TWI564164B - 流體流動結構、製作列印頭流體流動結構中之流體通道的方法及製作列印頭結構之方法 - Google Patents

流體流動結構、製作列印頭流體流動結構中之流體通道的方法及製作列印頭結構之方法 Download PDF

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TWI564164B
TWI564164B TW103115323A TW103115323A TWI564164B TW I564164 B TWI564164 B TW I564164B TW 103115323 A TW103115323 A TW 103115323A TW 103115323 A TW103115323 A TW 103115323A TW I564164 B TWI564164 B TW I564164B
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Taiwan
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fluid
saw
fluid flow
printhead
sawing
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TW103115323A
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TW201505859A (zh
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陳清華
麥可Ｗ 庫米比
阿冗Ｋ 阿卡沃
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惠普發展公司有限責任合夥企業
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Priority claimed from PCT/US2013/048214 external-priority patent/WO2014133576A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Description

流體流動結構、製作列印頭流體流動結構中之流體通道的方法及製作列印頭結構之方法
本發明係有關於具鋸切通道之模製流體流動結構。
噴墨印頭(inkjet pen)或列印橫條(print bar)中的列印頭晶粒包括在矽基體表面上的多個流體射出元件。流體通過在相對基體表面形成於基體的流體輸送狹縫流到射出元件。儘管流體輸送狹縫適當地輸送流體至流體射出元件，然而此類狹縫仍有一些缺點。從成本觀點來說，例如，油墨輸送狹縫佔用珍貴的矽建地(silicon real estate)以及增加顯著的狹縫加工成本。此外，較低的列印頭晶粒成本部份是通過縮小晶粒達成，這與矽基體中有較窄的狹縫間距及/或狹縫寬度相關聯。不過，縮小狹縫間距增加與小晶粒整合於噴墨印頭相關聯的額外組裝成本。結構上，移除基體的材料以形成油墨輸送狹縫會使列印頭晶粒變弱。因此，若單一列印頭晶粒有多個狹縫(例如，以改善單色列印頭晶粒的印刷品質及速度，或提供多色列印頭晶粒的不同顏色)，隨著每個狹縫的增加，列印頭晶粒變成越來越易碎。
依據本發明之一實施例，係特地提出一種流體流動結構，其包含：嵌入一模製品的一微型裝置；經形成穿過該微型裝置的一流體進料孔；以及經切割穿過該模製品的一鋸定(saw defined)流體通道，其係流體性地耦合該流體進料孔與該通道。
100‧‧‧結構
102‧‧‧微型裝置/列印頭晶粒
104‧‧‧單石體/模製品/模製體
106‧‧‧基體
108‧‧‧流體進料孔
110‧‧‧第一外表面
112‧‧‧第二外表面
114‧‧‧(薄)矽帽蓋
116‧‧‧層體
118‧‧‧射出腔室
120‧‧‧孔口
122‧‧‧導體(跡線)
124‧‧‧電氣端子
126‧‧‧絕緣層
128‧‧‧鋸定流體通道
160‧‧‧載體
162‧‧‧熱(分離)膠帶
164‧‧‧塑封蓋
166‧‧‧SU8點火腔室保護層
200‧‧‧系統
202‧‧‧流體源
204‧‧‧流體驅動器
300‧‧‧列印機
302‧‧‧列印橫條
304‧‧‧印刷基體
306‧‧‧流量調節器
308‧‧‧基體傳送機構
310‧‧‧供應器
312‧‧‧控制器
400‧‧‧行
700‧‧‧旋轉切割鋸
702‧‧‧順時鐘方向
704、708、710‧‧‧虛線圖示
706‧‧‧第一方向
712‧‧‧第二方向
714‧‧‧水平方向
716‧‧‧垂直方向
800、900‧‧‧周邊鋸刃
1700、1800‧‧‧流程圖
1702~1708、1802~1818‧‧‧步驟
S1、S2‧‧‧第一、第二側壁
此時參考附圖舉例說明本發明的具體實施例。
圖1圖示實作成列印頭結構之一模製流體流動結構實施例的立面剖視圖；圖2的方塊圖圖示實作如圖1列印頭結構之模製流體流動結構的示範系統；圖3的方塊圖圖示在基體寬式列印橫條中實作一流體流動結構實施例的噴墨列印機；圖4至圖6圖示將一模製流體流動結構實施例實作成為適用於列印機之列印頭結構的噴墨列印橫條；圖7至圖9圖示用旋轉切割鋸在流體流動結構之模製體內界定流體通道的示範方法；圖10圖示在形成鋸定流體通道之前的一模製流體流動結構實施例；圖11至圖15圖示可切成流體流動結構之模製體而有不同形狀的鋸定流體通道實施例；圖16圖示製作有鋸定流體通道之列印頭流體流動結構的示範方法；圖17的流程圖圖示在流體流動結構之模製體內 用如圖7至圖9所示之旋轉切割鋸界定流體通道的示範方法；圖18的流程圖圖示製作有如圖16所示之鋸定流體通道的列印頭流體流動結構之示範方法。
附圖中，類似但不一定相同的元件用相同的元件符號表示。
概述
習知噴墨列印頭晶粒過去達成降低成本係通過縮小晶粒大小及降低晶片成本。晶粒大小明顯取決於流體輸送狹縫的間距，該流體輸送狹縫係由在晶粒之一側上的貯器輸送油墨至在晶粒之另一側上的流體射出元件。因此，用來縮小晶粒大小的先前技術方法大部份包括通過矽開縫方法(silicon slotting process)來減少狹縫間距及大小，例如，可包括雷射機械加工法、非等向性濕蝕刻法、乾蝕刻法、彼等之組合、等等。可惜，矽開縫方法本身使列印頭晶粒增加可觀的成本。此外，減少狹縫間距的成功已逐漸滿足報酬遞減定律，因為與整合縮小晶粒(由較窄的狹縫間距所致)、噴墨印頭有關的成本已變成過多。
流體流動結構致能使用較小的列印頭晶粒以及形成從在列印頭晶粒之一側上之貯器輸送油墨至在晶粒之另一側上之流體射出元件的流體輸送通道的簡化方法。該流體流動結構包括模製於由塑膠、環氧樹脂模製化合物、或其他可模製材料組成之單石體內的一或更多列印頭晶 粒。例如，實作此新結構的列印橫條包括模製於長形單一模製體內的多個列印頭晶粒。藉由把流體輸送通道(亦即，油墨輸送狹縫)從晶粒轉移到結構的模製體，該模製品(molding)致能使用較小的晶粒。因此，該模製體有效增加用於製作外部流體連接之每個晶粒以及適於黏貼晶粒至其他結構的大小。用能直進切削(plunge cut)穿過該模製體的切割鋸，在流體流動結構中形成流體輸送通道。
上述流體流動結構不限於列印橫條或用於噴墨印刷的其他類型列印頭結構，反而可實作於其他的裝置中及用於其他的流體流動應用。因此，在一實施例中，該新結構包括微型裝置，其係嵌入有通道或其他流體路徑供流體直接流入或流至裝置上的模製品。該微型裝置可為例如電子裝置、機械裝置、或微機電系統(MEMS)裝置。例如，該流體流動可為進入或到微型裝置上的冷卻流體流動或進入列印頭晶粒或其他流體分配微型裝置的流體流動。圖示於附圖及描述於下文的以上及其他實施例係圖解說明而不是限制界定於下列請求項的本發明。
如用於本文的，“微型裝置”意指有小於或等於30毫米之一或更多外部尺寸的裝置；“薄”意指厚度小於或等於650微米；“薄片”意指長寬比(L/W)至少為3的薄微型裝置；“列印頭結構”與“列印頭晶粒”意指噴墨列印機或其他噴墨型分配器中由一或更多開口分配出流體的部件。列印頭結構包括一或更多列印頭晶粒。“列印頭結構”與“列印頭晶粒”不限於用油墨及其他印刷流體印刷，也包含不用 於印刷或除印刷以外之其他流體的噴墨型分配。
示範具體實施例
圖1的立面剖視圖圖示實作成為列印頭結構100的模製流體流動結構100之一實施例，其係適用於噴墨列印機的列印橫條。列印頭結構100包括模製於由塑膠或其他可模製材料組成之單石體104內的微型裝置102。模製體104在此也稱作模製品104。一般而言，微型裝置102可為例如電子裝置、機械裝置、或微機電系統(MEMS)裝置。在圖1的列印頭結構100中，微型裝置102實作成為列印頭晶粒102。列印頭晶粒102包括由厚約100微米矽薄片構成的矽晶粒基體106。矽基體106包括經乾蝕刻或其他方式形成於其中，以致能流體由第一外表面110流動通過基體106至第二外表面112的流體進料孔108。矽基體106更包括鄰接及覆蓋第一外表面110的薄矽帽蓋114(亦即，覆蓋矽基體106的帽蓋)。矽帽蓋114厚約30微米且可由矽或一些其他適當材料形成。
形成於基體106之第二外表面112上的是界定促進列印頭結構100射出液滴之流體性架構的一或更多層體116。層體116所界定的流體性架構大體包括有對應孔口120、歧管(未圖示)及其他流體性通道及結構的射出腔室118。(數個)層體116，例如，可包括形成於基體106上的腔室層以及形成於該腔室層上面的個別成形孔口層，或它們可包括組合腔室與孔口層的單石層。(數個)層體116通常由SU8環氧樹脂或一些其他聚亞醯胺材料形成。
除了由矽基體106上之(數個)層體116界定的流體性架構以外，列印頭晶粒102包括用未圖示於圖1之薄膜層及元件形成於基體106上的積體電路。例如，與每個射出腔室118對應的是形成於基體106上之熱射出元件或壓電射出元件。該等射出元件經致動以由腔室118通過孔口120射出油墨或其他印刷流體的小滴或串流。
列印頭結構100也包含在形成於基體106上之電氣端子124連接至列印頭晶粒102的訊號跡線或其他導體122。導體122可用各種方式形成於結構100上。例如，如圖1所示，導體122可用積層或沉積方法形成於絕緣層126中。絕緣層126通常為提供導體122之物理支撐及絕緣的聚合物材料。在其他的實施例中，可模製導體122於模製體104內。
鋸定流體通道(saw defined fluid channel)128經形成其係穿過模製體104及薄矽帽蓋114，以及在外表面110與列印頭晶粒基體106連接。流體通道128打開穿過該模製體及薄矽帽蓋114的途徑使流體能通過流體進料孔108直接流入矽基體106，以及在外表面110流到矽基體106上。如以下所詳述的，使用例如旋轉切割鋸之切割鋸形成穿過模製體104的流體通道128。
圖2的方塊圖圖示實作如圖1所示之列印頭結構100的模製流體流動結構100的系統200。系統200包括可操作地連接至的流體驅動器(fluid mover)204流體源202，流體驅動器(fluid mover)204經組配成可使流體移到流體流 動結構100中之通道128，例如列印頭結構100中之鋸定流體通道128。流體源202，例如，可包括作為空氣源的大氣以冷卻電子微型裝置102或列印頭晶粒102的印刷流體供應器。流體驅動器204為泵浦、風扇、重力或用於使流體由來源202移到流動結構100的任何其他適當機構。
圖3的方塊圖圖示實作流體流動結構100之一實施例於基體寬式列印橫條(substrate wide print bar)302中的噴墨列印機300。列印機300包括跨越印刷基體304寬度的列印橫條302，與列印橫條302相關聯的流量調節器306，基體傳送機構308，油墨或其他印刷流體供應器310，以及列印機控制器312。控制器312代表程式、(數個)處理器及相關聯之記憶體，以及控制列印機300之操作元件所需的電子電路及組件。列印橫條302包括由列印頭晶粒102組成的配置用於分配印刷流體至紙張或連續紙幅或其他印刷基體304上。每個列印頭晶粒102透過由供應器310進入及穿過流量調節器306及列印橫條302中之流體通道128的流動路徑來接受印刷流體。
圖4至圖6圖示實作模製流體流動結構100之一實施例成為適用於圖3列印機300之列印頭結構100的噴墨列印橫條302。請參考圖4的平面圖，列印頭晶粒102均嵌入狹長單石模製品104中且大體上頭尾銜接地排成呈交錯組態的數行400，其中每一行中的列印頭晶粒102與同一行中的另一列印頭晶粒相互重疊。在此組態下，列印頭晶粒102的每一行400接受來自不同鋸定流體通道128(圖 4以虛線圖示)的印刷流體。雖然圖示四條流體通道128供給四行400交錯列印頭晶粒102(例如，用於印刷四種不同顏色)，然而可能有其他的適當組態。圖5為噴墨列印橫條302沿著圖4中之直線5-5繪出的剖開透視圖，以及圖6為噴墨列印橫條302沿著圖4中之直線5-5繪出的剖視圖。圖6的剖視圖圖示如在說明圖1時所述之列印頭結構100的各種細節。
儘管已大體用圖1至圖6圖示及描述鋸定流體通道128的特定形狀或組態，然而可用切割鋸實現有各種不同組態的流體通道128。如下述，圖11至圖15圖示有各種不同形狀的流體通道128實施例，它們容易用有如圖7至圖9所示之不同周邊鋸刃形狀的切割鋸切成流體流動結構100的模製體104。
圖7至圖9圖示在流體流動結構100之模製體104內用旋轉切割鋸700界定流體通道128的示範方法。圖17為圖示於圖7至圖9之方法的流程圖1700。圖7的側面圖圖示在模製流體流動結構100中形成鋸定流體通道128的示範方法。圖7的側面圖係沿著圖8及圖9中之直線7-7繪成。圖8的立面剖視圖圖示用有大體直角周邊鋸刃800的旋轉切割鋸700在模製流體流動結構100中形成鋸定流體通道128的示範方法。大體直角周邊鋸刃800的特徵在於旋轉鋸700的側面與鋸子的周邊一直保持相互平行。圖9的立面剖視圖圖示用有大體錐形周邊鋸刃900的旋轉切割鋸700在模製流體流動結構100中形成鋸定流體通道128 的示範方法。大體錐形周邊鋸刃900的特徵在於旋轉鋸700的側面在鋸子的周邊附近向內相互岔開。圖8及圖9為沿著圖7中之直線8-8與9-9繪出的剖視圖。
此時主要參考圖7及圖17，在模製流體流動結構100保持在固定位置時，旋轉切割鋸700被致動成可例如在順時鐘方向702旋轉，以開始切割結構100的流體通道128(圖17的步驟1702)。旋轉切割鋸700的周邊刀刃(例如，800，900)可參差不齊及/或有形成於其上的磨料以便在鋸子旋轉時完成切割操作。例如，鋸700可具有鑲鑽刀刃。旋轉切割鋸700沿著垂直方向放低以接合及直進切削模製體104(參考鋸700的虛線圖示704)(圖17的步驟1704)。特別是，旋轉切割鋸700在垂直於矽基體106外表面110的第一方向706移動以部份形成模製體104的流體通道128和矽帽蓋114。亦即，鋸700放低穿過模製體104及矽帽蓋114(參考鋸700的虛線圖示708)，其係部份形成流體通道128。然後，旋轉切割鋸700水平移動以拖切(drag cut)模製體104及矽帽蓋114(參考鋸700的虛線圖示710)(圖17的步驟1706)。特別是，旋轉切割鋸700在平行於矽基體106外表面110的第二方向712移動以完成流體通道128的形成。然後，旋轉切割鋸700可沿著水平方向714及垂直方向716移動回到初始位置(圖17的步驟1708)。
圖示於圖11至圖15的不同形狀鋸定流體通道128用大體與以上關於圖7之描述相同的方式形成。不過，在形成形狀不同的通道128時，可個別或以組合方式使用 有形狀不同之周邊刀刃的旋轉鋸片(例如，圖8的800；圖9的900)，以及用不同的應用順序於模製流體流動結構100。此外，在將流體通道128形成為它們呈大體平行於狹長單石模製體的長度(參考圖4至圖6)以及與列印頭晶粒102的長度對應時，也可用不同的取向鋸切通道，例如與圖示垂直的取向。通道切口可以此方式安排流體以不同方向及針對不同目的來通過流體流動結構100的路線。例如，垂直於圖示於圖4至圖6的通道切口可用來用垂直的通道鏈路(channel link)連結兩條平行通道。
圖10圖示在鋸定流體通道128形成之前的模製流體流動結構100。流體流動結構100的組態與以上在說明圖1時提及的方式大體相同，除了圖示導體22嵌在模製體104內而不是在個別絕緣層126內以外。為了簡化圖解說明的一般目的而使用此組態於圖10至圖15。
請參考圖11，鋸定流體通道128已形成有實質相互平行的第一、第二側壁S1、S2。例如，用如圖8所示的旋轉切割鋸700可形成平行側壁S1及S2。圖8的旋轉切割鋸700有以平行刃片側面為特徵的大體直角周邊鋸刃800，它在插入流體流動結構100的模製體104時移除薄矽帽蓋114的模製品材料及矽，留下實質平行的鋸切側壁S1及S2。
圖12圖示鋸定流體通道128經形成有相互呈錐形的第一、第二側壁S1、S2。該等錐形側壁在它們靠近基體106之流體進料孔108時向對方靠近，以及在遠離基體 106時相互遠離。例如，用如圖9所示的旋轉切割鋸700，可形成錐形側壁S1及S2。圖9的旋轉切割鋸700有大體錐形周邊鋸刃900，其特徵在於旋轉鋸700的側面在鋸子周邊附近向內相互岔開。在插入流體流動結構100的模製體104時，有鋸刃900的鋸子移除薄矽帽蓋114的模製品材料及矽，留下錐形的鋸切側壁S1及S2。
圖13、圖14及圖15所示的鋸定流體通道128各自經形成有實質平行及互呈錐形兩種部份的第一、第二側壁S1及S2。側壁S1、S2的平行部份可用如圖8所示的旋轉切割鋸700形成，以及側壁S1、S2的錐形部份可用如圖9所示的旋轉切割鋸700形成。有不同錐形夾角(tapering angle)的側壁部份用側面在鋸子周邊附近有向內相互岔開之不同角度的如圖9所示切割鋸700形成。
圖13中，側壁S1及S2的平行部份鄰接薄片基體106，以及錐形部份向內相互逐漸變窄以與平行部份會合。圖14中，側壁S1及S2的錐形部份鄰接薄片基體106。錐形部份相互逐漸變窄以與薄片基體106會合以及相互逐漸變寬以與平行側壁部份會合。圖15中，側壁S1及S2的平行部份鄰接薄片基體106，以及第一組錐形部份相互逐漸變窄以與平行部份會合。第二組錐形部份向內逐漸變窄以與第一組錐形部份會合。
一般而言，圖示於圖11至圖15的鋸切流體通道128有以各種平行及/或錐形組態形成的通道側壁S1及S2。在遠離列印頭薄片基體106時相互岔開或相互逐漸變寬的 通道側壁提供協助氣泡離開孔口120、射出腔室118及流體進料孔108的效益，否則氣泡可能妨礙或阻止流體流動。因此，圖示於圖11至圖15的流體通道128包括在遠離薄片基體106時平行及/或岔開的側壁。不過，圖示通道側壁組態並非旨在限制鋸定流體通道128內有其他形狀及組態的側壁。反而，本揭示內容預期有以各種其他組態形成而未具體圖示及描述之側壁形狀的其他可能鋸定流體通道。
圖16圖示用於製作有鋸定流體通道128之列印頭流體流動結構100的示範方法。圖18的流程圖1800圖示圖16的方法。如圖16所示，在部份“A”處，列印頭晶粒102用熱分離膠帶(thermal release tape)162附著至載體160(圖18的步驟1802)。列印頭晶粒102以孔口側面朝下地放在載體160上。列印頭晶粒102處於經預加工狀態(pre-processed state)使得它已經包含界定流體性架構(例如射出腔室118、孔口120)的(數個)層體116，以及形成於薄片基體106上的電氣端子124及射出元件(未圖示)。流體進料孔108也已經被乾蝕刻或以其他方式形成於薄片基體106中。
如圖示，在圖16的部份“B”處，模製列印頭晶粒102於模製體104內(圖18的步驟1804)。在一實施例中，用塑封蓋(mold top)164壓縮模製晶粒102。如圖示，在圖16的部份“C”處，使載體160與熱膠帶162分離以及移除膠帶(圖18的步驟1806)。在圖16的部份“D”處，積層聚合物絕緣層126於列印頭晶粒102的孔口側面上，然後加以圖案化及固化 (圖18的步驟1808)。沉積SU8點火腔室保護層166於(數個)流體性架構層116上面，如圖16所示的部份“E”(圖18的步驟1810)。在如圖16所示部份“F”處，沉積金屬層(Cu/Au)於聚合物絕緣層126上以及圖案化成導體跡線122(圖18的步驟1812)。然後，旋塗頂聚合物絕緣層126於導體跡線122上面，然後圖案化及固化成，如圖16的部份“G”所示(圖18的步驟1814)。在圖16的部份“H”處，剝掉點火腔室保護層166以及進行聚合物絕緣層126的最終固化(圖18的步驟1816)。在圖16的部份“I”處，接著在列印頭流體流動結構100的背側形成鋸切流體通道128。流體通道128用上述圖示於圖7及圖17的流體通道形成方法形成。流體通道128可組配成有各種形狀，例如以上在說明圖11至圖15時提及的。
100‧‧‧結構
102‧‧‧微型裝置/列印頭晶粒
104‧‧‧單石體/模製品/模製體
106‧‧‧基體
108‧‧‧流體進料孔
110‧‧‧第一外表面
112‧‧‧第二外表面
114‧‧‧(薄)矽帽蓋
116‧‧‧層體
118‧‧‧射出腔室
120‧‧‧孔口
122‧‧‧導體(跡線)
124‧‧‧電氣端子
126‧‧‧絕緣層
128‧‧‧鋸定流體通道

Claims (12)

  1. 一種流體流動結構，其係包括：嵌入一模製品的一微型裝置；穿過該微型裝置形成的一流體進料孔；切割穿過該模製品的一鋸定(saw defined)流體通道，其係流體性地耦合該流體進料孔與該通道；以及在該微型裝置上的一矽帽蓋；其中該鋸定流體通道包括切割穿過該模製品及該矽帽蓋兩者以流體性地耦合該流體進料孔與該通道的一鋸定流體通道。
  2. 如請求項1所述之結構，其中該通道包括第一及第二實質平行側壁。
  3. 如請求項1所述之結構，其中該通道包括第一及第二錐形側壁。
  4. 如請求項3所述之結構，其中該等錐形側壁在靠近該等流體進料孔時相互逐漸變窄。
  5. 如請求項1所述之結構，其中該通道包括含有錐形側壁部份及實質平行側壁部份兩者的第一及第二側壁。
  6. 如請求項5所述之結構，其中該等錐形側壁部份鄰接該微型裝置，使得它們相互逐漸變窄以與該微型裝置會合，且相互逐漸變寬以與該等平行側壁部份會合。
  7. 如請求項5所述之結構，其中該等平行側壁部份鄰接該微型裝置以及該等錐形側壁部份相互逐漸變窄以與該 等平行側壁部份會合。
  8. 如請求項1所述之結構，其中該等側壁為模製側壁。
  9. 一種製作列印頭流體流動結構中之流體通道的方法，其係包含下列步驟：致動一旋轉切割鋸；以及使該鋸直進切削進入該列印頭流體流動結構的一模製體以形成一流體通道；其中使該鋸直進切削的步驟包括：使該鋸直進切削穿過該模製體以及穿過覆蓋一薄片矽基體中之數個流體進料孔的一矽帽蓋。
  10. 一種製作列印頭結構之方法，其係包含下列步驟：模製一列印頭晶粒於一模製體內；以及用一切割鋸鋸出進入該模製體的一流體通道；其中鋸出一流體通道的步驟包括：鋸出一流體通道，其係穿過該模製體以及穿過覆蓋該列印頭晶粒之一薄片矽基體中之數個流體進料孔的一矽帽蓋。
  11. 如請求項10所述之方法，其中鋸穿該矽帽蓋係使該流體通道流體性地耦合至該等進料孔，使流體能由該流體通道流出通過該薄片矽基體。
  12. 如請求項10所述之方法，其中鋸出一流體通道的步驟包括：鋸出具有在靠近該薄片矽基體時相互逐漸變窄之側壁的一流體通道。
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