TW201446539A - 印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法 - Google Patents

印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法 Download PDF

Info

Publication number
TW201446539A
TW201446539A TW103106566A TW103106566A TW201446539A TW 201446539 A TW201446539 A TW 201446539A TW 103106566 A TW103106566 A TW 103106566A TW 103106566 A TW103106566 A TW 103106566A TW 201446539 A TW201446539 A TW 201446539A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
channel
conductor
die
Prior art date
Application number
TW103106566A
Other languages
English (en)
Other versions
TWI547381B (zh
Inventor
Chien-Hua Chen
Michael W Cumbie
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW201446539A publication Critical patent/TW201446539A/zh
Application granted granted Critical
Publication of TWI547381B publication Critical patent/TWI547381B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B41J2/155—Arrangement thereof for line printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14032—Structure of the pressure chamber
    • B41J2/1404—Geometrical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00—Actions or mechanisms not otherwise provided for
    • B41J25/34—Bodily-changeable print heads or carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)

Abstract

在一範例中，一流體流動結構包括嵌設於一印刷電路板(PCB)中之一微裝置。流體可通過該PCB中的一通道流至該微裝置，以及一PCB導體被連接至所嵌設的微裝置上之一導體。

Description

印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法
本發明係有關一種印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法。
在一噴墨筆或列印桿中的每個列印頭晶粒包括將墨水運載至射出腔室之細微通道。墨水係從該墨水供應源透過通路而分配至該等晶粒通道，該等通路係在該筆或列印上支持該(等)列印頭晶粒的一結構中。可能會想要的是，縮小每個列印頭晶粒的尺寸，例如降低該晶粒的花費以及從而降低該筆或列印桿之花費。然而，使用較小的晶粒會需要改變支持該等晶粒之較大結構，其包括分配墨水到該等晶粒之通路。
依據本發明之一可行實施例，係特地提出一種流體流動結構，其包含嵌設於一印刷電路板中之一微裝置，該印刷電路板具有：一通道，其中流體可通過該通道流至該微裝置；以及一導體，其連接至該微裝置上的一導體。
10‧‧‧列印頭結構
12‧‧‧列印頭
14‧‧‧印刷電路板
16‧‧‧列
18‧‧‧晶粒長薄片、列印頭晶粒
20‧‧‧射出腔室
22‧‧‧小孔
24‧‧‧通道
26‧‧‧歧管
28‧‧‧埠、通孔
30‧‧‧晶粒表面
32‧‧‧基材
34、36‧‧‧層
38‧‧‧導體
40‧‧‧保護層
42‧‧‧電氣端子
44、48‧‧‧槽件
46‧‧‧黏性物、薄膜
50‧‧‧阻隔體、帶體
52‧‧‧腔穴
54‧‧‧製程中結構
56‧‧‧夾盤
58‧‧‧線件
60‧‧‧保護蓋體
100~136‧‧‧步驟
圖1~5描繪實作一新式列印頭流動結構的範例之一噴墨列印桿。
圖6~11描繪用以製造一列印頭流動結構之一程序的一範例，該列印頭流動結構例如可能在圖1~5中所顯示的列印桿中所使用。
圖12~18描繪用以製造一列印頭流動結構之一程序的另一範例，該列印頭流動結構例如可能在類似於圖1~5中所顯示的列印桿中所使用。
相同部件的號碼指出遍及該等圖式之相同或類似部件。該等圖式不必然依比例。某些部件的相對尺寸被誇大以更清楚地描繪所顯示的範例。
利用一基材寬列印桿總成之噴墨印表機已被發展來幫助增加列印速度及降低列印花費。傳統的基材寬列印桿總成包括多個部件，其將列印流體從列印流體供應源運載至小的列印頭晶粒，該列印流體係從該等小列印頭晶粒射出至紙張或其他列印基材。當降低列印頭晶粒的尺寸和空間對於降低花費持續重要，從較大的供應源構件輸送列印流體到更為較小、更緊縮空間的晶粒需要複雜的流動結構及實際上會增加花費之製造過程。
一個新的流體流動結構已被發展來能夠使用較小的列印頭晶粒和更緊密的晶粒電路，以幫助降低基材寬噴墨列印機中的成本。實施該新的流動結構之一範例的一列印頭結構包括多個列印頭晶粒，其膠黏或以其他方式裝 設於一印刷電路板中的開口中。每個開口形成一通道，列印流體可經由該通道直接流至個別的晶粒。該印刷電路板中的傳導路徑連接至該等晶粒上的電氣端子。該印刷電路板實際上使用於製造流體和電氣連接的各個晶粒以及用於使該等晶粒附接於其他結構的尺寸成長，因此能夠使用較小的晶粒。以具有此種印刷電路板的緩解狀況能夠被製造且製程，也幫助簡化頁寬列印桿和其他列印頭結構之製造為具有內建列印流體通道之新的、複合式結構，消除在一矽基材中形成該等列印流體通道之困難。
該新的流體流動並不限於印刷桿或其他類型之用於噴墨印刷的列印頭結構，亦可於其他裝置及其他流體流動應用中實現。因此，在一範例中，該新的結構包括嵌設於一印刷電路板中的一微裝置，該印刷電路板具有一通道，其中流體可經過該通道直接流至該微裝置。舉例而言，該微裝置能夠是一電子裝置、一機械裝置、或一微電機系統(MEMS)裝置。該流體流動例如可為流入該微裝置中或在其上流動之一冷卻流體、或是流入一列印頭晶粒或其他流體分配微裝置中之流體。
顯示於圖式中並於下文描述的這些和其他範例例示但並未限制本發明，本發明係由此描述文件後之申請專利範圍所定義。
如同在本文件中所使用地，一「印刷電路板」表示具有用以機械地支持和電性連接至一電子裝置之傳導性路徑之一非傳導性基材(印刷電路板有時候被縮寫成 「PCB」)，一「微裝置」表示具有小於或等於30mm的一或更多一外尺寸之一裝置；「薄」表示小於或等於650μm之一厚度；一「長薄片」表示一薄的微裝置具有至少為三的一長寬(L/W)比；一「列印頭」和一「列印頭晶粒」表示從一或更多開口分配流體之一噴墨印表機的部件或其他噴墨型分配器的部件。一列印頭包括一或更多列印頭晶粒。「列印頭」和「列印頭晶粒」不限於以墨水和其他列印流體列印，而是也包括其他流體及/或用於列印以外用途之噴墨類型分配。
圖1~5繪示一個新的噴墨列印頭結構10的一範例，其中列印頭晶粒係嵌設於具有流體流動通道之一印刷電路板中。在此範例中，列印頭結構10係組配成例如可能在一單趟通過基材寬印表機中所使用之一長形列印桿。首先參照圖1和2，列印頭12係埋設於一長形印刷電路板14，以及係大體端對端地設置於一交錯組態中之列16，其中每一列中的該等列印頭12與該列中的另一列印頭12重疊。雖然顯示出錯列的列印頭12之四列16，例如用以列印四種不同顏色，但是可能有其他合適的組態。圖3~5係圖2中所顯示的晶粒長薄片12中之一者的細節圖。現在參照圖1~5，在所顯示的範例中，每個列印頭12包括一單一列印頭晶粒長薄片18，其具有兩列射出腔室20和對應的小孔22，列印流體係透過該等小孔22自腔室20射出。在印刷電路板14中的一通道24供應列印流體給每個列印頭晶粒長薄片18。可能有用於各個列印頭12之其他合適的組態。舉例來說，較多 或較少的列印頭晶粒長薄片18可能被用於較多或較少的射出腔室20及通道24，或是可能使用較多的晶粒18(非長薄片)。
列印流體從一歧管26流入各個射出腔室20，該歧管26係在射出腔室20的兩列之間沿著每個晶粒長薄片18縱向延伸。列印流體經過多個埠28進送至歧管26，該等埠28係連接至在晶粒表面30的一列印流體供應通道24。僅為了方便來清楚顯示射出腔室20、小孔22、歧管26和埠28，圖1~5中的一列印頭晶粒18之理想化表示描繪為三層32、34、36。一實際的噴墨列印頭晶粒長薄片18係形成在具有未示於圖1~5中的層和元件之一矽基材32之一典型複雜的積體電路(IC)結構。舉例而言，在各個射出腔室20，於基材32上形成一熱射出器元件或一壓電射出器元件(未示出)係被致動來從小孔22射出墨水或其他列印流體的液滴或液流。由一保護層40所覆蓋且附接於基材32上的電氣端子42之導體38運載電氣信號至射出器及/或列印頭晶粒長薄片18的其他元件。
圖6~10描繪用以製造例如圖1~5中所顯示的這種列印頭結構10之一範例程序。圖11係描繪於圖6~10中的程序之一流程圖。雖然顯示出用以製造具有列印頭晶粒18之一列印頭結構10的一程序，但是該程序可被用來形成使用其他微裝置之流體流動結構。並且，雖僅顯示一列印頭結構10，然而該程序可同時製造多個列印頭結構10。的確，將晶粒18嵌設於具有通道24之一印刷電路板14的優點之一 是，該印刷電路板14之簡化可被做成不同尺寸，以適應個別、群組或晶圓等級的製造。
首先參照圖6，在準備收納一列印頭晶粒時，一槽件44係被移鋸或以其他方式形成於印刷電路板14中，以及導體38於槽件44內暴露(圖11中的步驟100和102)。在圖7中，一圖案化晶粒附接薄膜或其他合適的黏性物46係施加到印刷電路板14，以及一PET(聚對苯二甲酸乙二酯)薄膜或其他合適阻隔體50施加於晶粒附接薄膜46上方(圖11中的步驟104和106)。跨距槽件48之阻隔體50形成用以收納列印頭晶粒18之一腔穴52(圖11中的步驟108)，並且提供一安裝表面，其用以將圖8中顯示的製程中結構54附接於如圖9中所示的一晶圓夾盤56(圖11中的步驟110)。
在圖9中，PCB導體38係連結至列印頭晶粒端子42(圖11中的步驟112)，以及晶粒附接黏性物46係流入圍繞列印頭晶粒18的空隙內(圖11中的步驟114)。晶粒附接黏性物46也密封該經嵌設的晶粒18於通道24內。因此，雖然任何合適的黏性物可被用於晶粒附接黏性物46，包括商業上可用於半導體製造之晶粒附接薄膜，但是該黏性物應抵抗在通道24中的墨水或其他列印流體之腐蝕效應(若有的話)。
在針對連結和流動之一範例中，在組合之前(圖8)，焊料或傳導黏性物係施加至導體38和端子42之一或二者，以及在組合之後(圖9)，該結構加熱，以使該焊料回流至連結導體38和端子42，並使黏性物46流(或招致)入如圖9所示之圍繞列印頭晶粒18的空隙。列印頭結構10然後自夾 盤56釋開，且阻隔體50被移除，如圖10所示(圖11中的步驟116和118)。
圖12~17繪示用以製造一列印頭結構10之另一範例程序。圖18係繪示於圖12~17中的程序之一流程圖。在此範例中，該等電氣連接係在該等列印頭晶粒嵌設於印刷電路板14中之後，對鄰接於槽件44的PCB 14之外部上的導體38為之。參照圖12，在準備收納一列印頭晶粒時，一槽件44係被移鋸或以其他方式形成於印刷電路板14中，以及導體38在槽件44之外沿著PCB 14之外部表面暴露(圖18中的步驟120)。在此範例中，以一環氧樹脂或其他合適的膠黏物預浸漬(pre-impregnated，pre-preg)之一印刷電路板14係與一高溫度帶體50使用，以密封列印頭晶粒18於槽件44中。一預浸漬的帶體50可被用來作為一預浸漬PCB 14之一替換物或附加於該預浸漬PCB 14上。如同圖13所示，施加於印刷電路板14之帶體50形成用以收納列印頭晶粒18之一腔穴52(圖18中的步驟122和124)，並提供一安裝表面，其用以將如圖14所示的該製程中結構54附接於如圖15所示的一晶圓夾盤56(圖18中的步驟126)。
在圖15中，該總成係被加熱以使預浸漬黏性物46流進圍繞列印頭晶粒18的空隙中(圖18中的步驟128)，以使列印頭晶粒18附貼於槽件44中，並密封該嵌設的晶粒18於通道24中。然後列印頭結構10從夾盤釋開，阻隔體50如圖16所示地被移除(圖18中的步驟130和132)。在圖17中，線件58係被連結至PCB 14上的導體38以及列印頭18上的端子 42，且該等連接被封入一保護蓋體60中(圖18中的步驟134和136)。
一PCB流動結構10能夠使用長、窄且非常薄的列印頭晶粒18。舉例來說，大約26mm長和500μm寬之一100μm厚的列印頭晶粒18能夠被嵌設於一1mm厚的印刷電路板14內，以取代一傳統500μm厚的矽列印頭晶粒。相較於在一矽基材中形成進送通道，於一印刷電路板內形成通道24不僅較便宜且較容易，而且也比在一較薄的晶粒18中形成列印流體埠28較便宜且較簡單。舉例而言，一100μm厚的列印頭晶粒18中之埠28可藉由不是特別針對較厚基材的乾式蝕刻和其他合適的微加工技術所形成。非形成傳統槽件，而是將一高密度陣列的通孔28微加工至一薄的矽、玻璃或其他基材32，會留下一較強健的基材，同時仍然提供充足的列印流體流。
如同在本說明的開始所提示地，圖式中所顯示與上文所描述的範例係例示但不會限制本發明。有可能有其它範例。因此，前述描述應不會被詮釋為限制本發明的範圍，其是由後附的申請專利範圍所界定。
10‧‧‧列印頭結構
12‧‧‧列印頭
14‧‧‧印刷電路板
18‧‧‧晶粒長薄片、列印頭晶粒
20‧‧‧射出腔室
22‧‧‧小孔
24‧‧‧通道
26‧‧‧歧管
28‧‧‧埠、通孔
30‧‧‧晶粒表面
34、36‧‧‧層
38‧‧‧導體
42‧‧‧電氣端子
44‧‧‧槽件
46‧‧‧黏性物

Claims (15)

  1. 一種流體流動結構，其包含嵌設於一印刷電路板中之一微裝置，該印刷電路板具有：一通道，其中流體可通過該通道流至該微裝置；以及一導體，其連接至該微裝置上的一導體。
  2. 如請求項1之結構，其中該微裝置包括直接連接至該通道之一流體流動通路。
  3. 如請求項1之結構，其中該通道包含暴露於該微裝置的一外表面之一開口通道。
  4. 如請求項1之結構，其中該微裝置係被膠黏至在該板中形成該通道之一開口內。
  5. 如請求項4之結構，其中該開口包含一槽件，且該微裝置包含膠黏於該板中的該槽件內之一微裝置長薄片。
  6. 如請求項5之結構，其中該微裝置包含多個列印頭晶粒長薄片的一配置，每個長薄片係膠黏於該板中的一對應槽件內。
  7. 一種列印頭結構，其包含裝設於一印刷電路板中之多個列印頭晶粒，該印刷電路板具有：多個通道，其中列印流體可通過該等通道直接流至一晶粒；以及連接至該等晶粒上的電氣端子之導體。
  8. 如請求項7之結構，其中該印刷電路板包含一長形印刷 電路板，其中該等晶粒係被裝設於在該板中形成該等通道之槽件內，以及該等晶粒係沿著該板的一長度，大體上端對端地配置。
  9. 如請求項8之結構，其中每個晶粒包含膠黏於該板中的一個別槽件內之一晶粒長薄片。
  10. 如請求項9之結構，其中：每個導體係突伸進一槽件中，其中其係直接連接至一列印頭晶粒長薄片上的一端子，或是每個導體經由連結至該導體和該晶粒端子的一引線，間接地連接至一列印頭晶粒長薄片上的一端子。
  11. 如請求項9之結構，其中每個列印頭晶粒長薄片包括：連接至該通道之多個孔洞，使得列印流體能夠從該通道直接流入該等孔洞中；連接至該等孔洞之一歧管，使得列印流體能夠從該等孔洞直接流入該歧管中；以及連接至該歧管之多個射出腔室，使得列印流體能夠從該歧管流入該等射出腔室中。
  12. 一種用以製造流體流動結構之方法，其包含下列步驟：於一列印頭電路板中形成一通道；於該通道中裝設一微裝置，使得流體能夠經過該通道直接流至該微裝置；以及將該印刷電路板中的一導體連接至該微裝置上的一導體。
  13. 如請求項12之方法，其中形成一通道與於該通道中裝設 一微裝置之步驟，包含形成通過一印刷電路板之槽件，該印刷電路板具有較一微裝置的厚度大之一厚度，以及膠黏一微裝置於每個槽件內。
  14. 如請求項13之方法，其中每個微裝置包含一微裝置長薄片，且該方法進一步包含下列步驟：在每個槽件上方施加一阻隔體；抵靠每個槽件內的該阻隔體設置一長薄片；使黏性物繞著該等長薄片流動，以使該等長薄片膠黏於該等槽件內；將印刷電路板導體連結至該等長薄片上的電氣端子；以及移除覆蓋每個槽件的該阻隔體。
  15. 如請求項14之方法，其中將印刷電路板導體連結至該等長薄片上的電氣端子之步驟，包含暴露每個槽件中的一印刷電路板導體，以及然後將該等暴露的導體直接連結至該等長薄片上的該等電氣端子。
TW103106566A 2013-02-28 2014-02-26 印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法 TWI547381B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/US2013/028207 WO2014133516A1 (en) 2013-02-28 2013-02-28 Molded fluid flow structure
PCT/US2013/033865 WO2014133563A1 (en) 2013-02-28 2013-03-26 Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure

Publications (2)

Publication Number Publication Date
TW201446539A true TW201446539A (zh) 2014-12-16
TWI547381B TWI547381B (zh) 2016-09-01

Family

ID=51428636

Family Applications (3)

Application Number Title Priority Date Filing Date
TW103105120A TWI531479B (zh) 2013-02-28 2014-02-17 模製流體流動結構
TW103106566A TWI547381B (zh) 2013-02-28 2014-02-26 印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法
TW103143282A TWI590724B (zh) 2013-02-28 2014-12-11 印刷電路板流體排出裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW103105120A TWI531479B (zh) 2013-02-28 2014-02-17 模製流體流動結構

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103143282A TWI590724B (zh) 2013-02-28 2014-12-11 印刷電路板流體排出裝置

Country Status (13)

Country Link
US (8) US9944080B2 (zh)
EP (5) EP3330087A1 (zh)
JP (1) JP6154917B2 (zh)
KR (4) KR20180086281A (zh)
CN (6) CN108058485B (zh)
BR (1) BR112015020860B1 (zh)
DK (1) DK2825386T3 (zh)
ES (1) ES2662001T3 (zh)
PL (1) PL2825386T3 (zh)
PT (1) PT2825386T (zh)
RU (1) RU2633873C2 (zh)
TW (3) TWI531479B (zh)
WO (4) WO2014133516A1 (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
KR102005466B1 (ko) 2013-02-28 2019-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 프린트 바
KR20180086281A (ko) * 2013-02-28 2018-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 성형된 유체 유동 구조체
KR101827070B1 (ko) 2013-02-28 2018-02-07 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 유체 유동 구조체 성형
WO2014153305A1 (en) * 2013-03-20 2014-09-25 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
US9770909B2 (en) 2014-01-30 2017-09-26 Hewlett-Packard Development Company, L.P. Printhead dies molded with nozzle health sensor
WO2015152889A1 (en) * 2014-03-31 2015-10-08 Hewlett-Packard Development Company, Lp Printed circuit board fluid ejection apparatus
US9895888B2 (en) 2014-04-22 2018-02-20 Hewlett-Packard Development Company, L.P. Fluid flow structure
CN106794698B (zh) * 2014-08-28 2019-02-26 惠普发展公司，有限责任合伙企业 打印头组件
ES2902251T3 (es) * 2015-02-27 2022-03-25 Hewlett Packard Development Co Dispositivo de expulsión de fluido con orificios de alimentación de fluido
US10328694B2 (en) 2015-07-31 2019-06-25 Hewlett-Packard Development Company, L.P. Printed circuit board with recessed pocket for fluid droplet ejection die
WO2017065725A1 (en) * 2015-10-12 2017-04-20 Hewlett-Packard Development Company, L.P. Printhead
US10207500B2 (en) 2015-10-15 2019-02-19 Hewlett-Packard Development Company, L.P. Print head interposers
US11235574B2 (en) 2016-02-29 2022-02-01 Hewlett-Packard Development Company, L.P. Fluid propelling apparatus including a heat sink
JP6907298B2 (ja) * 2016-02-29 2021-07-21 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． ヒートシンクを含む流体推進装置
JP2019510245A (ja) * 2016-03-31 2019-04-11 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． デジタル分注用の流体ルーティングを含むモノリシック支持体構造
CN109641462B (zh) * 2016-11-01 2021-06-15 惠普发展公司，有限责任合伙企业 流体喷射装置
WO2018136099A1 (en) 2017-01-23 2018-07-26 Hewlett-Packard Development Company, L.P. Fluid ejection devices to dispense fluid of different sizes
US11331915B2 (en) 2017-03-15 2022-05-17 Hewlett-Packard Development Company, L.P. Fluid ejection dies
EP3558540A4 (en) 2017-04-23 2020-08-12 Hewlett-Packard Development Company, L.P. PARTICLE SEPARATION
CN110446613B (zh) * 2017-04-24 2022-01-11 惠普发展公司，有限责任合伙企业 模制到模制主体中的流体喷射管芯
WO2019022773A1 (en) * 2017-07-28 2019-01-31 Hewlett-Packard Development Company, L.P. FLUID EJECTION MATRIX BLOCKED WITH A MOLDED BODY
JP6979118B2 (ja) * 2017-09-20 2021-12-08 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. 流体ダイ
US11065894B2 (en) 2017-09-28 2021-07-20 Hewlett-Packard Development Company, L.P. Engageable fluid interface members and connectors
WO2019078868A1 (en) * 2017-10-19 2019-04-25 Hewlett-Packard Development Company, L.P. FLUIDIC MATRICES
CN108099409B (zh) * 2018-01-03 2023-12-22 京东方科技集团股份有限公司 打印喷头和喷墨打印设备
CN110154544B (zh) * 2018-02-12 2020-11-24 海德堡印刷机械股份公司 用于喷墨的印刷杆
EP3758944B1 (en) * 2018-05-03 2023-06-07 Memjet Technology Limited Inkjet printhead with encapsulant-retaining features
EP3921171A1 (en) * 2019-02-06 2021-12-15 Hewlett-Packard Development Company, L.P. Fluid ejection device with a carrier having a slot
US11827021B2 (en) * 2019-02-06 2023-11-28 Hewlett-Packard Development Company, L.P. Applying mold chase structure to end portion of fluid ejection die
EP3939079A4 (en) * 2019-04-15 2022-10-19 Hewlett-Packard Development Company, L.P. PCBS WITH ELECTRICAL CONTACTS AND SOLDER JOINTS WITH HIGHER MELTING TEMPERATURES
EP3962747A4 (en) 2019-04-29 2022-12-14 Hewlett-Packard Development Company, L.P. LIQUID EJECTION DEVICE WITH FRACTURES IN THE TOP LAYER
CN113795386B (zh) * 2019-05-15 2023-09-01 惠普发展公司，有限责任合伙企业 包括应变仪传感器的集成电路
EP3990285A4 (en) * 2019-06-25 2023-04-19 Hewlett-Packard Development Company, L.P. MOLDED STRUCTURES WITH CHANNELS
WO2020263236A1 (en) * 2019-06-25 2020-12-30 Hewlett-Packard Development Company, L.P. Molded structures with channels
WO2021045782A1 (en) * 2019-09-06 2021-03-11 Hewlett-Packard Development Company, L.P. Unsupported top hat layers in printhead dies
US20230137179A1 (en) * 2020-03-30 2023-05-04 Hewlett-Packard Development Company, L.P. Electrically conductive structures
US20230391071A1 (en) * 2020-09-25 2023-12-07 Hewlett-Packard Development Company, L.P. Fluidic dies
CN115592948A (zh) * 2021-07-07 2023-01-13 上海傲睿科技有限公司（Cn） 一种包含内部微流道的打印头
ES2900841B2 (es) * 2021-11-26 2023-03-02 Kerajet S A Dispositivo de impresion de inyeccion de tinta mems

Family Cites Families (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112754A (ja) * 1981-12-26 1983-07-05 Konishiroku Photo Ind Co Ltd インクジエツト記録装置の記録ヘツド
US4633274A (en) 1984-03-30 1986-12-30 Canon Kabushiki Kaisha Liquid ejection recording apparatus
JPH064325B2 (ja) * 1984-06-11 1994-01-19 キヤノン株式会社 液体噴射ヘッド
US4881318A (en) * 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
JP3459703B2 (ja) 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
EP0755793B1 (en) * 1995-07-26 2001-04-04 Sony Corporation Printer apparatus and method of production of same
US6281914B1 (en) 1996-11-13 2001-08-28 Brother Kogyo Kabushiki Kaisa Ink jet-type printer device with printer head on circuit board
US6259463B1 (en) * 1997-10-30 2001-07-10 Hewlett-Packard Company Multi-drop merge on media printing system
JP3052897B2 (ja) 1997-07-01 2000-06-19 日本電気株式会社 衛星捕捉・追尾装置
US5847725A (en) * 1997-07-28 1998-12-08 Hewlett-Packard Company Expansion relief for orifice plate of thermal ink jet print head
US6250738B1 (en) * 1997-10-28 2001-06-26 Hewlett-Packard Company Inkjet printing apparatus with ink manifold
US6188414B1 (en) * 1998-04-30 2001-02-13 Hewlett-Packard Company Inkjet printhead with preformed substrate
US20020041308A1 (en) * 1998-08-05 2002-04-11 Cleland Todd A. Method of manufacturing an orifice plate having a plurality of slits
US6227651B1 (en) * 1998-09-25 2001-05-08 Hewlett-Packard Company Lead frame-mounted ink jet print head module
JP2000108360A (ja) 1998-10-02 2000-04-18 Sony Corp プリントヘッドの製造方法
US6705705B2 (en) * 1998-12-17 2004-03-16 Hewlett-Packard Development Company, L.P. Substrate for fluid ejection devices
JP2001071490A (ja) 1999-09-02 2001-03-21 Ricoh Co Ltd インクジェット記録装置
JP2001108360A (ja) 1999-10-05 2001-04-20 Standex Internatl Corp 冷蔵・再加熱システム
KR100657108B1 (ko) 1999-10-29 2006-12-12 휴렛-팩커드 컴퍼니(델라웨어주법인) 잉크젯 프린트 헤드 및 그의 형성 방법
US6679264B1 (en) * 2000-03-04 2004-01-20 Emphasys Medical, Inc. Methods and devices for use in performing pulmonary procedures
US6560871B1 (en) * 2000-03-21 2003-05-13 Hewlett-Packard Development Company, L.P. Semiconductor substrate having increased facture strength and method of forming the same
IT1320026B1 (it) * 2000-04-10 2003-11-12 Olivetti Lexikon Spa Testina di stampa monolitica a canali multipli di alimentazione delloinchiostro e relativo processo di fabbricazione.
US6786658B2 (en) 2000-05-23 2004-09-07 Silverbrook Research Pty. Ltd. Printer for accommodating varying page thicknesses
JP4557386B2 (ja) 2000-07-10 2010-10-06 キヤノン株式会社 記録ヘッド用基板の製造方法
US6398348B1 (en) 2000-09-05 2002-06-04 Hewlett-Packard Company Printing structure with insulator layer
KR100677752B1 (ko) 2000-09-29 2007-02-05 삼성전자주식회사 잉크젯 프린트 헤드와 그 제조방법
US6402301B1 (en) * 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
US6554399B2 (en) 2001-02-27 2003-04-29 Hewlett-Packard Development Company, L.P. Interconnected printhead die and carrier substrate system
JP2002291262A (ja) 2001-03-27 2002-10-04 Hitachi Metals Ltd 圧電式アクチュエータ及びこれを用いた液体吐出ヘッド
US20020180825A1 (en) 2001-06-01 2002-12-05 Shen Buswell Method of forming a fluid delivery slot
US6561632B2 (en) * 2001-06-06 2003-05-13 Hewlett-Packard Development Company, L.P. Printhead with high nozzle packing density
US6595619B2 (en) * 2001-10-30 2003-07-22 Hewlett-Packard Development Company, L.P. Printing mechanism service station for a printbar assembly
US7125731B2 (en) * 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6705697B2 (en) * 2002-03-06 2004-03-16 Xerox Corporation Serial data input full width array print bar method and apparatus
US6834937B2 (en) 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
JP4298334B2 (ja) * 2003-03-17 2009-07-15 キヤノン株式会社 記録方法および記録装置
KR100506093B1 (ko) * 2003-05-01 2005-08-04 삼성전자주식회사 잉크젯 프린트헤드 패키지
KR100477707B1 (ko) * 2003-05-13 2005-03-18 삼성전자주식회사 모놀리틱 잉크젯 프린트헤드 제조방법
US7188942B2 (en) 2003-08-06 2007-03-13 Hewlett-Packard Development Company, L.P. Filter for printhead assembly
JP4553348B2 (ja) * 2003-12-03 2010-09-29 キヤノン株式会社 インクジェット記録ヘッド
US20060022273A1 (en) * 2004-07-30 2006-02-02 David Halk System and method for assembly of semiconductor dies to flexible circuits
US7438395B2 (en) 2004-09-24 2008-10-21 Brother Kogyo Kabushiki Kaisha Liquid-jetting apparatus and method for producing the same
US7347533B2 (en) * 2004-12-20 2008-03-25 Palo Alto Research Center Incorporated Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
US7249817B2 (en) * 2005-03-17 2007-07-31 Hewlett-Packard Development Company, L.P. Printer having image dividing modes
JP2006321222A (ja) * 2005-04-18 2006-11-30 Canon Inc 液体吐出ヘッド
US7658470B1 (en) 2005-04-28 2010-02-09 Hewlett-Packard Development Company, L.P. Method of using a flexible circuit
JP4804043B2 (ja) * 2005-06-03 2011-10-26 キヤノン株式会社 インクジェット記録装置、インクジェット記録方法、および記録制御形態の設定方法
CN100393519C (zh) 2005-07-27 2008-06-11 国际联合科技股份有限公司 喷墨印字头装置的通孔与喷口板的制造方法
CN100463801C (zh) 2005-07-27 2009-02-25 国际联合科技股份有限公司 喷墨印字头装置的通孔与喷口板的制造方法
JP2008012911A (ja) 2006-06-07 2008-01-24 Canon Inc 液体吐出ヘッド、及び液体吐出ヘッドの製造方法
KR100818277B1 (ko) 2006-10-02 2008-03-31 삼성전자주식회사 잉크젯 프린트헤드의 제조방법
US8246141B2 (en) 2006-12-21 2012-08-21 Eastman Kodak Company Insert molded printhead substrate
CN101274514B (zh) 2007-03-29 2013-03-27 研能科技股份有限公司 彩色喷墨头结构
CN101274515B (zh) 2007-03-29 2013-04-24 研能科技股份有限公司 单色喷墨头结构
US7735225B2 (en) 2007-03-30 2010-06-15 Xerox Corporation Method of manufacturing a cast-in place ink feed structure using encapsulant
US7862160B2 (en) 2007-03-30 2011-01-04 Xerox Corporation Hybrid manifold for an ink jet printhead
US7828417B2 (en) 2007-04-23 2010-11-09 Hewlett-Packard Development Company, L.P. Microfluidic device and a fluid ejection device incorporating the same
JP5008451B2 (ja) * 2007-05-08 2012-08-22 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
US7681991B2 (en) * 2007-06-04 2010-03-23 Lexmark International, Inc. Composite ceramic substrate for micro-fluid ejection head
US8047156B2 (en) * 2007-07-02 2011-11-01 Hewlett-Packard Development Company, L.P. Dice with polymer ribs
US7591535B2 (en) 2007-08-13 2009-09-22 Xerox Corporation Maintainable coplanar front face for silicon die array printhead
JP2009051066A (ja) * 2007-08-26 2009-03-12 Sony Corp 吐出条件調整装置、液滴吐出装置、吐出条件調整方法及びプログラム
US7824013B2 (en) 2007-09-25 2010-11-02 Silverbrook Research Pty Ltd Integrated circuit support for low profile wire bond
JP2009081346A (ja) * 2007-09-27 2009-04-16 Panasonic Corp 光学デバイスおよびその製造方法
WO2009088510A1 (en) * 2008-01-09 2009-07-16 Hewlett-Packard Development Company, L.P. Fluid ejection cartridge and method
US8109607B2 (en) * 2008-03-10 2012-02-07 Hewlett-Packard Development Company, L.P. Fluid ejector structure and fabrication method
US7938513B2 (en) * 2008-04-11 2011-05-10 Lexmark International, Inc. Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips
WO2009136915A1 (en) 2008-05-06 2009-11-12 Hewlett-Packard Development Company, L.P. Print head feed slot ribs
JP5464901B2 (ja) 2008-06-06 2014-04-09 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
US8888252B2 (en) * 2008-07-09 2014-11-18 Hewlett-Packard Development Company, L.P. Print head slot ribs
US7877875B2 (en) 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method for connecting a flexible printed circuit board (PCB) to a printhead assembly
JP2010137460A (ja) 2008-12-12 2010-06-24 Canon Inc インクジェット記録ヘッドの製造方法
US8251497B2 (en) * 2008-12-18 2012-08-28 Eastman Kodak Company Injection molded mounting substrate
US8303082B2 (en) * 2009-02-27 2012-11-06 Fujifilm Corporation Nozzle shape for fluid droplet ejection
TWI393223B (zh) * 2009-03-03 2013-04-11 Advanced Semiconductor Eng 半導體封裝結構及其製造方法
US8197031B2 (en) 2009-05-22 2012-06-12 Xerox Corporation Fluid dispensing subassembly with polymer layer
US8096640B2 (en) * 2009-05-27 2012-01-17 Hewlett-Packard Development Company, L.P. Print bar
US8540215B2 (en) * 2009-06-30 2013-09-24 Nagaki Seiki Co., Ltd. Wire grip
US8287095B2 (en) * 2009-07-27 2012-10-16 Zamtec Limited Printhead integrated comprising through-silicon connectors
US8496317B2 (en) 2009-08-11 2013-07-30 Eastman Kodak Company Metalized printhead substrate overmolded with plastic
US8118406B2 (en) * 2009-10-05 2012-02-21 Eastman Kodak Company Fluid ejection assembly having a mounting substrate
US8287104B2 (en) 2009-11-19 2012-10-16 Hewlett-Packard Development Company, L.P. Inkjet printhead with graded die carrier
US20110141691A1 (en) 2009-12-11 2011-06-16 Slaton David S Systems and methods for manufacturing synthetic jets
US8203839B2 (en) 2010-03-10 2012-06-19 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices, power modules, and vehicles incorporating the same
US8342652B2 (en) 2010-05-27 2013-01-01 Xerox Corporation Molded nozzle plate with alignment features for simplified assembly
US8622524B2 (en) * 2010-05-27 2014-01-07 Funai Electric Co., Ltd. Laminate constructs for micro-fluid ejection devices
JP5779176B2 (ja) * 2010-06-04 2015-09-16 日本碍子株式会社 液滴吐出ヘッドの製造方法
US8745868B2 (en) * 2010-06-07 2014-06-10 Zamtec Ltd Method for hydrophilizing surfaces of a print head assembly
US20110298868A1 (en) 2010-06-07 2011-12-08 Silverbrook Research Pty Ltd Inkjet printhead having hydrophilic ink pathways
US8205965B2 (en) * 2010-07-20 2012-06-26 Hewlett-Packard Development Company, L.P. Print bar structure
EP2605910B1 (en) * 2010-08-19 2020-10-21 Hewlett-Packard Development Company, L.P. Wide-array inkjet printhead assembly with a shroud
US8434229B2 (en) 2010-11-24 2013-05-07 Canon Kabushiki Kaisha Liquid ejection head manufacturing method
US8500242B2 (en) * 2010-12-21 2013-08-06 Funai Electric Co., Ltd. Micro-fluid ejection head
US20120188307A1 (en) * 2011-01-26 2012-07-26 Ciminelli Mario J Inkjet printhead with protective spacer
US8438730B2 (en) 2011-01-26 2013-05-14 Eastman Kodak Company Method of protecting printhead die face
US20120210580A1 (en) 2011-02-23 2012-08-23 Dietl Steven J Method of assembling an inkjet printhead
US8517514B2 (en) * 2011-02-23 2013-08-27 Eastman Kodak Company Printhead assembly and fluidic connection of die
JP5738018B2 (ja) * 2011-03-10 2015-06-17 キヤノン株式会社 インクジェット記録ヘッドとその製造方法
CN102689512B (zh) 2011-03-23 2015-03-11 研能科技股份有限公司 喷墨头结构
CN102689511B (zh) 2011-03-23 2015-02-18 研能科技股份有限公司 喷墨头结构
US9610772B2 (en) 2011-03-31 2017-04-04 Hewlett-Packard Development Company, L.P. Printhead assembly
KR102005466B1 (ko) * 2013-02-28 2019-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 프린트 바
KR20180086281A (ko) * 2013-02-28 2018-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 성형된 유체 유동 구조체
US10160209B2 (en) * 2014-01-28 2018-12-25 Hewlett-Packard Development Company, L.P. Flexible carrier for fluid flow structure

Also Published As

Publication number Publication date
JP2016508460A (ja) 2016-03-22
EP2961605A4 (en) 2017-03-01
BR112015020860A2 (pt) 2017-07-18
TWI547381B (zh) 2016-09-01
CN105142908B (zh) 2017-06-30
EP2961606B1 (en) 2020-01-01
CN105142908A (zh) 2015-12-09
CN105142910A (zh) 2015-12-09
US10195851B2 (en) 2019-02-05
CN108263098B (zh) 2020-08-11
DK2825386T3 (en) 2018-04-16
TWI531479B (zh) 2016-05-01
KR102078047B1 (ko) 2020-02-17
US9707753B2 (en) 2017-07-18
JP6154917B2 (ja) 2017-06-28
EP2961610A4 (en) 2017-03-01
US10166776B2 (en) 2019-01-01
US20170072693A1 (en) 2017-03-16
US20180141338A1 (en) 2018-05-24
EP2961605B1 (en) 2020-02-26
ES2662001T3 (es) 2018-04-05
US10160213B2 (en) 2018-12-25
EP2961606A1 (en) 2016-01-06
US20160009084A1 (en) 2016-01-14
WO2014133660A1 (en) 2014-09-04
CN105142910B (zh) 2018-02-23
US20180141337A1 (en) 2018-05-24
EP3330087A1 (en) 2018-06-06
WO2014133516A1 (en) 2014-09-04
US9919525B2 (en) 2018-03-20
CN108058485B (zh) 2019-10-22
US20180134039A1 (en) 2018-05-17
EP2825386B1 (en) 2018-02-21
RU2015141003A (ru) 2017-04-03
KR20190051090A (ko) 2019-05-14
TW201531179A (zh) 2015-08-01
EP2961605A1 (en) 2016-01-06
EP2961610B1 (en) 2020-09-09
US20160009082A1 (en) 2016-01-14
US9944080B2 (en) 2018-04-17
TW201501953A (zh) 2015-01-16
CN108058485A (zh) 2018-05-22
TWI590724B (zh) 2017-07-01
US20170282551A1 (en) 2017-10-05
WO2014133575A1 (en) 2014-09-04
CN108263098A (zh) 2018-07-10
EP2825386A4 (en) 2016-01-20
KR20150113140A (ko) 2015-10-07
CN105377560B (zh) 2018-01-19
US10300701B2 (en) 2019-05-28
EP2825386A1 (en) 2015-01-21
KR20170044206A (ko) 2017-04-24
EP2961610A1 (en) 2016-01-06
RU2633873C2 (ru) 2017-10-18
WO2014133563A1 (en) 2014-09-04
KR101886590B1 (ko) 2018-08-07
US20180154636A1 (en) 2018-06-07
CN105142911A (zh) 2015-12-09
BR112015020860B1 (pt) 2021-04-13
KR20180086281A (ko) 2018-07-30
CN105377560A (zh) 2016-03-02
EP2961606A4 (en) 2017-07-05
PT2825386T (pt) 2018-03-27
US10464324B2 (en) 2019-11-05
CN105142911B (zh) 2017-03-22
PL2825386T3 (pl) 2018-06-29

Similar Documents

Publication Publication Date Title
TWI547381B (zh) 印刷電路板流體流動結構及製造印刷電路板流體流動結構之方法
TWI531480B (zh) 模製列印桿
US11426900B2 (en) Molding a fluid flow structure
US9517626B2 (en) Printed circuit board fluid ejection apparatus
EP3046768B1 (en) Printbar and method of forming same
US10780696B2 (en) Printbars and methods of forming printbars
CN107949481B (zh) 打印头
US10220620B2 (en) Molded printhead structure
TWI568598B (zh) 印刷電路板流體噴出裝置及其製造方法
US10632752B2 (en) Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure