CN108588766B - 附载体铜箔 - Google Patents

附载体铜箔 Download PDF

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Publication number
CN108588766B
CN108588766B CN201810371406.9A CN201810371406A CN108588766B CN 108588766 B CN108588766 B CN 108588766B CN 201810371406 A CN201810371406 A CN 201810371406A CN 108588766 B CN108588766 B CN 108588766B
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CN
China
Prior art keywords
layer
carrier
copper foil
resin
area
Prior art date
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CN201810371406.9A
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English (en)
Chinese (zh)
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CN108588766A (zh
Inventor
古曳伦也
永浦友太
坂口和彦
千叶徹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN108588766A publication Critical patent/CN108588766A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201810371406.9A 2012-09-11 2013-09-11 附载体铜箔 Active CN108588766B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2012-200017 2012-09-11
JP2012200017 2012-09-11
JP2012-200973 2012-09-12
JP2012200973 2012-09-12
JP2012280024 2012-12-21
JP2012-280024 2012-12-21
JP2013-012468 2013-01-25
JP2013012468A JP5481577B1 (ja) 2012-09-11 2013-01-25 キャリア付き銅箔
CN201380046519.7A CN104619889B (zh) 2012-09-11 2013-09-11 附载体铜箔

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380046519.7A Division CN104619889B (zh) 2012-09-11 2013-09-11 附载体铜箔

Publications (2)

Publication Number Publication Date
CN108588766A CN108588766A (zh) 2018-09-28
CN108588766B true CN108588766B (zh) 2020-02-18

Family

ID=50278311

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201810371406.9A Active CN108588766B (zh) 2012-09-11 2013-09-11 附载体铜箔
CN201710739142.3A Pending CN107641820A (zh) 2012-09-11 2013-09-11 附载体铜箔
CN201380046519.7A Active CN104619889B (zh) 2012-09-11 2013-09-11 附载体铜箔
CN201811088181.2A Pending CN109379858A (zh) 2012-09-11 2013-09-11 附载体铜箔

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201710739142.3A Pending CN107641820A (zh) 2012-09-11 2013-09-11 附载体铜箔
CN201380046519.7A Active CN104619889B (zh) 2012-09-11 2013-09-11 附载体铜箔
CN201811088181.2A Pending CN109379858A (zh) 2012-09-11 2013-09-11 附载体铜箔

Country Status (7)

Country Link
JP (1) JP5481577B1 (ja)
KR (2) KR102050646B1 (ja)
CN (4) CN108588766B (ja)
MY (2) MY188679A (ja)
PH (1) PH12015500529A1 (ja)
TW (2) TWI504788B (ja)
WO (1) WO2014042201A1 (ja)

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JP2015078422A (ja) * 2012-11-20 2015-04-23 Jx日鉱日石金属株式会社 キャリア付き銅箔
CN105209252B (zh) * 2013-03-04 2018-01-30 Jx日矿日石金属株式会社 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
TWI613940B (zh) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
JP2015205481A (ja) * 2014-04-22 2015-11-19 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
JP6297011B2 (ja) * 2014-08-28 2018-03-20 株式会社有沢製作所 ３層フレキシブル金属張積層板及び両面３層フレキシブル金属張積層板
CN105050331B (zh) * 2015-07-07 2016-09-07 安徽铜冠铜箔有限公司 一种用于陶瓷基高频覆铜板的高粗糙度电子铜箔的制造方法
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
US10950768B2 (en) 2017-04-27 2021-03-16 Kyocera Corporation Circuit board and light-emitting device provided with same
WO2019003775A1 (ja) 2017-06-29 2019-01-03 京セラ株式会社 回路基板およびこれを備える発光装置
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
US11950376B2 (en) 2018-03-30 2024-04-02 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI697549B (zh) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
EP4132235A4 (en) * 2020-03-30 2024-04-10 Mitsubishi Materials Corp BONDED BODY AND INSULATION CIRCUIT BOARD
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN117321253A (zh) * 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
WO2022255421A1 (ja) * 2021-06-03 2022-12-08 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
EP4362611A1 (en) * 2021-06-24 2024-05-01 Kyocera Corporation Wiring board
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
TWI781818B (zh) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

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Publication number Priority date Publication date Assignee Title
WO2012046804A1 (ja) * 2010-10-06 2012-04-12 古河電気工業株式会社 銅箔及びその製造方法、キャリア付き銅箔及びその製造方法、プリント配線板、多層プリント配線板

Also Published As

Publication number Publication date
TW201533280A (zh) 2015-09-01
CN104619889A (zh) 2015-05-13
TWI504788B (zh) 2015-10-21
CN107641820A (zh) 2018-01-30
JP5481577B1 (ja) 2014-04-23
KR101766554B1 (ko) 2017-08-08
MY188679A (en) 2021-12-22
KR20170046822A (ko) 2017-05-02
CN104619889B (zh) 2018-10-09
KR20150052315A (ko) 2015-05-13
WO2014042201A1 (ja) 2014-03-20
PH12015500529B1 (en) 2015-04-27
CN109379858A (zh) 2019-02-22
JP2014139336A (ja) 2014-07-31
CN108588766A (zh) 2018-09-28
TW201428144A (zh) 2014-07-16
TWI575120B (zh) 2017-03-21
KR102050646B1 (ko) 2019-11-29
MY167704A (en) 2018-09-21
PH12015500529A1 (en) 2015-04-27

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Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JX Nippon Mining & Metals Corp.

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Corp.