CN105121166B - 传递模塑的流体流动结构 - Google Patents

传递模塑的流体流动结构 Download PDF

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Publication number
CN105121166B
CN105121166B CN201380076067.7A CN201380076067A CN105121166B CN 105121166 B CN105121166 B CN 105121166B CN 201380076067 A CN201380076067 A CN 201380076067A CN 105121166 B CN105121166 B CN 105121166B
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Prior art keywords
fluid
fluid passage
print head
chip
chamber
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CN201380076067.7A
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CN105121166A (zh
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陈健华
M.W.坎比
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority claimed from PCT/US2013/028207 external-priority patent/WO2014133516A1/en
Priority claimed from PCT/US2013/028216 external-priority patent/WO2014133517A1/en
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Publication of CN105121166A publication Critical patent/CN105121166A/zh
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    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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Abstract

在实施例中，一种流体流动结构包括：嵌入模塑件中的微型装置；贯穿所述微型装置形成的流体供给孔；以及所述模塑件中的传递模塑的流体通道，其使所述流体供给孔与所述通道流体地耦接在一起。

Description

传递模塑的流体流动结构
背景技术
喷墨笔或打印杆中的打印头芯片包括在硅衬底表面上的多个流体喷射元件。流体通过形成在衬底中位于相反的衬底表面之间的流体传送槽流到喷射元件。虽然流体传送槽足以将流体传送到流体喷射元件，但这类槽具有一些缺点。例如，在成本方面，流体传送槽占据了昂贵的硅实体并且增加了高昂的槽加工成本。此外，通过减小芯片能部分地实现降低打印头芯片的成本，减小芯片继而导致了硅衬底中的槽间距和/或槽宽度的缩小。但是，减小芯片和槽间距增加了与组装期间将小芯片集成到笔中相关的喷墨笔成本。在结构方面，从衬底移除材料以形成墨传送槽会弱化打印头芯片。因此，当单个打印头芯片具有多个槽时（例如，用以在多色打印头芯片中提供不同颜色，或用以在单色打印头芯片中提高打印质量和速度），每增加一个槽都会使得打印头芯片变得更易损坏。
附图说明
现在将以举例方式参照附图来描述本发明的实施例，在附图中：
图1是立视剖视图，图示了被实现为打印头结构的模塑流体流动结构的一个例子；
图2是方块图，图示了实现了诸如图1的打印头结构的模塑流体流动结构的示例性系统；
图3是方块图，图示了实现具有衬底宽度的打印杆中的流体流动结构的一个例子的喷墨打印机；
图4-6图示了喷墨打印杆，其实现了模塑流体流动结构的一个例子，如适合用于打印机的打印头结构；
图7a-e图示了用于制造具有传递模塑的流体通道的模塑打印头流体流动结构的示例性传递模塑过程；
图8图示了与图7a-e相对应的示例性传递模塑过程的流程图；
图9-15图示了可通过传递模塑过程在模塑主体中形成的不同形状的传递模塑的流体通道的各种例子。
在所有附图中，相同的附图标记表示相似但不必相同的元件。
具体实施方式
概述
过去通过减小芯片尺寸和降低晶片成本已经实现了降低常规喷墨打印头芯片的成本。芯片尺寸主要取决于将墨从芯片一侧上的容器传送到芯片另一侧上的流体喷射元件的流体传送槽的间距。因此，用于减小芯片尺寸的现有方法大多数涉及通过硅开槽过程来减小槽的间距和尺寸，硅开槽过程包括例如激光加工、各向异性湿蚀刻、干蚀刻以及它们的组合等。遗憾的是，硅开槽加工本身显著增加了打印头芯片的成本。此外，成功地减小槽间距的回报越来越小，因为与将减小的芯片（由更加紧密的槽间距导致的结果）集成到喷墨笔相关的成本变得过高。
经传递模塑的流体流动结构使得能够使用较小的打印头芯片以及简化的流体传送通道形成方法，所述流体传送通道将墨从打印头芯片一侧上的容器传送到芯片另一侧上的流体喷射元件。流体流动结构包括被传递模塑到塑料、环氧树脂模塑化合物或其他可模塑材料的单块主体中的一个或多个打印头芯片。例如，实现流体流动结构的打印杆包括被传递模塑到细长的单个模塑主体中的多个打印头芯片。模塑加工通过将流体传送通道（即，墨传送槽）从芯片转移到结构的模塑主体从而使得能够使用更小的芯片。因此，模塑主体有效地增加了每个芯片的尺寸，这改善了制造外部流体连接和将芯片附接到其他结构的机会。
流体流动结构包括在晶片或面板级利用传递模塑加工在每个芯片背面处的结构中形成的模塑流体传送通道。在形成流体传送通道/槽时，与传统的硅开槽加工相比，传递模塑加工可降低总成本。此外，传递模塑加工通过改变包封模具（mold chase）顶部的表面形态或设计，使得能够增加模塑槽的形状、其长度及其侧壁轮廓方面的灵活性。
所描述的流体流动结构不限于打印杆或其他类型的用于喷墨打印的打印头结构，而是可以实现在其他装置中和用于其他流体流动应用。因此，在一个例子中，新结构包括嵌入到模塑件中的微型装置，所述模塑件具有使流体直接流入或流到装置上的通道或其他路径。微型装置可以是例如电子装置、机械装置或微机电系统（MEMS）装置。例如，流体流可以是流入或流到微型装置中的冷却流体流，或流入打印头芯片或其他流体分配微型装置中的流体流。图中示出和下文描述的这些和其他例子说明了本发明，但不限制本发明，本发明由随附于该说明书的权利要求来限定。
如在本文件中使用的，“微型装置”是指具有小于或等于30mm的一个或多个外部尺寸的装置；“薄”是指厚度小于或等于650μm；“长条”是指长宽比（L/W）至少为3的薄微型装置；“打印头结构”和“打印头芯片”是指喷墨打印机或其他喷墨式分配器的从一个或多个开口分配流体的那部分。打印头结构包括一个或多个打印头芯片。“打印头结构”和“打印头芯片”不限于用墨或其他打印流体来打印，而是还包括用于除了打印之外或不同于打印的用途的其他流体的喷墨式分配。
说明性实施例
图1是立视剖视图，图示了被实现成适合用于喷墨打印机的打印杆中的打印头结构100的传递模塑的流体流动结构100的一个例子。打印头结构100包括被模塑到塑料或其他可模塑材料的单块主体104中的微型装置102。模塑主体104在此还可被称作模塑件104。一般地，微型装置102可以是例如电子装置、机械装置或微机电系统（MEMS）装置。在图1的本打印头结构100中，微型装置102被实现成打印头芯片102。打印头芯片102包括硅芯片衬底106，该衬底包括厚度约为100微米的薄硅长条。硅衬底106包括干蚀刻或以其他方式形成在其中的流体供给孔108，其使得流体能够通过衬底106从第一外表面110流到第二外表面112。
在衬底106的第二外表面112上形成一个或多个层116，所述层限定了促进从打印头结构100喷射流体滴的流体构造。由层116限定的流体构造通常包括具有相对应的孔口120的喷射腔118、歧管（未示出）以及其他流体通道和结构。一个或多个层116可包括例如形成在衬底106上的腔层和在腔层上单独形成的孔口层，或者它们可包括将腔层和孔口层结合在一起的整体层。一个或多个层116典型地由SU8环氧树脂或一些其他聚酰亚胺材料形成。
除了由硅衬底106上的一个或多个层116限定的流体构造之外，打印头芯片102包括形成在衬底106上的集成电路。集成电路利用薄膜层和图1中未具体示出的其他元件形成。例如，在衬底106的第二外表面112上形成与每个喷射腔118相对应的热喷射器元件或压电喷射器元件。启动喷射元件，以便通过孔口120从腔118喷射墨或其他打印流体的滴或流。
打印头结构100还包括通过形成在衬底106上的电端子124连接到打印头芯片102的信号迹线或其他导体122。导体122可以各种方式形成在结构100上。例如，可利用层压或沉积过程在如图1所示的绝缘层126中形成导体122。绝缘层126典型地是为导体122提供物理支撑和绝缘作用的聚合物材料。在其他例子中，导体122可被模塑到模塑主体104中，如下面参照图6-7和9-15示出的。
传递模塑的流体通道128形成到模塑主体104中，并且在外表面110处与打印头芯片的衬底106连接。传递模塑的流体通道128提供了通过模塑主体的路径，该路径使得流体能够在外表面110处直接流到硅衬底106上，并且通过流体供给孔108流入硅衬底106中，然后流入腔118。如下面更详细地论述的，利用传递模塑过程在模塑主体104中形成流体通道128，传递模塑过程使得能够形成各种不同的通道形状，其廓形各自反映了模塑过程期间所使用的包封模具的表面形态的相反形状。
图2是方块图，图示了实现了诸如图1所示的打印头结构100的传递模塑的流体流动结构100的系统200。系统200包括操作性地连接到流体移动器204的流体源202，流体移动器204被配置为将流体移动到形成在流体流动结构100中的传递模塑的通道128。流体源202可包括例如用以冷却微型电子装置102的作为空气源的大气，或用于打印头芯片102的打印流体供应。流体移动器204表示泵、风扇、重力或用于将流体从源202移动到流动结构100的任何其他合适的机构。
图3是方块图，图示了实现具有衬底宽度的打印杆302中的流体流动结构100的一个例子的喷墨打印机300。打印机300包括跨打印衬底304的宽度的打印杆302、与打印杆302相关连的流调节器306、衬底运送机构308、墨或其他打印流体供应310以及打印机控制器312。控制器312表示程序、一个或多个处理器和相关的存储器，以及控制打印机300的操作元件所需的其他电子电路和部件。打印杆302包括打印头芯片102的布置，用于将打印流体分配到一张纸或纸的连续幅面或其他打印衬底304上。每个打印头芯片102通过一流动路径接收打印流体，该流路径从供应310延伸到流调节器306中，并延伸通过流调节器，然后延伸通过打印杆302中的传递模塑的流体通道128。
图4-6图示了实现传递模塑的流体流动结构100的一个例子（如适合用于图3所示的打印机300的打印头结构100）的喷墨打印杆302。参照图4的平面图，打印头芯片102被嵌入细长的单块模塑件104中，并且大体端对端地布置成多行400。打印头芯片102被布置为交错配置，其中，每行中的芯片与同一行中的另一打印头芯片重叠。在此配置中，打印头芯片102的每行400从不同的传递模塑的流体通道128（由图4中的虚线图示）接收打印流体。虽然示出了四个流体通道128对交错的打印头芯片102的四行400（例如，用于打印四种不同的颜色）进行供给，但可以采用其他合适的配置。图5图示了沿图4中的线5-5截取的喷墨打印杆302的立体剖视图，图6图示了沿图4中的线5-5截取的喷墨打印杆302的剖视图。图6的剖视图示出了上文参照图1论述的打印头结构100的各种细节。
虽然已经参照图1-6大体说明和论述了传递模塑的流体通道128的特定形状或配置，但利用传递模塑过程可形成各种不同形状的流体通道128。如下所述，图9-15图示了利用具有变化的表面形态设计的包封模具顶部来使得到流体流动结构100的模塑主体104中的不同形状的传递模塑的流体通道128容易地形成的例子。
现在参照图7a-e，图示了用于制造具有传递模塑的流体通道128的模塑打印头流体流动结构100的示例性传递模塑过程。图8是图7a-e所示过程的相对应的流程图800。如图7a所示，利用热释放胶带162将打印头芯片102附接到载体160（图8中的步骤802），形成芯片载体组件700。打印头芯片102被放置成孔口120侧向下放置到载体160上，如方向箭头所示。打印头芯片102处于预加工状态，从而使得它已经包括限定流体构造（例如，喷射腔118、孔口120）的一个或多个层116以及电导体和端子122/124，以及形成在长条衬底106上的喷射元件（未示出）。流体供给孔108也已经被干蚀刻或以其他方式形成在薄长条衬底106中。
在下一步骤中，除了四个打印头芯片102已经附接到载体160之外，图7b示出了与如图7a所示地已制备的组件类似的芯片载体组件700。如图7b所示，一旦芯片附接到载体160，就将芯片载体组件700置于底部传递包封模具702上（图8中的步骤804）。如图7c所示，在将芯片载体组件700放置到底部传递包封模具702上之后，使传递包封模具的顶部704下降到芯片载体组件700上方位置处（图8中的步骤806）。虽然顶部包封模具704可具有变化的表面形态，以在流体流动结构100的主体104中形成不同形状的传递模塑的流体通道128（例如，见图9-15），但在任何情形中，顶部包封模具704的表面形态都被设计为，使得当定位于芯片载体组件700上方并下降到组件700上时，包封模具密封了薄长条硅衬底106的背面外表面110处的墨供给孔108。将顶部包封模具704放置在芯片载体组件700上方密封了墨供给孔108，并在顶部包封模具和底部包封模具之间以及在芯片载体组件700上的打印头芯片102周围产生腔室706。可选的释放膜可被真空向下保持并符合传递包封模具，以防止污染传递包封模具704并最小化传递模塑过程期间的环氧树脂模的溢料。
仍参照图7c，在下一步骤中，用环氧树脂模塑化合物708（EMC）或其他合适的可模塑材料填充腔室706（图8中的步骤808）。用EMC填充腔室706会形成包裹打印头芯片102的模塑主体104，还会在模塑主体104内形成模塑流体通道128。典型地，用EMC填充腔室706涉及预热EMC，直到它达到熔化温度并成为液体（图8中的步骤810）。可在腔室706内形成真空，然后利用活塞710注入液体EMC，例如通过包封模具的流槽712（即，通道），直到它达到并充满腔室706（图8中的步骤812和814）。由顶部包封模具704形成的对墨供给孔108的密封防止在填充腔室时EMC进入墨供给孔。
在EMC冷却并硬化成固体之后，可从包封模具移除芯片载体组件700，其现在包括附接的模塑打印头流体流动结构100，如图7d所示（图8中的步骤816）。图7d示出了通过热释放胶带162附接到载体160的模塑打印头流体流动结构100。然后，从载体160释放模塑打印头结构100并移除热释放胶带162，如图7e所示（图8中的步骤818）。因此，在本实施方式中，在传递模塑过程中形成模塑打印头结构100。倒转图7e中模塑打印头结构100的位置，以便与图6和图9-15所示的模塑打印头流体流动结构100的视图相一致。
如上所述，在传递模塑过程中使用包封模具顶部704使得能够形成许多不同形状的流体通道128。这通过提供具有变化的表面形态设计的包封模具顶部704来实现。一般来说，流体通道128的最终得到的形状相反地遵循传递模塑过程中所使用的包封模具顶部704的表面形态的轮廓。图9-15图示了不同形状的传递模塑流体通道128的若干例子。
参照图9，传递模塑流体通道128由大体平直并互相平行的第一和第二侧壁S1和S2形成。图10示出了侧壁S1和S2平直并相对于彼此呈楔形的传递模塑流体通道128。楔形的侧壁随着它们靠近衬底106中的流体供给孔108而朝向彼此向内缩窄，并且随着它们相对于衬底106后退时远离彼此。在图11中，传递模塑流体通道128的侧壁S1和S2随着它们接近衬底106中的流体供给孔108以使通道变窄的方式向内弯曲。图12和图13的传递模塑流体通道128示出了侧壁的一些例子，其包括互相平行的平直壁部分和彼此成镜像的弯曲壁部分。因此，传递模塑流体通道128的单个侧壁可具有不同地组合和配置的多个形状的廓形，诸如平直、倾斜和弯曲的廓形。图14示出了传递模塑流体通道128，其侧壁S1和S2中的每个具有与相对的侧壁部段大体平行的两个平直部段。图15示出了单块传递模塑打印头结构100的例子，其多个模塑流体通道128在它们自身之间被塑造成不同形状。在本例子中，一个通道包括楔形侧壁，而另一个通道包括平直形状的侧壁。此外，图15所示的中心流体通道图示了传递模塑流体通道可如何形成为与用于多个打印头芯片102的多个薄长条硅衬底106流体耦接在一起的一个例子。
一般来说，图9-15所示的传递模塑流体通道128具有形成为彼此平行和/或呈楔形和/或成镜像的各种平直和/或弯曲配置的侧壁S1和S2。在大多数情形中，有益的是，随着通道侧壁相对于长条的打印头衬底106后退（即，远离移动），通道侧壁远离彼此发散或呈楔形。这种发散提供了帮助空气泡移动离开孔口120、喷射腔118和流体供给孔108的益处，否则它们可能在这些地方阻碍或阻止流体流动。因此，图9-15所示的流体通道128包括通常是发散的侧壁，但所述侧壁至少在它们从长条衬底106后退时是平行的。但是，所示通道侧壁的形状和配置并未意图成为对可利用传递模塑过程形成的流体通道128内的侧壁的其他形状和配置的限制。反而，本发明设想了，其他传递模塑流体通道有可能使侧壁被形成为未具体说明或论述的各种其他配置。

Claims (16)

1.一种流体流动结构，包括：
嵌入模塑件中的微型装置；
贯穿所述微型装置形成的流体供给孔；以及
所述模塑件中的传递模塑的流体通道，其使所述流体供给孔与所述流体通道流体地耦接在一起，所述流体通道通过传递模塑过程形成。
2.如权利要求1所述的结构，其中，所述流体通道的形状的轮廓相反地遵循用于形成所述流体通道的包封模具的表面形态。
3.如权利要求1所述的结构，其中，所述流体通道包括第一和第二侧壁，所述第一和第二侧壁随着它们远离所述微型装置延伸而相对于彼此发散，并且随着它们靠近所述微型装置而朝向彼此会聚。
4.如权利要求1所述的结构，其中，所述流体通道包括彼此基本平行的第一和第二平直侧壁。
5.如权利要求1所述的结构，其中，所述流体通道包括相对于彼此呈楔形的第一和第二平直侧壁。
6.如权利要求1所述的结构，其中，所述流体通道包括彼此成镜像的第一和第二弯曲侧壁。
7.如权利要求1所述的结构，其中，所述流体通道包括第一侧壁和第二侧壁，每个侧壁具有从下述组中选择的多个轮廓，所述组包括平直轮廓、楔形轮廓和弯曲轮廓。
8.如权利要求7所述的结构，其中，所述第一侧壁的多个轮廓与所述第二侧壁的多个轮廓成镜像。
9.一种流体流动结构，包括：
被传递模塑在多个打印头长条衬底周围的单块主体；以及
所述主体中的多个传递模塑的流体通道，通过这些流体通道，流体能够直接流到所述衬底中的一个或多个，所述流体通道通过传递模塑过程形成。
10.如权利要求9所述的结构，其中，所述流体通道具有不同的形状。
11.如权利要求9所述的结构，其中，单个流体通道与多个衬底流体地耦接在一起，从而使得流体能够通过所述单个流体通道直接流到所述多个衬底。
12.一种在流体流动结构中制造流体通道的方法，包括：
将打印头芯片附接到载体，形成芯片载体组件；
将所述芯片载体组件放置到底部包封模具上；
将顶部包封模具放置在所述芯片载体组件上方，在所述底部包封模具和所述顶部包封模具之间形成腔室；
用环氧树脂模塑化合物填充所述腔室。
13.如权利要求12所述的方法，其中，将顶部包封模具放置在所述芯片载体组件上方包括：密封所述打印头芯片的背侧外表面处的墨供给孔。
14.如权利要求12所述的方法，其中，用所述环氧树脂模塑化合物填充所述腔室包括：
形成包裹所述打印头芯片的模塑主体；以及
在所述模塑主体内形成模塑的流体通道，通过该流体通道，流体能够直接流到所述打印头芯片。
15.如权利要求12所述的方法，其中，用所述环氧树脂模塑化合物填充所述腔室包括：
将所述环氧树脂模塑化合物预热至液相；
在所述腔室内形成真空；以及
将液体的所述环氧树脂模塑化合物注入所述腔室中。
16.如权利要求14所述的方法，进一步包括：
冷却所述环氧树脂模塑化合物；
从所述顶部包封模具和所述底部包封模具中移除带有所述模塑主体的所述芯片载体组件；以及
从所述载体释放所述模塑主体。
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PCT/US2013/033046 WO2014133561A1 (en) 2013-02-28 2013-03-20 Molding a fluid flow structure
PCT/US2013/033865 WO2014133563A1 (en) 2013-02-28 2013-03-26 Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure
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USPCT/US2013/048214 2013-06-27
PCT/US2013/048214 WO2014133576A1 (en) 2013-02-28 2013-06-27 Molded fluid flow structure with saw cut channel
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Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105121171B (zh) 2013-02-28 2017-11-03 惠普发展公司，有限责任合伙企业 模制打印棒
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
KR101827070B1 (ko) 2013-02-28 2018-02-07 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 유체 유동 구조체 성형
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
CN105555539B (zh) * 2013-09-20 2017-08-15 惠普发展公司，有限责任合伙企业 打印杆以及形成打印杆的方法
US9889664B2 (en) 2013-09-20 2018-02-13 Hewlett-Packard Development Company, L.P. Molded printhead structure
WO2015116073A1 (en) 2014-01-30 2015-08-06 Hewlett-Packard Development Company, L.P. Printhead dies molded with nozzle health sensor
BR112016024662B1 (pt) 2014-04-22 2022-02-01 Hewlett-Packard Development Company, L.P Estrutura de fluxo de fluido e cabeça de impressão
CN107531052B (zh) * 2015-05-15 2019-10-11 惠普发展公司有限责任合伙企业 流体喷射设备
EP3271182B1 (en) * 2015-08-21 2021-12-29 Hewlett-Packard Development Company, L.P. Printing apparatus with an emission device to expose printing material
CN108349254B (zh) * 2015-10-12 2020-10-30 惠普发展公司，有限责任合伙企业 打印头
WO2017065744A1 (en) * 2015-10-13 2017-04-20 Hewlett-Packard Development Company, L.P. Printhead with non-epoxy mold compound
WO2017065772A1 (en) 2015-10-15 2017-04-20 Hewlett-Packard Development Company, L.P. Print head interposers
WO2017078661A1 (en) * 2015-11-02 2017-05-11 Hewlett-Packard Development Company, L.P. Fluid ejection die and plastic-based substrate
KR102115149B1 (ko) 2016-02-24 2020-05-26 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 집적 회로를 포함하는 유체 배출 장치
JP6639671B2 (ja) * 2016-02-29 2020-02-05 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． ヒートシンクを含む流体推進装置
JP6750669B2 (ja) 2016-03-29 2020-09-02 富士フイルム和光純薬株式会社 多官能重合型化合物および着色組成物
EP3463902A4 (en) * 2016-11-01 2020-06-03 Hewlett-Packard Development Company, L.P. LIQUID DISPENSER
US10549985B2 (en) * 2016-11-25 2020-02-04 Infineon Technologies Ag Semiconductor package with a through port for sensor applications
US10780697B2 (en) 2017-03-15 2020-09-22 Hewlett-Packard Development Company, L.P. Fluid ejection dies
JP2018163017A (ja) * 2017-03-24 2018-10-18 東芝テック株式会社 液滴分注装置
CN110325372B (zh) * 2017-04-05 2022-02-18 惠普发展公司，有限责任合伙企业 流体喷射装置、打印杆和流体流动结构
CN110461575B (zh) * 2017-05-01 2021-10-01 惠普发展公司，有限责任合伙企业 用于形成模制板的方法和流体喷射装置
CN110461612B (zh) * 2017-05-08 2021-06-08 惠普发展公司，有限责任合伙企业 流体喷射装置和操作流体喷射装置的方法
CN110650846B (zh) * 2017-07-17 2021-04-09 惠普发展公司，有限责任合伙企业 射流盒和可更换打印头
WO2019022735A1 (en) * 2017-07-26 2019-01-31 Hewlett-Packard Development Company, L.P. MATRIX CONTACT TRAINING
JP6971377B2 (ja) * 2017-07-31 2021-11-24 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. 内蔵された横断流路を備えた流体吐出デバイス
US11059291B2 (en) 2017-07-31 2021-07-13 Hewlett-Packard Development Company, L.P. Fluidic ejection dies with enclosed cross-channels
CN110154544B (zh) * 2018-02-12 2020-11-24 海德堡印刷机械股份公司 用于喷墨的印刷杆
US11034151B2 (en) 2018-03-12 2021-06-15 Hewlett-Packard Development Company, L.P. Nozzle arrangements
CN111542437B (zh) * 2018-03-12 2021-12-28 惠普发展公司，有限责任合伙企业 流体喷射设备
JP2021514876A (ja) 2018-03-12 2021-06-17 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． ノズル配列および供給孔
US11020966B2 (en) 2018-04-27 2021-06-01 Canon Kabushiki Kaisha Liquid ejection head substrate, method of manufacturing liquid ejection head substrate, and liquid ejection head
WO2020162925A1 (en) 2019-02-06 2020-08-13 Hewlett-Packard Development Company, L.P. Movable mold insert adjuster
CA3126726C (en) * 2019-02-06 2023-12-05 Hewlett-Packard Development Company, L.P. Fluid ejection devices including electrical interconnect elements for fluid ejection dies
CN113382878B (zh) * 2019-02-06 2023-02-03 惠普发展公司，有限责任合伙企业 将模套结构施加到流体喷射管芯的端部部分
WO2020222736A1 (en) * 2019-04-29 2020-11-05 Hewlett-Packard Development Company, L.P. Fluid ejection device with break(s) in cover layer
US11780227B2 (en) 2019-06-25 2023-10-10 Hewlett-Packard Development Company, L.P. Molded structures with channels
US20220126577A1 (en) * 2019-06-25 2022-04-28 Hewlett-Packard Development Company, L.P. Molded structures with channels
US11975468B2 (en) 2019-07-26 2024-05-07 Hewlett-Packard Development Company, L.P. Coplanar modular printbars
EP3999345A4 (en) * 2019-09-06 2023-03-29 Hewlett-Packard Development Company, L.P. UNSUPPORTED CYLINDER LAYERS IN PRINT HEAD NOZZLES

Family Cites Families (265)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4224627A (en) 1979-06-28 1980-09-23 International Business Machines Corporation Seal glass for nozzle assemblies of an ink jet printer
JPS58112754A (ja) 1981-12-26 1983-07-05 Konishiroku Photo Ind Co Ltd インクジエツト記録装置の記録ヘツド
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods
US4633274A (en) 1984-03-30 1986-12-30 Canon Kabushiki Kaisha Liquid ejection recording apparatus
US4881318A (en) 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
JPH064325B2 (ja) 1984-06-11 1994-01-19 キヤノン株式会社 液体噴射ヘッド
JPS61125852A (ja) * 1984-11-22 1986-06-13 Canon Inc インクジエツト記録ヘツド
JPS62240562A (ja) 1986-04-14 1987-10-21 Matsushita Electric Works Ltd ドツトプリンタ用ワイヤガイドの製造方法
US4973622A (en) 1989-03-27 1990-11-27 Ppg Industries, Inc. Vinyl chloride-olefin copolymers having good color stability and flexibility for container coatings
US5016023A (en) 1989-10-06 1991-05-14 Hewlett-Packard Company Large expandable array thermal ink jet pen and method of manufacturing same
US5124717A (en) 1990-12-06 1992-06-23 Xerox Corporation Ink jet printhead having integral filter
AU657720B2 (en) 1991-01-30 1995-03-23 Canon Kabushiki Kaisha A bubblejet image reproducing apparatus
US5160945A (en) 1991-05-10 1992-11-03 Xerox Corporation Pagewidth thermal ink jet printhead
JP3088849B2 (ja) 1992-06-30 2000-09-18 株式会社リコー インクジェット記録ヘッド
US5387314A (en) 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
JPH06226977A (ja) 1993-02-01 1994-08-16 Ricoh Co Ltd インクジェットヘッド
JP3444998B2 (ja) 1993-12-22 2003-09-08 キヤノン株式会社 液体噴射ヘッド
US5565900A (en) 1994-02-04 1996-10-15 Hewlett-Packard Company Unit print head assembly for ink-jet printing
JP3268937B2 (ja) 1994-04-14 2002-03-25 キヤノン株式会社 インクジェット記録ヘッド用基板及びそれを用いたヘッド
US5538586A (en) 1994-10-04 1996-07-23 Hewlett-Packard Company Adhesiveless encapsulation of tab circuit traces for ink-jet pen
JP3459703B2 (ja) 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
JPH091812A (ja) * 1995-06-21 1997-01-07 Canon Inc 液体噴射記録ヘッドの製造方法および製造装置
JPH0929970A (ja) 1995-07-19 1997-02-04 Canon Inc インクジェット記録ヘッドおよびその製造方法
EP0755793B1 (en) 1995-07-26 2001-04-04 Sony Corporation Printer apparatus and method of production of same
US5745131A (en) 1995-08-03 1998-04-28 Xerox Corporation Gray scale ink jet printer
JP3402879B2 (ja) 1995-11-08 2003-05-06 キヤノン株式会社 インクジェットヘッドおよびその製造方法ならびにインクジェット装置
US6305790B1 (en) 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
US6179410B1 (en) 1996-03-22 2001-01-30 Sony Corporation Printer
US6257703B1 (en) 1996-07-31 2001-07-10 Canon Kabushiki Kaisha Ink jet recording head
US6281914B1 (en) 1996-11-13 2001-08-28 Brother Kogyo Kabushiki Kaisa Ink jet-type printer device with printer head on circuit board
US5719605A (en) 1996-11-20 1998-02-17 Lexmark International, Inc. Large array heater chips for thermal ink jet printheads
US6259463B1 (en) 1997-10-30 2001-07-10 Hewlett-Packard Company Multi-drop merge on media printing system
US5894108A (en) * 1997-02-11 1999-04-13 National Semiconductor Corporation Plastic package with exposed die
US6045214A (en) * 1997-03-28 2000-04-04 Lexmark International, Inc. Ink jet printer nozzle plate having improved flow feature design and method of making nozzle plates
US7708372B2 (en) 1997-07-15 2010-05-04 Silverbrook Research Pty Ltd Inkjet nozzle with ink feed channels etched from back of wafer
US6918654B2 (en) 1997-07-15 2005-07-19 Silverbrook Research Pty Ltd Ink distribution assembly for an ink jet printhead
US7527357B2 (en) 1997-07-15 2009-05-05 Silverbrook Research Pty Ltd Inkjet nozzle array with individual feed channel for each nozzle
US5847725A (en) 1997-07-28 1998-12-08 Hewlett-Packard Company Expansion relief for orifice plate of thermal ink jet print head
US6022482A (en) 1997-08-04 2000-02-08 Xerox Corporation Monolithic ink jet printhead
JP3521706B2 (ja) 1997-09-24 2004-04-19 富士ゼロックス株式会社 インクジェット記録ヘッドおよびその製造方法
US6508546B2 (en) 1998-10-16 2003-01-21 Silverbrook Research Pty Ltd Ink supply arrangement for a portable ink jet printer
US6123410A (en) 1997-10-28 2000-09-26 Hewlett-Packard Company Scalable wide-array inkjet printhead and method for fabricating same
US6789878B2 (en) 1997-10-28 2004-09-14 Hewlett-Packard Development Company, L.P. Fluid manifold for printhead assembly
US6250738B1 (en) * 1997-10-28 2001-06-26 Hewlett-Packard Company Inkjet printing apparatus with ink manifold
US6188414B1 (en) * 1998-04-30 2001-02-13 Hewlett-Packard Company Inkjet printhead with preformed substrate
US6132028A (en) 1998-05-14 2000-10-17 Hewlett-Packard Company Contoured orifice plate of thermal ink jet print head
US20020041308A1 (en) 1998-08-05 2002-04-11 Cleland Todd A. Method of manufacturing an orifice plate having a plurality of slits
US6227651B1 (en) 1998-09-25 2001-05-08 Hewlett-Packard Company Lead frame-mounted ink jet print head module
JP2000108360A (ja) 1998-10-02 2000-04-18 Sony Corp プリントヘッドの製造方法
US6464333B1 (en) * 1998-12-17 2002-10-15 Hewlett-Packard Company Inkjet printhead assembly with hybrid carrier for printhead dies
US6341845B1 (en) 2000-08-25 2002-01-29 Hewlett-Packard Company Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
US6705705B2 (en) 1998-12-17 2004-03-16 Hewlett-Packard Development Company, L.P. Substrate for fluid ejection devices
US6745467B1 (en) 1999-02-10 2004-06-08 Canon Kabushiki Kaisha Method of producing a liquid discharge head
US7182434B2 (en) 1999-06-30 2007-02-27 Silverbrook Research Pty Ltd Inkjet printhead assembly having aligned printhead segments
US6254819B1 (en) 1999-07-16 2001-07-03 Eastman Kodak Company Forming channel members for ink jet printheads
CN1286172A (zh) 1999-08-25 2001-03-07 美商·惠普公司 制造薄膜喷墨打印头的方法
JP2001071490A (ja) 1999-09-02 2001-03-21 Ricoh Co Ltd インクジェット記録装置
US6616271B2 (en) 1999-10-19 2003-09-09 Silverbrook Research Pty Ltd Adhesive-based ink jet print head assembly
US6190002B1 (en) 1999-10-27 2001-02-20 Lexmark International, Inc. Ink jet pen
US6454955B1 (en) 1999-10-29 2002-09-24 Hewlett-Packard Company Electrical interconnect for an inkjet die
KR100657108B1 (ko) 1999-10-29 2006-12-12 휴렛-팩커드 컴퍼니(델라웨어주법인) 잉크젯 프린트 헤드 및 그의 형성 방법
JP4533522B2 (ja) 1999-10-29 2010-09-01 ヒューレット・パッカード・カンパニー インクジェットのダイ用の電気的相互接続
JP2001246748A (ja) 1999-12-27 2001-09-11 Seiko Epson Corp インクジェツト式記録ヘッド
US6679264B1 (en) 2000-03-04 2004-01-20 Emphasys Medical, Inc. Methods and devices for use in performing pulmonary procedures
AUPQ605800A0 (en) 2000-03-06 2000-03-30 Silverbrook Research Pty Ltd Printehead assembly
US6560871B1 (en) 2000-03-21 2003-05-13 Hewlett-Packard Development Company, L.P. Semiconductor substrate having increased facture strength and method of forming the same
IT1320026B1 (it) 2000-04-10 2003-11-12 Olivetti Lexikon Spa Testina di stampa monolitica a canali multipli di alimentazione delloinchiostro e relativo processo di fabbricazione.
US6379988B1 (en) 2000-05-16 2002-04-30 Sandia Corporation Pre-release plastic packaging of MEMS and IMEMS devices
US6786658B2 (en) 2000-05-23 2004-09-07 Silverbrook Research Pty. Ltd. Printer for accommodating varying page thicknesses
JP4557386B2 (ja) 2000-07-10 2010-10-06 キヤノン株式会社 記録ヘッド用基板の製造方法
IT1320599B1 (it) 2000-08-23 2003-12-10 Olivetti Lexikon Spa Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione.
US6398348B1 (en) 2000-09-05 2002-06-04 Hewlett-Packard Company Printing structure with insulator layer
US6896359B1 (en) 2000-09-06 2005-05-24 Canon Kabushiki Kaisha Ink jet recording head and method for manufacturing ink jet recording head
JP4672840B2 (ja) 2000-09-06 2011-04-20 キヤノン株式会社 液体吐出ヘッド
KR100677752B1 (ko) 2000-09-29 2007-02-05 삼성전자주식회사 잉크젯 프린트 헤드와 그 제조방법
US6402301B1 (en) 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
US6291317B1 (en) 2000-12-06 2001-09-18 Xerox Corporation Method for dicing of micro devices
US6554399B2 (en) 2001-02-27 2003-04-29 Hewlett-Packard Development Company, L.P. Interconnected printhead die and carrier substrate system
JP2002291262A (ja) 2001-03-27 2002-10-04 Hitachi Metals Ltd 圧電式アクチュエータ及びこれを用いた液体吐出ヘッド
JP2002326117A (ja) * 2001-04-25 2002-11-12 Nakamura Seisakusho Kk 金属板へのキャビティ形成方法
US20020180825A1 (en) 2001-06-01 2002-12-05 Shen Buswell Method of forming a fluid delivery slot
GB0113639D0 (en) 2001-06-05 2001-07-25 Xaar Technology Ltd Nozzle plate for droplet deposition apparatus
US6561632B2 (en) 2001-06-06 2003-05-13 Hewlett-Packard Development Company, L.P. Printhead with high nozzle packing density
JP2003011365A (ja) 2001-07-04 2003-01-15 Ricoh Co Ltd インクジェットヘッド及びその製造方法
US6805432B1 (en) 2001-07-31 2004-10-19 Hewlett-Packard Development Company, L.P. Fluid ejecting device with fluid feed slot
JP2003063020A (ja) 2001-08-30 2003-03-05 Ricoh Co Ltd 液滴吐出ヘッド及びその製造方法
US6595619B2 (en) 2001-10-30 2003-07-22 Hewlett-Packard Development Company, L.P. Printing mechanism service station for a printbar assembly
US6543879B1 (en) 2001-10-31 2003-04-08 Hewlett-Packard Company Inkjet printhead assembly having very high nozzle packing density
US7125731B2 (en) * 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US20030090558A1 (en) 2001-11-15 2003-05-15 Coyle Anthony L. Package for printhead chip
WO2003051637A1 (fr) 2001-12-18 2003-06-26 Sony Corporation Tete d'impression
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US20030140496A1 (en) 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
JP4274513B2 (ja) 2002-02-15 2009-06-10 キヤノン株式会社 液体噴射記録ヘッド
US6705697B2 (en) 2002-03-06 2004-03-16 Xerox Corporation Serial data input full width array print bar method and apparatus
US6666546B1 (en) 2002-07-31 2003-12-23 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6834937B2 (en) 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
JP4210900B2 (ja) 2002-08-15 2009-01-21 セイコーエプソン株式会社 インクジェット印刷ヘッド及びインクジェットプリンタ
KR100484168B1 (ko) 2002-10-11 2005-04-19 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
US6942316B2 (en) 2002-10-30 2005-09-13 Hewlett-Packard Development Company, L.P. Fluid delivery for printhead assembly
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
JP4298334B2 (ja) 2003-03-17 2009-07-15 キヤノン株式会社 記録方法および記録装置
US6886921B2 (en) 2003-04-02 2005-05-03 Lexmark International, Inc. Thin film heater resistor for an ink jet printer
US6869166B2 (en) 2003-04-09 2005-03-22 Joaquim Brugue Multi-die fluid ejection apparatus and method
KR100506093B1 (ko) 2003-05-01 2005-08-04 삼성전자주식회사 잉크젯 프린트헤드 패키지
KR100477707B1 (ko) 2003-05-13 2005-03-18 삼성전자주식회사 모놀리틱 잉크젯 프린트헤드 제조방법
US7188942B2 (en) 2003-08-06 2007-03-13 Hewlett-Packard Development Company, L.P. Filter for printhead assembly
JP3673266B2 (ja) * 2003-08-22 2005-07-20 株式会社東芝 静電方式アクチュエータ用可動子の製造方法
CN1302930C (zh) 2003-09-10 2007-03-07 财团法人工业技术研究院 喷墨头组件及其制造方法
JP3952048B2 (ja) 2003-09-29 2007-08-01 ブラザー工業株式会社 液体移送装置及び液体移送装置の製造方法
KR20050039623A (ko) 2003-10-24 2005-04-29 소니 가부시끼 가이샤 헤드 모듈, 액체 토출 헤드, 액체 토출 장치, 헤드 모듈의제조 방법 및 액체 토출 헤드의 제조 방법
JP4553348B2 (ja) 2003-12-03 2010-09-29 キヤノン株式会社 インクジェット記録ヘッド
US7524016B2 (en) 2004-01-21 2009-04-28 Silverbrook Research Pty Ltd Cartridge unit having negatively pressurized ink storage
JP2005212134A (ja) 2004-01-27 2005-08-11 Fuji Xerox Co Ltd インクジェット記録ヘッド、及びインクジェット記録装置
US7240991B2 (en) 2004-03-09 2007-07-10 Hewlett-Packard Development Company, L.P. Fluid ejection device and manufacturing method
US20050219327A1 (en) 2004-03-31 2005-10-06 Clarke Leo C Features in substrates and methods of forming
US6930055B1 (en) 2004-05-26 2005-08-16 Hewlett-Packard Development Company, L.P. Substrates having features formed therein and methods of forming
US7597424B2 (en) 2004-05-27 2009-10-06 Canon Kabushiki Kaisha Printhead substrate, printhead, head cartridge, and printing apparatus
US20060022273A1 (en) 2004-07-30 2006-02-02 David Halk System and method for assembly of semiconductor dies to flexible circuits
KR100560720B1 (ko) 2004-08-05 2006-03-13 삼성전자주식회사 광경화성 수지 조성물을 사용한 잉크젯 프린트 헤드의제조방법
US7475964B2 (en) 2004-08-06 2009-01-13 Hewlett-Packard Development Company, L.P. Electrical contact encapsulation
US7438395B2 (en) 2004-09-24 2008-10-21 Brother Kogyo Kabushiki Kaisha Liquid-jetting apparatus and method for producing the same
US7498666B2 (en) 2004-09-27 2009-03-03 Nokia Corporation Stacked integrated circuit
JP4290154B2 (ja) 2004-12-08 2009-07-01 キヤノン株式会社 液体吐出記録ヘッドおよびインクジェット記録装置
US7347533B2 (en) 2004-12-20 2008-03-25 Palo Alto Research Center Incorporated Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
TWI295632B (en) 2005-01-21 2008-04-11 Canon Kk Ink jet recording head, producing method therefor and composition for ink jet recording head
JP2006212984A (ja) 2005-02-04 2006-08-17 Fuji Photo Film Co Ltd 液体吐出口形成方法
JP2006224624A (ja) 2005-02-21 2006-08-31 Fuji Xerox Co Ltd 積層ノズルプレート、液滴吐出ヘッド、及び、積層ノズルプレート製造方法
US7249817B2 (en) 2005-03-17 2007-07-31 Hewlett-Packard Development Company, L.P. Printer having image dividing modes
JP2006321222A (ja) 2005-04-18 2006-11-30 Canon Inc 液体吐出ヘッド
US7658470B1 (en) 2005-04-28 2010-02-09 Hewlett-Packard Development Company, L.P. Method of using a flexible circuit
JP4766658B2 (ja) 2005-05-10 2011-09-07 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP2006315321A (ja) 2005-05-13 2006-11-24 Canon Inc インクジェット記録ヘッドの製造方法
JP4804043B2 (ja) 2005-06-03 2011-10-26 キヤノン株式会社 インクジェット記録装置、インクジェット記録方法、および記録制御形態の設定方法
KR100601725B1 (ko) 2005-06-10 2006-07-18 삼성전자주식회사 감열방식 화상형성장치
CN100393519C (zh) 2005-07-27 2008-06-11 国际联合科技股份有限公司 喷墨印字头装置的通孔与喷口板的制造方法
CN100463801C (zh) 2005-07-27 2009-02-25 国际联合科技股份有限公司 喷墨印字头装置的通孔与喷口板的制造方法
JP5194432B2 (ja) 2005-11-30 2013-05-08 株式会社リコー 面発光レーザ素子
KR100667845B1 (ko) 2005-12-21 2007-01-11 삼성전자주식회사 어레이 프린팅헤드 및 이를 구비한 잉크젯 화상형성장치
JP4577226B2 (ja) 2006-02-02 2010-11-10 ソニー株式会社 液体吐出ヘッド及び液体吐出装置
JP4854336B2 (ja) 2006-03-07 2012-01-18 キヤノン株式会社 インクジェットヘッド用基板の製造方法
JP2008012911A (ja) 2006-06-07 2008-01-24 Canon Inc 液体吐出ヘッド、及び液体吐出ヘッドの製造方法
JP2008009149A (ja) 2006-06-29 2008-01-17 Canon Inc 画像形成装置
TWM308500U (en) 2006-09-08 2007-03-21 Lingsen Precision Ind Ltd Pressure molding package structure for optical sensing chip
KR100818277B1 (ko) 2006-10-02 2008-03-31 삼성전자주식회사 잉크젯 프린트헤드의 제조방법
US7898093B1 (en) 2006-11-02 2011-03-01 Amkor Technology, Inc. Exposed die overmolded flip chip package and fabrication method
US8246141B2 (en) 2006-12-21 2012-08-21 Eastman Kodak Company Insert molded printhead substrate
KR20080068260A (ko) 2007-01-18 2008-07-23 삼성전자주식회사 잉크젯 프린터 및 잉크젯 프린터 헤드칩 조립체
US20080186187A1 (en) 2007-02-06 2008-08-07 Christopher Alan Adkins Ink tank having integrated rfid tag
JP2008238485A (ja) 2007-03-26 2008-10-09 Fujifilm Corp インクジェット記録方法及びインクジェット記録装置
CN101663591A (zh) 2007-03-26 2010-03-03 株式会社爱德万测试 连接用板、探针卡及设有探针卡的电子元件测试装置
US7959266B2 (en) * 2007-03-28 2011-06-14 Xerox Corporation Self aligned port hole opening process for ink jet print heads
CN101274514B (zh) 2007-03-29 2013-03-27 研能科技股份有限公司 彩色喷墨头结构
CN101274515B (zh) 2007-03-29 2013-04-24 研能科技股份有限公司 单色喷墨头结构
US7735225B2 (en) 2007-03-30 2010-06-15 Xerox Corporation Method of manufacturing a cast-in place ink feed structure using encapsulant
US7862160B2 (en) 2007-03-30 2011-01-04 Xerox Corporation Hybrid manifold for an ink jet printhead
JP2008273183A (ja) 2007-04-03 2008-11-13 Canon Inc インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法および記録装置
US7828417B2 (en) 2007-04-23 2010-11-09 Hewlett-Packard Development Company, L.P. Microfluidic device and a fluid ejection device incorporating the same
JP5037214B2 (ja) 2007-05-01 2012-09-26 Ｊｘ日鉱日石エネルギー株式会社 改質器システム、燃料電池システム、及びその運転方法
JP5008451B2 (ja) 2007-05-08 2012-08-22 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
KR20080102903A (ko) 2007-05-22 2008-11-26 삼성전자주식회사 잉크젯 프린터 헤드의 제조 방법 및 상기 방법에 의하여제조된 잉크젯 프린터 헤드
KR20080104851A (ko) 2007-05-29 2008-12-03 삼성전자주식회사 잉크젯 프린트헤드
US7681991B2 (en) 2007-06-04 2010-03-23 Lexmark International, Inc. Composite ceramic substrate for micro-fluid ejection head
US8556389B2 (en) 2011-02-04 2013-10-15 Kateeva, Inc. Low-profile MEMS thermal printhead die having backside electrical connections
US8047156B2 (en) 2007-07-02 2011-11-01 Hewlett-Packard Development Company, L.P. Dice with polymer ribs
US7571970B2 (en) 2007-07-13 2009-08-11 Xerox Corporation Self-aligned precision datums for array die placement
KR101422203B1 (ko) 2007-08-07 2014-07-30 삼성전자주식회사 포토레지스트 조성물, 상기 포토레지스트 조성물을 이용한 패턴 형성 방법 및 잉크젯 프린트 헤드
US7591535B2 (en) 2007-08-13 2009-09-22 Xerox Corporation Maintainable coplanar front face for silicon die array printhead
JP2009051066A (ja) 2007-08-26 2009-03-12 Sony Corp 吐出条件調整装置、液滴吐出装置、吐出条件調整方法及びプログラム
JP5219439B2 (ja) 2007-09-06 2013-06-26 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法
US8063318B2 (en) 2007-09-25 2011-11-22 Silverbrook Research Pty Ltd Electronic component with wire bonds in low modulus fill encapsulant
US7824013B2 (en) 2007-09-25 2010-11-02 Silverbrook Research Pty Ltd Integrated circuit support for low profile wire bond
JP2009081346A (ja) 2007-09-27 2009-04-16 Panasonic Corp 光学デバイスおよびその製造方法
TWI347666B (en) 2007-12-12 2011-08-21 Techwin Opto Electronics Co Ltd Led leadframe manufacturing method
CN101909893B (zh) 2008-01-09 2012-10-10 惠普开发有限公司 流体喷出盒、其制造方法和流体喷出方法
US8109607B2 (en) * 2008-03-10 2012-02-07 Hewlett-Packard Development Company, L.P. Fluid ejector structure and fabrication method
US7938513B2 (en) 2008-04-11 2011-05-10 Lexmark International, Inc. Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips
JP2009255448A (ja) * 2008-04-18 2009-11-05 Canon Inc インクジェット記録ヘッド
WO2009136915A1 (en) 2008-05-06 2009-11-12 Hewlett-Packard Development Company, L.P. Print head feed slot ribs
WO2009143025A1 (en) 2008-05-22 2009-11-26 Fujifilm Corporation Actuatable device with die and integrated circuit element
JP5464901B2 (ja) 2008-06-06 2014-04-09 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
CN102089151B (zh) 2008-07-09 2013-12-04 惠普开发有限公司 打印头槽筋
JP2010023341A (ja) * 2008-07-18 2010-02-04 Canon Inc インクジェット記録ヘッド
EP2154713B1 (en) 2008-08-11 2013-01-02 Sensirion AG Method for manufacturing a sensor device with a stress relief layer
US7877875B2 (en) 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method for connecting a flexible printed circuit board (PCB) to a printhead assembly
US7862147B2 (en) 2008-09-30 2011-01-04 Eastman Kodak Company Inclined feature to protect printhead face
JP2010137460A (ja) 2008-12-12 2010-06-24 Canon Inc インクジェット記録ヘッドの製造方法
US8251497B2 (en) 2008-12-18 2012-08-28 Eastman Kodak Company Injection molded mounting substrate
TWI393223B (zh) 2009-03-03 2013-04-11 Advanced Semiconductor Eng 半導體封裝結構及其製造方法
US8197031B2 (en) 2009-05-22 2012-06-12 Xerox Corporation Fluid dispensing subassembly with polymer layer
US8096640B2 (en) 2009-05-27 2012-01-17 Hewlett-Packard Development Company, L.P. Print bar
JPWO2011001502A1 (ja) 2009-06-30 2012-12-10 株式会社永木精機 掴線器
JP2009266251A (ja) 2009-07-01 2009-11-12 Shigeo Nakaishi 電子関数グラフ表示装置、座標取得装置、電子関数グラフ表示方法、座標取得方法、及びプログラム
US8287094B2 (en) 2009-07-27 2012-10-16 Zamtec Limited Printhead integrated circuit configured for backside electrical connection
US8287095B2 (en) 2009-07-27 2012-10-16 Zamtec Limited Printhead integrated comprising through-silicon connectors
US8101438B2 (en) 2009-07-27 2012-01-24 Silverbrook Research Pty Ltd Method of fabricating printhead integrated circuit with backside electrical connections
US8496317B2 (en) * 2009-08-11 2013-07-30 Eastman Kodak Company Metalized printhead substrate overmolded with plastic
JP4897023B2 (ja) 2009-09-18 2012-03-14 富士フイルム株式会社 インク組成物、インクセットおよびインクジェット画像形成方法
US8118406B2 (en) 2009-10-05 2012-02-21 Eastman Kodak Company Fluid ejection assembly having a mounting substrate
JP5279686B2 (ja) 2009-11-11 2013-09-04 キヤノン株式会社 液体吐出ヘッドの製造方法
US8287104B2 (en) 2009-11-19 2012-10-16 Hewlett-Packard Development Company, L.P. Inkjet printhead with graded die carrier
US20110141691A1 (en) 2009-12-11 2011-06-16 Slaton David S Systems and methods for manufacturing synthetic jets
US8203839B2 (en) 2010-03-10 2012-06-19 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices, power modules, and vehicles incorporating the same
JP5743427B2 (ja) 2010-05-14 2015-07-01 キヤノン株式会社 プリント配線板及び記録ヘッド
JP5717527B2 (ja) 2010-05-19 2015-05-13 キヤノン株式会社 液体吐出ヘッド
US8342652B2 (en) 2010-05-27 2013-01-01 Xerox Corporation Molded nozzle plate with alignment features for simplified assembly
US8622524B2 (en) 2010-05-27 2014-01-07 Funai Electric Co., Ltd. Laminate constructs for micro-fluid ejection devices
US20120003902A1 (en) 2010-06-04 2012-01-05 Ngk Insulators, Ltd. Method for manufacturing a droplet discharge head
US20110298868A1 (en) * 2010-06-07 2011-12-08 Silverbrook Research Pty Ltd Inkjet printhead having hydrophilic ink pathways
US8745868B2 (en) 2010-06-07 2014-06-10 Zamtec Ltd Method for hydrophilizing surfaces of a print head assembly
US8430474B2 (en) 2010-06-10 2013-04-30 Eastman Kodak Company Die mounting assembly formed of dissimilar materials
TWI445139B (zh) 2010-06-11 2014-07-11 Advanced Semiconductor Eng 晶片封裝結構、晶片封裝模具與晶片封裝製程
JP5627307B2 (ja) 2010-06-18 2014-11-19 キヤノン株式会社 液体吐出ヘッド用基板および液体吐出ヘッド
KR101192307B1 (ko) 2010-07-15 2012-10-17 (주)라이스텍 감마아미노부티르산 생산 균주 및 이를 이용한 감마아미노부티르산의 제조방법
US8205965B2 (en) 2010-07-20 2012-06-26 Hewlett-Packard Development Company, L.P. Print bar structure
CN103052507B (zh) 2010-08-19 2015-01-07 惠普发展公司，有限责任合伙企业 具有盖罩的宽阵列喷墨打印头组件
WO2012023941A1 (en) 2010-08-19 2012-02-23 Hewlett-Packard Development Company, L.P. Wide-array inkjet printhead assembly
JP5854693B2 (ja) 2010-09-01 2016-02-09 キヤノン株式会社 液体吐出ヘッドの製造方法
US8753926B2 (en) 2010-09-14 2014-06-17 Qualcomm Incorporated Electronic packaging with a variable thickness mold cap
US20120098114A1 (en) 2010-10-21 2012-04-26 Nokia Corporation Device with mold cap and method thereof
US8434229B2 (en) 2010-11-24 2013-05-07 Canon Kabushiki Kaisha Liquid ejection head manufacturing method
US8500242B2 (en) 2010-12-21 2013-08-06 Funai Electric Co., Ltd. Micro-fluid ejection head
JP5843444B2 (ja) 2011-01-07 2016-01-13 キヤノン株式会社 液体吐出ヘッドの製造方法および液体吐出ヘッド
US8438730B2 (en) 2011-01-26 2013-05-14 Eastman Kodak Company Method of protecting printhead die face
US20120188307A1 (en) 2011-01-26 2012-07-26 Ciminelli Mario J Inkjet printhead with protective spacer
US8485637B2 (en) 2011-01-27 2013-07-16 Eastman Kodak Company Carriage with capping surface for inkjet printhead
JP5737973B2 (ja) 2011-02-02 2015-06-17 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
US20120210580A1 (en) 2011-02-23 2012-08-23 Dietl Steven J Method of assembling an inkjet printhead
US8517514B2 (en) 2011-02-23 2013-08-27 Eastman Kodak Company Printhead assembly and fluidic connection of die
JP5738018B2 (ja) 2011-03-10 2015-06-17 キヤノン株式会社 インクジェット記録ヘッドとその製造方法
CN102689513B (zh) 2011-03-23 2015-02-18 研能科技股份有限公司 喷墨头结构
CN102689511B (zh) 2011-03-23 2015-02-18 研能科技股份有限公司 喷墨头结构
CN102689512B (zh) 2011-03-23 2015-03-11 研能科技股份有限公司 喷墨头结构
CN103442894B (zh) 2011-03-31 2016-03-16 惠普发展公司，有限责任合伙企业 打印头组件
ITMI20111011A1 (it) 2011-06-06 2012-12-07 Telecom Italia Spa Testina di stampa a getto d'inchiostro comprendente uno strato realizzato con una composizione di resina reticolabile
US8556611B2 (en) 2011-06-21 2013-10-15 Xerox Corporation Method for interstitial polymer planarization using a flexible flat plate
DE102011078906A1 (de) 2011-07-11 2013-01-17 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen halbleiterbauteils mittels spritzpressens
JP5828702B2 (ja) 2011-07-26 2015-12-09 キヤノン株式会社 液体吐出ヘッドの製造方法
US8721042B2 (en) 2011-07-27 2014-05-13 Eastman Kodak Company Inkjet printhead with layered ceramic mounting substrate
WO2013016048A1 (en) 2011-07-27 2013-01-31 Eastman Kodak Company Inkjet printhead with layered ceramic mounting substrate
JP5762200B2 (ja) 2011-07-29 2015-08-12 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
JP5861815B2 (ja) 2011-08-10 2016-02-16 セイコーエプソン株式会社 インク組成物、これを用いる記録ユニットおよびインクジェット記録装置、ならびに記録物
DE102011084582B3 (de) 2011-10-17 2013-02-21 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren
US8887393B2 (en) 2012-01-27 2014-11-18 Eastman Kodak Company Fabrication of an inkjet printhead mounting substrate
US8690296B2 (en) 2012-01-27 2014-04-08 Eastman Kodak Company Inkjet printhead with multi-layer mounting substrate
US8876256B2 (en) 2012-02-03 2014-11-04 Hewlett-Packard Development Company, L.P. Print head die
US9308726B2 (en) 2012-02-16 2016-04-12 Xerox Corporation Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes
US20140028768A1 (en) 2012-05-18 2014-01-30 Meijet Coating and Inks, Inc. Method and system for printing untreated textile in an inkjet printer
US8890269B2 (en) 2012-05-31 2014-11-18 Stmicroelectronics Pte Ltd. Optical sensor package with through vias
KR102011450B1 (ko) 2012-06-21 2019-08-19 삼성디스플레이 주식회사 잉크젯 프린트 헤드 및 이의 제조 방법
EP2834998A4 (en) 2012-07-18 2015-11-18 Viber Media S A R L ACTIVE MESSAGING SERVICE DEVICE
JP5580874B2 (ja) 2012-12-25 2014-08-27 京セラドキュメントソリューションズ株式会社 記録液およびそれを用いた画像形成装置
CN105121171B (zh) 2013-02-28 2017-11-03 惠普发展公司，有限责任合伙企业 模制打印棒
KR101827070B1 (ko) 2013-02-28 2018-02-07 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 유체 유동 구조체 성형
US9517626B2 (en) 2013-02-28 2016-12-13 Hewlett-Packard Development Company, L.P. Printed circuit board fluid ejection apparatus
CN105377560B (zh) 2013-02-28 2018-01-19 惠普发展公司，有限责任合伙企业 模制的流体流动结构
US9731509B2 (en) 2013-02-28 2017-08-15 Hewlett-Packard Development Company, L.P. Fluid structure with compression molded fluid channel
US9446587B2 (en) 2013-02-28 2016-09-20 Hewlett-Packard Development Company, L.P. Molded printhead
US9539814B2 (en) 2013-02-28 2017-01-10 Hewlett-Packard Development Company, L.P. Molded printhead
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
WO2014153305A1 (en) 2013-03-20 2014-09-25 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
US10421274B2 (en) 2014-01-28 2019-09-24 Hewlett-Packard Devleopment Company. L.P. Printbars and methods of forming printbars
US10160209B2 (en) 2014-01-28 2018-12-25 Hewlett-Packard Development Company, L.P. Flexible carrier for fluid flow structure
US9550358B2 (en) 2014-05-13 2017-01-24 Xerox Corporation Printhead with narrow aspect ratio

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