CN105142911A - 打印头芯片 - Google Patents
打印头芯片 Download PDFInfo
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- CN105142911A CN105142911A CN201380076072.8A CN201380076072A CN105142911A CN 105142911 A CN105142911 A CN 105142911A CN 201380076072 A CN201380076072 A CN 201380076072A CN 105142911 A CN105142911 A CN 105142911A
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- 239000012530 fluid Substances 0.000 claims abstract description 69
- 239000007921 spray Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 235000013290 Sagittaria latifolia Nutrition 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
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- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
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- Physical Or Chemical Processes And Apparatus (AREA)
- Coating Apparatus (AREA)
- Micromachines (AREA)
Abstract
在一个示例中,一种打印头芯片包括具有100μm或更小的厚度和至少50的长宽比的结构,所述结构在其厚度内包含多个流体喷射器和多个流体室,所述多个流体室均在喷射器附近且均具有入口和出口,打印流体可通过所述入口进入所述室,并且打印流体可通过所述出口从所述室喷出。
Description
背景技术
在喷墨笔或打印杆中的每个打印头芯片包括小通道,该小通道将墨载送到喷射室。墨通过结构中的通路从墨供应装置分配到芯片通道,该结构支撑在笔或打印杆上的(多个)打印头芯片。可能希望缩小每个打印头芯片的大小,例如以降低芯片的成本,并且相应地降低笔或打印杆的成本。然而,使用较小的芯片可能需要改变支撑芯片的较大结构,包括将墨分配到芯片的通路。
附图说明
图1是框图,示出了带有实现新型打印头的一个示例的介质宽打印杆的喷墨打印机。
图2和3是诸如可能在图1所示打印机中使用的打印杆的一个示例的透视图。
图4是框图,示出了带有实现新型打印头的另一个示例的介质宽打印杆的喷墨打印机。
图5和6是诸如可能在图4所示打印机中使用的打印杆的一个示例的透视图。
图7是在图1-3或图4-6中所示打印杆中的打印头的一个示例的近距离视图。
图8是沿图7中的线8-8截取的剖视图。
图9和10是图8的详图。
图11是平面视图图形,显示了图7-8的每个打印头芯片的特征中的一些的布局。
图12是剖视图,更详细地显示了图9-11的打印头芯片。
贯穿附图,相同的附图标记标示相同或类似的部件。附图未必按比例绘制。一些零件的尺寸被夸大,以更清楚地示出所示示例。
具体实施方式
已经开发出采用介质宽打印杆的喷墨打印机,以帮助增加打印速度和降低打印成本。常规的介质宽打印杆组件包括多个零件,这些零件将打印流体从打印流体供应源载送至小型打印头芯片,打印流体从打印头芯片喷射到纸张或其它打印介质上。虽然减小打印头芯片的尺寸和间距对于降低成本来说仍然是重要的,但将打印流体从较大的供应源部件导引至非常小的更紧密间隔的芯片需要实际上会增加总成本的复杂的流动结构和制造过程。
已经开发出一种新型流体流动结构,以允许使用较小的打印头芯片来帮助降低用于介质宽和其它喷墨打印机的打印头组件的成本。新型流体流动结构和用于制造此类结构的过程的示例公开于2013年2月28日提交的国际专利申请PCT/US2013/028207和2013年3月20日提交的PCT/US2013/033046中,这两份专利中的每一个都以引用方式全文并入本文中。
一种实现新型结构的一个示例的打印头包括模制到可模制材料的细长一体化主体中的多个打印头芯片。模制到主体中的打印流体通道将打印流体直接载送到每个芯片中的流动通路。模制实际上增加了用于制造外部流体连接部和用于将芯片附接到其它结构的每个芯片的尺寸,由此允许使用较小的芯片。打印头芯片和打印流体递送通道可在晶圆级模制以形成具有内置打印流体通道的复合打印头晶圆,从而消除了在硅衬底中形成打印流体通道的需求,并且允许使用更薄、更长且更窄的芯片。非常细长且薄的打印头芯片“薄片”目前是可能的。在一个示例中,一种新型打印头芯片包括具有100μm或更小厚度的结构,其包含多个流体喷射器和多个流体喷射室,且具有50或以上的长宽比。在该示例的一个具体实施中,芯片结构为25mm长(或更长)且不超过200μm宽,并且嵌入模制件中,该模制件具有仅约90μm宽的打印流体递送通道。
附图中所示和下文描述的这些和其它示例示出但不限制本发明,本发明在说明书之后的权利要求书中限定。
如本文所用,“打印头”和“打印头芯片”是指喷墨打印机或其它喷墨式分配器的从一个或多个开口分配流体的零件。打印头包括一个或多个打印头芯片。“打印头”和“打印头芯片”不限于用墨和其它打印流体打印,也包括其它流体的喷墨式分配和/或用于除打印之外的用途。
图1和4是框图,示出了具有实现新型打印头14的页宽打印杆12的喷墨打印机10。在图1所示打印机10中,打印杆12包括多个打印头14。在图4所示打印机10中,打印杆12包括单个页宽打印头14。图2和3是打印杆12的透视图,该打印杆具有诸如在图1所示打印机10中可能使用那样的多个打印头14。图5和6是打印杆12的透视图,该打印杆具有诸如在图4所示打印机10中可能使用那样的单个打印头14。
首先参看图1和4,打印机10包括跨越打印介质16的宽度的打印杆12、与打印杆12相关联的流调节器18、介质输送机构20、墨或其它打印流体供应源22、以及打印机控制器24。控制器24表示编程、(多个)处理器和相关联的(多个)存储器、以及控制打印机10的操作元件所需的电子电路和部件。打印杆12包括(多个)模制打印头14的布置,打印头用于将打印流体分配到纸张或其它打印介质16的片材或连续幅材上。图1中的打印杆12包括跨越打印介质16的多个模制打印头14。图4中的打印杆12包括跨越打印介质16的单个模制打印头14。如下文详细描述的,每个打印头14包括嵌入具有通道的模制件中的多个打印头芯片,该通道将打印流体进给到从供应源22通过流调节器18至打印杆12的流动路径中的每个芯片。
在图2和3所示打印杆12的示例中,多个打印头14以交错构型横跨打印杆纵长布置在行中,在交错构型中,每个打印头与相邻打印头重叠。(虽然在交错构型中显示了十个打印头14,但可使用更多或更少的打印头14和/或具有不同的构型。)每个打印头14安装到打印杆主体28上的平台或其它合适的安装结构26,并且由护罩30部分地围绕。在图5和6所示打印杆12的示例中,单个页宽打印头14安装到结构26。除了为(多个)打印头14提供安装平台26之外,打印杆主体28也可包括或容纳路径和流调节器,以用于将打印流体递送到(多个)打印头14。另外,虽然安装平台26显示为主体28的一体部分,但平台26也可形成为支撑在主体28中或之上的离散部分。
图7是图2和3所示打印杆12中的打印头14中的一个或图5和6中所示单个打印头14的近距离视图。图8是沿图7中的线8-8截取的剖视图。如上所述,新型模制打印头结构的优点之一在于,它允许使用非常细长且窄的打印头芯片,这是诸如图5和6所示那样的单个页宽打印头所期望的,并且用于利用诸如图2和3中所示那样的多个打印头打印杆覆盖大幅面的打印介质。并且,当然,新型较小的打印头芯片也适合在较短的打印头中使用。
现在参看图7和8,打印头14包括打印头芯片36,其嵌入一体化模制件38中并且横跨模制件38的宽度布置成彼此平行。模制件38在本文中有时称为可模制材料的主体38。虽然显示了用于打印例如四种不同墨颜色的四个平行的芯片36,但更多或更少打印头芯片36和/或其它构型是可能的。接合焊盘40将每个打印头芯片36中的电子电路通过接合引线42和印刷电路板或柔性电路32连接到外部部件。柔性电路32和环氧树脂或其它保护性覆盖物34在图7中用虚线描绘以更清楚地显示下面的结构。打印头14也包括通道44,其被模制到一体化主体38中以将打印流体直接递送至相应的打印头芯片36。
图9和10是图8的详图。图11是平面视图图形,显示了图7-10的每个打印头芯片36的特征中的一些的布局。现在也参看图9-11,在所示示例中,每个打印头芯片36包括两行喷射室46和对应的喷嘴48,打印流体通过喷嘴48从室46喷出。模制件38中的每个通道44将打印流体供应至一个打印头芯片36。用于打印头芯片36的其它合适的构型是可能的。例如,可使用更多或更少的喷射室46和通道44。打印流体从歧管52通过入口50流入每个喷射室46,歧管52沿着每个芯片36在两行喷射室46之间纵长延伸。打印流体通过多个端口54进给到歧管52中,端口54连接到在芯片表面56处的打印流体供应通道44。
打印流体供应通道44显著宽于打印流体端口54,如图所示,以将来自流调节器中的较大的宽松间隔的通路或将打印流体载送到打印杆12中的其它零件的打印流体载送到打印头芯片36中的较小的紧密间隔的打印流体端口54。因此,打印流体供应通道44可帮助减少或甚至消除对一些常规打印头中必要的离散的“扇形展开”流体传送结构的需求。此外,如图所示,将打印头芯片表面56的相当大一部分区域直接暴露于通道44允许通道44中的打印流体在打印期间帮助冷却芯片36。
图8-11中的打印头芯片36的理想化表示仅为便利起见描绘了三个层58、60、62,以清楚地显示喷射室46、喷嘴48、歧管52和端口54。实际的喷墨打印头芯片36通常是形成于硅衬底58上的复杂的集成电路(IC)结构,其带有在图8-11中未示出的层和元件。例如并且参看图12的剖视图,用于热喷墨打印的打印头芯片36采用分层架构,该架构包括硅或其它合适的衬底64、形成于衬底64中的流体端口54、通过喷嘴48喷射来自室46的墨的电阻加热元件66。(图12的截面线被调整,使得两个相对的喷射室46均为可见的。)图12也提供了不成比例的打印头芯片36的理想表示。一些零件的相对尺寸为清楚起见而被夸大。例如,芯片36的总体厚度相对于其宽度远小于图12中所示那样,喷嘴48也小得多,在每个打印头芯片36上具有成百上千个喷嘴48,并且图12中的特定层可能看起来相比另一层厚于其实际厚度。
图12所示打印头36包括形成于衬底64上的电介质68。在所示示例中,电介质68为图案化的薄膜,其包括形成于衬底64上的两个层:TEOS(原硅酸四乙酯)层70和上覆TEOS层70的BPSG(硼磷硅酸盐玻璃)层72。其它材料也可能适用于电介质68。电阻器66形成于电介质68上方的电阻层74中。典型的电阻层74由例如氮化钨硅(WSiN)、氮化钽硅(TaSiN)、铝化钽(TaAI)、氮化钽(Ta2N)、或这些材料的组合制成。形成于电阻层74上(或之下)的导电层76可用来将电流供应至电阻器66和/或将电阻器66联接到控制电路或打印头芯片36中的其它电子电路。典型的导电层76由例如铂(Pt)、铝(AI)、钨(W)、钛(Ti)、钼(Mo)、钯(Pd)、钽(Ta)、镍(Ni)、铜(Cu)与插入的扩散屏障和这些材料的组合制成。钝化层78形成于导电层76上方,以作为电介质和对空化(在喷射室46中)、氧化、腐蚀和其它环境条件的屏障。典型的钝化层78由例如碳化硅(SiC)、氮化硅(SiN)、TEOS和这些材料的组合制成。
继续参看图12,喷嘴48形成于喷嘴板80中,喷嘴板80形成于上文所述下面的结构上或固结到该结构。喷嘴板80有助于限定喷射室46、入口50和歧管52。在所示示例中,喷嘴板80形成于两个层中:形成于钝化层78上的第一层82和形成于第一层82上的第二层84。虽然在该示例中两个层82、84有助于限定喷射室46,但喷嘴48形成于最外侧的第二层84上。每个喷嘴板层82、84由SU8环氧树脂聚合物或其它合适的材料制成。第一层82有时被称为“室”层,因为它形成喷射室46的侧壁。第二层84有时被称为“喷嘴”层,因为喷嘴48形成于该层中。在操作中,墨或其它打印流体通过端口54从通道44进给到室46中,如由流箭头86所示。电阻器66被供能以加热对应的室46中的墨,以形成气泡,该气泡将墨挤出喷嘴48,如由流箭头88所示。
模制打印头14允许使用长而窄且非常薄的打印头芯片36。虽然具有50的长宽比的100μm厚的打印头芯片36被认为是新的,但已经表明,约25mm长和200μm宽的100μm厚的打印头芯片36可被模制到带有90μm宽的通道44的500μm厚的模制件38中,其芯片长宽比为120,这是在常规打印头中目前可得的甚至最小的芯片的几乎2?倍。打印头芯片36的厚度在图12中由尺寸TD表示。打印头芯片36的长度和宽度在图7中由尺寸L和W表示。模制件38的厚度在图8中由尺寸TM表示。不仅将通道44模制到模制件38中是相比在硅衬底中形成进料通道更便宜和容易,而且在更薄的芯片36中形成打印流体端口54也是更便宜和容易的。(渐缩的端口54有助于将气泡移离歧管52和喷射室46。)例如,在100μm厚的打印头芯片36中的端口54可通过干蚀刻和对于较厚的衬底不可行的其它合适的微机加工技术来形成。代替形成常规狭槽,在薄硅、玻璃或其它结构58中微机加工直的或略微渐缩的贯穿端口54的高密度阵列使结构更坚固,同时仍提供足够的打印流体流。因此,模制的打印头14允许使用非常细长且窄的芯片36,同时仍控制“芯片脆性”损坏(通常由在硅开槽期间形成的裂纹的蔓延导致的损坏)的风险。
可预期,现有的芯片操纵设备和微型装置模制工具及技术可适用于模制薄至50μm且具有高达150的长宽比的芯片36,并且适用于模制窄至30μm的通道44。模制件38提供有效但经济的结构,在该结构中,多行这样的芯片“薄片”36可被支撑在单个一体化主体中。芯片薄片可在模制件内间隔开,以消除对在常规打印头中使用的离散的墨通道扇形张开结构的需求。
如在本说明书的开始处提及的,附图中所示和上文描述的示例示出但不限制本发明。其它示例是可能的。因此,上述描述不应理解为限制在所附权利要求中限定的本发明的范围。
Claims (17)
1.一种打印头芯片,包括具有100μm或更小的厚度和至少50的长宽比的结构,所述结构在其厚度内包含多个流体喷射器和多个流体室,所述多个流体室均在喷射器附近且均具有入口和出口,打印流体可通过所述入口进入所述室,打印流体可通过所述出口从所述室喷出。
2.根据权利要求1所述打印头芯片,其中,所述结构为至少25mm长且小于或等于200μm宽。
3.根据权利要求2所述打印头芯片,还包括模制件,所述结构嵌入在所述模制件中,并且所述模制件具有在其中的通道,打印流体可通过所述通道直接传输至所述结构。
4.根据权利要求3所述打印头芯片,其中,所述通道具有90μm或更小的宽度。
5.根据权利要求4所述打印头芯片,其中,所述结构还在其厚度内包含:
多个端口,其连接到所述通道,使得打印流体能从所述通道直接流至所述端口中;以及
歧管,其连接在所述端口和所述入口之间,使得打印流体能从所述端口直接流入所述歧管中至所述入口。
6.根据权利要求5所述打印头芯片,其中,每个端口从在所述通道处的较宽部分渐缩至在所述歧管处的较窄部分。
7.根据权利要求6所述打印头芯片,其中,所述通道从远离所述端口的较宽部分渐缩至在所述端口处的较窄部分。
8.一种打印头,包括模制到一体化主体中的打印头芯片,所述打印头芯片具有100μm或更小的厚度,所述一体化主体具有在其中的通道,打印流体可穿过所述通道直接传输至所述芯片。
9.根据权利要求8所述的打印头,其中,所述打印头芯片具有由至少50的长宽比表征的大体上矩形的周边。
10.根据权利要求9所述的打印头,其中,所述主体具有500μm或更小的厚度。
11.根据权利要求10所述的打印头,其中,所述打印头芯片包括多个打印头芯片,每个打印头芯片具有100μm或更小的厚度和由至少50的长宽比表征的大体上矩形的周边,所述打印头芯片彼此平行地布置在所述主体中,并且所述通道包括多个通道,打印流体可穿过每个通道传输至所述芯片中的一个。
12.根据权利要求11所述的打印头,其中
每个通道具有90μm或更小的宽度;并且
每个打印头芯片在其厚度内包含:
多个流体喷射器;
多个流体室,所述多个流体室均在喷射器附近且均具有入口和出口,打印流体可通过所述入口进入所述室,并且打印流体可通过所述出口从所述室喷出;
多个端口,其连接到通道,使得打印流体能从所述通道直接流至所述端口中;以及
歧管,其连接在所述端口和所述入口之间,使得打印流体能从所述端口直接流入所述歧管中至所述入口。
13.一种打印杆,包括:
安装结构;以及
打印头,其安装到所述安装结构,所述打印头包括多个打印头芯片,所述多个打印头芯片模制到一体化主体中并且彼此平行地布置在所述主体中,并且所述主体具有在其中的多个通道,打印流体可通过所述通道直接传输至所述芯片。
14.根据权利要求13所述的打印杆,其中,所述打印头包括仅一个打印头。
15.根据权利要求13所述的打印杆,其中,所述打印头包括大体上端对端布置成交错构型的多个打印头,在所述交错构型中,每个打印头与相邻的打印头重叠,并且每个打印头包括多个打印头芯片,所述多个打印头芯片模制到一体化主体中并且彼此平行地布置在所述主体中,并且每个主体具有在其中的多个通道,打印流体可通过所述通道直接传输至所述芯片。
16.根据权利要求13所述的打印杆,其中,每个打印头芯片具有小于或等于100μm的厚度和由至少50的长宽比表征的大体上矩形的周边。
17.根据权利要求16所述的打印杆,其中:
每个通道具有90μm或更小的宽度;并且
每个打印头芯片在其厚度内包含:
多个流体喷射器;
多个流体室,所述多个流体室均在喷射器附近且均具有入口和出口,打印流体可通过所述入口进入所述室,并且打印流体可通过所述出口从所述室喷出;
多个端口,其连接到通道,使得打印流体能从所述通道直接流至所述端口中;以及
歧管,其连接在所述端口和所述入口之间,使得打印流体能从所述端口直接流入所述歧管中至所述入口。
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PT (1) | PT2825386T (zh) |
RU (1) | RU2633873C2 (zh) |
TW (3) | TWI531479B (zh) |
WO (4) | WO2014133516A1 (zh) |
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