CN105142909B - 打印头、打印流体盒以及打印杆 - Google Patents

打印头、打印流体盒以及打印杆 Download PDF

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CN105142909B
CN105142909B CN201380076070.9A CN201380076070A CN105142909B CN 105142909 B CN105142909 B CN 105142909B CN 201380076070 A CN201380076070 A CN 201380076070A CN 105142909 B CN105142909 B CN 105142909B
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print head
head chip
printhead
molded item
conductor
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CN105142909A (zh
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陈健华
M.W.坎比
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Hewlett Packard Development Co LP
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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Abstract

在一个例子中，模塑打印头包括在具有通道的模塑件中的打印头芯片，通过该通道，流体可直接传送到芯片的后部。芯片的前部暴露在包围所述芯片的模塑件外。电连接结构形成在芯片前部处的端子和连接到打印头外部电路的接触件之间。

Description

打印头、打印流体盒以及打印杆
背景技术
常规的喷墨打印头需要从微观的喷墨腔到宏观的墨供应通道的流体散开。
附图说明
图1是方块图，图示了实现新的模塑打印头的一个例子的具有墨盒的喷墨打印机。
图2是立体图，图示了墨盒的一个例子，诸如可用于图1所示的打印机的墨盒。
图3和图4分别是模塑打印头的一个例子的正面和背面的立体图，诸如可用于图2所示的墨盒中的打印头。
图5是图3的细节平面图，示出了打印头芯片和外部接触件之间的电连接结构的一个例子。
图6是沿图5中的线6-6截取的剖视图。
图7是细节平面图，示出了打印头芯片和外部接触件之间的电连接结构的另一个例子。
图8是沿图7中的线8-8截取的剖视图。
图9是细节平面图，示出了打印头芯片和外部接头之间的电连接结构的另一个例子。
图10是沿图9中的线10-10截取的剖视图。
图11是立体图，图示了墨盒的另一个例子，诸如可用于图1所示的打印机的墨盒。
图12是模塑打印头组件的正面立体图，诸如可用于图11所示的墨盒中的打印头组件。
图13-15是图12的近视放大图，示出了打印头芯片和外部接触件之间的电连接结构的一个例子。
图16是沿图13中的线16-16截取的剖视图。
图17是沿图12中的线17-17截取的剖视图。
图18是方块图，图示了实现新的模塑打印头的另一个例子的具有介质宽度的喷墨打印杆的喷墨打印机。
图19是正面立体图，图示了具有多个打印头的模塑打印杆的一个例子，诸如可用于图18所示的打印机中的模塑打印杆。
图20-22是图19的近视放大图，示出了打印头芯片和外部接触件之间的电连接结构的一个例子。
图23是沿图20中的线23-23截取的剖视图。
图24是沿图19中的线24-24截取的剖视图。
在所有附图中，相同零件编号表示相同或相似的零件。图不必按比例绘制。一些零件的相对尺寸被夸大，以更清楚地图示所示例子。
具体实施方式
常规的喷墨打印头需要从微观的喷墨腔到宏观的墨供应通道的流体上的散开。惠普公司研制了一种新的模塑喷墨打印头，其打破了喷射腔所需芯片的尺寸和流体上散开所需的间隔之间的联系，使得能够使用极小的打印头芯片“长条”，诸如2013年6月17日提交的名称为“Printhead Die”的国际专利申请PCT/US2013/046065中以及2013年2月28日提交的名称为“Molded Print Bar”的国际专利申请PCT/US2013/028216中描述的那些，这两个国际申请中每个的全部内容都通过引用合并于此。支承打印头芯片长条的价廉的模塑件也可用作结构基础，用于使接线互相连接、支撑接线的接合以及使得能够利用胶带自动接合（TAB）来连接到外部电路。
因此，在新模塑打印头的一个例子中，打印头芯片长条被模塑到其中具有通道的模塑件中，通过该通道，流体可直接传送到达每个芯片长条的背部。每个芯片长条的前部暴露于模塑件外并且与包围芯片长条的模塑件的表面共面。利用沿模塑件的表面形成的导体、被模塑到模塑件中的印刷电路板中的导体和/或被固定到模塑件的胶带自动接合（TAB）电路中的导体，在每个芯片长条的前部和外部接触件之间实现电连接。模塑打印头的此例子和其他例子可实现在扫描式打印流体盒和页宽打印杆中。但是，新的模塑打印头的例子不限于打印流体盒或页宽打印杆，而是可以实现在其他结构或组件中以及用于其他应用。因此，附图示出和在此描述的例子说明本发明，但不限制本发明，本发明由随附于本说明书的权利要求来限定。
如在本文件中使用的，“打印头”和“打印头芯片”是指喷墨打印机或其他喷墨式分配器的可从一个或多个开口分配流体的那部分。打印头包括一个或多个打印头芯片。芯片“长条”是指长宽比为50或更大的打印头芯片。 “打印头”和“打印头芯片”不限于用墨或其他打印流体打印，而是还包括其他流体和/或除打印外的用途的喷墨式分配。
图1是图示了实现模塑打印头14的一个例子的具有墨盒12的喷墨打印机10的方块图。图2是立体图，图示了墨盒12的一个例子，诸如可用于图1所示的打印机10的墨盒。首先参照图1，打印机10包括由可在打印介质18上方来回扫描的滑架16承托的墨盒12，从而以期望图案将墨应用到介质18。在所示例子中，盒12还包括与打印头14被容纳在一起的墨腔20，以从外部供应22接收墨。在其他例子中，墨供应可集成到腔20中，作为独立完备的墨盒12的一部分。墨盒12通常还被称作打印机盒或墨笔。打印机10包括打印介质运送机构24，以使卷筒式或片式介质18移动经过墨盒12。打印机控制器26表示程序、一个或多个处理器和相关的一个或多个存储器，以及控制打印机10的操作元件所需的电子电路和部件。
现在也参照图2，墨盒12包括具有嵌入模塑件30中的四个打印头芯片28的打印头14，模塑件30由盒外壳32支撑。尽管对于墨盒12示出了具有四个芯片28的单个打印头14，但可存在其他配置，例如，各自具有更多或更少芯片28的更多的打印头14。盒12通过墨端口34流体连接到墨供应22并通过电接触件36电连接到控制器26。接触件36形成在被固定到外壳32的所谓“柔性电路”38中。嵌入柔性电路38中的极小的接线（未示出），通常被称作迹线或信号迹线，将接触件36连接到打印头14上相对应的接触件40。通过沿盒外壳32底部的柔性电路38中的开口43，露出每个打印头芯片28上的喷墨孔口42。
图3和图4分别是模塑打印头14的一个例子的正面和背面的立体图，诸如可用于图1和图2所示的墨盒12中的打印头。图5是图3的细节平面图，并且图6是沿图5中的线6-6截取的剖视图。参照图3-6，打印头14包括被嵌入单块模塑件30中的多个打印头芯片28和形成在模塑件30中用以将打印流体直接运载到相对应的打印头芯片28的背部的通道45。在所示例子中，每个打印头芯片28被配置为细长的芯片长条，诸如上述国际专利申请PCT/US2013/046065中描述的芯片长条。芯片长条28跨打印头14的宽度互相平行地布置。虽然示出了平行配置的四个芯片长条28，但可使用更多或更少的芯片28和/或采用不同配置。
喷墨打印头芯片28通常是形成在硅衬底46上的复杂的集成电路（IC）。每个打印头IC电路结构44中的喷墨元件和其他部件利用每个芯片28上的接合焊盘或其他合适的电端子48直接或通过衬底46连接到柔性电路38中的信号迹线，并因此连接到控制器26（图1和图2）。导体50将端子48连接到用于与外部电路连接的接触件40。在图3-6所示的例子中，模塑件30和芯片28的正面52、54形成围绕喷墨孔口42的单个不间断的平面的打印头表面/面56，并且导体50和接触件40沿模塑件表面52形成。导体50和接触件40中的一个或两者可形成在模塑件表面52上或其中，例如，通过溅射沉积、电镀或利用引线框。根据需要或要求，导体50可覆盖有环氧树脂或其他合适的保护材料66，以保护导体免于接触墨或其他潜在的有害环境情况。图2和图3中省略了包封材料66，并且在图5中使其透明，以更清楚地示出下面的结构。
图7和图8是平面图和剖视图，详细示出了打印头芯片28和用以连接到打印头14外部的电路的接触件40之间的电连接结构的另一个例子。参照图7和图8，在本例子中，外部接触件40被集成到TAB电路58中，以便连接到柔性电路38（图2），并且接头40和芯片端子48之间的导体50形成为两部分：（1）被嵌入模塑件30中的印刷电路板（PCB）62中的导体60和（2）将PCB导体60连接到芯片端子48的接合线64。印刷电路板（PCB）通常还被称作印刷电路组件（PCA）。接合线64覆盖有环氧树脂或其他合适的保护材料66。可添加平坦帽68，以在接合线64上形成更加平坦的低廓形的保护盖。图7中省略了包封材料66和帽68，以更清楚地示出下面的结构。
PCB 62为在打印头14中对导体50布线提供了价廉的合适的平台。例如，PCB 62有助于将ASIC（专用集成电路）和SMD（表面安装器件）添加到打印头14中。再例如，在一些实施方式中，可能期望省略TAB电路58，并在PCB 62中形成接触件40。例如，可能期望结合TAB电路58和PCB 62，以适应芯片端子48和外部接触件40的一些配置，和/或容许更多空间用于连接到柔性电路38（图2）。此外，虽然可使用除接合线64之外的结构将打印头芯片连接到PCB导体，但接合线组件工具容易获得并且容易适应打印头14的制作。
在一些实施方式中，模塑打印头14可使用包括接触件40和导体50两者的TAB电路58，如图9和图10所示。在本例子中，参照图9和图10，接合线64连接在芯片端子48和TAB电路58的导体之间。同样，图9中省略了包封材料66和帽68，以更清楚地示出下面的结构。
图11是立体图，图示了墨盒12的另一个例子，诸如可用于图1所示的打印机10的墨盒。参照图11，墨盒12包括具有四个打印头14的打印头组件70，每个打印头14包括嵌入模塑件30中的四个打印头芯片28，模塑件30由盒外壳32支撑。尽管对于墨盒12的此例子示出了具有四个打印头14的打印头组件70，但可存在其他配置，例如，各自具有更多或更少芯片28的更多或更少个打印头14。盒12通过墨端口34流体连接到墨供应22（图1）并通过电接触件36电连接到控制器26（图1）。接触件36通常形成在被固定到外壳32的柔性电路38中。柔性电路38中的迹线将接触件36连接到打印头组件70上相对应的接头40。通过沿盒外壳32底部的柔性电路38中的开口43，露出每个打印头芯片28上的喷墨孔口。
图12是模塑打印头组件70的正面立体图，诸如可用于图11所示的墨盒12中的打印头组件。图13-15是图12的近视放大图，示出了打印头组件70中在打印头芯片28和外部接触件40之间的电连接结构的一个例子。在图13中，省略了接合线上的保护盖，以示出下面的连接结构。在图14中，示出了覆盖接合线的包封材料。在图15中，示出了覆盖包封材料的保护盖。图16和图17分别是沿图13和图12中的线16-16和17-17截取的剖视图。
参照图12-17，打印头组件70包括被嵌入单块模塑件30中并且跨打印杆被布置成交错配置的纵长行的多个打印头14，其中每个打印头与相邻打印头重叠。尽管示出了交错配置的四个打印头14，但可使用更多或更少的打印头14和/或采用不同配置。此外，虽然预期通常将使用单块模塑件30，但模塑件30可形成为多个部分。每个打印头14包括被嵌入模塑件30中的打印头芯片28和形成在模塑件30中用以将打印流体直接运载到相对应的打印头芯片28的背面的通道45。虽然示出了在每个打印头14中四个芯片28横跨模塑件30互相平行地布置，但可使用更多或更少的打印头芯片28和/或采用其他配置。
如上所示，研制出的新的模塑喷墨打印头使得能够使用极小的打印头芯片“长条”，诸如国际专利申请PCT/US2013/046065中描述的那些。这里描述的模塑打印头结构和彼此间的电互连结构尤其适合在打印头14中实现这类极小的芯片长条28。如图17所示，将每个打印头芯片28连接到外部电路的电导体60通过包围每个打印头14中的芯片28的组的印刷电路板（PCB）62来布线。在所示例子中，如图13和图16中最佳可见的，每个打印头14中的芯片28位于PCB 62的开口72中，并且被模塑，从而使得模塑件30的正面、PCB 62和芯片28沿喷墨孔口42形成单个不间断的平面表面。
PCB导体60将电信号运载到每个打印头芯片28的喷射器和/或其他元件。如图13和图17所示，PCB导体60通过接合线64连接到每个打印头芯片28中的电路。每个接合线64连接在芯片28前部处的接合焊盘或其他合适的端子48与PCB 62上的端子74之间。接合线64覆盖有环氧树脂或其他合适的保护材料66（图14和图17）。可添加平坦帽68，以在接合线64上形成更加平坦的低廓形的保护盖。尽管可存在其他导体布线配置，但印刷电路板为在模塑打印头中的导体布线提供了价廉的合适平台。类似地，如上所示，虽然可使用其他配置将打印头芯片连接到PCB导体，但接合线组件工具容易获得且容易适应于打印头组件70和打印头14的制作。
图18是方块图，图示了实现模塑打印头14的另一个例子的具有介质宽度的喷墨打印杆78的喷墨打印机76。参照图18，打印机76包括跨度为打印介质18的宽度的打印杆78、与打印杆78相关连的流调节器80、介质运送机构24、墨或其他打印流体供应22以及打印机控制器26。打印机控制器26表示程序、一个或多个处理器和相关的一个或多个存储器，以及控制打印机76的操作元件所需的电子电路和部件。图18中的打印杆78包括嵌入跨度为打印介质18的模塑件30中的一个或多个打印头14。如下面参照图19-24描述的，一个或多个打印头14和外部电路的接触件之间的电连接结构通过嵌入模塑件30中的印刷电路板62来布线。
图19是正面立体图，图示了具有多个打印头14的模塑打印杆78的一个例子，诸如可用于图18所示的打印机76中的打印杆。图20-22是图19的近视放大图，示出了打印头芯片28和外部接触件40之间的电连接结构的一个例子。在图20中，省略了接合线上的保护盖，以示出下面的连接结构。在图21中，示出了覆盖接合线的包封材料。在图22中，示出了覆盖包封材料的保护帽。图23和图24分别是沿图20和图19中的线23-23和24-24截取的剖视图。
参照图19-24，打印杆78包括被嵌入模塑件30中并且跨打印杆被布置成交错配置的纵长行的多个打印头14，其中每个打印头与相邻打印头重叠。尽管示出了交错配置的十个打印头14，但可使用更多或更少的打印头14和/或采用不同配置。例子不限于介质宽的打印杆。例子还可实现为具有更少的模塑打印头或者甚至单个模塑打印头（类似于图3所示的打印头）的扫描式喷墨盒或打印头组件。每个打印头14包括被嵌入模塑件30中的打印头芯片28和形成在模塑件30中用以将打印流体直接运载到相对应的打印头芯片28的背面的通道45。虽然示出了在每个打印头14中四个芯片28横跨模塑件30互相平行地布置，例如用于打印四种不同的墨色，但可使用更多或更少的打印头芯片28和/或采用其他配置。如上所示，本文描述的模塑打印头结构和电互连结构特别适于实现打印头14中的这类极小的芯片长条28。
如图24所示，将每个打印头芯片28连接到外部电路的电导体60通过包围每个打印头14中的芯片28的组的印刷电路板（PCB）62来布线。如图20和图23中最佳可见的，每个打印头14中的芯片28位于PCB 62的开口72中，并且被模塑，从而使得模塑件30的正面、PCB 62和芯片28沿喷墨孔口42形成单个不间断的平面表面。PCB导体60将电信号运载到每个打印头芯片28的喷射器和/或其他元件。如图20和图24所示，PCB导体60通过接合线64连接到每个打印头芯片28中的电路。每个接合线64连接在芯片28前部处的接合焊盘或其他合适的端子48和PCB 62上的端子80之间。PCB端子80可暴露于PCB中的凹口82中，如图所示，以帮助形成更加平坦的低廓形面，从而便于维护芯片28。接合线64覆盖有环氧树脂或其他合适的保护材料66。可添加平坦帽68，以在接合线64上形成更加平坦的低廓形的保护盖层。
权利要求中使用的措词“一”表示一个或多个。
如在本说明书的开始处所提到的，附图示出和以上描述的例子说明本发明，但不限制本发明。其他例子也是可能的。因此，以上描述不应该被认为限制本发明的范围，本发明的范围由所附权利要求限定。

Claims (16)

1.一种打印头，包括：
打印头芯片，其具有前部，流体能够沿所述前部从所述打印头芯片被分配，所述打印头芯片被模塑到其中具有通道的模塑件中，通过所述通道，流体能够直接被传送到所述打印头芯片的后部，所述打印头芯片的所述前部暴露于所述模塑件外，并且所述打印头芯片的后部除所述通道处之外都被所述模塑件覆盖；
电接触件，用以连接到所述打印头外的电路；以及
在所述打印头芯片的前部处的端子和所述电接触件之间的电连接结构；
其中，所述打印头芯片的露出的正面与包围所述打印头芯片的所述模塑件的表面一起形成单个不间断的平面打印头表面。
2.如权利要求1所述的打印头，其中，所述电连接结构包括沿所述模塑件的表面的导体。
3.如权利要求1所述的打印头，进一步包括印刷电路板，其被模塑到所述模塑件中，并且其中，所述电连接结构包括在所述印刷电路板中的导体。
4.如权利要求3所述的打印头，其中，所述电接触件是胶带自动接合电路的一部分。
5.如权利要求3所述的打印头，其中，每个电连接结构包括将所述打印头芯片上的端子连接到所述印刷电路板中的导体的接合线。
6.如权利要求3所述的打印头，其中，所述印刷电路板包围所述打印头芯片。
7.如权利要求1所述的打印头，进一步包括被固定到所述模塑件的胶带自动接合电路，并且其中，多个电接触件是所述胶带自动接合电路的一部分，并且所述电连接结构包括在所述胶带自动接合电路中的导体。
8.如权利要求7所述的打印头，其中，利用接合线，每个端子连接到所述胶带自动接合电路中的导体。
9.如权利要求1所述的打印头，其中：
所述打印头芯片包括横跨所述模塑件互相平行地布置的多个打印头芯片长条；以及
所述通道包括多个通道，通过每个通道，流体都能够直接传送到所述打印头芯片长条中相对应一个的后部。
10.如权利要求1所述的打印头，其中，所述打印头芯片包括沿所述模塑件基本上端对端地布置成交错配置的多个打印头芯片，其中，所述打印头芯片中的一个或多个与所述打印头芯片中的相邻的一个或多个重叠。
11.一种打印流体盒，包括：
用以容纳打印流体的容器；以及
打印头，其包括：
嵌入被安装到所述容器上的单块模塑件中的打印头芯片长条，所述模塑件覆盖所述打印头芯片长条的背面和侧面，留下所述打印头芯片长条的前面沿所述打印头芯片长条的正面和包围所述打印头芯片长条的所述正面的所述模塑件的正面露出，所述模塑件中具有开口，通过所述开口，流体能够传送到所述打印头芯片长条的后部；
连接到所述打印头外部的电路的电打印头接触件；以及
在所述打印头芯片的前部处的端子和所述打印头接触件之间的电连接结构；
其中，所述打印头芯片长条的正面和所述模塑件的正面一起形成单个不间断的平面打印头表面。
12.如权利要求11所述的盒，其中：
所述打印头芯片长条包括沿所述容器的底部横跨所述模塑件互相平行地布置的多个芯片长条；以及
所述开口包括各自位于所述打印头芯片长条中相对应一个的所述后部处的多个细长通道。
13.如权利要求11所述的盒，其中，所述打印头包括沿所述模塑件基本上端对端地布置成交错配置的多个打印头芯片长条，其中，所述打印头芯片长条中的一个或多个与所述打印头芯片长条中相邻的一个或多个重叠。
14.如权利要求11所述的盒，其中，所述电连接结构包括以下中的一个或多个：
沿所述模塑件的表面的导体；
被模塑到所述模塑件中的印刷电路板中的导体；以及
被固定到所述模塑件的胶带自动接合电路中的导体。
15.一种打印杆，包括：被嵌入模塑件中的具有电导体的多个打印头芯片，所述电导体从所述打印头芯片中的每个的前部延伸到电接触件，所述打印头芯片的正面和所述模塑件围绕所述打印头芯片的表面一起限定了包围所述打印头芯片中的每个的所述前部处的分配孔口的单个不间断的平面打印头表面，并且所述模塑件中具有通道，通过所述通道，流体能够传送到所述打印头芯片的后部，并且其中所述电导体包括以下中的一个或多个：
沿所述模塑件的表面的导体；
被模塑到所述模塑件中的印刷电路板中的导体；以及
被固定到所述模塑件的胶带自动接合电路中的导体。
16.如权利要求15所述的打印杆，其中，每个打印头芯片包括打印头芯片长条，所述打印头芯片长条沿所述模塑件基本上端对端地布置成交错配置，其中，所述打印头芯片长条中的一个或多个与所述打印头芯片长条中相邻的一个或多个重叠。
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