CN105142910B - 印刷电路板流体流动结构和用于制造印刷电路板流体流动结构的方法 - Google Patents

印刷电路板流体流动结构和用于制造印刷电路板流体流动结构的方法 Download PDF

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CN105142910B
CN105142910B CN201380076071.3A CN201380076071A CN105142910B CN 105142910 B CN105142910 B CN 105142910B CN 201380076071 A CN201380076071 A CN 201380076071A CN 105142910 B CN105142910 B CN 105142910B
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陈健华
M.W.坎比
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Hewlett Packard Development Co LP
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Abstract

在一个示例中，流体流动结构包括：嵌入印刷电路板（PCB）中的微装置。流体能够通过PCB中的通道流动到微装置，PCB导体连接到被嵌入的微装置上的导体。

Description

印刷电路板流体流动结构和用于制造印刷电路板流体流动结 构的方法
背景技术
喷墨笔或打印棒（打印棒）中的每个打印头芯片（die）均包括将墨汁输送到喷射腔的细小通道。墨汁从墨汁供应器穿过支撑笔或打印棒上的打印头芯片的结构中的通路而分配到芯片通道。可期望的是：缩小每个打印头芯片的尺寸，从而例如减少芯片的成本并因而减少笔或打印棒的成本。不过，使用较小的芯片可能需要对支撑芯片（其包含将墨汁分配到芯片的通路）的更大结构进行改变。
附图说明
图1－5例示出实施新式打印头流动结构一个实施例的喷墨打印棒。
图6－11例示出用于制造打印头流动结构的方法的一个示例，例如可用于图1－5中所示打印棒中。
图12－18例示出用于制造打印头流动结构的方法的另一个示例，例如可用于与图1－5中所示类似的打印棒中。
相同的构件编号贯穿附图表示相同或相似的构件。附图不必按比例。一些构件的相对尺寸被夸大以更清楚地例示出所示的示例。
具体实施方式
已经开发出利用基底宽打印棒组件的喷墨打印机协助增加打印速度并减少打印成本。传统的基底宽打印棒组件包括多个零件将打印流体从打印流体供应器输送到小的打印头芯片，由此将打印流体喷射到纸或其它打印基底上。虽然减小打印头芯片的尺寸和间隔对于减少成本而言仍然很重要，不过将打印流体从较大的供应部件引导至更小、更紧密间隔的芯片需要复杂的流动结构和制造方法，这可能会实际上增加成本。
已开发出新式流体流动结构，能够使用较小的打印头芯片和更紧凑的芯片电路以助于减少基底宽喷墨打印机的成本。实施所述新式结构的一个示例的打印头结构包括：多个打印头芯片，其胶粘或以其它方式安装到印刷电路板中的开口中。每个开口形成通道，打印流体能够穿过所述通道直接流动到相应的芯片。印刷电路板中的导电途径连接到芯片上的电气端子。印刷电路板在效果上增加了每个芯片的尺寸，以形成流体和电气连接并将芯片附接到其它结构，因而能够使用较小的芯片。印刷电路板能够易于制造和处理还有助于简单地将宽打印棒和其它打印头结构制造为具有内置打印流体通道的新式复合结构，从而消除了在硅基底中形成打印流体通道的困难。
新式流体流动结构不限于打印棒或者其他类型的用于喷墨打印的打印头结构，不过可在其它装置中实施并用于其它流体流动应用。这样，在一个示例中，所述新式结构包括：被嵌入印刷电路板中的微装置，该印刷电路板中具有通道，流体能够穿过所述通道流动到微装置。微装置例如可为：电子装置、机械装置、或微机电系统（MEMS）装置。所述流体流动例如可为：流动到微装置之中或之上的冷却流体流动，或流动到打印头芯片或其它流体配发（dispense）微装置中的流体流动。
图中所示的和下文中所述的这些和其它示例是例示而不是限制本发明，本发明在本说明书之后所附权利要求书中限定。
如在本文中所用，“印刷电路板”是指具有导电途径以机械支撑或电气连接到电子装置的非导电基底（印刷电路板有时被简称为“PCB”）；“微装置”是指具有小于或等于30mm的一个或多个外尺度的装置；“薄”是指厚度小于或等于650µm；“薄片（sliver）”是指长宽比（L/W）至少为3的薄的微装置；而“打印头”和“打印头芯片”是指喷墨打印机或将流体从一个或多个开口配发的其它喷墨类型的配发器。“打印头”和“打印头芯片”不限于以墨汁或其它打印流体打印，而是也可包括其它流体的喷墨类型的配发和/或用于非打印应用。
图1－5例示出新式喷墨打印头结构10的一个示例，其中打印头芯片嵌入具有流体流动通道的印刷电路板中。在此示例中，打印头结构10被构造为细长的打印棒，例如可用于单次通过式（single pass）基底宽打印机中。首先参见图1和2，打印头12嵌入细长的印刷电路板14中并整体上以交错构造端对端地成行16布置，其中，每行中的打印头12重叠于该行中的另一打印头12。虽然显示四行16的交错的打印头12，例如用于打印四种不同的颜色，不过其它适合的构造也是可以的。图3－5是图2中所示芯片薄片12中的一个的细节图。现在参见图1－5，在所示的示例中，每个打印头12包括单个打印头芯片薄片18，打印头芯片薄片18具有两行喷射腔20和对应的洞口22，打印流体通过洞口22从腔20喷射。印刷电路板14中的通道24将打印流体供应到每个打印头芯片薄片18。每个打印头12也可以使用其它适合构造。例如，更多或更少的打印头芯片薄片18可用于更多或更少的喷射腔20和通道24，或者可使用更大的芯片18（非薄片）。
打印流体从歧管26流动到每个喷射腔20中，歧管26在两行喷射腔20之间沿每个芯片薄片18沿长度延伸。打印流体通过多个端口28馈送到歧管26中，端口28在芯片表面30处连接到打印流体供应通道24。图1－5中的打印头芯片18的理想化体现图示出三个层32、34、36，这仅为了便于清楚显示喷射腔20、洞口22、歧管26、和端口28。实际的喷墨打印头芯片薄片18典型地是在硅基底32上形成的复杂的集成电路（IC）结构，并具有未在图1－5中示出的层和元件。例如，在每个喷射腔20处在基底32上形成的热喷射元件或者压电喷射元件（未示出）被致动以从洞口22喷射出墨汁或其它打印流体的滴或流。导体38被保护层40覆盖且附接到基底32上的电气端子42，承载发向喷射器和/或打印头芯片薄片18的其它元件的电信号。
图6－10例示出制造打印头结构10（例如图1－5中所示结构10）的一个示例性方法。图11是图6－10中所示方法的流程示意图。虽然显示出用于制造具有打印头芯片18的打印头结构10的方法，不过，所述方法也可以用于形成采用其它微装置的其它流体流动结构。而且，虽然仅显示出一个打印头结构10，不过所述方法可用于同时制造多个打印头结构10。实际上，将芯片18嵌入具有通道24的印刷电路板14中的一个优点在于：可以容易地将印刷电路板14制造为不同尺寸，以适应于个体的、成组的、或晶圆层级的制造。
首先参见图6，在准备接纳打印头芯片时，在印刷电路板14中锯出或者以其它方式形成槽44，并使导体38露出于槽44内（图11中的步骤100和102）。在图7中，将一定样式的芯片附接膜或其它适合的粘接物46施加于印刷电路板14，将聚对苯二甲酸乙二醇酯（PET）膜或其它适合的隔障50施加于芯片附接膜46上（图11中的步骤104和106）。跨越槽48的隔障50形成用于接纳打印头芯片18的腔52（图11中的步骤108），并提供安装表面以将图8中所示的处理中的结构54附接到如图9中所示的晶圆夹台（chuck）56（图11中的步骤110）。
在图9中，PCB导体38结合到打印头芯片电子42，而芯片附接粘接物46流动到打印头芯片18周围的间隙中（图11中的步骤114）。芯片附接粘接物46形成将打印头芯片18保持在槽44中的粘胶。芯片附接粘接物46还将通道24中的嵌入芯片18密封。相应地，虽然任何适合的粘接物可用于芯片附接物46，包括用于半导体制造的商业销售的芯片附接膜，不过，所述粘接物应耐受通道24中的墨汁或其它打印流体的腐蚀作用（如果有的话）。
在用于结合（bonding）和流动的一个示例中，焊料或导电粘接物在组装之前（图8）施加于一个或两个导体38和端子42，所述结构在组装之后（图9）被加热，使焊料回流以结合导体38和端子42，并使粘接物46流动（或毛细传送（wick））到打印头芯片18周围的间隙中，如图9中所示。打印头结构10然后从夹56脱除，并移除隔障50，如图10中所示（图11中的步骤116和118）。
图12－17例示出用于制造打印头结构10的方法。图18是图12－17中所示方法的流程示意图。在此示例中，在打印头芯片嵌入印刷电路板14之后，形成与导体38的电气连接，导体38在PCB 14的邻近于槽44的外表上露出。参见图12，在准备接纳打印头芯片时，在印刷电路板14中锯出或者以其它方式形成槽44，导体38沿PCB 14的外表面露出于槽44外（图18中的步骤120）。在此示例中，以环氧树脂或其它适合粘接物预灌注（pre-impregnated，"pre－preg"）的印刷电路板14使用高温带50以密封槽44中的打印头芯片18。针对预灌注PCB14而言可替代地或另外地，可使用预灌注的带50。如图13中所示，施加于印刷电路板14的带50形成用于接纳打印头芯片18的腔52（图18中的步骤122和124），并提供安装表面以将图14中所示的处理中结构54附接到如图15中所示的晶圆夹台56（图18中的步骤126）。
在图15中，组件被加热，以使预灌注的粘接物46流动到打印头芯片18周围的间隙中（图18中的步骤128），从而将打印头芯片18固定到槽44中并将嵌入的芯片18密封在通道24中。打印头结构10然后从夹56脱除，并移除隔障50，如图16中所示（图18中的步骤130和132）。在图17中，金属线58结合到PCB 14上的导体38和打印头18上的端子42和在保护覆盖物60中封装的连接部（图18中的步骤134和136）。
PCB流动结构10能够使用长、窄且极薄的打印头芯片18。例如，约26mm长、500µm宽的100µm厚的打印头芯片18可被嵌入1mm厚的印刷电路板14中，以替代传统的500µm厚的硅打印头芯片。与在硅基底中形成馈送通道相比，不仅在印刷电路板中形成通道24更便宜且更容易，而且在更薄的芯片18中形成打印流体端口28也更便宜且更容易。例如，100µm厚的打印头芯片18中的端口28可以通过干法刻蚀和对于较厚基底不实用的其它适合的微机加工技术形成。在薄的硅、玻璃或其它基底32中微机加工出通透端口28的高密度的阵列，而不是形成传统的槽，这样留下更强的基底，而同时仍提供适合的打印流体流动。
如本说明书开始部分所述，图中所示的和以上所述的示例用于例示而不是限制本发明。其它示例也是可以的。因此，以上描述应被理解为不限制在所附权利要求书中限定的本发明的范围。

Claims (15)

1.一种流体流动结构，包括：嵌入印刷电路板中的微装置，所述印刷电路板具有：
在其内的通道，流体能够穿过所述通道流动到所述微装置；和
导体，其连接到所述微装置上的导体，
其中，所述通道具有邻近于所述微装置的第一端和远离所述微装置的第二端，并且其中，所述第一端小于所述第二端，并且
其中，所述通道部分地由粘接物形成，所述粘接物的一部分流动到所述微装置周围的间隙中。
2.如权利要求1所述的结构，其中，所述微装置包括：直接连接到所述通道的流体流动通路。
3.如权利要求1所述的结构，其中，所述通道包括：露出于所述微装置的外表面的开放的通道。
4.如权利要求1所述的结构，其中，所述微装置被胶粘到形成所述板中的所述通道的开口中。
5.如权利要求4所述的结构，其中，所述开口包括槽，所述微装置包括胶粘到所述板中的所述槽中的微装置薄片。
6.如权利要求5所述的结构，其中，所述微装置包括微装置薄片的构造，每个微装置薄片胶粘到所述板中的对应的槽中。
7.一种打印头结构，包括安装在印刷电路板中的多个打印头芯片，所述印刷电路板具有：
在其内的多个通道，打印流体能够穿过每个所述通道直接流动到芯片；和
导体，其连接到所述芯片上的电气端子，
其中，每个通道具有邻近于所述芯片的第一端和远离所述芯片的第二端，并且其中，所述第一端小于所述第二端，并且
其中，每个通道部分地由粘接物形成，所述粘接物的一部分流动到所述芯片周围的间隙中。
8.如权利要求7所述的结构，其中，
所述印刷电路板是细长的印刷电路板，在所述细长的印刷电路板中，所述芯片安装到形成所述板中的所述通道的槽中，所述芯片整体上沿所述板的长度端对端布置。
9.如权利要求8所述的结构，其中，
每个芯片包括芯片薄片，所述芯片薄片胶粘到所述板中的对应的槽中。
10.如权利要求9所述的结构，其中，
每个导体突出到槽中，在所述槽中其直接连接到芯片薄片上的端子；或者
每个导体通过金属线间接连接到芯片薄片上的端子，所述金属线结合到所述导体且结合到所述芯片薄片上的端子。
11.如权利要求9所述的结构，其中，每个芯片薄片包括：
多个孔，其连接到所述通道，使得打印流体能够从所述通道直接流动到所述孔中；
歧管，其连接到所述孔，使得打印流体能够从所述孔直接流动到所述歧管中；
多个喷射腔，其连接到所述歧管，使得打印流体能够从所述歧管流动到所述喷射腔中。
12.一种用于制造流体流动结构的方法，包括：
在印刷电路板中形成通道；
将微装置安装到所述通道中，使得流体能够通过所述通道直接流动到所述微装置；和
将所述印刷电路板中的导体连接到所述微装置上的导体，
其中，所述通道具有邻近于所述微装置的第一端和远离所述微装置的第二端，并且其中，所述第一端小于所述第二端，并且
其中，所述通道部分地由粘接物形成，所述粘接物的一部分流动到所述微装置周围的间隙中。
13.如权利要求12所述的方法，其中，形成通道和将微装置安装到所述通道中包括：形成穿过印刷电路板的槽，该槽具有的厚度大于微装置的厚度；和将微装置胶粘到每个槽中。
14.如权利要求13所述的方法，其中，每个微装置包括微装置薄片，且所述方法还包括：
跨过每个槽施加隔障；
在每个槽中将薄片抵靠所述隔障安置；
使粘接物在所述薄片周围流动以将所述薄片胶粘到所述槽中；
将印刷电路板导体结合到所述薄片上的电气端子；和
将覆盖每个槽的所述隔障移除。
15.如权利要求14所述的方法，其中，将印刷电路板导体结合到所述薄片上的电气端子包括：使印刷电路板导体在每个槽中露出；然后将露出的导体直接结合到所述薄片上的电气端子。
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