CN105142915A - 具有压缩模塑的流体通道的流体结构 - Google Patents

具有压缩模塑的流体通道的流体结构 Download PDF

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Publication number
CN105142915A
CN105142915A CN201380076065.8A CN201380076065A CN105142915A CN 105142915 A CN105142915 A CN 105142915A CN 201380076065 A CN201380076065 A CN 201380076065A CN 105142915 A CN105142915 A CN 105142915A
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China
Prior art keywords
fluid
passage
print head
compression molding
chip
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CN201380076065.8A
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CN105142915B (zh
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陈健华
M.W.坎比
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority claimed from PCT/US2013/028216 external-priority patent/WO2014133517A1/en
Priority claimed from PCT/US2013/028207 external-priority patent/WO2014133516A1/en
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Publication of CN105142915A publication Critical patent/CN105142915A/zh
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
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    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
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    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

在实施例中，一种流体流动结构包括：嵌入模塑件中的微型装置；贯穿所述微型装置形成的流体供给孔。流体通道被流体耦接到所述流体供给孔，并且包括第一压缩模塑通道区段和第二材料消除通道区段。

Description

具有压缩模塑的流体通道的流体结构
背景技术
喷墨笔或打印杆中的打印头芯片包括在硅衬底表面上的多个流体喷射元件。流体通过形成在衬底中位于相反的衬底表面之间的流体传送槽流到喷射元件。虽然流体传送槽足以将流体传送到流体喷射元件，但这类槽具有一些缺点。例如，在成本方面，流体传送槽占据了昂贵的硅实体并且增加了高昂的槽加工成本。此外，通过减小芯片的尺寸部分地实现了降低打印头芯片的成本。较小的芯片尺寸会致使硅衬底中的槽间距和/或槽宽度缩小。但是，减小芯片和槽间距增加了与组装期间将小芯片集成到笔中相关的喷墨笔成本。在结构方面，从衬底移除材料以形成墨传送槽会弱化打印头芯片。因此，当单个打印头芯片具有多个槽时（例如，用以在多色打印头芯片中提供不同颜色，或用以在单色打印头芯片中提高打印质量和速度），每增加一个槽都会使得打印头芯片变得更易损坏。
附图说明
现在将以举例方式参照附图描述本发明的实施例，在附图中：
图1是立视剖视图，图示了被实现为打印头结构的压缩模塑的流体流动结构的一个例子；
图2是方块图，图示了实现诸如图1的打印头结构的压缩模塑的流体流动结构的示例性系统；
图3是方块图，图示了实现具有衬底宽度的打印杆中的流体流动结构的一个例子的喷墨打印机；
图4-6图示了喷墨打印杆，其实现了压缩模塑的流体流动结构的一个例子，如适合用于打印机的打印头结构；
图7-10图示了用于制造具有流体通道的压缩模塑的打印头流体流动结构的示例性方法，该通道通过包括压缩模塑和材料消除的过程形成；
图11是用于制造图7-10所示的压缩模塑的打印头流体流动结构的示例性方法的流程图；
图12-14图示模具顶部的例子，其具有可用于压缩模塑过程以产生不同形状的流体通道的变化的表面形态的设计。
在所有附图中，相同的附图标记表示相似但不必相同的元件。
具体实施方式
概述
过去通过减小芯片尺寸和降低晶片成本已经实现了降低常规喷墨打印头芯片的成本。芯片尺寸主要取决于将墨从芯片一侧上的容器传送到芯片另一侧上的流体喷射元件的流体传送狭槽的间距。因此，用于减小芯片尺寸的现有方法大多数涉及通过硅开槽过程减小槽间距和尺寸，硅开槽过程包括例如激光加工、各向异性湿蚀刻、干蚀刻以及它们的组合等。遗憾的是，硅开槽过程本身显著增加了打印头芯片的成本。此外，成功地减小槽间距的回报越来越小，因为与将减小的芯片（由更加紧密的槽间距导致的结果）集成到喷墨笔相关的成本变得过高。
经压缩模塑的流体流动结构使得能够使用较小的打印头芯片以及简化的流体传送通道/槽形成方法，所述流体传送通道/槽将墨从打印头芯片一侧上的容器传送到芯片另一侧上的流体喷射元件。流体流动结构包括被压缩模塑到塑料、环氧树脂模塑化合物或其他可模塑材料的单块主体中的一个或多个打印头芯片。例如，实现流体流动结构的打印杆包括被模塑到细长的单个模塑主体中的多个打印头芯片。模塑加工通过将流体传送通道（即，墨传送槽）从芯片转移到结构的模塑主体从而使得能够使用更小的芯片。因此，模塑主体有效地增加每个芯片的尺寸，这改善了制造外部流体连接和将芯片附接到其他结构的机会。
在晶片或面板级，在将芯片压缩模塑到流体流动结构中的压缩模塑过程期间，流体传送通道或槽的区段被形成到每个打印头芯片背面处的流体流动结构中。随后利用移除剩余的通道材料并将通道流体耦接到打印头芯片的材料消除过程，诸如粉末爆破，完成流体传送通道。与传统的硅开槽过程相比，在形成流体传送通道时，压缩模塑过程提供了总成本的降低。在压缩模塑过程中形成的流体传送通道的第一压缩模塑区段用作自对齐掩模，该掩模用于随后的材料消除过程，以完成通道。压缩模塑过程通过改变顶部包封模具的表面形态设计，使得能够增加模塑通道/槽的形状、其长度及其侧壁廓形方面的灵活性。
所描述的流体流动结构不限于打印杆或其他类型的用于喷墨打印的打印头结构，而是可以实现在其他装置中和用于其他流体流动应用。因此，在一个例子中，模塑结构包括嵌入到模塑件中的微型装置，所述模塑件具有使流体直接流入或流到装置上的通道或其他路径。微型装置可以是例如电子装置、机械装置或微机电系统（MEMS）装置。例如，流体流可以是流入或流到微型装置上的冷却流体流，或流入打印头芯片或其他流体分配微型装置中的流体流。图中示出和下文描述的这些和其他例子说明了本发明，但不限制本发明，本发明由随附于该说明书的权利要求来限定。
如在本文件中使用的，“微型装置”是指具有小于或等于30mm的一个或多个外部尺寸的装置；“薄”是指厚度小于或等于650μm；“长条”是指长宽比（L/W）至少为3的薄微型装置；“打印头结构”和“打印头芯片”是指喷墨打印机或其他喷墨式分配器的从一个或多个开口分配流体的那部分。打印头结构包括一个或多个打印头芯片。“打印头结构”和“打印头芯片”不限于用墨或其他打印流体来打印，而是还包括用于除了打印之外或不同于打印的用途的其他流体的喷墨式分配。
说明性实施例
图1是立视剖视图，图示了被实现成适合用于喷墨打印机的打印杆中的打印头结构100的压缩模塑的流体流动结构100的一个例子。打印头结构100包括被压缩模塑到塑料或其他可模塑材料的单块主体104中的微型装置102。模塑主体104在此还可被称作模塑件104。一般地，微型装置102可以是例如电子装置、机械装置或微机电系统（MEMS）装置。在图1的本打印头结构100中，微型装置102被实现成打印头芯片102。打印头芯片102包括硅芯片衬底106，该衬底包括厚度约为100微米的薄硅长条。薄长条硅衬底106包括干蚀刻或以其他方式形成在其中的流体供给孔108，其使得流体能够通过衬底106从第一外表面110流到第二外表面112。硅衬底106还包括与第一外表面110相邻并覆盖第一外表面110的硅帽114（即，硅衬底106上的帽）。硅帽114的厚度约为30微米，并且可由硅或一些其他合适的材料形成，诸如聚合物层、厚金属层或厚电介质层。在一个实施方式中，例如，聚合物膜可被层压到薄硅长条上，以覆盖硅衬底106，由此在压缩模塑过程中，环氧树脂模塑化合物将不会进入流体供给孔108。
在衬底106的第二外表面112上形成一个或多个层116，所述层限定了促进从打印头结构100喷射流体滴的流体构造。由层116限定的流体构造通常包括具有相对应的孔口120的喷射腔118、歧管（未示出）以及其他流体通道和结构。一个或多个层116可包括例如形成在衬底116上的腔层和在腔层上单独形成的孔口层，或者它们可包括将腔层和孔口层两者结合在一起的整体层。一个或多个层116典型地由SU8环氧树脂或一些其他聚酰亚胺材料形成。
除了由硅衬底106上的一个或多个层116限定的流体构造之外，打印头芯片102包括形成在衬底106上的集成电路。集成电路利用薄膜层和图1中未具体示出的其他元件形成。例如，在衬底106的第二外表面112上形成与每个喷射腔118相对应的热喷射器元件或压电喷射器元件。启动喷射元件，以便通过孔口120从腔118喷射墨或其他打印流体的滴或流。
打印头结构100还包括通过形成在衬底106上的电端子124连接到打印头芯片102的信号迹线或其他导体122。导体122可以各种方式形成在结构100上。例如，可利用层压或沉积过程在如图1所示的绝缘层126中形成导体122。绝缘层126典型地是为导体122提供物理支撑和绝缘作用的聚合物材料。在其他实施方式中，例如，导体122可被模塑到模塑主体104中，如下面在图6中示出的。
流体通道128贯穿模塑主体104形成，并且薄硅帽114在外表面110处与打印头芯片衬底106流体耦接在一起。在将打印头芯片102模塑到打印头结构100中的压缩模塑过程期间，形成通道128的第一区段。通过利用第一通道区段作为自对齐掩模来移除通道材料的材料消除过程，形成通道128的其余部分。流体通道128提供了通过模塑主体和薄硅帽114的路径，该路径使得流体能够在外表面110处直接流到硅衬底106上，并且通过流体供给孔108流入硅衬底106中，然后流入腔118。如下面更详细地论述的，部分地利用压缩模塑过程在模塑主体104中形成流体通道128，压缩模塑过程能够形成各种不同的通道形状，其廓形各自反映了模塑过程期间所使用的包封模具的表面形态的相反形状。
图2是方块图，图示了实现了诸如图1所示的打印头结构100的压缩模塑的流体流动结构100的系统200。系统200包括操作性地连接到流体移动器204的流体源202，流体移动器204被配置为将流体移动到通过压缩模塑和材料消除过程形成在流体流动结构100中的流体通道128。流体源202可包括例如用以冷却微型电子装置102的作为空气源的大气，或用于打印头芯片102的打印流体供应。流体移动器204表示泵、风扇、重力或用于将流体从源202移动到流动结构100的任何其他合适的机构。
图3是方块图，图示了实现具有衬底宽度的打印杆302中的流体流动结构100的一个例子的喷墨打印机300。打印机300包括跨打印衬底304的宽度的打印杆302、与打印杆302相关连的流调节器306、衬底运送机构308、墨或其他打印流体供应310以及打印机控制器312。控制器312表示程序、一个或多个处理器和相关的存储器，以及控制打印机300的操作元件的电子电路和部件。打印杆302包括打印头芯片102的布置，用于将打印流体分配到一张纸或纸的连续幅面或其他打印衬底304上。每个打印头芯片102通过一流动路径来接收打印流体，该流动路径从供应310延伸到流调节器306中，并延伸通过流调节器，然后延伸通过打印杆302中的压缩模塑的流体通道128。
图4-6图示了实现压缩模塑的流体流动结构100的一个例子（如适合用于图3所示的打印机300的打印头结构100）的喷墨打印杆302。参照图4的平面图，打印头芯片102被嵌入细长的单块模塑件104中，并且大体端对端地布置成多行400。打印头芯片102被布置为交错配置，其中，每行中的芯片与同一行中的另一打印头芯片重叠。在此配置中，打印头芯片102的每行400从不同的压缩模塑的流体通道128（由图4中的虚线图示）接收打印流体。虽然示出了四个流体通道128对交错的打印头芯片102的四行400（例如，用于打印四种不同的颜色）进行供给，但可以采用其他合适的配置。图5图示了沿图4中的线5-5截取的喷墨打印杆302的立体剖视图，图6图示了同样沿图4中的线5-5截取的喷墨打印杆302的剖视图。图6的剖视图示出了上文参照图1论述的打印头结构100的各种细节。
图7-10图示用于制造具有流体通道128的压缩模塑的打印头流体流动结构100的示例性方法，该流体通道由包括压缩模塑和材料消除的过程形成。图11是图7-10所示方法的流程图1100。如图7所示，在部分“A”处，利用热释放胶带162将打印头芯片102附接到载体160（图11中的步骤1102），形成芯片载体组件163。打印头芯片102被放置成使孔口120侧向下放置到载体160上。打印头芯片102处于预加工状态，从而使得它已经包括限定流体构造（例如，喷射腔18、孔口120）的一个或多个层116以及电端子124，以及形成在薄长条衬底106上的喷射元件（未示出）。流体供给孔108也已经被干蚀刻或以其他方式形成在长条衬底106中。
参照图7，在部分“B”处，将打印头芯片102压缩模塑到模塑主体104中（图11中的步骤1104）。一般来说，压缩模塑过程涉及预加热模塑材料，诸如塑料或环氧树脂模塑化合物，并将材料与芯片102一起放入被加热的模具腔室中，诸如底部模具164内的区域。使模具顶部166下降，以封闭模具，并且加热模塑材料并施加压力将其压入腔室内的所有区域中，从而使得它形成包裹打印头芯片102的模塑件104。除了包裹芯片102之外，模塑件104的形状的轮廓遵循模具顶部166的表面形态。在本例子中，模塑件104形成部分流体通道168，其构成衬底106的第一外（背侧）表面110处的流体通道128的第一压缩模塑区段169，如图7的部分“C”所示。
仍参照图7，部分“B”和“C”，显然，在压缩模塑过程期间，硅帽114防止模塑材料进入长条衬底106中的流体供给孔108中。此外，压缩模塑过程在硅帽114之上留下了模塑材料的剩余层170。因此，如部分“C”所示，部分流体通道168（第一压缩模塑通道区段169）未一直延伸到墨供给孔108。因此，随后在下述材料消除过程中完成流体通道128。如图7的部分“C”所示，从底部和顶部模具（164、166）中移除芯片载体组件163，并且从热胶带162释放载体160，并且从芯片移除胶带（图11中的步骤1106）。
如图7的部分“D”所示，将聚合物绝缘层126层压到打印头芯片102的孔口120侧上，然后对其进行图案化和固化（图11的步骤1108）。将SU8发射室保护层172沉积在一个或多个流体构造层116上，如图7的部分“E”所示（图11中的步骤1110）。在部分“F”，如图7所示，将金属层（Cu/Au）沉积到聚合物绝缘层126上并将金属层图案化成导体迹线122（图11中的步骤1112）。然后，将顶部聚合物绝缘层126旋涂在导体迹线122上，之后图案化和固化该绝缘层，如图7的部分“G”所示（图11中的步骤1114）。在图7的部分“H”，剥离发射室保护层166，并且执行聚合物绝缘层126的最终固化（图11中的步骤1116）。如图7的部分“I”所示，移除衬底106中流体供给孔108区域上方的模塑材料的剩余层170和硅帽114，形成完整的流体通道128（图11的步骤1118）。在一个例子中，材料消除过程用于移除剩余层170和硅帽114。因此，完整的流体通道128包括第一压缩模塑通道区段169和是材料消除通道区段174的第二区段。
图8-10进一步图示了图7的部分“I”中所示的材料移除（消除）过程步骤。存在可用于从硅帽114和保留在硅帽114上的模塑材料的剩余层170移除材料的各种过程。这些材料消除过程可包括例如粉末爆破、蚀刻、激光加工、铣削、钻削、放电加工等。这类过程常常涉及使用掩模，掩模防止移除材料不应当被移除的区域中的材料。在本情形中，在图7的部分“B”和“C”所示的压缩模塑步骤期间形成的第一压缩模塑通道区段169用作引导蚀刻剂或其他磨蚀物质800的自对齐掩模，以从延伸区域中的硅帽114和剩余层170移除材料，并完成通道。材料消除过程形成第二材料消除通道区段174，其延长第一通道区段169，形成完整的流体通道128。完整的流体通道128提供了通过模塑主体并通过薄硅帽114的路径，使得流体能够直接流到外表面110处的硅衬底106上，并通过流体供给孔108流入硅衬底106中，然后流入腔118。
如图8所示，蚀刻剂或其他磨蚀物质800可通过第一通道区段169引导，以通过消除来移除通道闭合端处的材料。消除过程从保留在硅帽114上的模塑材料的剩余层170开始（图11中的步骤1120）。因此，图7的部分“I”所示的材料消除过程首先移除剩余层170并使硅帽114暴露于蚀刻剂或其他磨蚀材料800，如图9所示。然后，材料消除过程进行到从通道区域中的硅帽114移除材料（图11中的步骤1122），其将通道延伸至衬底106的外表面110。移除剩余层170和硅帽材料会形成第二（材料消除）通道区段174，其完成流体通道128并使流体供给孔108通向通道128（图11中的步骤1124）。因此，完整的流体通道128包括是压缩模塑通道区段169的第一区段和是材料消除通道区段174的第二区段。
如在上述图中可见的，压缩模塑过程可在流体通道内128产生不同的形状。更具体地，图1、图5和图6都图示了具有彼此平行的大体平直侧壁的流体通道128，而图7-10示出了具有相对于彼此呈楔形或发散的平直侧壁的流体通道128。在压缩模塑过程期间可利用具有不同表面形态设计的模具顶部166产生不同的流体通道形状。一般来说，流体通道128的最终得到的形状相反地遵循压缩模塑过程中使用的模具顶部166的表面形态的轮廓。
图12-14图示了具有可在压缩模塑过程中用于产生不同形状的流体通道128的不同表面形态设计的模具顶部166的若干附加例子。如图12所示，模具顶部166具有使得流体通道128的模塑侧壁S1和S2彼此成镜像的轮廓。侧壁S1和S2中的每个都具有两个大体平直的部段，一个部段中侧壁互相平行，一个部段中侧壁呈楔形。在图13中，模具顶部166的轮廓使得流体通道128的模塑侧壁S1和S2各自具有大体平直的两个部段。包括侧壁的两个部段都是楔形的，并且当它们远离彼此呈楔形时也成镜像。如图14所示，模具顶部166也可具有在流体通道128内产生弯曲的侧壁形状的弯曲（或其他形状的）轮廓。
一般来说，附图示出和以上论述的模塑流体通道128具有形成为彼此平行和/或呈楔形和/或成镜像的各种平直和/或弯曲配置的通道侧壁。在大多数情形中，有益的是，随着通道侧壁从长条的打印头衬底106后退或远离移动，通道侧壁远离彼此发散或呈楔形。这种发散提供了帮助空气泡移动离开孔口120、喷射腔118和流体供给孔108的益处，否则在操作期间它们可能在这些地方阻碍或阻止流体流动。因此，附图论述和示出的流体通道128包括典型地是发散的、但至少在它们从长条衬底106后退时是平行的侧壁。但是，所示通道侧壁的形状和配置并未意图成为对可利用压缩模塑过程形成的流体通道128内的侧壁的其他形状和配置的限制。反而，本发明设想了，其他压缩模塑的流体通道有可能使侧壁被形成为未具体说明或论述的各种其他配置。

Claims (17)

1.一种在打印头结构中制造流体通道的方法，包括：
将打印头芯片放置在载体上；
将所述芯片压缩模塑到模塑打印头结构中；
与压缩模塑所述芯片同时地，将流体通道的第一区段压缩模塑到所述模塑打印头结构中；
对所述流体通道的第二区段进行材料消除，以使所述通道与所述芯片中的流体供给孔耦接在一起。
2.如权利要求1所述的方法，进一步包括在所述消除期间将所述通道的所述第一区段用作掩模。
3.如权利要求1所述的方法，其中，所述材料消除包括从所述通道的所述第一区段和所述芯片之间移除模塑材料的剩余层。
4.如权利要求3所述的方法，其中，所述材料消除进一步包括从所述芯片上的帽移除材料，以露出所述流体供给孔。
5.如权利要求4所述的方法，其中，从所述帽移除材料包括移除从下述组中选择的材料，所述组包括硅、聚合物、金属和电介质。
6.如权利要求1所述的方法，其中，材料消除包括利用从下述组中选择的过程，所述组包括粉末爆破、蚀刻、激光加工、铣削、钻削和放电加工。
7.一种流体流动结构，包括：
嵌入模塑件中的微型装置；
贯穿所述微型装置形成的流体供给孔；以及
流体耦接到所述流体供给孔的流体通道，其包括第一压缩模塑通道区段和第二材料消除通道区段。
8.如权利要求7所述的结构，其中，所述压缩模塑通道区段贯穿所述模塑件形成，并且所述材料消除通道区段贯穿覆盖所述流体供给孔的帽形成。
9.如权利要求8所述的结构，其中，所述帽包括从下述组中选择的材料，所述组包括硅、聚合物、金属和电介质。
10.如权利要求7所述的结构，其中，所述压缩模塑通道区段的通道具有的形状的轮廓相反地遵循用于形成所述模塑件的顶部包封模具的表面形态。
11.如权利要求7所述的结构，其中，所述通道包括第一和第二侧壁，所述第一和第二侧壁随着它们从所述微型装置延伸远离而相对于彼此发散，并且随着它们靠近所述微型装置而朝向彼此会聚。
12.如权利要求7所述的结构，其中，所述通道包括彼此基本平行的第一和第二平直侧壁。
13.如权利要求7所述的结构，其中，所述通道包括相对于彼此呈楔形的第一和第二平直侧壁。
14.如权利要求7所述的结构，其中，所述通道包括彼此成镜像的第一和第二弯曲侧壁。
15.如权利要求7所述的结构，其中，所述通道包括第一侧壁和第二侧壁，每个侧壁具有从下述组中选择的多个轮廓，所述组包括平直轮廓、楔形轮廓和弯曲轮廓。
16.一种流体流动结构，包括：
被压缩模塑到模塑件中的打印头芯片长条；
从第一外表面至第二外表面延伸穿过所述打印头芯片长条的流体供给孔；
具有压缩模塑通道区段和材料消除通道区段的流体通道，所述材料消除通道区段直接连接到所述第一外表面。
17.如权利要求16所述的结构，其中，所述模塑件包括被压缩模塑在多个打印头芯片长条周围的单块主体，所述主体具有模塑在其中的流体通道，通过所述流体通道，流体可直接流到每个打印头芯片长条。
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