CN106457861B - 用于制造模制设备组件以及打印头组件的方法 - Google Patents

用于制造模制设备组件以及打印头组件的方法 Download PDF

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Publication number
CN106457861B
CN106457861B CN201480078851.6A CN201480078851A CN106457861B CN 106457861 B CN106457861 B CN 106457861B CN 201480078851 A CN201480078851 A CN 201480078851A CN 106457861 B CN106457861 B CN 106457861B
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China
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print
printed circuit
circuit board
head die
rear portion
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CN106457861A (zh
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陈简华
托马斯·R·斯特兰德
迈克尔·G·格罗
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority claimed from PCT/US2013/048214 external-priority patent/WO2014133576A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
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    • B41J2/1404—Geometrical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/01—Ink jet
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    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
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    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • H—ELECTRICITY
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

在一示例中，一种用于制造微型设备组件的方法，包括：将微型设备放置在印刷电路板的前部上；将模制件围绕所述微型设备模制在所述印刷电路板上；并且随后在所述印刷电路板的后部中形成通向所述微型设备的通道。

Description

用于制造模制设备组件以及打印头组件的方法
背景技术
喷墨笔或打印杆中的每个打印头模包括将墨水或其它打印流体运送到喷射室的微小通路。打印流体通过支撑所述笔或打印杆上的打印头模的结构中的通道被分配到模通路。可能期望缩小每个打印头模的尺寸，例如，以便降低模的成本，并相应地降低笔或打印杆的成本。
附图说明
图1例示诸如可在喷墨打印机的笔或打印杆中使用的新的模制喷墨打印头组件的一个示例。
图2为图1的细节。
图3为沿图2中的线3-3看去的剖面。
图4为图3的细节。
图5为示出图1-图4中例示的打印头组件中的打印头模之一的一部分的平面图细节。
图6-图11为例示用于制造诸如图1-图5中所示的组件的打印头组件的方法的一个示例的一系列剖面图。
图12为例示图6-图11中所示的方法的流程图。
图13和图14为例示图12的方法中的通道形成步骤的一个示例的剖面图。
图15为例示图12的方法中的模制步骤的一个示例的剖面图。
图16-图18示出盖模制件包括沿每个打印头模的凹槽的一个示例。
图19-图21示出盖模制件包括沿打印头模的一侧的脊的一个示例。
在全部附图中，相同的附图标记表示相同或相似的部件。附图不一定按比例绘制。一些部件的尺寸被夸大以更清楚地例示所示的示例。
具体实施方式
利用基底宽打印头组件(substrate wide printhead assembly)、通常被称为“打印杆”的喷墨打印机已经被开发用于帮助提高打印速度并降低打印成本。常规打印杆包括将打印流体从打印流体供给部运送到小打印头模的多个部件，其中打印流体从该小打印头模喷射到纸长或其它打印基底上。虽然减小打印头模的尺寸和间距对于降低成本仍然很重要，但是将打印流体从较大的供应部件引导至更小且更紧密间隔的模需要复杂的流道结构和制造工艺，这实际上会增加成本。
已经开发新的制造工艺来实现利用更小的打印头模和更紧凑的模电路，以帮助降低基底宽喷墨打印机打印杆的成本。在新工艺的一个示例中，打印头模条以所需的构造布置在印刷电路板(PCB)的前部上，并例如利用丝焊电连接到PCB中的电路。然后，盖模制件(cover molding)围绕模条被模制在PCB上，留下流体喷射喷嘴暴露在每个条上。流体输送通道被切割至PCB的后部中以连接到每个条中的流体通路。每个模条中的流体通路在条制造期间可不打开，以简化条制造工艺并使得条更坚固以便于后续处理。模中的流体通路打开，同时流体输送通道通过切割穿透PCB并切割至每个片的后部中而被切割至PCB中。
产生的结构包括嵌入PCB的前部上的模制件中的多个打印头模条，其中打印头喷嘴被暴露用以分配打印流体，并且有通道穿过PCB的后部以将打印流体直接供应到每个模条中的通路。印刷电路板实际上增长了每个模条用于建立流体连接和电连接的尺寸，因此使得能够使用更小的条。印刷电路板可被制造和加工的容易性，帮助简化打印头组件的制造。另外，模制可被用于成形打印头组件的表面，例如利用凸部以防止纸张撞到暴露的喷嘴板上和/或利用凹槽以帮助控制可能围绕喷嘴积聚的任意墨水。
新的制造工艺和流体分配结构不限于打印杆或用于喷墨打印的其它类型的打印头组件，而是可以实施为其它设备并用于包括例如添加剂制造机器(additivemanufacturing machine)以及数字滴定和其它这种药物分配设备的其它流体流应用。在附图中示出并在本文描述的示例例示但不限制本发明，本发明由本说明书后附的权利要求书限定。
如在本文献中所使用的，“微型设备”意指具有一个或多个小于或等于30mm的外部尺寸的设备；“薄”意指厚度小于或等于650μm；“条”意指具有至少为三的长宽比(L/W)的薄微型设备；“打印头模”意指喷墨打印机或其它喷射型分配器的用于将流体从一个或多个开口分配的部件。“打印头模”不限于用墨水和其它打印流体打印，而且包括其它流体的喷射型分配和/或用于打印以外的用途。
图1-图5例示具有四排打印头模条12的打印头组件10，四排打印头模条12大体上以交错的构造首尾相连地布置，其中每个模条12与另一模条12交叠，诸如可在基底宽打印杆中用于分配四种颜色的墨水的喷墨打印机。其它合适的构造也是可能的。例如，可使用具有更多或更少模和/或为不同构造的比条大的打印头模12。如在图3和图4中最佳可见的，模12例如利用粘合剂18被安装到印刷电路板(PCB)16的前表面14。喷墨打印头模12通常为形成在硅基底20上的复杂的IC(集成电路)结构。每个打印头IC结构中的热、压电或其它合适的流体喷射器元件22和其它部件(未示出)通过每个模12上的接合焊盘或其它合适的电端子26连接到PCB电路24。在所示的示例中，接合线或其它合适的导体28将模接合焊盘26连接到PCB16上的接合焊盘或其它合适的端子30。
现在特别参照图3-图5，在所示的示例中，每个打印头模12包括两排喷射室32和对应的喷嘴34，墨水或其它打印流体通过该对应的喷嘴34从室32喷出。PCB16中的通道36将打印流体供应到打印头模12中对应的一个。用于打印头模12和通道36的其它合适的构造也是可能的。例如，可使用更多或者更少的喷射室32和/或通道36。打印流体从沿每个模12在两排喷射室32之间纵向延伸的岐管38流入每个喷射室32中。打印流体通过在每个模12的后部42处连接到打印流体供应通道36的流体通路40注入岐管38中。
打印头组件10在图1-图5中面朝上地示出以更清楚地示出组件的一些特征部。打印头组件10在被安装于打印机中时通常面朝下地定向。而且，图3-图5中的打印头模12的理想化图示为了方便仅描绘三个层(基底20、室层44和喷嘴板46)以清楚地示出喷射室32、喷嘴34、岐管38和通路40。实际的喷墨打印头模12可包括比所示的那些更少或更多的层和/或用于将流体供应到室32的不同路径。例如，可使用具有或不具有岐管38的单个通路来代替多个通路40。
参见图1-5，模制件48覆盖PCB16的前表面，从而包围模12并封装接合线28，在流体分配喷嘴34处留出每个模12的暴露的前表面50。在所示的示例中，模制件48覆盖模基底20的延伸经过喷嘴板46的部分以及PCB前表面14的全部。虽然盖模制件48的前表面52在图1-图5中所示的示例中为完全平坦的，但是模制件48的其它表面构造也是可能的。
图6-图11为例示用于制造打印头组件10的方法的一个示例的一系列剖面图。图12为图6-图11中所示的方法的流程图。虽然在图6-图11的一系列的局部剖面图中仅示出一个打印头模12，但是该方法步骤同时应用于组装并模制类似图1-图5中所示的打印头组件10的所有模12。如图6-图8中所示，各个打印头模12例如利用施加到PCB16的带图案的粘合剂18被附接到预制为具有支撑打印头模12所需的结构和电子特性的PCB16(图12中的步骤102)。可以使用任意合适的技术来施加粘合剂18并将粘合剂18形成图案，包括例如粘合剂膜和通常在IC设备制造和包装中使用的粘胶输送系统(paste delivery system)。如图9中所示(图12中的步骤104)，丝焊或其它电连接部被形成在模12和PCB16之间。如图10中所示(图12中的步骤106)，盖模制件48被模制到图9的加工中的组件上。在图11中(图12中的步骤108)，通道36被形成在PCB16中。
在图13和图14中所示的示例中，通道36通过割锯穿透PCB16的后部54并割锯至模12的后部42中以打开流体通路40而形成。参见图13和图14，加工中的模制组件56被保持在固定位置中，同时锯片58在通道36的位置处开始切割穿透PCB16的后部54。在该示例中，模基底20中的流体流动通路40在打印头模12的制造期间未打开以简化模制造工艺并使模12更坚固以便处理，包括放置在PCB16上。图13和图14中的锯片58代表任意合适的切削片，包括，例如，锯齿状锯片或切割砂轮。另外，在所示的示例中，锯片58的外围切割边缘60具有弓形轮廓。其它合适的边缘轮廓也是可能的，包括例如平坦的和锥形的轮廓。
如图13和图14中的方向箭头64和虚线66、68所指示，锯片58被移动至PCB16的后部54中并继续移动至模12的后部42中以形成通道36，并且去除覆盖流体通路40的“帽”62。如图14中的方向箭头70所指示，锯片58以所需的深度沿PCB16纵向移动以切割通道36并打开通路40，以形成延伸通过PCB16的后部54并延伸至模12的后部42中通向通路40的单个连续的通道轮廓。如图2中最佳可见，一系列分离的通道36被切割至PCB16中。因此，每个通道36通过对于每个通道36将锯片58插入PCB16的后部中并继续至模12的后部42中进行切割。
可使用任意合适的模制技术来形成模制件48。在图15中所示的一个示例中，传递模具(transfer mold)72被用于形成模制件48。在该示例中，顶模镂刻腔74被构造为形成类似图3中所示的盖模制件48，在图3中模制件48横过打印头组件10的全部宽度为完全平坦的。在图16-图18中所示的另一示例中，顶模镂刻腔74包括凸部76以形成带有凹部78的盖模制件48，以例如帮助控制可能积聚在喷嘴34周围的任意墨水。在图19-图21中所示的另一示例中，顶模镂刻腔74包括凹部80以形成盖模制件48中的凸部82，以例如防止纸张撞到暴露的喷嘴34上。因此，通过改变模镂刻腔的构造，盖模制件48的拓扑结构可以被改变以实现打印头组件10的暴露的表面轮廓的期望特性。
如在本说明书的开始提示的，在附图中示出并且在上面描述的示例例示但不限制本发明。其它示例也是可能的。因此，前述描述不应该被解释为限制本发明的范围，本发明的范围在所附权利要求书中限定。

Claims (10)

1.一种用于制造微型设备组件的方法，包括：
将微型设备放置在印刷电路板的前部上；
将模制件围绕所述微型设备模制在所述印刷电路板上；并且随后
从所述印刷电路板的后部在所述印刷电路板中形成通向所述微型设备的通道，
其中所述模制包括将单个整体模制件模制在所述印刷电路板上和所述微型设备上，并且
其中所述形成包括切割穿透所述印刷电路板的后部并切割至所述微型设备中。
2.根据权利要求1所述的方法，其中所述切割包括割锯穿透所述印刷电路板的后部并割锯至所述微型设备中以打开所述微型设备中通向所述通道的流体通路。
3.根据权利要求2所述的方法，其中所述割锯包括将锯片插入穿透所述印刷电路板的后部并插入至所述微型设备中。
4.根据权利要求1所述的方法，其中所述模制包括将所述单个整体模制件模制在所述微型设备的一部分上。
5.一种用于制造打印头组件的方法，包括：
将打印头模布置在印刷电路板的前表面上；
将所述打印头模电连接到所述印刷电路板；
将盖围绕每个打印头模上暴露的流体分配喷嘴模制在所述印刷电路板上；并且随后
从所述印刷电路板的后部在所述印刷电路板中形成通向所述打印头模的通道，
其中所述模制包括将单个整体盖模制在所述印刷电路板上和所述打印头模上，
所述进一步包括在所述印刷电路板中形成通道的同时打开每个打印头模中的流体通路。
6.根据权利要求5所述的方法，其中所述形成和所述打开包括割锯穿透所述印刷电路板的后部以形成所述通道，并且割锯至所述模中以打开所述流体通路。
7.根据权利要求6所述的方法，其中所述割锯包括将锯片插入穿透所述印刷电路板的后部并插入至所述打印头模中。
8.根据权利要求5所述的方法，其中所述模制包括在所述盖模制件中模制凹部，或者在所述盖模制件中模制凸部，或者在所述盖模制件中模制凹部和凸部。
9.根据权利要求5所述的方法，其中：
所述电连接包括将所述打印头模上的端子丝焊到所述印刷电路板上的端子；并且
所述模制包括将盖围绕每个打印头模上暴露的流体分配喷嘴模制在所述印刷电路板上并完全覆盖所述丝焊。
10.一种打印头组件，包括：
印刷电路板；
安装到所述印刷电路板的前部的多个打印头模，每个所述打印头模具有流体喷射器、均靠近一喷射器的流体室、在所述打印头模的后部中的通路以及在所述打印头模的前部的喷嘴，其中流体能够通过所述通路流动至所述室，并且流体能够通过所述喷嘴从所述室喷射；
覆盖所述印刷电路板并围绕在所述多个打印头模中的每个的前部的所述喷嘴的单个整体模制件；以及
切割穿透所述印刷电路板的后部并切割至所述多个打印头模中对应的一个打印头模的后部中通向所述对应的一个打印头模中的所述通路的多个单个通道，
其中每个打印头模包括模条，并且所述模条大体上沿所述打印头的长度以交错的构造首尾相连地布置，其中每个模条与另一模条交叠。
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US9656469B2 (en) 2017-05-23
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CN106457861A (zh) 2017-02-22
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US20160096366A1 (en) 2016-04-07
TWI609611B (zh) 2017-12-21
TW201505859A (zh) 2015-02-16

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