TW201605306A - 用於製造模造裝置總成及列印頭總成的方法 - Google Patents

用於製造模造裝置總成及列印頭總成的方法 Download PDF

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TW201605306A
TW201605306A TW104114267A TW104114267A TW201605306A TW 201605306 A TW201605306 A TW 201605306A TW 104114267 A TW104114267 A TW 104114267A TW 104114267 A TW104114267 A TW 104114267A TW 201605306 A TW201605306 A TW 201605306A
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Taiwan
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die
circuit board
printed circuit
molding
fluid
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TW104114267A
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TWI609611B (zh
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清華 陳
湯瑪斯Ｒ 史翠德
麥克Ｇ 葛羅赫
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惠普發展公司有限責任合夥企業
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Priority claimed from PCT/US2013/048214 external-priority patent/WO2014133576A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H05K2203/0228—Cutting, sawing, milling or shearing
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

在一範例中，一用於製造一微裝置總成之方法係包括將一微裝置放置在一印刷電路板的一前部份上，在印刷電路板上模造一圍繞微裝置之模製物，然後在印刷電路板的一背部份中形成對於微裝置之一通路。

Description

用於製造模造裝置總成及列印頭總成的方法
本發明係有關於用於製造模造裝置總成及列印頭總成的方法。
一噴墨筆或列印桿中的各列印頭晶粒係包括微小通道，微小通道將墨水或其他列印流體攜載至射出腔室。列印流體係經過一用以將列印頭晶粒支撐於筆或列印桿上之結構中的通路而被配送至晶粒通道。可能係欲縮小各列印頭晶粒的尺寸，以例如降低晶粒的成本並依此降低筆或列印桿的成本。
依據本發明之一實施例，係特地提出一種用於製造一微裝置總成之方法，其包含：將一微裝置放置在一印刷電路板的一前部份上；在該印刷電路板上模造一圍繞該微裝置之模製物；然後在該印刷電路板的一背部份中形成一通至該微裝置之一通路。
10‧‧‧列印頭總成
12‧‧‧列印頭晶粒狹條
14‧‧‧前表面
16‧‧‧印刷電路板(PCB)
18‧‧‧黏劑
20‧‧‧矽基體
22‧‧‧流體射出器元件
24‧‧‧PCB電路
26‧‧‧電終端
28‧‧‧銲線或其他適當導體
30‧‧‧終端
32‧‧‧射出腔室
34‧‧‧噴嘴
36‧‧‧通路
38‧‧‧歧管
40‧‧‧流通道
42‧‧‧晶粒12的背部份
44‧‧‧腔室層
46‧‧‧噴嘴板
48‧‧‧模製物
50‧‧‧晶粒12之露出的前面
54‧‧‧PCB 16的背部份
56‧‧‧程序中模造總成
58‧‧‧鋸刃
60‧‧‧周邊切割邊緣
62‧‧‧帽蓋
64,70‧‧‧方向箭頭
66,68‧‧‧虛線
72‧‧‧轉移模具
74‧‧‧頂模鏤刻
76‧‧‧凸塊
78,80‧‧‧凹部
102,104,106,108‧‧‧步驟
圖1顯示諸如有可能使用於一筆中或一噴墨印表機中的列印桿中之一新的模造噴墨列印頭總成的一範例； 圖2是圖1中的細部；圖3是沿圖2的線3-3所取之剖視圖；圖4是圖3中的細部；圖5是顯示圖1至4所示的列印頭總成中之列印頭晶粒的一者的一部分之平面圖細部；圖6至11是顯示一用於製造諸如圖1至5所示的總成等的列印頭總成之方法的一範例之一序列的剖視圖；圖12是顯示圖6至11所示的方法之流程圖；圖13及14是顯示圖12的方法中之通路形成步驟的一範例之剖視圖；圖15是顯示圖12的程序中之模造步驟的一範例之剖視圖；圖16至18顯示一其中覆蓋模製物包括沿著各列印頭晶粒的溝槽之範例；圖19至21顯示一其中覆蓋模製物包括沿著列印頭晶粒一側的凸脊之範例。
相同的元件號碼係代表各圖中相同或類似的元件。圖式未必依照實際比例。部份元件的尺寸係加大以更清楚地示範所顯示的範例。
已經開發利用一常稱為“列印桿”的基體寬列印頭總成來幫助增高列印速度及降低列印成本之噴墨印表機。傳統的列印桿係包括用以將列印流體從列印流體供應物攜載至小列印頭晶粒之多重部份，列印流體自小列印頭晶粒 被射出至紙或其他列印基體上。雖然降低列印頭晶粒的尺寸及間隔對於降低成本而言一直很重要，要將列印流體從較大供應組件傳送至愈來愈小、更緊密分隔的晶粒係需要實際上會增高成本之複雜的流結構及製造方法。
已經開發一新的製造方法，以能夠使用較小的列印頭晶粒及較密實的晶粒電路而在基體寬噴墨印表機列印桿中幫助降低成本。在新方法的一範例中，列印頭晶粒狹條(sliver)係在所欲組構中配置於一印刷電路板(PCB)的前部份上且例如以銲線被電性連接至PCB中的電路。然而，一圍繞晶粒狹條之覆蓋模製物係被模造於PCB上，而使流體射出噴嘴露出於各狹條上。流體輸送通路係切割至PCB的背部份中以連接至各狹條中的流體通道。各晶粒狹條中的流體通道係可能在狹條製造期間未被開啟以簡化狹條製造方法並使狹條更強固以供後續處置。在藉由切割經過PCB且進入各晶片的背部份中而將流體輸送通路切割至PCB中之相同時間，令晶粒狹條中的流體通道被開啟。
所產生的結構係包括被嵌入PCB前部上的一模製物中之多重的列印頭晶粒狹條，其中列印頭噴嘴係露出以供施配列印流體，且具有經過PCB背部的通路以將列印流體直接供應至各晶粒狹條中的通道。印刷電路板係實質上藉由製造流體及電性組件而增大各晶粒狹條的尺寸，因此能夠使用較小狹條。由於容易製造及處理印刷電路板而有助於簡化列印頭總成之製造。並且，可使用模製物來定形列印頭總成的面，例如具有凸塊以防護一紙闖入露出的 噴嘴板中及/或具有溝槽以幫助控制任何有可能累積於噴嘴周圍的墨水。
新的製造方法及流體施配結構係不限於列印桿或用於噴墨列印之其他類型的列印頭總成，而是可在其他裝置中被實行及用於其他的流體流應用，例如包括加成性製造機具及數位滴定及其他的此等藥學施配裝置。圖中所顯示及本文所描述的範例係示範而非限制在此描述後續的申請專利範圍中被界定之本發明。
如同此文件所使用，“微裝置”係指具有一或多個外部維度小於或等於30mm之裝置；“薄”係指小於或等於650μm的厚度；“狹條”係指具有至少為3的長寬比(L/W)之薄型微裝置；“列印頭晶粒”係指用以從一或多個開口施配流體之噴墨印表機或其他噴墨類型施配器的部份。“列印頭晶粒”並不限於以墨水及其他列印流體作列印，而是亦包括其他流體的噴墨類型施配及/或使用列印以外的方式。
圖1至5顯示一列印頭總成10，其具有在一交錯組態中概括呈端對端式配置之四列的列印頭晶粒狹條12，其中各晶粒狹條12係重疊於另一晶粒狹條12，諸如有可能使用在一基體寬列印桿中以供一噴墨印表機施配四色墨水。亦可能具有其他的適當組態。例如，可使用比狹條更大的列印頭晶粒12，具有較多或較少個晶粒及/或呈現一不同組態。如圖3及4清楚顯示，晶粒12係例如以一黏劑18被安裝至一印刷電路板(PCB)16的前表面14。一噴墨列印頭晶粒12係為被形成於一矽基體20上之一典型複雜的IC(積體電路) 結構。各列印頭IC結構中之熱性、壓電或其他適當的流體射出器元件22及其他組件(未圖示)係經過各晶粒12上之結合墊或其他適當的電終端26而被連接至PCB電路24。在所顯示範例中，銲線或其他適當導體28係將晶粒結合墊26連接至PCB 16上之結合墊或其他適當的終端30。
現在特別參照圖3至5，在所顯示範例中，各列印頭晶粒12係包括二列的射出腔室32及對應噴嘴34，墨水或其他列印流體經過其而從腔室32被射出。PCB 16中的一通路36將列印流體供應至列印頭晶粒12的一對應者。係可能具有用於列印頭晶粒12及通路36的其他適當組態。例如，可使用較多或較少個射出腔室32及/或通路36。列印流體係從一沿著各晶粒12在兩列射出腔室32之間作長度方向延伸之歧管38而流入各射出腔室32中。列印流體係經過在各晶粒12的一背部份42被連接至列印流體供應通路36之流通道40而饋給至歧管38中。
列印頭總成10係以面朝上顯示於圖1至5中，以更清楚地顯示總成的部分特性。一列印頭總成10通常將在裝設於一印表機中時被定向成面朝下。並且，圖3至5中之一列印頭晶粒12的理想化圖示係僅供方便而描繪三層(基體20、腔室層44及噴嘴板46)，以清楚顯示射出腔室32、噴嘴34、歧管38及通道40。一實際的噴墨列印頭晶粒12可包括比圖示者更少或更多層及/或不同路徑以將流體供應至腔室32。例如，可具有或沒有一歧管38的單一通道可採用來取代多重通道40。
參照圖1至5，一模製物48係覆蓋PCB 16的前表面，而圍繞晶粒12且包封住銲線28，在流體施配噴嘴34處留下各晶粒12之一露出的前面50。在所顯示範例中，模製物48係覆蓋住延伸經過噴嘴板46暨PCB前表面14完整幅度之晶粒基體20的一部分。雖然覆蓋模製物48的前面52在圖1至5所示範例中為完全平坦，係可能具有用於模製物48之其他表面組態。
圖6至11是顯示一用於製造一列印頭總成10之方法的一範例之一序列的剖視圖。圖12是顯示圖6至11所示的方法之流程圖。雖然在圖6至11的序列的部份剖視圖中顯示僅一個列印頭晶粒12，程序步驟係被同時施用以組裝及模造用於一列印頭總成10之全部晶粒12，就像圖1至5所示者。如圖6至8所示，在預製所欲的結構性及電性特徵以支撐列印頭總成12之前，例如利用一被施加至PCB 16的圖案化黏劑18將個別列印頭晶粒12附接至一PCB 16(圖12的步驟102)。可使用任何適當的技術來施加及圖案化黏劑18，例如包括IC裝置製造及封裝中所常用的黏劑膜及膏輸送系統。銲線或其他電性連接係形成於晶粒12與PCB 16之間，如圖9所示(圖12的步驟104)。覆蓋模製物48係模造至圖9的製程中總成上，如圖10所示(圖12的步驟106)。通路36形成於圖11的PCB 16中(圖12的步驟108)。
在圖13及14所示的範例中，藉由鋸切經過PCB 16的背部份54且進入晶粒12的背部份42中以開啟流通道40，而形成通路36。參照圖13及14，程序中模造總成56係被固 持在一固定位置中，同時一鋸刃58則在一通路36的區位中開始切割經過PCB 16的背部份54。在此範例中，晶粒基體20中的流體流通道40係在列印頭晶粒12製造期間保持未被開啟，以簡化晶粒製造方法並使晶粒12更強固以供處置，包括PCB 16之放置。圖13及14中的鋸刃58係代表任何適當的切刃，例如包括一有齒式鋸刃或一研磨性切輪。並且，在所顯示範例中，鋸刃58的周邊切割邊緣60具有一拱形輪廓。可能具有其他的適當邊緣輪廓，例如包括平坦及推拔狀輪廓。
鋸刃58係被移動進入PCB 16的背部份54中且繼續進入晶粒12的背部份42中以形成通路36，並移除覆蓋住流通道40之“帽蓋”62，如圖13及14的方向箭頭64及虛線66、68所示。鋸刃58在所欲深度沿著PCB 16在長度方向被移動，以切割通路36及開啟通道40，如圖14的方向箭頭70所示，以形成延伸經過PCB 16的背部份54且進入晶粒12背部份42中來到通道40之單一未中斷的通路輪廓。如圖2清楚顯示，一系列的離散通路36係切割進入PCB 16中。為此，藉由對於各通路36將鋸刃58切入(plunging)PCB 16的背部份中且繼續進入晶粒12的背部份42中，而切割各個通路36。
可使用任何適當的模造技術來形成模製物48。在一範例中，如圖15所示，使用一轉移模具72以形成模製物48。在此範例中，頂模鏤刻74腔穴係組構以形成一覆蓋模製物48，如同圖3所示者，其中模製物48橫越列印頭總成10全寬呈現完全平坦。在圖16至18所示的另一範例中，頂模 鏤刻74腔穴係包括凸塊76，以形成一具有凹部78之覆蓋模製物48，以例如幫助控制任何有可能累積在噴嘴34周圍的墨水。在圖19至21所示的另一範例中，頂模鏤刻74腔穴係包括凹部80，以形成覆蓋模製物48中的凸塊82，以例如防護紙闖入露出的噴嘴34中。因此，藉由改變模鏤刻腔穴的組態，覆蓋模製物48的拓樸結構係可能變動，以達成列印頭總成10的露出表面之所欲特徵。
如同此描述開頭所提到，圖示及上述的範例係示範而非限制本發明。其他範例亦為可能。因此，上文描述不應被詮釋成限制住下列申請專利範圍中所界定之本發明的範圍。
10‧‧‧列印頭總成
12‧‧‧列印頭晶粒狹條
14‧‧‧前表面
16‧‧‧印刷電路板(PCB)
18‧‧‧黏劑
20‧‧‧矽基體
22‧‧‧流體射出器元件
24‧‧‧PCB電路
26‧‧‧電終端
28‧‧‧銲線或其他適當導體
30‧‧‧終端
32‧‧‧射出腔室
34‧‧‧噴嘴
36‧‧‧通路
38‧‧‧歧管
40‧‧‧流通道
42‧‧‧晶粒12的背部份
44‧‧‧腔室層
46‧‧‧噴嘴板
48‧‧‧模製物
50‧‧‧晶粒12之露出的前面

Claims (15)

  1. 一種用於製造一微裝置總成之方法，其包含：將一微裝置放置在一印刷電路板的一前部份上；在該印刷電路板上模造一圍繞該微裝置之模製物；然後在該印刷電路板的一背部份中形成一通至該微裝置之通路。
  2. 如請求項1之方法，其中該形成步驟係包括：切割經過該印刷電路板的背部份及進入該微裝置中。
  3. 如請求項2之方法，其中該切割步驟係包括：鋸切經過該印刷電路板的背部份及進入該微裝置中，以開啟該微裝置中通至該通路之一流體通道。
  4. 如請求項3之方法，其中該鋸切步驟係包括：將一鋸刃切入經過該印刷電路板的背部份及進入該微裝置中。
  5. 如請求項4之方法，其中該模造步驟係包括：將單一的單體性模製物模造於該印刷電路板上及該微裝置上方。
  6. 如請求項5之方法，其中該模造步驟係包括：將單一的單體性模製物模造於該微裝置的部份上方。
  7. 一種用於製造一列印頭總成之方法，其包含：將數個列印頭晶粒配置在一印刷電路板的一前面上；將該等晶粒電性連接至該印刷電路板； 在該印刷電路板上模造一覆蓋件，該覆蓋件圍繞各晶粒上露出的數個流體施配噴嘴；然後在該印刷電路板的一背部份中形成數個通至該等晶粒之通路。
  8. 如請求項7之方法，其進一步包含：在該印刷電路板中形成一通路的同時，開啟各晶粒中的數個流體通道。
  9. 如請求項8之方法，其中該形成及該開啟步驟係包括：鋸切經過該印刷電路板的背部份以形成該等通路，並進入該等晶粒中以開啟該等流體通道。
  10. 如請求項9之方法，其中該鋸切步驟係包括：將一鋸刃切入經過該印刷電路板的背部份及進入該等晶粒中。
  11. 如請求項6之方法，其中該模造步驟係包括：模造該覆蓋模製物中之數個凹部，或模造該覆蓋模製物中之數個凸塊，或模造該覆蓋模製物中之數個凹部及凸塊。
  12. 如請求項6之方法，其中：該電性連接步驟係包括：將該等晶粒上的數個終端線銲至該印刷電路板上的數個終端；及該模造步驟係包括：在該印刷電路板上模造一覆蓋件，該覆蓋件圍繞各晶粒上露出的數個流體施配噴嘴且完全地覆蓋線銲物。
  13. 一種列印頭總成，其包含：一印刷電路板；一列印頭晶粒，其係被安裝至該印刷電路板的一前部份，該晶粒係具有數個流體射出器、各接近於一射出 器的數個流體腔室、位於該晶粒的一背部份中的數個通道、以及位於該等晶粒的一前部份處的數個噴嘴，流體可經過該等通道流到該等腔室，且流體可經過該等噴嘴從該等腔室被射出；一模製物，其係覆蓋該印刷電路板且圍繞位於該晶粒的前部份之該等噴嘴；及單一的通路，其延伸經過該印刷電路板的背部份，且進入該晶粒的背部份中而來到該晶粒中的該等通道。
  14. 如請求項13之列印頭總成，其中：該列印頭晶粒係包括多重的列印頭晶粒，其係各被安裝至該印刷電路板的一前部份，各列印頭晶粒具有數個流體射出器、各接近於一射出器的數個流體腔室、位於該晶粒的一背部份中的數個通道、以及位於該等晶粒的一前部份處的數個噴嘴，流體可經過該等通道流到該等腔室，且流體可經過該等噴嘴從該等腔室被射出；該模製物係為單一的單體性模製物，其係覆蓋住該印刷電路板且圍繞位於該等晶粒的前部份處之該等噴嘴；及該單一的通路係包括多重的單一通路，其各延伸經過該印刷電路板的背部份，且進入該等晶粒的一對應者之該背部份中而來到該晶粒中的該等通道。
  15. 如請求項14之列印頭總成，其中各晶粒係包含一晶粒狹條，且該等晶粒狹條係以一交錯組態沿著該列印頭的一 長度概括地呈端對端式配置，而在該交錯組態中各晶粒狹條重疊於另一晶粒狹條。
TW104114267A 2013-06-27 2015-05-05 用於製造模造裝置總成及列印頭總成的方法 TWI609611B (zh)

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TWI609611B (zh) 2017-12-21
EP3142861A1 (en) 2017-03-22
US20180361746A1 (en) 2018-12-20
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US9656469B2 (en) 2017-05-23
US10479086B2 (en) 2019-11-19
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