TW201529345A - 模製列印頭 - Google Patents

模製列印頭 Download PDF

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TW201529345A
TW201529345A TW103131760A TW103131760A TW201529345A TW 201529345 A TW201529345 A TW 201529345A TW 103131760 A TW103131760 A TW 103131760A TW 103131760 A TW103131760 A TW 103131760A TW 201529345 A TW201529345 A TW 201529345A
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Taiwan
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die
molded article
printed circuit
circuit board
front side
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TW103131760A
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TWI609796B (zh
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西連Ｊ 喬伊
麥可Ｗ 庫米比
迪文Ａ 莫瑞
清華 陳
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惠普發展公司有限責任合夥企業
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
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    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/16—Production of nozzles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Impression-Transfer Materials And Handling Thereof (AREA)
  • Pens And Brushes (AREA)

Abstract

於一實例中，一列印頭包括：一列印頭晶粒，其具有一流體可沿著自該晶粒分配的正面，該晶粒模製成一單塊模製品其中具有一通道，流體可直接地通過至該晶粒之背部部分，該晶粒之該正面暴露在該模製品外側以及該晶粒之該背部部分除了在該通道處外由該模製品所覆蓋；一暴露在該模製品外側的電接點，連接至該列印頭外部的電路；一模製於該模製品中的印刷電路板，該印刷電路板具有一暴露的正面與該晶粒之該暴露的正面共平面並環繞以及一導體電連接至該接點；以及一介於該晶粒與該印刷電路板導體之間完全地包覆在該模製品中的電連接。

Description

模製列印頭
本發明係有關於模製列印頭。
傳統噴墨式列印頭需要流體扇出由細微噴墨室至粗大供墨通道。
依據本發明之一具體實施例，係特地提出一種列印頭，其包含：一列印頭晶粒，其具有一流體可沿著自該晶粒分配的正面，該晶粒模製成一單塊模製品其中具有一通道，流體可直接地通過至該晶粒之背部部分，該晶粒之該正面暴露在該模製品外側以及該晶粒之該背部部分除了在該通道處外由該模製品所覆蓋；一暴露在該模製品外側的電接點，連接至該列印頭外部的電路；一模製於該模製品中的印刷電路板，該印刷電路板具有一暴露的正面與該晶粒之該暴露的正面共平面並環繞以及一導體電連接至該接點；以及一介於該晶粒與該印刷電路板導體之間的電連接。
10‧‧‧噴墨式印表機
12‧‧‧列印橫條
14‧‧‧模製列印頭
16‧‧‧列印媒體
18‧‧‧流量調節器
20‧‧‧媒體運送機構
22‧‧‧列印流體供給
24‧‧‧印表機控制器
26‧‧‧模製品
28‧‧‧電連接
30‧‧‧接點
32‧‧‧面
34‧‧‧列印頭晶粒
35‧‧‧通道
36‧‧‧電導體
38‧‧‧印刷電路板
39‧‧‧積體電路結構
40‧‧‧接合線
41‧‧‧矽基材
42,44‧‧‧接合墊/終端
46,48‧‧‧背部部分
50,52,54‧‧‧正面
56‧‧‧噴墨孔口
58‧‧‧直通矽晶穿孔
60‧‧‧載具
62‧‧‧特定應用積體電路晶粒
64,66‧‧‧開口
68‧‧‧表面黏著元件
70‧‧‧後面
102-112‧‧‧步驟
圖1係為圖解具有執行一新模製列印頭的一媒體 寬列印橫條之噴墨式印表機的一方塊圖。
圖2及3係分別為背側及前側透視圖，圖解諸如可於圖1所示該印表機中使用具有多個列印頭的一模製列印橫條的一實例。
圖4係為沿著圖2中該線4-4所取的一斷面視圖。
圖5係為沿著圖2中該線5-5所取的一斷面視圖。
圖6係為來自於圖3的一詳細視圖。
圖7-11圖解用於製作諸如於圖2-6中所示該列印橫條的一列印橫條之一示範製程。
圖12係為圖解圖7-11中該製程的一流程圖。
相同的元件代表符號表示整個圖式中相同或是相似的元件。該等圖式並非必然地按比例繪製。一些元件的相對尺寸係經誇大顯示，為了更清晰地圖解所示該等實例。
傳統噴墨式印表機需要流體扇出由細微噴墨室至粗大供墨通道。惠普(Hewlett-Packard)公司已發展新式、模製噴墨列印頭，中斷針對該等噴射室所需的該晶粒之尺寸與流體扇出所需的該間隔之間的連接，使能夠使用微小的列印頭晶粒“Slivers”，諸如於2013年6月17日提出申請的國際專利申請案編號第PCT/US2013/046065號，標題為列印頭晶粒(Printhead Die)，以及於2013年2月28日提出申請的國際專利申請案編號第PCT/US2013/028216號，標題為列模製列印橫條(Molded Print Bar)中所說明者，分別以全文引 用方式併入本案以為參考資料。儘管此新的方案具有複數優點，但有一挑戰在於在該等列印頭晶粒與外部線路之間完成堅固的電連接，抵抗墨水與機械應力同時不致影響低成本上限與維修保養。
為了對付此挑戰，已發展一新的模製列印頭其中，就一示範構態而言，該等電連接係移動至該列印頭晶粒的背部並在模製作業中嵌入。此構態容許堅固的機械連接，其大大地受保護不致暴露至墨水以及，因為沿著該晶粒之正面並無電連接，所以該列印頭能夠製成為平坦並因而將會妨礙列印頭至紙張的間隔及/或成本上限與維修保養的突出結構降至最低。於一示範的實作中，於以下詳細說明，一紙張寬模製列印橫條包括具有於模製作業中埋入的接合線的多個列印頭。該等電連接係按路線安排由美一列印頭晶粒之背部經由於該模製作業中內嵌的一印刷電路板，使一連續的平坦表面能夠橫越該列印橫條之該正面，於該處暴露該等噴射噴嘴以分配列印流體。
新的列印頭之實例並未限制在紙張寬列印橫條，但可以其他結構或總成實作。如於本文件中使用，一“列印頭”及一“列印頭晶粒”意指一噴墨式印表機或是其他由一或更多開口分配流體的噴墨式分配器之元件，以及一晶粒“sliver”意指一具有50或更大長寬比的列印頭晶粒。一列印頭包括一或更多的列印頭晶粒。“列印頭”及“列印頭晶粒”並未限定在以墨水及其他列印流體進行列印作業，而同時包括分配其他流體的噴墨式及/或供列印作業外使用。於 該等圖式中顯示並於本文中說明的該等實例圖解但未限定本發明，其係於此實施方式之後的申請專利範圍中定義。
圖1係為圖解具有執行一模製列印頭14的一媒體寬列印橫條12之噴墨式印表機10的一方塊圖。參考圖1，印表機10包括跨越一列印媒體16之寬度的一列印橫條12，與列印橫條12結合的流量調節器18，一媒體運送機構20，墨水或是其他列印流體供給22，以及一印表機控制器24。控制器24代表程式化處理器及結合的記憶體，以及電子電路及控制印表機10之操作元件所需的組件。列印橫條12包括一或更多的模製列印頭14的一佈置，用於將列印流體分配在一紙張上或紙張或是其他列印媒體16之連續捲包上。圖1中列印橫條12包括一或更多個列印頭14內嵌於橫跨列印媒體16的一模製品26中。介於列印頭14與接點30之間至外部電路的該等電連接28係由每一列印頭14之背部按路線安排並埋入於模製品26中，以容許沿著列印頭145之正面的一單一不中斷平坦表面。
圖2及3係分別為背側及前側透視圖，圖解諸如可於圖1所示該印表機10中使用具有多個列印頭14的一模製列印橫條12的一實例。圖4及5係為沿著圖2中該等線4-4及5-5所取的斷面視圖。圖6係為出自於圖3的一細節。參考圖2-6，列印橫條12包括多個列印頭14其係內嵌於一單塊模製品26中並成列地沿長度方向以一交錯形式該列印橫條橫越佈置，其中每一列印頭與一相鄰的列印頭部分重疊。僅管十個列印頭14係以一交錯形式顯示，但可使用更多或是較 少的列印頭14及/或為一不同的形式。實例並非限定在一媒體寬列印橫條。同時可以一掃描型式噴墨筆或是具有較少模製列印頭，或甚至一單一模製列印頭的列印頭總成實作該等實例。
每一列印頭14包括內嵌於模製品26中的列印頭晶粒34以及於模製品26中構成的通道35用以承載列印流體直接至相對應的列印頭晶粒34。僅管圖中顯示相互平行地佈置的四晶粒34橫向地橫越模製品26，但是例如對於四不同墨水顏色的列印作業，能夠有更多或較少的列印頭晶粒34及/或以其他的形式。如以上提及，該新式、模製噴墨列印頭之發展已使能夠使用微小列印頭晶粒“Slivers”，諸如於於2013年6月17日提出申請的國際專利申請案編號第PCT/US2013/046065號，標題為列印頭晶粒中所說明者。本文中說明的該等模製列印頭結構及電互連係特別地充分適合列印頭14中該等微小晶粒slivers34之實作。
於所示該實例中，將每一列印頭晶粒34連接至外部電路的該等電導體36係按路線安排通過一印刷電路板(PCB)38。印刷電路板通常亦係視為一印刷電路總成(一“PCA”)。一列印頭晶粒34典型地係為在一矽基材41上構成的一複雜積體電路(IC)結構39。PCB 38中導體36運送電信號至每一列印頭晶粒34之噴射器及/或其他元件。如於圖5中顯示，PCB導體36係經由接合線40連接至每一列印頭晶粒34中的電路。儘管在圖5之該斷面視圖中僅有一單一接合線40可看見，但可多個接合線40將每一列印頭晶粒34連接 至多個PCB導體36。
每一接合線40係分別地在列印頭晶粒34及PCB 38之背部部分46、48處連接至接合墊或是其他適合的終端42、44，並接著埋入於模製品26中。(於圖8及9之製造順序中亦顯示接合線40及接合墊42)。模製品26完全地包覆接合墊42、44及接合線40。於此上下文中“背部”部分意指離開列印橫條12之正面50因此該等電連接能夠完全地包覆在模製品26中。此構態分別地容許晶粒34、模製品26及PCB 38之正面32、52、54在每一晶粒34之該面32處沿著噴墨孔口56構成一單一不中斷平坦表面/面50，如於圖4之該斷面視圖中清楚可見。
儘管能夠作其他的導體佈線構態，但是印刷電路板提供相對價廉且高度地順應的平台供模製列印頭中導體佈線所用。同樣地，儘管可使用其他構態以將該等列印頭晶粒連接至該PCB導體，但接合線裝配工具係立即可用且容易順應於製造列印頭14及列印橫條12。就列印頭晶粒34而言其中該內部電子電路主要地係遠離該等晶粒之背部而構成，直通矽晶穿孔(TSV)58係構成在每一晶粒34中以將位在該晶粒34之該背部處的接合墊42連接至該內部電路，如於圖5中所顯示。TSV對於在該晶粒之背部處已有內部電路的晶粒構態而言非為所需的。
現將相關於圖7-11說明用於製作一列印橫條12的一示範製程。圖12係為於圖7-11中所圖解該製程的一流程圖。首先參考圖7，列印頭晶粒34係利用一導熱膠帶或是 其他適合的可鬆開黏著劑安置在一載具60上(圖12中的步驟102)。於所示該實例中，特定應用積體電路(ASIC)晶粒62亦係安置在載具60上。接著，如於圖8及9中顯示，PCB 38係安置在載具60上具有開口64環繞該等列印頭晶粒34以及開口66環繞ASIC 62(圖12中的步驟104)。位於PCB 38中的導體接著係以打線接合或是其他方式電連接至晶粒34及ASIC 62(圖12中的步驟106)。針對每一列印橫條12為必需或有需要時，PCB 38可包括表面黏著元件(SMD)68。具有PCB導體佈線的一模製列印橫條12的其中之一優點係易於將諸如ASIC 62及SMD 68的其他組件與該列印橫條結合。
圖10係為一平面視圖顯示在一載具面板60上出自於圖8之多個製程中列印橫條的佈局。位在面板60上的PCB 38及列印頭晶粒34係利用一環氧樹脂模塑化合物或是其他適合的可模製材料26重疊模製(圖12中的步驟108)，如於圖11中所示，並接著將個別列印橫條分開(圖12中的步驟110)並自載具60鬆開(圖12中的步驟112)以構成於圖2-6中所顯示的個別列印橫條12。該模製結構可分開成條以及該等條自載具60鬆開或是該模製結構可自載具60鬆開並接著分開成條。可使用任何適合的模製技術，例如，包括轉注模製及壓縮模製。於重疊模製期間於模製品26中構成的通道35可延伸通過以暴露列印頭晶粒34。可交替地，於重疊模製期間構成的通道35可僅部分地延伸通過模製品26並於一個別的加工步驟中經粉末噴砂處理或以其他方式開啟以暴露列印頭晶粒34。
面向下安置位在載具60上的重疊模製列印頭晶粒34及PCB 38產生一連續的平坦表面橫越每一列印橫條12之正面50，於該處噴射孔口56係暴露至分配列印流體。如於圖6中清楚可見，列印橫條正面50係為晶粒面32、PCB面52及環繞晶粒34及PCB 38的模製品26之面54的一合成物。假若對於列印橫條12之特別的實作係為必需或為所需的，則模製品26之後面70亦可模製為平坦的以製作一完全地平坦的列印橫條12(當然，在通道35處除外)。使用一單一黏著劑，模製品26，以保持該等列印頭晶粒34分開以及包覆該等電連接，不僅簡化該列印頭結構同時有助於降低材料成本以及製程成本。此外，一電重新分佈層(RDL)係非為所需的，一價廉的PCB 38執行該RDL功能，並僅使用一單一層的電互連以將每一晶粒34連接至PCB 38，進一步地簡化該結構並降低製造成本。
如於申請專利範圍中所使用“一個(a)”及“一個(an)”意指一或更多個。
如於此實施方式之開始處所提及，於該等圖式中顯示及以上說明的該等實例圖解但未限定本發明。其他實例係為可行的。因此，前述說明不應視為限定本發明之範疇，其係於以下的申請專利範圍中界定。
26‧‧‧模製品
30‧‧‧接點
32‧‧‧面
34‧‧‧列印頭晶粒
35‧‧‧通道
36‧‧‧電導體
38‧‧‧印刷電路板
39‧‧‧積體電路結構
40‧‧‧接合線
41‧‧‧矽基材
42,44‧‧‧接合墊/終端
46,48‧‧‧背部部分
52,54‧‧‧正面
58‧‧‧直通矽晶穿孔
68‧‧‧表面黏著元件
70‧‧‧後面

Claims (19)

  1. 一種列印頭，其包含：一列印頭晶粒，其具有一流體可沿著自該晶粒分配的正面，該晶粒模製成其中具有一通道之一單塊模製品，流體可穿過該通道直接地通至該晶粒之一背部部分，該晶粒之該正面暴露在該模製品外側以及該晶粒之該背部部分除了在該通道處外由該模製品所覆蓋；一電接點，其暴露在該模製品外側用以與該列印頭外部的電路連接；一模製於該模製品中的印刷電路板，該印刷電路板具有一暴露的正面與該晶粒之該暴露的正面共平面並環繞該晶粒之該暴露的正面以及一導體電連接至該接點；以及一介於該晶粒與該印刷電路板導體之間的電連接。
  2. 如請求項1之列印頭，其中該晶粒之該暴露的正面、該印刷電路板之該暴露的正面以及該模製品之一正面一起地構成一連續平坦的表面，該連續平坦的表面界定該列印頭的一正面。
  3. 如請求項2之列印頭，其中該電連接係介於該晶粒之該背部部分與該印刷電路板導體之間並完全地包覆在該模製品中。
  4. 如請求項3之列印頭，其中：該晶粒包括一貫穿矽通孔由該晶粒之該背部部分 至該晶粒之外部電路；以及該電連接包含一打線接合完全地包覆在該模製品中由該貫穿矽通孔至該印刷電路板導體。
  5. 如請求項4之列印頭，其中該模製品之與該正面相對的一背面構成一連續的平坦表面，除該通道處外。
  6. 如請求項5之列印頭，其中：該列印頭晶粒包含多個列印頭晶粒條，其配置成相互平行佈置且側向橫越該模製品；以及該通道包含多個通道，流體可穿過該等通道的每一者而直接地通至該等晶粒條對應一者的一背部部分。
  7. 一種列印頭，其包含內嵌在一模製品中的多個列印頭晶粒，該等列印頭晶粒具有完全地包覆的電導體自該等晶粒每一者延伸至一暴露的電接點，該等晶粒及該模製品一起地界定一暴露的平坦表面環繞著位在該等晶粒每一者之正面處的分配孔口，以及該模製品其中具有一通道，流體可穿過該通道而通至該等晶粒。
  8. 如請求項7之列印頭，其進一步包含內嵌在該模製品中的一印刷電路板，該等導體包括第一導體及第二導體，該等第一導體位在該印刷電路板中並連接至該接點，該等第二導體將該等第一導體連接至該等晶粒之一背部部分，且該等晶粒、該模製品及該印刷電路板一起地構成該暴露的平坦表面環繞著位在該等晶粒每一者之該正面處的該等分配孔口。
  9. 如請求項8之列印頭，其中該等第二導體包含接合線。
  10. 如請求項9之列印頭，其中：每一晶粒包括一貫穿矽通孔由該晶粒之該背部部分至該晶粒內部的電路；以及每一接合線，將一貫穿矽通孔連接至一第一導體。
  11. 如請求項9之列印頭，其進一步包含一非列印頭晶粒電子裝置，內嵌於該模製品中並連接至位在該印刷電路板中的一第一導體且接合線完全地包覆在該模製品中。
  12. 一列印頭，包含一位在單塊模製品中之伸長的立方形列印頭晶粒條，覆蓋該晶粒條之背部與側邊而讓該晶粒條之正面沿著一平坦表面暴露，該平坦表面包括該晶粒條之一正面以及環繞著該晶粒條之該正面的該模製品之一正面，該模製品其中具有一開口，流體可穿過該開口直接地通至該晶粒條之一背部部分。
  13. 如請求項12之列印頭，其進一步包含一位在該模製品中的印刷電路板，該模製品覆蓋該印刷電路板之該背部與側邊而讓該印刷電路板之正面沿著該平坦表面暴露，該平坦表面包括該晶粒條之該正面、環繞著該晶粒條之該正面的該模製品之該正面、以及該印刷電路板之該正面，該印刷電路板其中具有導體，該等導體藉由該模製品電連接至該晶粒條之一背部部分。
  14. 如請求項12之列印頭，其中：該伸長的立方形晶粒條包含多個伸長的立方形晶粒條，其配置成大體上端對端地沿著該模製品呈一交錯組態，其中一或更多個晶粒條與相鄰的一或更多個晶粒 條重疊；以及該開口包含多個開口，每一開口定位在該等晶粒條對應一者之該背部部分處。
  15. 如請求項12之列印頭，其中：該伸長的立方形晶粒條包含多個伸長的立方形晶粒條，其配置成相互平行並側向地橫越該模製品；以及該開口包含多個開口，每一開口定位在該等晶粒條對應一者之該背部部分處。
  16. 一種列印橫條製造方法，其包含：將多個列印頭晶粒面向下地安置在一載具上；將一印刷電路板安置在該載具上；將每一列印頭晶粒打線接合至該印刷電路板；以及在該載具上重疊模製該等列印頭晶粒及該印刷電路板，包括完全地包覆該等打線接合。
  17. 如請求項16之方法，其中將該印刷電路板安置在該載具上的作業包括將印刷電路板安置在該載具上，且將位在該印刷電路板中多個開口的每一開口環繞著一或更多個列印頭晶粒。
  18. 如請求項16之方法，其進一步包含安置一非列印頭晶粒電子裝置在該載具上並將該非列印頭晶粒電子裝置打線接合至該印刷電路板，以及其中該重疊模製作業包括在該載具上重疊模製該非列印頭晶粒電子裝置。
  19. 如請求項16之方法，其進一步包含：將該模製結構分開成個別的列印橫條並接著將該 等列印橫條自該載具鬆開；或將該模製結構自該載具鬆開並接著將該模製結構分開成個別的列印橫條。
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CN107901609A (zh) 2018-04-13
EP3656570A1 (en) 2020-05-27
KR102005466B1 (ko) 2019-07-30
US11541659B2 (en) 2023-01-03
US20170080715A1 (en) 2017-03-23
KR20170131720A (ko) 2017-11-29
US9751319B2 (en) 2017-09-05
EP2961609A4 (en) 2017-06-28
CN105121171B (zh) 2017-11-03
CN105142909A (zh) 2015-12-09
EP2961609A1 (en) 2016-01-06
EP3296113B1 (en) 2019-08-28
KR101940945B1 (ko) 2019-01-21
US10933640B2 (en) 2021-03-02
EP2961614B1 (en) 2020-01-15
EP2961614A1 (en) 2016-01-06
EP2825385B1 (en) 2017-09-06
RU2015140751A (ru) 2017-03-31
KR20180127529A (ko) 2018-11-28
US20180304633A1 (en) 2018-10-25

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