CN107839313B - 柔性覆铜层叠板 - Google Patents

柔性覆铜层叠板 Download PDF

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Publication number
CN107839313B
CN107839313B CN201711033823.4A CN201711033823A CN107839313B CN 107839313 B CN107839313 B CN 107839313B CN 201711033823 A CN201711033823 A CN 201711033823A CN 107839313 B CN107839313 B CN 107839313B
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CN
China
Prior art keywords
copper foil
layer
copper
polyimide layer
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711033823.4A
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English (en)
Chinese (zh)
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CN107839313A (zh
Inventor
松下祐之
井伊正一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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Publication of CN107839313A publication Critical patent/CN107839313A/zh
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Publication of CN107839313B publication Critical patent/CN107839313B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
CN201711033823.4A 2013-03-29 2014-03-27 柔性覆铜层叠板 Active CN107839313B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013074202A JP5976588B2 (ja) 2013-03-29 2013-03-29 フレキシブル銅張積層板の製造方法
JP2013-074202 2013-03-29
CN201410119210.2A CN104070763B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板的制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410119210.2A Division CN104070763B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板的制造方法

Publications (2)

Publication Number Publication Date
CN107839313A CN107839313A (zh) 2018-03-27
CN107839313B true CN107839313B (zh) 2019-10-08

Family

ID=51592560

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201711033823.4A Active CN107839313B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板
CN201410119210.2A Active CN104070763B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410119210.2A Active CN104070763B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板的制造方法

Country Status (4)

Country Link
JP (1) JP5976588B2 (ko)
KR (2) KR102329908B1 (ko)
CN (2) CN107839313B (ko)
TW (2) TWI665084B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201700302A (zh) * 2015-03-31 2017-01-01 鐘化股份有限公司 多層聚醯亞胺膜、撓性金屬箔積層體、撓性金屬箔積層體之製造方法及軟硬複合配線板之製造方法
JP2016215651A (ja) * 2016-07-19 2016-12-22 新日鉄住金化学株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
CN108621513B (zh) * 2017-03-22 2019-11-12 昆山雅森电子材料科技有限公司 用于超细线路fpc及cof材料的纳米金属基板及制造方法
CN107696669B (zh) * 2017-09-20 2024-02-06 广东拓斯达科技股份有限公司 自动贴箔机
JP7212480B2 (ja) * 2017-09-29 2023-01-25 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
JP6597983B2 (ja) * 2017-10-23 2019-10-30 パナソニックＩｐマネジメント株式会社 ロールプレス装置
CN109796761A (zh) * 2018-12-25 2019-05-24 努比亚技术有限公司 显示屏组件、其制备方法和显示终端
CN111635547B (zh) * 2020-06-11 2022-06-28 四川铂利明德科技有限公司 一种高性能改性聚酰亚胺可挠性复合膜的制备方法
US11382210B1 (en) 2020-12-17 2022-07-05 International Business Machines Corporation Dielectric material change to optimize electrical and mechanical properties of flex circuit
CN114679837A (zh) * 2020-12-24 2022-06-28 广东生益科技股份有限公司 一种黑色无胶挠性覆铜板及其制备方法和应用
CN112764533A (zh) * 2020-12-30 2021-05-07 电子科技大学 一种用于手套式键盘的柔性碳系应变传感器阵列
JP2023000498A (ja) 2021-06-18 2023-01-04 合肥漢之和新材料科技有限公司 接着剤、接着シート及びフレキシブル銅張積層板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法
CN117528897A (zh) * 2022-07-27 2024-02-06 宏启胜精密电子(秦皇岛)有限公司 软性电路板及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637451A (ja) * 1992-07-20 1994-02-10 Hitachi Chem Co Ltd 多層印刷配線板及びその製造方法
CN1692017A (zh) * 2002-11-20 2005-11-02 株式会社巴川制纸所 柔性金属层状产品和耐热粘合剂组合物
JP2008174708A (ja) * 2007-01-22 2008-07-31 Chang Chun Plastic Co Ltd 熱硬化性樹脂変性のポリイミド樹脂組成物
CN101974155A (zh) * 2010-07-10 2011-02-16 襄樊市凯隆鑫高分子材料有限公司 聚酰亚胺前聚体树脂合成方法及单面柔性覆铜板制造方法

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JPH04285586A (ja) 1991-03-13 1992-10-09 Juki Corp ミシンの布送り歯軌跡調節装置
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
JP2006015681A (ja) * 2004-07-05 2006-01-19 Shin Etsu Chem Co Ltd フレキシブル金属箔ポリイミド積層板及びその製造方法
JP4756194B2 (ja) * 2005-02-22 2011-08-24 新日鐵化学株式会社 銅張積層板の製造方法
WO2006107043A1 (ja) * 2005-04-04 2006-10-12 Ube Industries, Ltd. 銅張り積層基板
CN101175633B (zh) * 2005-04-19 2011-12-21 宇部兴产株式会社 聚酰亚胺薄膜层合体
KR100629360B1 (ko) * 2005-05-30 2006-10-02 한국화학연구원 에틸렌이민 커플링제를 이용한 폴리이미드 필름의표면개질방법, 그를 이용한 동박 적층 필름의 제조방법 및그로 제조된 2층 구조의 동박 적층필름
JP2009113475A (ja) * 2007-10-18 2009-05-28 Shin Etsu Chem Co Ltd フレキシブル片面ポリイミド銅張積層板の製造方法
JP2009292090A (ja) * 2008-06-06 2009-12-17 Nippon Mining & Metals Co Ltd 屈曲性に優れた二層フレキシブル銅貼積層板およびその製造方法
KR101710218B1 (ko) * 2009-04-14 2017-02-24 우베 고산 가부시키가이샤 금속화용 폴리이미드 필름, 이의 제조 방법, 및 금속 적층 폴리이미드 필름
JP2011148192A (ja) * 2010-01-21 2011-08-04 Jx Nippon Mining & Metals Corp 銅張積層板の製造方法、それに用いる銅箔、及び銅張積層板のラミネート装置。
CN201774739U (zh) * 2010-09-29 2011-03-23 莱芜金鼎电子材料有限公司 一种四层双面挠性覆铜板结构及其生产设备
CN201872386U (zh) * 2010-12-13 2011-06-22 莱芜金鼎电子材料有限公司 双面不同铜箔厚度的挠性覆铜板
TW201304633A (zh) 2011-07-08 2013-01-16 Azotek Co Ltd 可撓性基板的製造方法
CN102794962A (zh) * 2012-08-29 2012-11-28 松扬电子材料(昆山)有限公司 复合式双面铜箔基板及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637451A (ja) * 1992-07-20 1994-02-10 Hitachi Chem Co Ltd 多層印刷配線板及びその製造方法
CN1692017A (zh) * 2002-11-20 2005-11-02 株式会社巴川制纸所 柔性金属层状产品和耐热粘合剂组合物
JP2008174708A (ja) * 2007-01-22 2008-07-31 Chang Chun Plastic Co Ltd 熱硬化性樹脂変性のポリイミド樹脂組成物
CN101974155A (zh) * 2010-07-10 2011-02-16 襄樊市凯隆鑫高分子材料有限公司 聚酰亚胺前聚体树脂合成方法及单面柔性覆铜板制造方法

Also Published As

Publication number Publication date
KR102319574B1 (ko) 2021-10-29
TW201836840A (zh) 2018-10-16
TWI635951B (zh) 2018-09-21
KR102329908B1 (ko) 2021-11-22
CN107839313A (zh) 2018-03-27
TW201500181A (zh) 2015-01-01
JP5976588B2 (ja) 2016-08-23
TWI665084B (zh) 2019-07-11
KR20200141418A (ko) 2020-12-18
CN104070763A (zh) 2014-10-01
JP2014198385A (ja) 2014-10-23
CN104070763B (zh) 2017-12-05
KR20140118894A (ko) 2014-10-08

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Effective date of registration: 20190130

Address after: Tokyo, Japan, Japan

Applicant after: Nippon Iron Chemical Materials Co., Ltd.

Address before: Tokyo, Japan, Japan

Applicant before: Nippon Steel Chemical Co.

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