CN105142916B - 模制流体流动结构 - Google Patents

模制流体流动结构 Download PDF

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Publication number
CN105142916B
CN105142916B CN201380076066.2A CN201380076066A CN105142916B CN 105142916 B CN105142916 B CN 105142916B CN 201380076066 A CN201380076066 A CN 201380076066A CN 105142916 B CN105142916 B CN 105142916B
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China
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chip
main body
thin slice
passage
chip thin
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CN105142916A (zh
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陈健华
M.W.坎比
A.K.阿加瓦尔
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority claimed from PCT/US2013/028207 external-priority patent/WO2014133516A1/en
Priority claimed from PCT/US2013/028216 external-priority patent/WO2014133517A1/en
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    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
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    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
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    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

在一个示例中，一种用于制造微型装置结构的过程包括：在材料的一体化主体中模制微型装置；以及在主体中形成流体流动通路，流体能穿过该流体流动通路直接流至微型装置。

Description

模制流体流动结构
背景技术
在喷墨笔或打印杆中的每个打印头芯片包括小通道，该小通道将墨载送到喷射室。墨通过结构中的通路从墨供应源分配到芯片通道，该结构支撑在笔或打印杆上的(多个)打印头芯片。可能希望缩小每个打印头芯片的大小，例如以降低芯片的成本，并且相应地降低笔或打印杆的成本。然而，使用较小的芯片可能需要改变支撑芯片的较大结构，包括将墨分配到芯片的通路。
附图说明
图1-5示出了实现新型打印头流动结构的一个示例的喷墨打印杆。
图6-11和图12-15示出了用于制造诸如在图1-5中所示打印杆中可能使用的打印头流动结构的示例性过程。
图16-21示出了用于制造诸如在图1-5中所示打印杆的晶圆级过程的一个示例。
图22-24示出了新型打印头流动结构的其它示例。
图25-27和图28-30示出了用于制造诸如在图22-24中所示那样的打印头流动结构的示例性过程。
贯穿附图，相同的附图标记标示相同或类似的部件。附图未必按比例绘制。一些零件的相对尺寸被夸大，以更清楚地示出所示示例。
具体实施方式
已经开发出采用衬底宽打印杆组件的喷墨打印机，以帮助增加打印速度和降低打印成本。衬底宽打印杆组件包括多个零件，这些零件将打印流体从打印流体供应源载送至小型打印头芯片，打印流体从打印头芯片喷射到纸张或其它打印衬底上。虽然减小打印头芯片的尺寸和间距对于降低成本来说仍然是重要的，但将打印流体从较大的供应源部件导引至非常小的更紧密间隔的芯片需要实际上会增加成本的复杂的流动结构和制造过程。
已经开发出一种用于制造打印头流体流动结构的新过程，该结构有助于实现在衬底宽喷墨打印机中使用较小的打印头芯片。在一个示例中，新过程包括在多个打印头芯片周围的材料的主体中形成流体流动通道，使得通道中的一个或多个接触进入芯片中的每一个的流动通路。在该示例的一种实施中，在使用转移模制工具模制芯片周围的主体的同时，将通道模制到主体中。
新过程的示例不限于制造打印头结构，而是可以用来制造其它装置并用于其它流体流应用。因此，在一个示例中，新过程包括在材料的一体主体中模制微型装置和在主体中形成流体流动通路，流体可穿过该流体流动通道直接流至微型装置。微型装置例如可以是电子装置、机械装置或微机电系统(MEMS)装置。流体流例如可以是进入微型装置或到微型装置上的冷却流体流或进入打印头芯片或其它流体分配微型装置的流体流。
附图中所示和下文描述的这些和其它示例示出但不限制本发明，本发明在说明书之后的权利要求书中限定。
如本文所用，“微型装置”是指具有小于或等于30mm的一个或多个外部尺寸的装置；“薄的”是指厚度小于或等于650µm；“薄片”是指具有至少3的长宽比(L/W)的薄微型装置；“打印头”和“打印头芯片”是指喷墨打印机或其它喷墨式分配器用于从一个或多个开口分配流体的零件。打印头包括一个或多个打印头芯片。“打印头”和“打印头芯片”不限于用墨和其它打印流体打印，也包括其它流体的喷墨式分配和/或用于除打印之外的用途。
图1-5示出了新型模制喷墨打印头结构10的一个示例。在该示例中，打印头结构10构造为细长的打印杆，例如可能在单道衬底宽打印机中使用的打印杆。图6-21示出了用于制造打印杆10的新过程的示例。首先参看图1的平面图，打印头12被嵌入塑料或其它可模制材料的细长的一体化主体14中，并且在行16中大体端对端地布置成交错构型，在该构型中，每一行中的打印头与该行中的另一个打印头重叠。模制主体14在本文中也被称为模制件14。虽然显示了用于打印例如四种不同颜色的四行16交错的打印头12，但可以是其它合适的构型。
图2是沿图1中的线2-2截取的剖视图。图3和4是图2的详图，图5是平面图，显示了打印头12的特征中的一些的布局。现在参看图1-5，在所示示例中，每个打印头12包括单个打印头芯片18，其具有两行喷射室20和对应的孔口22，打印流体通过孔口22从室20喷出。模制件14中的通道24将打印流体供应至每个打印头芯片18。用于每个打印头12的其它合适的构型是可能的。例如，更多或更少的打印头芯片18可与更多或更少的喷射室20和通道24一起使用。打印流体从歧管26流入每个喷射室20，歧管26沿着每个芯片18在两行喷射室20之间纵长延伸。打印流体通过多个端口28进给到歧管26中，端口28连接到在芯片表面30处的打印流体供应通道24。
图1-5中的打印头芯片12的理想化表示仅为便利起见描绘了三个层32、34、36，以清楚地显示喷射室20、孔口22、歧管26和端口28。实际的喷墨打印头芯片18通常是形成于硅衬底32上的复杂的集成电路(IC)结构，其带有在图1-5中未示出的层和元件。例如，在每个喷射室20处形成于衬底32上的热喷射器元件或压电喷射器元件(未示出)被致动，以从孔口22喷出墨或其它打印流体的滴或料流。导体38由保护层40覆盖并且附接到衬底32上的电气端子42，其将电信号载送到喷射器和/或打印头芯片18的其它元件。
图6-10示出了一种用于制造诸如图1-5中所示那样的打印杆10的示例性过程。图11是图6-10中所示过程的流程图。首先参看图6，带有导电迹线38和保护层40的柔性电路44利用热释放带48层合在载体46上，或者以其它方式施加到载体46 (图11中的步骤102)。柔性电路44可以施加为例如与载体46尺寸大约相同的片材或条带，该条带连接多个芯片18和接合焊盘60 (接合焊盘60在图16和21中示出)。如图7和8所示，打印头芯片18孔板侧向下放置在载体46上的开口50中(图11中的步骤104)，并且导体38利用焊料、导电粘合剂、金属到金属压缩结合或另一种合适的技术结合到芯片18上的电气端子42 (图11中的步骤106)。在图9中，转移模制工具52在打印头芯片18周围形成一体化主体14 (图11中的步骤108)。在该示例中，通道24被模制到主体14中。在模制之后，打印杆10被从载体46释放(图11中的步骤110)以形成图10中所示成品零件，其中导体38被层40覆盖并且由模制件14围绕。
图12-14示出了用于制造打印杆10的另一个示例性过程。图15是图12-14中所示过程的流程图。首先参看图12，打印头芯片18已被放置在柔性电路44上方的载体46上，如上文结合图6和7所述(图15中的步骤112、114和116)，并且预模制的模型54以用于通道24的所需构型的图案胶粘或以其它方式固结到芯片18的背面(图15中的步骤118)。在图13中，转移模制工具52在打印头芯片18周围形成一体化模制件56 (图15中的步骤120)。在该示例中，模制化合物55流入芯片18周围的间隙中，但被模型54阻止进入通道24。主体14由此通过预模制的模型54与模制件56的组合形成，其中通道24由模型54限定。在模制之后，打印杆10被从载体46释放(图15中的步骤122)以形成图14中所示成品零件。
用预模制模型54限定通道24允许更简单的模制工具52和更大的公差。预模制模型54中的通道24可以显著宽于端口28，以便允许芯片18上的模型54的显著的不对准公差。例如，对于约100µm宽的打印流体端口28来说，300µm宽的通道24允许多达100µm的预模制模型不对准，而不影响打印流体流动至端口28。模型54可以是环氧树脂、聚合物、不锈钢、印刷电路板层合物或另一种合适的主体材料。
图16-21示出了用于制造多个打印杆10的晶圆级过程的一个示例。参看图16，打印头12被以多个打印杆的图案放置在玻璃或其它合适的载体晶圆46上。“晶圆”有时在工业中用来表示圆形衬底，而“面板”用来表示矩形衬底。然而，本文所用“晶圆”包括任何形状的载体。另外，虽然显示了载体晶圆，但可以使用具有高温带的切片环、引线框架或另一种合适的载体。打印头12可以在首先施加或形成如上文结合图6和图11中的步骤102所述的导体38和芯片开口50的图案之后放置在载体46上。
在图16所示示例中，在载体46上摆放各自具有四行打印头12的五组58，以形成五个打印杆。具有四行打印头12的用于打印在Letter或A4尺寸的衬底上的衬底宽打印杆例如为约230mm长和16mm宽。因此，可以在单个270mm x 90mm载体晶圆46上摆放五个打印头组58，如图16所示。图17是四行打印头12的一个组沿着图16中的线17-17截取的近距离剖视图。(在图17中为清楚起见而省略了交叉影线。)在图17所示示例中，每个打印头12包括一对打印头芯片18。另外，导体38的阵列延伸至每行打印头12的边缘附近的接合焊盘60，如图16和21所示。图18显示了在打印头芯片18周围模制带有通道24的主体14之后的过程中晶圆结构。单独的打印杆条带58在图19中被分离并且在图20中被从载体46释放以形成五个单独的打印杆10。
图22-24示出了新型打印头结构10的其它示例。在这些示例中，通道24沿着打印头芯片12的每一侧模制在主体14中。参看图22-24，打印流体直接从通道24从通道24通过端口28侧向流入每个喷射室20，如由图23和24中的流箭头62所指示的。在图23的示例中，在孔口板36上方形成覆盖件64以闭合通道24。在图24的示例中，孔口板36在模制主体14之后被施加以闭合通道24。
图25-27示出了用于制造图23所示打印头结构10的过程的一个示例。参看图25，打印头芯片18被孔口侧向下放置在载体46上，并且用热释放带48或其它合适的临时粘合剂固定。在图26中，转移模制工具52在打印头芯片18周围形成主体14，并且在模制之后，打印头结构10被从载体46释放，如图27所示。在该示例中，被部分形成的通道66被模制到主体14中。覆盖件64被施加到或形成于图27的过程中结构上，以完成通道24，如图23所示。
图28-30示出了用于制造图24所示打印头结构10的过程的一个示例。在该示例中，并且参看图28，部分地完成的打印头芯片68被放置在载体46上并且用临时粘合剂48固定。在图29中，转移模制工具52在部分打印头芯片68周围形成主体14，其带有模制到主体14中的被部分形成的通道66 (图30)。在模制之后，打印头结构10被从载体46释放，如图30所示，然后，孔口板36被施加到或形成于图30的过程中结构上以完成如图24所示的通道24和芯片18。
模制流动结构10有助于允许使用长而窄且非常薄的打印头芯片18。例如，已经表明，25mm长和500µm宽度的100µm厚的打印头芯片18可被模制到500µm厚的主体14中，以代替常规的500µm厚硅打印头芯片。不仅将通道24模制到主体14中是相比在硅衬底中形成进料通道更便宜和容易，而且在更薄的芯片12中形成打印流体端口28也是更便宜和容易的。例如，在100µm厚的打印头芯片12中的端口28可以通过干蚀刻和对于较厚的衬底不可行的其它合适的微机加工技术来形成。代替形成常规狭槽，在薄硅、玻璃或其它衬底32中微机加工贯穿端口28的高密度阵列使衬底更坚固，而是仍提供足够的打印流体流。可以预期，现有的芯片操纵设备和微型装置模制工具及技术可以适用于模制薄至50µm且具有高达150的长宽比的芯片18，并且适用于模制或以其它方式形成窄至30µm的通道24。并且，模制件14提供有效但经济的结构，在该结构中，多行这样的芯片薄片可被支撑在单个一体化主体中。
如在本说明书的开始处提及的，附图中所示和上文描述的示例示出但不限制本发明。其它示例是可能的。因此，上述描述不应理解为限制在所附权利要求中限定的本发明的范围。

Claims (13)

1.一种用于制造打印杆的方法，包括：
将多个打印头芯片薄片在载体上布置成用于打印杆的图案，每个芯片薄片具有入口和带有孔口的前部，流体可通过所述入口进入所述芯片薄片，流体可以穿过所述孔口从所述芯片薄片分配，并且所述芯片薄片布置在所述载体上，而每个芯片薄片的所述前部面向所述载体；
在每个芯片薄片周围模制材料的主体，而不覆盖所述芯片薄片的所述前部上的所述孔口；
在所述入口处形成在所述主体中的开口；
从所述载体移除所述芯片薄片；以及
将芯片薄片的组分离成打印杆。
2.根据权利要求1所述的方法，还包括：
将电导体的图案施加到所述载体；
将每个芯片薄片上的电气端子连接到导体；以及
在每个芯片薄片周围模制所述主体的同时，在所述导体周围模制所述主体。
3.根据权利要求1所述的方法，其中，形成所述开口包括在每个芯片薄片周围模制所述主体的同时将开口模制到所述主体中。
4.根据权利要求1所述的方法，其中，形成所述开口包括：将预模制模型以限定所述开口的图案施加到所述芯片薄片，然后在所述芯片薄片周围模制材料的所述主体。
5.根据权利要求1所述的方法，其中，模制所述主体包括在所有所述芯片薄片周围同时模制材料的一体化主体。
6.根据权利要求5所述的方法，其中，在每个芯片薄片周围同时模制所述主体包括在所有所述芯片薄片周围同时转移模制材料的一体化主体。
7.根据权利要求1所述的方法，其中，移除所述芯片薄片在将芯片薄片的组分离成打印杆之后进行。
8.一种用于制造打印头结构的方法，包括在围绕多个打印头芯片的材料的主体中形成流体流动通道，使得所述通道中的一个或多个接触进入所述芯片的每一个中的流动通路，其中，在围绕所述芯片的主体中形成所述通道包括在所述芯片周围模制所述主体的同时将所述通道模制到所述主体中。
9.根据权利要求8所述的方法，其中，在围绕所述芯片的主体中形成所述通道包括：将所述主体的预模制模型部分以限定所述通道的图案施加到所述芯片，然后在所述芯片周围模制所述主体的另一部分。
10.根据权利要求8所述的方法，其中，在围绕所述芯片的主体中形成所述通道包括：在所述主体中模制被部分形成的通道，同时在所述芯片周围模制所述主体，然后覆盖所述被部分形成的通道。
11.根据权利要求10所述的方法，其中，所述打印头芯片为部分完成的打印头芯片，并且覆盖所述被部分形成的通道包括用打印头芯片孔口板覆盖所述被部分形成的通道。
12.一种用于制造微型装置结构的方法，包括：在材料的一体化主体中模制微型装置；以及在所述主体中形成流体流动通路，流体能穿过所述流体流动通路直接流至所述微型装置，其中，所述流体流动通路与在所述主体中模制所述微型装置同时地形成。
13.根据权利要求12所述的方法，其中，所述微型装置包括打印头芯片薄片。
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