CN1286172A - 制造薄膜喷墨打印头的方法 - Google Patents
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Abstract
揭示一种制造薄膜喷墨打印头的方法。以预定图案将打印头块排列在基片上。该方法包括在铸模的表面上电成型单个化喷嘴板的步骤。形成喷嘴板后,使铸模与基片相对准,允许喷嘴板与它们相应的打印头块共同对准。而后,使打印头块上的聚合物粘合剂固化,允许喷嘴板粘合到相应的打印头块。然后使铸模与喷嘴板分开。最终将基片上的打印头块单个化,产生一个个薄膜喷墨打印头。
Description
本发明涉及制造供喷墨打印机笔用的薄膜喷墨打印头的方法。更具体地,本发明涉及同时将喷嘴板附着到包含打印头块的基片上的方法。
现有的制造薄膜喷墨打印头的方法需要分别地将喷嘴板附着到打印头块(printhead die)上。这种方法包括利用铸模(mandrel)电成型包含多个喷嘴板的单个镍片的步骤。铸模以玻璃、塑料或抛光硅基片作基板。在这一基板上淀积一层导电材料薄膜层。导电材料通常是铬和不锈钢。接着,在导电层上淀积一层电介质层。这一电介质层是诸如碳化硅的非导电材料。电介质层上的图案是利用传统的掩蔽、紫外曝光和刻蚀技术通过光刻形成的,从尺寸上限定一个模型,模制喷嘴板中的喷嘴。第4773971号美国专利揭示了一种制造这种铸模的方法。
喷嘴板是利用电成型工艺方法形成的。如此形成的喷嘴板都是在单个片板上。隔开翼片(它们也电成型在该片板上)限定每个喷嘴板的边界。在制造打印头过程中,将喷嘴板的片板附着到安装条带,例如日本Nitto Denko公司提供的Nitto Denko Holder V-8T型条带上。接着,通过沿隔开翼片将该片板隔断,将喷嘴板划分成各个喷嘴板。安装条带携带各个喷嘴板,作进一步处理。机器接着捡起每个喷嘴板并将它们放置在含有多个打印头块的基片上的相应打印头块上。基片和所附着的喷嘴板通过“定位和烘烤”工艺过程使得喷嘴板粘合到块上。经过“定位和烘烤”工艺过程后,利用切块锯将由块和喷嘴板组成的每个打印头分成单个。于是每个成对的喷嘴板和打印头块就可以附着到笔体上,以完成喷墨笔的制备。这一笔体通常包含给打印头提供油墨的油墨储存器。
现有的制造打印头的方法有几个缺点。第一,将喷嘴板附着到基片的块上的步骤是一种顺序过程,因此相当耗费时间。附着喷嘴板的过程按一次一个喷嘴板进行。将喷嘴板附着到单个基片上所有块中所花的总时间是将单个喷嘴板附着到块中所花的时间乘以块的总数。第二,在这种制造工艺过程中存在以下非必要的步骤。这些非必要的步骤包括以手工方式使喷嘴板与铸模分开、将分开的喷嘴板附着到安装条带上以及接着使喷嘴板分成单个的步骤。这些非必要的步骤要求喷嘴板具有最小厚度以承受与铸模的严格分开和喷嘴板的单个化。这一最小厚度转化为喷嘴的可实现的最小尺寸,因此,限制了每个喷嘴板上的喷嘴计数。较薄的喷嘴板将允许在给定面积内封装大量喷嘴,因为喷嘴相对较小。与这一现有方法有关的第三个缺点是难以使单个化喷嘴板与打印头块正确对准。通常采用观测系统使单个化喷嘴板与打印头块相对准。然后使对准的喷嘴板与打印头块通过“定位和烘烤”过程,这里利用热和压力使块上的胶或粘合剂薄层固化,将喷嘴板固定到块上。“定位和烘烤”过程仍然影响小的单个化喷嘴板与打印头块的这一对准。
因此与上述过程有关的问题促使需要一种制造薄膜喷墨打印头的更快和更可靠的方法。
本发明的一个方面,一种制备并将喷嘴板附着到基片上的较佳方法,包括电成型单个化喷嘴板的步骤。这些喷嘴板以预定图案形成在铸模的表面上。这一预定图案对应于打印头块在基片上的排列。该方法还包括使铸模与基片相对准的步骤,允许喷嘴板与它们相应的打印头块同时对准。然后对打印头块上的聚合物层进行固化,以使喷嘴板粘合到它们相应的打印头块上。
本发明的另一个方面,一种制造薄膜喷墨打印头的较佳方法,包括如上所述的制备并将喷嘴板附着到打印头块基片上的步骤。该较佳方法进一步包括使铸模与所附喷嘴板相分开。将铸模分开后,使打印头块单个化。
本发明的再一个方面,一种薄膜喷墨打印头,包括含有聚合物阻挡层和喷嘴板的打印头块。喷嘴板是利用上述制造薄膜喷墨打印头的方法分别电成型并附着到打印头块上的。
本发明的又一个方面,一种电成型单个化喷嘴板的铸模,包括基板和驻留在基板上的金属层。铸模进一步包括电介质层。以光刻方式对这一电介质层形成图案并进行刻蚀,在金属层上产生电介质圆片(dielectric button)和边界条。圆片用于在电成型喷嘴板期间限定喷嘴。边界条保证分别地形成喷嘴板。金属层、圆片和边界条形成铸模的铸模表面。
参考附图将能够更好地理解本发明,其中:
图1是一方框图,表明根据本发明在制造薄膜喷墨打印头的过程中的一系列步骤。
图2是图1所示过程中使用的示例铸模的放大等比例图。
图3是沿线段A-A截取的图2所示铸模的进一步放大截面图。该视图示出电形成在铸模上的喷嘴板。
图4是图2所示铸模与打印头块的基片相对准的放大和分解等比例图,将铸模上的喷嘴板附着到基片上的打印头块上。
借助于图1描述根据本发明的制造薄膜喷墨打印头的方法。图1是一方框图,表明根据本发明制造薄膜喷墨打印头的工艺步骤的典型工序2。工序2从“产生铸模”步骤4开始,这里产生用于电形成喷嘴板的铸模。图2示出一个示例铸模6,这是在“产生铸模”步骤4中产生的。图2中示出的这一铸模仅能形成四个喷嘴板。对于本领域的专业技术人员而言众所周知,只要每个喷嘴板的尺寸和硅基片的表面面积给定,在单个硅基片上可以形成多个喷嘴板。一旦产生铸模6,它是可以重复使用的。这里仅简单地描述产生这种铸模6的过程,因为这种过程对于本领域的专业技术人员而言是公知的。第4,773,971号美国专利详细地揭示了这种过程。然而,要强调重要的设计约束。制造这种铸模6的步骤从抛光的硅基片基板8开始。也可以采用具有平滑且非导电表面的其它合适材料,如玻璃基板、未抛光的硅基片或塑料基片。接着,在基板8的表面上淀积一层导电薄膜10,如铬和不锈钢。也可以采用其它导电材料。导电层10形成产生喷嘴板的形状。接着,在导电层10上淀积电介质层12。在本较佳实施例中,电介质为碳化硅。其它电介质材料同样可应用于本发明。这一电介质层12是以光刻方式用已知光致抗蚀剂、经过掩膜和刻蚀过程形成的,在导电层10上限定电介质圆片12和边界条13。穿过导电层10和基板8刻蚀出孔14,,用于下一步铸模6与其上形成有打印头块的另一基片相对准。
下一步进行到“电成型喷嘴板”步骤14。图3示出沿图线段A-A截取的铸模6的放大截面图。在电成型喷嘴板中,将铸模6插入到电成型池中,形成阴极。提供电成型材料的金属源材料作为阳极。在本发明的较佳实施例中,源材料板由非油墨腐蚀金属,如镍合金制成。在电成型过程中,金属从阳极金属板转移到阴极铸模6。金属附着到阴极铸模6的导电层10,而非基板8、圆片12或边界条13。金属至导电层12以及离开边界条13的这一吸引力导致形成单个化的喷嘴板。金属离开圆片12的吸引力也导致在喷嘴板中产生喷嘴18。电成型过程一直继续到电成型喷嘴板达到所需厚度为止。这种电成型过程对于本领域专业人员而言是众所周知的。本领域的专业人员熟悉金属在铸模上的积累分布。在形成喷嘴板的同时,采用分隔过程在各个基片上制备薄膜打印头块。制备这些打印头块的过程对本领域专业人员而言是众所周知的,这里不需要作描述。制备这种打印头块的任何现有技术同样可应用于本发明。图4是铸模6的放大和分解等比例图,电成型的喷嘴板16与打印头块26的基片24相对准。众所周知,采用由聚合物材料制成的阻挡层28限定打印头块26中油墨通道和腔体。在基片24上作一些对准标记30,它们对应于铸模6上的这些刻蚀孔14。
制造打印头的工序2接着继续到“使铸模与块基片对准”步骤32。在这一步骤32中,具有电成型喷嘴板16的铸模6与打印头块26的基片24相对准,喷嘴板16面向块26。借助于观测系统将两个基片对准。观测系统通过铸模6上的对准孔14对对准标记30定位,使两者对准,典型的容差小于或等于1微米。也可以采用其它的对准方法。对准后给铸模6施加压力,使得铸模6与基片24合在一起。
工序2接着进行到“烘烤铸模和基片”步骤34,这里将铸模6和基片24放入炉子中,将炉子加热到约摄氏200度的温度。将铸模6和基片24留在炉子中约15分钟。压力和高温引起聚合物层28固化并粘合到喷嘴板上。
经过“烘烤铸模和基片”步骤34后,工序继续到“分开铸模”步骤36,这里将铸模6与基片24分开,留下喷嘴板16,被附着到各自的打印头块26上。最后,在“将打印头单个化”步骤38中,利用切块锯使完成的块打印头和喷嘴板单个化。然后可以将每个单个打印头附着到笔体,产生准备供喷墨打印机用的喷墨笔。分开的铸模6可以重复用于制造另一组喷嘴板16。
从以上描述显而易见,根据本发明的过程消除了现有技术方法中存在的非必要的步骤。因此,该过程导致明显节省时间。由于喷嘴板16在被附着到打印头块26不需要与铸模6分开,它们可以被电成型至比现有技术可提供的更薄。这些较薄的喷嘴板导致更小的喷嘴,因此可实现更多的喷嘴个数。
Claims (8)
1.一种制造并将喷嘴板附着到打印头块上的方法,所述打印头块以第一预定图案制作在基片上,其特征在于所述方法包括:
以第二预定图案在铸模的表面上电成型单个化的喷嘴板;
使铸模与基片相对准,允许喷嘴板与它们相应的打印头块同时对准;以及
使打印头块上的聚合物层固化,允许喷嘴板被粘合到相应的打印头块上。
2.如权利要求1所述的方法,其特征在于进一步包括:
制造铸模,它包括:
基板;
基板上的导电层,具有模型化表面,以允许电成型喷嘴板;以及
导电层的模型化表面上的电介质区,以允许电成型单个化的喷嘴板以及限定喷嘴板上的喷嘴。
3.如权利要求2所述的方法,其特征在于:电成型的每个喷嘴板具有基本平坦的表面,面向铸模的模型化表面。
4.一种制造薄膜喷墨打印头给定打印头块的方法,所述打印头块以第一预定图案排列在基片上,其特征在于所述方法包括:
以第二预定图案在铸模的表面上电成型单个化的喷嘴板;
使铸模与基片相对准,允许喷嘴板与它们相应打印头块同时对准;
使打印头块上的聚合物层固化,允许喷嘴板被粘合到相应的打印头块上;
使铸模与喷嘴板分离;以及
使打印头块单个化,产生一个个薄膜喷墨打印头。
5.如权利要求4所述的方法,其特征在于进一步包括:
制造铸模,它包括:
基板;
基板上的导电层,具有模型化表面,以允许电成型喷嘴板;以及
导电层的模型化表面上的电介质区,以允许电成型单个化的喷嘴板以及限定喷嘴板上的喷嘴。
6.如权利要求5所述的方法,其特征在于:电成型的每个喷嘴板具有基本平坦的表面,面向铸模的模型化表面。
7.一种薄膜喷墨打印头,其特征在于所述打印头包括:
包含聚合物阻挡层的打印头块;和
在工艺过程中分别电成型并附着到打印头块上的喷嘴板,包括:
以预定图案在铸模的表面上电成型单个化的喷嘴板;
使铸模与基片相对准,允许喷嘴板与它们相应打印头块同时对准;
使打印头块上的聚合物层固化,允许喷嘴板被粘合到相应的打印头块上;
使铸模与喷嘴板分离;以及
使打印头块单个化,产生一个个薄膜喷墨打印头。
8.一种用于电成型喷嘴板的铸模,所述铸模包括:
基板;基板上的金属层,具有用于电成型喷嘴板的模型化表面;和
电介质层,以光刻方式对其形成图案并刻蚀,在金属层上产生电介质区,用于电成型单个化的喷嘴板和限定单个化喷嘴板中的喷嘴;
其特征在于:金属层和电介质层形成铸模的模型化表面。
Applications Claiming Priority (2)
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US38310999A | 1999-08-25 | 1999-08-25 | |
US09/383,109 | 1999-08-25 |
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CN1286172A true CN1286172A (zh) | 2001-03-07 |
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ID=23511756
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CN 00104158 Pending CN1286172A (zh) | 1999-08-25 | 2000-03-15 | 制造薄膜喷墨打印头的方法 |
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EP (1) | EP1080907A3 (zh) |
CN (1) | CN1286172A (zh) |
Cited By (8)
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CN101559671B (zh) * | 2005-02-18 | 2012-03-28 | 惠普开发有限公司 | 一种制造用于喷墨打印盒的打印头的方法 |
CN105121167A (zh) * | 2013-02-28 | 2015-12-02 | 惠普发展公司,有限责任合伙企业 | 模塑打印头 |
CN105934345A (zh) * | 2014-01-28 | 2016-09-07 | 惠普发展公司,有限责任合伙企业 | 柔性载体 |
CN107531051A (zh) * | 2015-10-26 | 2018-01-02 | 惠普发展公司,有限责任合伙企业 | 打印头和制造打印头的方法 |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
US11292257B2 (en) | 2013-03-20 | 2022-04-05 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4773971A (en) * | 1986-10-30 | 1988-09-27 | Hewlett-Packard Company | Thin film mandrel |
US5236572A (en) * | 1990-12-13 | 1993-08-17 | Hewlett-Packard Company | Process for continuously electroforming parts such as inkjet orifice plates for inkjet printers |
DE69616008T2 (de) * | 1995-12-22 | 2002-05-29 | Scitex Digital Printing Inc | Direkte Plattierung einer Düsenplatte auf einem Halter |
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2000
- 2000-03-15 CN CN 00104158 patent/CN1286172A/zh active Pending
- 2000-08-22 EP EP00307222A patent/EP1080907A3/en not_active Withdrawn
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CN101559671B (zh) * | 2005-02-18 | 2012-03-28 | 惠普开发有限公司 | 一种制造用于喷墨打印盒的打印头的方法 |
US10836169B2 (en) | 2013-02-28 | 2020-11-17 | Hewlett-Packard Development Company, L.P. | Molded printhead |
CN105121167A (zh) * | 2013-02-28 | 2015-12-02 | 惠普发展公司,有限责任合伙企业 | 模塑打印头 |
US11541659B2 (en) | 2013-02-28 | 2023-01-03 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11130339B2 (en) | 2013-02-28 | 2021-09-28 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure |
US10994539B2 (en) | 2013-02-28 | 2021-05-04 | Hewlett-Packard Development Company, L.P. | Fluid flow structure forming method |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
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US10751997B2 (en) | 2014-01-28 | 2020-08-25 | Hewlett-Packard Development Company, L.P. | Flexible carrier for fluid flow structure |
US10160209B2 (en) | 2014-01-28 | 2018-12-25 | Hewlett-Packard Development Company, L.P. | Flexible carrier for fluid flow structure |
CN105934345B (zh) * | 2014-01-28 | 2017-06-13 | 惠普发展公司,有限责任合伙企业 | 柔性载体 |
CN105934345A (zh) * | 2014-01-28 | 2016-09-07 | 惠普发展公司,有限责任合伙企业 | 柔性载体 |
US10661567B2 (en) | 2015-10-26 | 2020-05-26 | Hewlett-Packard Development Company, L.P. | Printheads and methods of fabricating a printhead |
CN107531051A (zh) * | 2015-10-26 | 2018-01-02 | 惠普发展公司,有限责任合伙企业 | 打印头和制造打印头的方法 |
Also Published As
Publication number | Publication date |
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EP1080907A3 (en) | 2002-01-09 |
EP1080907A2 (en) | 2001-03-07 |
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