CN105142912A - 带有锯切割通道的模制流体流动结构 - Google Patents

带有锯切割通道的模制流体流动结构 Download PDF

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Publication number
CN105142912A
CN105142912A CN201380076073.2A CN201380076073A CN105142912A CN 105142912 A CN105142912 A CN 105142912A CN 201380076073 A CN201380076073 A CN 201380076073A CN 105142912 A CN105142912 A CN 105142912A
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China
Prior art keywords
fluid
saw
passage
convergent
fluid passage
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CN201380076073.2A
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CN105142912B (zh
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陈健华
M.W.坎比
A.K.阿加瓦尔
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority claimed from PCT/US2013/028207 external-priority patent/WO2014133516A1/en
Priority claimed from PCT/US2013/028216 external-priority patent/WO2014133517A1/en
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Publication of CN105142912A publication Critical patent/CN105142912A/zh
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    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
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    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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    • H—ELECTRICITY
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  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

在一个实施例中，一种流体流动结构包括嵌入模制件中的微型装置。流体供给孔穿过所述微型装置形成，并且锯限定的流体通道被切割穿过所述模制件以将所述流体供给孔与所述通道流体联接。

Description

带有锯切割通道的模制流体流动结构
背景技术
喷墨笔或打印杆中的打印头芯片包括在硅衬底的表面上的多个流体喷射元件。流体通过在相对的衬底表面之间形成于衬底中的流体递送狭槽流至喷射元件。虽然流体递送狭槽将流体充分地递送至流体喷射元件，但这样的狭槽存在一些缺点。例如，从成本角度来看，墨递送狭槽占据宝贵的硅衬底面积并且增加了显著的狭槽加工成本。此外，较低的打印头芯片成本部分地通过芯片收缩实现，这与硅衬底中更紧密的狭槽间距和/或狭槽宽度相关联。然而，缩小狭槽间距增加了与将小芯片集成到喷墨笔中相关联的过量的组装成本。在结构上，从衬底移除材料以形成墨递送狭槽弱化了打印头芯片。因此，当单个打印头芯片具有多个狭槽(例如，为了提高单色打印头芯片中的打印质量和速度，或者为了在多色打印头芯片中提供不同的颜色)时，打印头芯片对于每个狭槽的添加变得越来越脆弱。
附图说明
现在将以举例方式参照附图描述本发明的实施例，在附图中：
图1是正视剖视图，示出了实现为打印头结构的模制流体流动结构的一个示例；
图2是框图，示出了实现诸如图1的打印头结构的模制流体流动结构的示例性系统；
图3是框图，示出了实现衬底宽打印杆中的流体流动结构的一个示例的喷墨打印机；
图4-6示出了喷墨打印杆，其将模制流体流动结构的一个示例实现为适合在打印机中使用的打印头结构；
图7-9示出了用于使用旋转切割锯在流体流动结构的模制主体内限定流体通道的示例性过程；
图10示出了在形成锯限定的流体通道之前模制流体流动结构的示例；
图11-15示出了可切入流体流动结构的模制主体中的不同形状的锯限定的流体通道的示例；
图16示出了用于制造具有锯限定的流体通道的打印头流体流动结构的示例性过程；
图17是如图7-9所示用于使用旋转切割锯在流体流动结构的模制主体内限定流体通道的示例性过程的流程图；
图18是如图16所示用于制造具有锯限定的流体通道的打印头流体流动结构的示例性过程的流程图。
贯穿附图，相同的附图标记标示类似但未必相同的元件。
具体实施方式
概述
降低常规喷墨打印头芯片的成本在过去是通过缩小芯片尺寸和降低晶圆成本来实现。芯片尺寸主要取决于流体递送狭槽的间距，该狭槽将墨从在芯片一侧上的贮存器递送至在芯片的另一侧上的流体喷射元件。因此，用来缩小芯片尺寸的现有方法大多数涉及通过硅开槽过程减小狭槽间距和尺寸，该过程可包括例如激光机加工、各向异性湿蚀刻、干蚀刻、它们的组合等。遗憾的是，硅开槽过程本身显著地增加了打印头芯片的成本。此外，狭槽间距的成功减小正越来越多地伴随着不断减少的回报，因为与将(由更紧密的狭槽间距导致的)缩小的芯片与喷墨笔集成相关联的成本已变得过高。
流体流动结构允许使用较小的打印头芯片和形成流体递送通道的简化方法，该递送通道将墨从在打印头芯片一侧上的贮存器递送至在芯片的另一侧上的流体喷射元件。流体流动结构包括一个或多个打印头芯片，其被模制到塑料、环氧树脂模制化合物或其它可模制材料的一体化主体中。例如，实现新结构的打印杆包括模制到细长的单个模制主体中的多个打印头芯片。模制通过将流体递送通道(即，墨递送狭槽)从芯片转移到结构的模制主体而允许使用较小的芯片。因此，模制主体有效地增加了每个芯片的尺寸以用于制造外部流体连接部和用于将芯片附接到其它结构。流体递送通道使用切割锯形成于流体流动结构中，该切割锯用于冲切穿过模制主体。
所描述的流体流动结构不限于打印杆或用于喷墨打印的其它类型的打印头结构，而是可以在其它装置中实现并用于其它流体流动应用。因此，在一个示例中，新结构包括嵌入模制件中的微型装置，其具有通道或其它路径以供流体直接流到所述装置之内或之上。微型装置例如可以是电子装置、机械装置或微机电系统(MEMS)装置。流体流例如可以是进入微型装置或到微型装置上的冷却流体流或进入打印头芯片或其它流体分配微型装置的流体流。附图中所示和下文描述的这些和其它示例示出但不限制本发明，本发明在说明书之后的权利要求书中限定。
如本文所用，“微型装置”是指具有小于或等于30mm的一个或多个外部尺寸的装置；“薄的”是指厚度小于或等于650μm；“薄片”是指具有至少3的长宽比(L/W)的薄微型装置；“打印头结构”和“打印头芯片”是指喷墨打印机或其它喷墨式分配器用于从一个或多个开口分配流体的零件。打印头结构包括一个或多个打印头芯片。“打印头结构”和“打印头芯片”不限于用墨和其它打印流体打印，也包括其它流体的喷墨式分配或用于除打印之外或作为其补充的用途。
示例性实施例
图1是正视剖视图，示出了实现为打印头结构100的模制流体流动结构100的一个示例，打印头结构100适合在喷墨打印机的打印杆中使用。打印头结构100包括微型装置102，其被模制到塑料或其它可模制材料的一体化主体104中。模制主体104在本文中也可被称为模制件104。通常，微型装置102可以是例如电子装置、机械装置或微机电系统(MEMS)装置。在图1的本发明的打印头结构100中，微型装置102实现为打印头芯片102。打印头芯片102包括硅芯片衬底106，其包括厚度大约100微米的硅薄片。硅衬底106包括干蚀刻或以其它方式形成于其中的流体供给孔108，用于允许流体流从第一外表面110穿过衬底106至第二外表面112。硅衬底106还包括薄硅盖114(即，跨过硅衬底106的盖)，其邻近且覆盖第一外表面110。硅盖114厚度大约30微米，并且可由硅或某些其它合适的材料形成。
在衬底106的第二外表面112上形成有一个或多个层116，其限定有利于喷射来自打印头结构100的流体滴的流体架构。由层116限定的流体架构大体上包括具有对应的孔口120的喷射室118、歧管(未示出)、以及其它流体通道和结构。(多个)层116可包括例如形成于衬底106上的室层，其具有跨过室层分开地形成的孔口层，或者它们可包括结合室层与孔口层的一体化层。(多个)层116通常由SU8环氧树脂或某些其它聚酰亚胺材料形成。
除了由硅衬底106上的(多个)层116限定的流体架构之外，打印头芯片102包括使用薄膜层和图1中未示出的元件形成于衬底106上的集成电路。例如，对应于每个喷射室118的是形成于衬底106上的热喷射器元件或压电喷射器元件。喷射元件被致动以通过孔口120从室118喷射墨或其它打印流体的滴或料流。
打印头结构100也包括信号迹线或其它导体122，其在形成于衬底106上的电气端子124处连接到打印头芯片102。导体122可以多种方式形成于结构100上。例如，导体122可通过层合或沉积过程形成于绝缘层126中，如图1所示。绝缘层126通常为聚合物材料，其为导体122提供物理支撑和绝缘。在其它示例中，导体122可被模制到模制主体104中。
锯限定的流体通道128穿过模制主体104和薄硅盖114形成，并且在外表面110处与打印头芯片衬底106相连。流体通道128打开穿过模制主体和薄硅盖114的通路，该通路使得流体能够通过流体供给孔108直接流入硅衬底106并且在外表面110处流到硅衬底106上。如下文更详细地讨论的，流体通道128使用诸如旋转切割锯的切割锯穿过模制主体104形成。
图2是框图，示出了系统200，该系统实现诸如图1中所示打印头结构100的模制流体流动结构100。系统200包括流体供应源202，流体供应源202操作性地连接到流体移动器204，流体移动器204被构造用于将流体移动至流体流动结构100中的通道128，例如，打印头结构100中的锯限定的流体通道128。流体供应源202可包括例如用于冷却电子微型装置102的作为空气源的大气环境或打印头芯片102的打印流体供应源。流体移动器204表示泵、风扇、重力或任何其它合适的机构，以用于将流体从源202移动至流动结构100。
图3是框图，示出了实现衬底宽打印杆302中的流体流动结构100的一个示例的喷墨打印机300。打印机300包括跨越打印衬底304的宽度的打印杆302、与打印杆302相关联的流调节器306、衬底输送机构308、墨或其它打印流体供应源310、以及打印机控制器312。控制器312表示编程、(多个)处理器和相关联的存储器、以及控制打印机300的操作元件所需的电子电路和部件。打印杆302包括打印头芯片102的布置，以用于将打印流体分配到纸张或其它打印衬底304的片材或连续幅材上。每个打印头芯片102通过从供应源310进入且穿过流调节器306和打印杆302中的流体通道128的流动路径接纳打印流体。
图4-6示出了喷墨打印杆302，其将模制流体流动结构100的一个示例实现为适合在图3的打印机300中使用的打印头结构100。参看图4的平面图，打印头芯片102被嵌入细长的一体化模制件104中，并且在行400中大体端对端地布置成交错构型，在该构型中，每一行中的打印头芯片102与该行中的另一个打印头芯片重叠。在该构型中，每行400打印头芯片102接纳来自不同的锯限定的流体通道128(图4中以虚线示出)的打印流体。虽然显示了用于四行400交错的打印头芯片102供给的四个流体通道128(例如，用于打印四种不同的颜色)，但其它合适的构型是可能的。图5示出了喷墨打印杆302沿图4中的线5-5截取的透视剖视图，图6示出了喷墨打印杆302沿图4中的线5-5截取的剖视图。图6的剖视图显示了如上文结合图1讨论的打印头结构100的各种细节。
虽然已结合图1-6大体上示出和讨论了锯限定的流体通道128的特定形状或构型，但可以使用切割锯实现各种不同构型的流体通道128。如下文所讨论的，图11-15示出了不同形状的锯限定的流体通道128的示例，其可以使用具有诸如图7-9中所示那样的不同形状的锯片外周边缘的切割锯容易地切割到流体流动结构100的模制主体104中。
图7-9示出了用于使用旋转切割锯700在流体流动结构100的模制主体104内限定流体通道128的示例性过程。图17是图7-9中所示过程的流程图1700。图7显示了侧向正视图，示出了在模制流体流动结构100中形成锯限定的流体通道128的示例性方法。图7的侧向正视图沿着图8和9两者中的线7-7截取。图8显示了正视剖视图，示出了使用具有大体正方形的锯片外周边缘800的旋转切割锯700在模制流体流动结构100中形成锯限定的流体通道128的示例性方法。大体正方形的锯片外周边缘800的特征在于旋转锯700的侧面一直到锯的外周边缘都保持彼此平行。图9显示了正视剖视图，示出了使用具有大体渐缩的锯片外周边缘900的旋转切割锯700在模制流体流动结构100中形成锯限定的流体通道128的示例性方法。大体渐缩的锯片外周边缘900的特征在于旋转锯700的侧面在锯的外周边缘附近朝彼此向内发散。图8和9的剖视图沿着图7的线8-8和9-9截取。
现在主要参看图700和图17，虽然模制流体流动结构100保持在固定位置，但旋转切割锯700被启动以例如在顺时针方向702上旋转，以开始在结构100中切割流体通道128(图17中的步骤1702)。旋转切割锯700的外周切割边缘(例如，800、900)可以是参差不齐的，和/或具有形成于其上的磨料，以便在锯旋转时执行切割操作。例如，锯700可具有菱形结壳的切割边缘。旋转切割锯700在竖直方向上被降低以接合并冲切模制主体104(参见锯700的虚线表示704)(图17中的步骤1704)。特别地，旋转切割锯700在垂直于硅衬底106的外表面110的第一方向706上移动以在模制主体104和硅盖114中部分地形成流体通道128。即，锯700被降低至穿过模制主体104和硅盖114两者(参见锯700的虚线表示708)，这部分地形成流体通道128。旋转切割锯700接着水平移动以拖切模制主体104和硅盖114(参见锯700的虚线表示710)(图17中的步骤1706)。特别地，旋转切割锯700在平行于硅衬底106的外表面110的第二方向712上移动，以完成流体通道128的成形。旋转切割锯700可接着沿着水平方向714和竖直方向716移动回到其初始位置(图17中的步骤1708)。
图11-15所示各种形状的锯限定的流体通道128以与上文结合图7刚讨论的相同的大体方式形成。然而，在形成不同形状的通道128过程中，具有不同形状的外周切割边缘的旋转锯片(例如，图8，800；图9，900)可单独地或组合地使用并且以变化的顺序施加到模制流体流动结构100。此外，虽然流体通道128形成为使得它们大体上平行于细长的一体化模制主体的长度(参见图4-6)延伸并且对应于打印头芯片102的长度，但通道也可被切割成不同的取向，例如垂直于所示取向的取向。以这样的方式切割的通道可在不同方向上并且为了不同的目的而将流体导引通过流体流动结构100。例如，垂直于图4-6中所示那样切割的通道可用来利用垂直的通道连接件接合两个平行的通道。
现在参看图10，模制流体流动结构100显示为在形成锯限定的流体通道128之前。流体流动结构100被以与上文结合图1所讨论的相同的大体方式构造，所不同的是，导体22显示为嵌入模制主体104内，而不是在单独的绝缘层126内。该构型贯穿图10-15中使用，以用于简化图示的一般目的。
现在参看图11，锯限定的流体通道128形成于彼此基本上平行的第一侧壁S1和第二侧壁S2。平行的侧壁S1和S2可例如使用如图8所示的旋转切割锯700形成。图8的旋转切割锯700具有由平行的锯片侧面表征的大体正方形的锯片外周边缘800，平行的锯片侧面在冲切到流体流动结构100的模制主体104中时从薄硅盖114移除模制材料和硅，从而留下基本上平行的锯切割侧壁S1和S2。
图12示出了锯限定的流体通道128，其形成有相对于彼此渐缩的第一侧壁S1和第二侧壁S2。渐缩的侧壁在它们更靠近衬底106中的流体供给孔108时朝彼此渐缩，并且在它们从衬底106后退时彼此远离。渐缩的侧壁S1和S2可例如使用如图9所示的旋转切割锯700形成。图9的旋转切割锯700具有大体渐缩的锯片外周边缘900，其特征在于旋转锯700的侧面在锯的外周边缘附近朝彼此向内发散。当冲切到流体流动结构100的模制主体104中时，带有锯片边缘900的锯从薄硅盖114移除模制材料和硅，从而留下渐缩的锯切割侧壁S1和S2。
图13、14和15各自示出了形成有第一侧壁S1和第二侧壁S2的锯限定的流体通道128，这两个侧壁均为相对于彼此基本上平行且渐缩的。侧壁S1和S2的平行部段可使用如图8所示的旋转切割锯700形成，侧壁S1和S2的渐缩部段使用如图9所示的旋转切割锯700形成。具有不同的渐缩角度的侧壁部段使用如图9所示的切割锯700形成，该切割锯的侧面具有在其接近锯的外周边缘时朝彼此向内发散的变化的角度。
在图13中，侧壁S1和S2的平行部段邻近薄片衬底106，渐缩部段朝彼此向内渐缩以与平行部段相遇。在图14中，侧壁S1和S2的渐缩部段邻近薄片衬底106。渐缩部段朝彼此渐缩以与薄片衬底106相遇，并且远离彼此渐缩以与平行侧壁部段相遇。在图15中，侧壁S1和S2的平行部段邻近薄片衬底106，并且第一组渐缩部段朝彼此向内渐缩以与平行部段相遇。第二组渐缩部段向内渐缩以与第一组渐缩部段相遇。
通常，图11-15所示锯切割流体通道128具有形成为各种平行和/或渐缩构型的通道侧壁S1和S2。在其从打印头薄片衬底106后退时发散或渐缩远离彼此的通道侧壁提供有助于气泡移动远离孔口120、喷射室118和流体供给孔108的益处，在这些地方，气泡否则可能阻碍或阻止流体的流动。因此，图11-15所示流体通道128包括在其从薄片衬底106后退时平行和/或发散的侧壁。然而，图示通道侧壁构型并非意图限制在锯限定的流体通道128内的侧壁的其它形状和构型。相反，本公开设想：具有以未具体示出或讨论的各种其它构型成形的侧壁的其它锯限定的流体通道是可能的。
图16示出了用于制造具有锯限定的流体通道128的打印头流体流动结构100的示例性过程。图18是图16中所示过程的流程图1800。如图16所示，在部分“A”处，打印头芯片102使用热释放条带162附接到载体160(图18中的步骤1802)。打印头芯片102孔口侧朝下放置在载体160上。打印头芯片102处于预处理状态，使得它已经包括形成于薄片衬底106上的(多个)层116，(多个)层116限定流体架构(例如，喷射室118、孔口120)、以及电气端子124和喷射元件(未示出)。流体供给孔108也已经被干蚀刻或以其它方式形成于薄片衬底106中。
如图16的部分“B”处所示，打印头芯片102被模制到模制主体104中(图18中的步骤1804)。在一个示例中，芯片102使用模具顶部164压缩模制。如图16的部分“C”处所示，载体160被从热条带162释放，并且条带被移除(图18中的步骤1806)。在图16的部分“D”处，聚合物绝缘层126被层合到打印头芯片102的孔口侧上，然后被图案化和固化(图18中的步骤1808)。SU8喷射室保护层166被沉积跨过流体架构(多个)层116，如图16中在部分“E”处所示(图18中的步骤1810)。在如图16所示的部分“F”处，金属层(Cu/Au)被沉积到聚合物绝缘层126上并且被图案化到导体迹线122中(图18中的步骤1812)。顶部聚合物绝缘层126然后被旋涂跨过导体迹线122，然后被图案化和固化，如在图16的部分“G”处所示(图18中的步骤1814)。在图16的部分“H”处，喷射室保护层166被剥离，并且执行聚合物绝缘层126的最终固化(图18中的步骤1816)。如图16的部分“I”处所示，锯切割流体通道128接着形成于打印头流体流动结构100的背侧中。流体通道128如上文结合图7和17中所示流体通道形成过程那样形成。流体通道128可被构造成各种形状，例如上文结合图11-15所讨论那些。

Claims (15)

1.一种流体流动结构，包括：
微型装置，其嵌入模制件中；
流体供给孔，其穿过所述微型装置形成；以及
切割穿过所述模制件的锯限定的流体通道，其将所述流体供给孔与所述通道流体联接。
2.根据权利要求1所述的结构，其中，所述通道包括第一和第二基本上平行的侧壁。
3.根据权利要求1所述的结构，其中，所述通道包括第一和第二渐缩的侧壁。
4.根据权利要求3所述的结构，其中，所述渐缩的侧壁在它们变得更靠近所述流体供给孔时朝彼此渐缩。
5.根据权利要求1所述的结构，其中，所述通道包括第一和第二侧壁，所述第一和第二侧壁包括渐缩侧壁部段和基本上平行的侧壁部段两者。
6.根据权利要求5所述的结构，其中，所述渐缩的侧壁部段邻近所述微型装置，使得它们朝彼此渐缩以与所述微型装置相遇并且渐缩远离彼此以与所述平行的侧壁部段相遇。
7.根据权利要求5所述的结构，其中，所述平行的侧壁部段邻近所述微型装置，并且所述渐缩的侧壁部段朝彼此渐缩以与所述平行的侧壁部段相遇。
8.根据权利要求1所述的结构，还包括跨过所述微型装置的硅盖，其中，所述锯限定的流体通道包括切割穿过所述模制件和所述硅盖两者的锯限定的流体通道，以将所述流体供给孔与所述通道流体联接。
9.根据权利要求1所述的结构，其中，所述侧壁为模制侧壁。
10.一种在打印头流体流动结构中制造流体通道的方法，包括：
启动旋转切割锯；以及
将所述锯冲切到所述打印头流体流动结构的模制主体中以形成流体通道。
11.根据权利要求10所述的方法，其中，冲切所述锯包括将所述锯冲切穿过所述模制主体并且穿过硅盖，所述硅盖覆盖薄片硅衬底中的流体供给孔。
12.一种制造打印头结构的方法，包括：
在模制主体内模制打印头芯片；以及
利用切割锯将流体通道锯到所述模制主体中。
13.根据权利要求12所述的方法，其中，锯流体通道包括穿过所述模制主体且穿过硅盖而锯流体通道，所述硅盖覆盖所述打印头芯片的薄片硅衬底中的流体供给孔。
14.根据权利要求13所述的方法，其中，穿过所述硅盖而锯使得所述流体通道流体联接到所述供给孔，允许流体流从所述流体通道穿过所述薄片硅衬底。
15.根据权利要求13所述的方法，其中，锯流体通道包括锯具有如下侧壁的流体通道：该侧壁在它们更靠近所述薄片硅衬底时朝彼此渐缩。
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