基板1的绝缘层5是多个的情况下，多个绝缘层5层叠或粘接，成为基体2。
布线基板1既可以如图1以及图2所示的示例那样由五层绝缘层5形成，也可以如图3以及图4所示的示例那样由两层绝缘层5形成。或者，布线基板1可以由三～四层或六层以上的绝缘层5形成。另外，布线基板1例如俯视观察下外形是矩形，外形的一边的长度是3mm～100mm，上下方向的长度是0.2mm～20mm。另外，开口部在俯视观察下一边的长度是2mm～90mm。
另外，也可以如图1～图4所示的示例那样，布线基板1在上表面具有与电子元件10电连接的焊盘3。在图1～图2所示的示例中，基体2具有由框部2b和基部2a形成的凹部，其中，框部2b具有具备贯通孔的多个绝缘层5，基部2a具有没有贯通孔的多个绝缘层5。另外，在图1～图2所示的示例中，框部2b具有两个大小不同的框部，由这两个框部2b形成高低差部，在该高低差部设置焊盘3。另外，布线基板1也可以具有用于进行布线基板1与外部电路的连接的电极。
在图1～图4所示的示例中，在构成基体2的绝缘层5的上表面，具有与绝缘层5的外缘隔着间隔配置的导电层4。通过在绝缘层5的外缘与导电层4的外缘之间没置距离，减少导电层4在布线基板1的外缘部露出的情况，能够减少未预料的导电等。此外，此时通过导电层4和布线基板1的外部分开20μm以上，能够进一步减少导电层4在布线基板1的外缘部露出的情况。
另外，可以在布线基板1的内部设置使各绝缘层5间导通的贯通导体和由内部布线构成的内部布线导体，布线基板1可以具有在表面露出的外部布线导体。另外，设于形成布线基板1的各绝缘层5的每一个中的内部布线导体可通过在各绝缘层5的表面露出的外部布线导体等被电连接。另外，也可以是导电层4与其他导电层4、焊盘3、电极或内部导体分别被电连接。另外，在此，外部布线导体设为在除了焊盘3以及电极以外的布线基板1的外部露出的布线导体。
在布线基板1由电绝缘性陶瓷构成的情况下，焊盘3、导电层4、电极由钨(W)、钼(Mo)、锰(Mn)、银(Ag)或铜(Cu)或者含有从它们中选出的至少一种以上的金属材料的合金等构成。
也可以在焊盘3、设于布线基板1的表面的导电层4、电极以及外部布线导体所露出的表面，设置镀覆层。根据该构成，能保护焊盘3、设于布线基板1的表面的导电层4、电极以及外部布线导体的露出表面，使它们难以被氧化。另外，根据该构成，能使焊盘3和电子元件10的经由连接构件13(接合线等)的电连接良好。镀覆层例如附着厚度为0.5～10μm的Ni镀覆层。或者，在该Ni镀覆层上附着厚度为0.5～3μm的金(Au)镀覆层。
布线基板1的导电层4具有：外周沿着绝缘层5的外缘隆起的周缘区域4c；和存在于周缘区域4c的内侧的中央区域4d。已知，在作为绝缘层5的材料而例如使用了电绝缘性陶瓷时，在成为绝缘层5的陶瓷生片的上表面形成导电层4时，使用丝网印刷法来形成。在该丝网印刷法中，在网格状的掩模的上表面承载会变成导电层4的半液状的导电体，并用刮刀等按压，形成导电层4。掩模用SUS板等固定其外周部。因此，因从刮刀对掩模施加的应力使得掩模挠曲时，挠曲的部分在外周部和中央部发生差异。由此，导电层4变成具有截面观察下外周隆起的周缘区域4c和存在于周缘区域4c的内侧的中央区域4d的形状。
另外，作为绝缘层5的材料，例如使用树脂。关于布线基板1，在由树脂构成的绝缘层5的上表面利用丝网印刷法来制作导电层4时，也与电绝缘性陶瓷同样地，导电层4变成具有截面观察下外周隆起的周缘区域4c和存在于周缘区域4c的内侧的中央区域4d的形状。
布线基板1的导电层4具有在中央区域4d隆起至周缘区域4c的高度位置的线状部4a。另外，在以后的记述中，将被周缘区域4c和线状部4a包围的部位称作凹陷部。
一般，近年来布线基板1要求薄型化以及多层化。随着该要求，构成布线基板1的基体2的绝缘层5的厚度变得更薄。作为绝缘层5的材料，例如使用电绝缘性陶瓷。这时，在导电层4处于在截面观察下外周侧比中央侧隆起的状态下，假设在导电层4的上表面叠加会成为绝缘层5的比较柔软的陶瓷生片并进行加压，则会成为绝缘层5的陶瓷生片的一部分产生凹陷的变形，布线基板1的上表面的一部分有可能会凹陷。并且，当想要在绝缘层5上安装电子元件10的情况下，因绝缘层5的凹陷的变形，难以安装电子元件10，因此要求提升安装性。与此相对，在图1～图2所示的本实施方式的示例中，布线基板1的导电层4设置有在中央区域4d隆起至周缘区域4c的高度位置的线状部4a，布线基板1设置有设于导电层4的上表面且覆盖了导电层4的第2绝缘层5a。由此，能减小在导电层4的上表面形成的凹陷部的距离。由此，即使在导电层4的上表面层叠会成为第2绝缘层5a的陶瓷生片并加压的情况下，第2绝缘层5a也会追随导电层4的形状变形，能减少在布线基板1的上表面出现大的凹陷变形的情形，能提升电子元件10的安装性。
另外，作为绝缘层5的材料，例如使用树脂。在绝缘层5的材料是树脂时，也与绝缘层5由电绝缘性陶瓷构成的情况相同。特别是，柔性布线基板等绝缘层5由树脂构成的布线基板1中设于导电层4的上表面的绝缘层5更薄。与此相对，通过设为本实施方式的形状，能减少在布线基板1的上表面出现凹陷变形的情形，能提升电子元件10的安装性。
另外，一般，近年来电子元件10正在推进高功能化，电子元件10工作时的发热变得更高温。为此，有时为了对来自电子元件10的热进行更良好的散热，在布线基板1的表面，在顶视观察下与电子元件10重叠的位置处设置导电层4。这时，若处于在导电层4的表面如过去那样截面观察时外周侧比中央侧更隆起的状态，则在安装电子元件10的工序中，因导电层4的形状而很难安装电子元件10，有可能会导致电子元件10的安装性的恶化。与此相对，在图3～图4所示的本实施方式的示例中，布线基板1的导电层4设置有在中央区域4d隆起至周缘区域4c的高度位置的线状部4a，导电层4设置在布线基板1的表面。由此，能减小在导电层4的上表面形成的凹陷部的距离。由此，在安装电子元件10的工序中，能提升电子元件10的安装性，并且进一步通过导电层4和电子元件10直接相接，能使电子元件10的发热更良好地散热导布线基板1侧。这时，通过导电层4与电子元件10的运算部等发热部分相接，能更加提升散热性。另外，通过如图3～图4所示的示例那样将导电层4设置在布线基板1的上表面，能通过绝缘层5与导电层4的色调之差做出判别安装电子元件10的区域的校准标记。
另外，若如本发明这样设置线状部4a使得导电层4变成与周缘区域4c相同程度的高度，就能在线状部4a部分使电阻值降低。由此，例如在导电层4与电源或地面连接的情况下，能降低其电阻值。因而，在本实施方式中，能减少布线基板1的凹陷的变形并实现电特性的提升。
另外，通过设计成电子元件10的外周位于在导电层4的中央区域4d的被线状部4a包围而凹陷的部分，能减少电子元件10的外边与布线基板1接触的情形。其结果，能抑制电子元件10缺损的产生。
另外，在本实施方式的导电层4中，周缘区域4c的高度例如是从绝缘层5的上表面起3～25μm程度。另外，线状部4a的高度例如是从中央区域4d的上表面起3～20μm程度。另外，这时线状部4a可以突出到与周缘区域4c相同程度的位置，但也可以因工序误差而出现些许差异。这时，若与周缘区域4c的高度之差在5μm以下，则能良好地保留本实施方式的效果。
另外，在图1～图2所示的示例中，在由多个绝缘层5构成的基体2具有框部2b时，周缘区域4c或线状部4a设置在顶视观察下与框部2b的开口部重叠的位置处。一般地，在布线基板1具有框部2b时，框部2b在制造时朝向基部2a侧下垂的可能性变高，因此与电子元件10的接合可靠性有可能会变差。这时，如图1～图2所示的示例那样，通过周缘区域4c或线状部4a被设置在顶视观察下与框部2b的开口部重叠的位置，周缘区域4c或线状部4a成为支撑部分，从而能减少框部2b朝向基部2a侧下垂的情形。因而，框部2b的上表面的平坦度变得良好，能使设于框部2b的上表面的焊盘3的平坦度变得良好，能提升电子元件10与布线基板1的接合可靠性。
图5(a)示出了图1所示的布线基板1的主要部分B的放大图，图5(b)示出了图3所示的布线基板1的主要部分B的放大图。可以如图5(a)所示的示例那样，设于导电层4的上表面的绝缘层5在截面观察下追随导电层4平滑地波动。另外，导电层4可以是描绘圆弧那样平滑的形状。由此，在层叠绝缘层5的工序、安装电子元件10的工序中从导电层4的上表面施加了应力的情况下，能减少应力施加在线状部4a与中央区域4d之间的角部导致在导电层4产生裂纹等的情形。因而，能更加良好地保持导电层4的导电性。
另外，在图1～图5所示的示例中，导电层4以及线状部4a朝向布线基板1的上表面侧形成，但导电层4也可以朝向布线基板1的下表面侧形成。另外，就像导电层4在图3以及图4中在布线基板1的表面的上表面侧露出那样，也可以在布线基板1的表面的下表面侧朝下露出。这时，在布线基板1的下表面侧露出的导电层4能通过与外部的散热构件等相接而提升散热性。
接下来，利用图2以及图4来说明电子装置21。在图2以及图4所示的示例中，电子装置21具有布线基板1和安装于布线基板1的电子元件10，电子元件10安装在与线状部4a重叠的位置处。
电子元件10例如使用CCD型或CMOS型等摄像元件、LED等发光元件或半导体电路元件等。在图2以及图4所示的示例中，电子元件10的各电极通过连接构件13(接合线)而与焊盘3电连接。另外，在图2以及图4所示的示例中，电子元件10和布线基板1通过连接构件13(接合线等)而连接，连接构件13例如可以是由金或焊料构成的珠、由铜等金属材料构成的引线(TAB安装)或者由树脂等构成的各向异性导电树脂等。
另外，电子元件10的下表面和布线基板1表面例如用热固化性的树脂等接合，由此稳固地安装电子元件10，在处理时等能减少电子元件10的位置偏离。另外，在安装电子元件10的工序中，通过使上述的热固化性的树脂等介于电子元件10的下表面与布线基板1的电子元件安装部之间，能减少在安装等工序中布线基板1和电子元件10发生摩擦而产生灰尘等的情形。
另外，电子装置21也可以在框部2b或基体2的上表面具有盖体。另外，盖体可以通过由热固化性的树脂或金属材料所形成的钎料等构成的接合构件与框部2b或基体2接合。这时，例如在安装于布线基板1的电子元件是半导体电路元件或陀螺仪传感器等的情况下，盖体可以由金属或树脂等所构成的没有光透过性的材料构成。
另外，例如在安装于布线基板1的电子元件是CCD型或CMOS型等摄像元件、LED等发光元件的情况下，盖体由玻璃、水晶或树脂所构成的具有光透过性的材料构成。另外，例如盖体在俯视观察下外形为矩形形状，外形的一边的长度为2.5mm～95mm，上下方向的长度例如为0.1mm～5mm。
本发明的电子装置21通过使用本发明的布线基板1，能实现与电子元件10的安装性的良好。
接下来，说明本实施方式的布线基板1的制造方法的一例。
另外，以下示出的制造方法的一例是利用多连片布线基板的制造方法。
(1)首先，准备构成布线基板1的会成为绝缘层5的陶瓷生片。例如，在获得氧化铝(Al2O3)质烧结体的绝缘层5的情况下，在Al2O3的粉末中添加硅氧(SiO2)、氧化镁(MgO)或氧化钙(CaO)等粉末作为烧结辅助材料，进一步添加适当的粘合剂、溶剂以及增塑剂，然后将这些混合物混匀并制成浆状。然后，用现有周知的刮刀法或砑光辊法等成形方法，获得多连片用的陶瓷生片。
另外，在基体2例如由树脂构成的情况下，使用可成形为给定形状的金属模，用递模法或注模法等进行成形，由此可形成基体2。
另外，基体2也可以是如玻璃环氧树脂那样使树脂浸渍于由玻璃纤维构成的基材而得到的产物。在该情况下，使环氧树脂的前体浸渍于由玻璃纤维构成的基材中，使该环氧树脂前体在给定温度下热固化，由此可形成基体2。
(2)接下来，用丝网印刷法等，在上述(1)的工序中得到的陶瓷生片中，在会成为焊盘3、导电层4、电极以及包含了贯通导体和内部布线在内部布线导体的部分，涂布或填充金属膏。
在由前述的金属材料构成的金属粉末中加入适当的溶剂以及粘合剂并混匀，调整为适度的粘度，由此制作该金属膏。另外，金属膏也可以为了提高与布线基板1的接合强度而包含玻璃、陶瓷。
在该工序中，在导电层4设置线状部4a。制作线状部4a的方法例如有图11以及图12所示那样的制法。另外，在图11以及图12中示出了工序中途的电子元件安装用基板41。
在图11所示的制造方法中，首先，针对陶瓷生片42利用丝网印刷法印刷第1导体墨液44。接下来，在印刷于陶瓷生片42的上表面的第1导体墨液44的作为中央区域4d的位置的希望设置线状部4a的部位，利用丝网印刷法等印刷第2导体墨液45。接下来，从上表面对第1导体墨液44以及第2导体墨液45进行加压，或者从上表面层叠陶瓷生片42并加压，由此可形成具有线状部4a的导电层4。
以下叙述图12所示的制造方法。图12的特征在于在丝网印刷法中所用的掩模46。另外，掩模46中，开口部分是掩模开口部46a，闭口部分是掩模闭口部46b。图12(a)与图12(b)之差在于，图12(b)与图12(a)相比，掩模46的掩模闭口部46b较大。在图12所示的制造方法中，如图12所示的示例那样，控制掩模闭口部46b的大小，通过使用该掩模，能在一次丝网印刷中制作线状部4a。通过如图12所示的示例那样控制掩模闭口部46b的大小，能控制线状部4a的高低差。
另外，图11以及图12所示那样的制法在绝缘层5由树脂等构成的情况下可同样使用，可将线状部4a设于导电层4的中央部。
(3)接下来，对陶瓷生片42进行加工。另外，在布线基板1具有凹部的情况下，为了制作具有凹部的布线基板1，例如有如下的方法，即，制作会成为框部2b以及基部2a的陶瓷生片42，通过后述的层叠并加压的工序来实现一体化。会成为框部2b的陶瓷生片42例如能使用金属模具或激光加工，打穿会成为开口部的部分，由此制作。另外，也可以将多个陶瓷生片42层叠并加压，制作出陶瓷生片层叠体之后，打穿会成为开口部的部分。
(4)接下来，将会成为各绝缘层的陶瓷生片42层叠并加压，制作会成为布线基板1的陶瓷生片层叠体。这是，通过对会成为上述的框部2b的陶瓷生片42和会成为基部2a的陶瓷生片42进行层叠并加压，能制作会成为一体化的布线基板1的陶瓷生片层叠体。
(5)接下来，在约1500～1800℃的温度下对该陶瓷生片层叠体进行烧成，测定排列了多个布线基板1的多连片基板。另外，通过该工序，前述的金属膏和会成为布线基板1的陶瓷生片42同时被烧成，变成焊盘3、导电层4、电极、内部布线导体或外部布线导体。
(6)接下来，将烧成后得到的多连片布线基板分断成多个布线基板1。在该分断中，能使用：沿着会成为布线基板1的外缘的部位在多连片布线基板预先形成分割槽，沿着该分割槽折断来进行分割的方法；或者通过切片法等沿着会成为布线基板1的外缘的部位进行切断的方法等。另外，分割槽可通过在烧成后由切片装置切入比多连片布线基板的厚度小的厚度来形成。另外，也可以通过将切割机刀刃顶在多连片布线基板用的陶瓷生片层叠体，或者由切片装置切入比陶瓷生片层叠体的厚度小的厚度，由此形成分割槽。
通过上述(1)～(6)的工序，获得布线基板1。另外，并不指定上述(1)～(6)的工序顺序。
通过在这样形成的布线基板1安装电子元件10，能制作电子装置21。
(第2实施方式)
接下来，参照图6以及图7来说明本发明的第2实施方式的布线基板1。另外，在图6以及图7中，将可在内层能看到的部分用点线来表示，将导电层4变凸的部分(截面观察下隆起的部分)用圆点阴影来表示。
在本实施方式的布线基板1中，与第1实施方式的布线基板1的不同点在于，在顶视观察下线状部4a有所不同。与第1实施方式的不同点在于，图6(a)中设有多个线状部4a，图6(b)中线状部4a为矩形，图7中从绝缘层5的中央部向外侧辐射状地设置线状部4a。
在图6(a)的布线基板1中，布线基板1具有安装电子元件10的电子元件安装部，在电子元件安装部内至少在两处以上设有线状部4a。并且，多个线状部4a彼此隔着间隔。
在图6(a)所示的示例中，布线基板1在安装电子元件10的电子元件安装部具有至少两个隔着间隔设置的线状部4a，能进一步减小导电层4的凹陷部的宽度。因而，能减少导电层4的周缘区域4c与中央区域4d的高低差引起的绝缘层5的变形，能进一步提升电子元件安装部的平坦度。
另外，如图6(a)所示的示例那样，通过在电子元件安装部具有隔着间隔设置的线状部4a，线状部4a支撑安装于与导电层4重叠的位置处的电子元件10的外周部，由此能减少电子元件10在安装时倾斜的情形，能使安装变得稳定。由此，在将电子元件10安装于布线基板1的工序中，能进一步提升安装性。
在图6(b)的布线基板1中，布线基板1为矩形，线状部4a是顶视观察下沿着布线基板1的各四个边的线状部4a彼此相连的框状。
一般，在导电层4的周围全部形成导电层4的周缘区域4c。这时，通过如图6(b)所示的示例那样线状部4a是框状，在布线基板1的X、Y方向的任何方向上都能减小导电层4的凹陷部的宽度。因而，能提升布线基板1的表面的平坦度。因而，在将电子元件10安装于布线基板1的工序中，能进一步提升安装性。
在图7的布线基板1中，线状部4a从布线基板1的中心部向外侧辐射状地延伸。
通过如图7所示的示例那样，线状部4a从布线基板1的中心部向外侧辐射状地延伸，与图6(b)同样地，在布线基板1的X、Y方向的任何方向上都能减小导电层4的凹陷部的宽度。因而，能提升布线基板1的表面的平坦度。因而，在将电子元件10安装于布线基板1的工序中，能进一步提升安装性。
另外，通过线状部4a集中在布线基板1的中心部，能进一步提升布线基板1的中心部的平坦性，由此在将电子元件10安装于布线基板1的工序中，能进一步提升安装性。
另外，通过线状部4a从布线基板1的中心部向外侧辐射状地延伸，在例如将电子元件10安装于布线基板1的中心部时，当电子元件10工作时发热的情况下能良好地促使散热。另外，在如图7所示的示例那样线状部4a从布线基板1的中心在对角线上延伸时，若在电子元件10的下表面设置由树脂等构成的接合材料，则由于自对准的效果，容易在线状部4a的中心设置电子元件10。另外，这时，由树脂等构成的接合材料还可沿着线状部4a容易地扩展。
另外，在图6以及图7所示的示例中，导电层4设置在绝缘层5与第2绝缘层5a之间，但也可以被设置在布线基板1的上表面或下表面的表面。
作为制作图6以及图7所示的示例那样的线状部4a的方法，例如在基体2由电绝缘性陶瓷构成的情况下，使用被制作成可变成各种任意形状的掩模，通过丝网印刷来印刷会成为线状部4a的导体墨液，由此形成线状部4a。
(第3实施方式)
接下来，参照图8来说明本发明的第3实施方式的布线基板1。另外，在图8中，将可在内层看到的部分用点线了来表示，另外将导电层4变凸的部分(截面观察下隆起的部分)用圆点阴影来表示。
在本实施方式的布线基板1中，与第1实施方式的布线基板1的不同点在于，线状部4a的个数多。
通过如图8所示的示例那样，缩小线状部4a的间隔并增加个数，能进一步减小导电层4的凹陷部的宽度。因而，能进一步提升电子元件10的安装性。
这时，线状部4a彼此的距离为安装到布线基板1的电子元件10在纵向或横向上的长度的三成以下，由此能进一步可靠地减少电子元件10因导电层4的形状而倾斜的情形。另外，通过更加缩小线状部4a彼此的距离，能应对各种尺寸的电子元件10。
另外，在图8所示的示例中，导电层4设置在绝缘层5与第2绝缘层5a之间，但也可以被设置在布线基板1的上表面或下表面的表面。
(第4实施方式)
接下来，参照图9来说明本发明的第4实施方式的布线基板1。另外，图9是本实施方式的主要部分、即中央区域4d的放大图，省略了周缘区域4c。
在本实施方式的布线基板1中，与第1实施方式的布线基板1的不同点在于，设有两层导电层4。
在本实施方式的布线基板1中，在第2绝缘层5a上，在不与导电层4中的周缘区域4c的最上部以及线状部4a的最上部重叠的部位，设置有向上方隆起的第2导电层6。
如图9所示的示例那样，布线基板1具有多个导电层4，在各导电层中设置的线状部4a被设置在顶视观察下不重叠的位置处，由此能进一步提升布线基板1的平坦性。这是因为，通过将即使设置线状部4a也不能完全消除的在导电层4产生的凹陷部设置成第2导电层6的第2线状部6a与该凹陷部重叠，由此能进一步减少在布线基板1的表面出现的凹陷变形。
另外，一般，期望与电源连接的导电层4和与地连接的导电层4被设置在顶视观察下重叠的位置处。但是，若导电层4具有周缘区域4c和中央区域4d，而且设置在顶视观察下重叠的位置处，则设于其上表面的第2绝缘层5a的变形有可能会变得更大。与此相对，如本实施方式那样，导电层4的线状部4a和第2导电层6的第2线状部6a设置在顶视观察下不重叠的位置。由此，例如即使将与电源连接的导电层4和与地连接的导电层4设置在了顶视观察下重叠的位置处时，也能使设于它们的上表面的绝缘层5的变形更小。由此，能在减小布线基板1的变形的同时实现电特性的提升。
作为制作图9所示的示例那样的布线基板1的方法，例如，在基体2由电绝缘性陶瓷构成的情况下，在各个层形成导电层4。这时，使用制作成不会使线状部4a以及第2线状部6a位于重叠的位置的掩模，通过丝网印刷来印刷导体墨液，由此形成。
(第5实施方式)
接下来，参照图10来说明本发明的第5实施方式的布线基板1。另外，图10是本实施方式的主要部分、即中央区域4d的放大图，省略了周缘区域4c。在本实施方式的布线基板1中，与第4实施方式的布线基板1的不同点在于，面对面设置两个导电层4。
本实施方式的布线基板1被设置成：在导电层4上，在与导电层4中的周缘区域4c的最上部以及线状部4a的最上部重叠的部位，在上方凹陷的第3导电层7被设置成与导电层4相接。
在图10所示的示例中，通过具有上述构成，将即使设置线状部4a也不能完全消除的在导电层4产生的凹陷部设置成第3导电层7的第3线状部7a与该凹陷部重叠，能进一步减少在布线基板1的表面出现的凹陷的变形。其结果，能提升电子元件10的安装性。
另外，如图10所示的示例那样，将与导电层4接触的第3导电层7设置在第2绝缘层5a的下表面，并设置成与导电层4相接，由此能加大导电层4的厚度。由此，例如在导电层4与电源或地连接的情况下，能降低其电阻值。因而，在本实施方式中，能减少布线基板1的凹陷的变形，并且能实现电特性的提升。
另外，在本实施方式中，也可以在导电层4上，在与导电层4中的周缘区域4c的最上部以及线状部4a的最上部重叠的部位，设置有在上方凹陷的平坦化膜8。与图10所示的示例之差在于，与导电层4接触的平坦化膜8具有电绝缘性。由此，能与图10所示的示例同样地，进一步减少在布线基板1的表面出现的凹陷的变形。因而，能进一步减少在布线基板1的表面出现的凹陷的变形，能提升电子元件10的安装性。另外，在此，所谓平坦化膜8是绝缘性的膜，主成分可以与绝缘层5相同。并且，平坦化膜8的一部分会成为平坦化膜线状部8a。
作为制作图10所示的示例那样的布线基板1的方法，例如在基体2由电绝缘性陶瓷构成的情况下，在第2绝缘层5a的下表面使用丝网印刷法。利用丝网印刷方式涂布导电性墨液或绝缘性的膏，使用图11或图12记载的制造方法来制作隆起部，由此可形成布线基板1。
另外，本发明并不限于上述的实施方式的示例，可进行数值等的种种变形。另外，例如在图1～图4所示的示例中，焊盘3或导电层4、线状部4a的形状为矩形，但也可以是圆形形状或其他多角形形状。
另外，并不指定本实施方式中的焊盘3、导电层4的配置、数量、形状等。另外，本实施方式中的特征部的种种组合并不限于上述的实施方式的示例。
符号说明
1 布线基板
2 基体
2a 基部
2b 框部
3 焊盘
4 导电层
4a 线状部
4c 周缘区域
4d 中央区域
5 绝缘层
5a 第2绝缘层
6 第2导电层
6a 第2线状部
7 第3导电层
7a 第3线状部
8 平坦化膜
8a 平坦化膜线状部
10 电子元件
13 连接构件
21 电子装置
41 工序中途的电子元件安装用基板
42 陶瓷生片
44 第1导体墨液
45 第2导体墨液
46 掩模
46a 掩模开口部
46b 掩模闭口部

Claims (10)

1.一种布线基板，其特征在于，具备：
板状的绝缘层，上表面平坦；和
导电层，设于所述绝缘层的上表面，且与所述绝缘层的外缘隔着间隔配置该导电层，该导电层具有沿着所述绝缘层的外缘而外周隆起的周缘区域、存在于所述周缘区域的内侧的中央区域和在该中央区域隆起至所述周缘区域的高度位置的线状部。
2.根据权利要求1所述的布线基板，其特征在于，
所述布线基板具有安装电子元件的电子元件安装部，
在所述电子元件安装部内至少在两处以上设置所述线状部，并且隔着间隔设置该线状部彼此。
3.根据权利要求1所述的布线基板，其特征在于，
所述布线基板是矩形形状，
所述线状部是顶视观察下沿着所述布线基板的各四个边的、所述线状部彼此相连的框状。
4.根据权利要求1所述的布线基板，其特征在于，
所述线状部从所述布线基板的中心部向外侧辐射状地延伸。
5.根据权利要求1～4中任一项所述的布线基板，其特征在于，
在所述布线基板的表面设置有所述导电层。
6.根据权利要求1～4中任一项所述的布线基板，其特征在于，
所述布线基板设置有在所述导电层的上表面设置且覆盖所述导电层的第2绝缘层。
7.根据权利要求6所述的布线基板，其特征在于，
在所述第2绝缘层上，在不与所述导电层中的所述周缘区域的最上部以及所述线状部的最上部重叠的部位，设置有向上方隆起的第2导电层。
8.根据权利要求6所述的布线基板，其特征在于，
在所述导电层上，在与所述导电层中的所述周缘区域的最上部以及所述线状部的最上部重叠的部位，设置有在上方凹陷的第3导电层。
9.根据权利要求6所述的布线基板，其特征在于，
在所述导电层上，在与所述导电层中的所述周缘区域的最上部以及所述线状部的最上部重叠的部位，设置有在上方凹陷的平坦化膜。
10.一种电子装置，其特征在于，具备：
权利要求1～8中任一项所述的布线基板；和
安装于布线基板的上表面的电子元件，
所述电子元件安装在与所述线状部重叠的位置处。
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