TW201532849A - 模製列印頭 - Google Patents

模製列印頭 Download PDF

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TW201532849A
TW201532849A TW103143477A TW103143477A TW201532849A TW 201532849 A TW201532849 A TW 201532849A TW 103143477 A TW103143477 A TW 103143477A TW 103143477 A TW103143477 A TW 103143477A TW 201532849 A TW201532849 A TW 201532849A
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Taiwan
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die
molding
print head
circuit board
printed circuit
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TW103143477A
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TWI562901B (en
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清華 陳
麥可Ｗ 庫米比
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惠普發展公司有限責任合夥企業
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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    • B41J2/01—Ink jet
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/135—Nozzles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Impression-Transfer Materials And Handling Thereof (AREA)
  • Pens And Brushes (AREA)

Abstract

在一範例中，一模製列印頭係包括一列印頭晶粒，其嵌入一模製物中，及一外部電接頭，其電性連接至列印頭晶粒且曝露於模製物外以連接至列印頭外部的電路。模製物中具有一通路，流體可經過其通往晶粒的背部份。晶粒的前部份曝露於模製物外，且晶粒的背部份除在通路處外係被模製物所覆蓋，且模製物的厚度從晶粒周圍的一較小厚度變動至遠離晶粒的一較大厚度。

Description

模製列印頭
本發明係有關於模製列印頭。
背景
傳統的噴墨列印頭係需要從微觀墨水配送腔室至巨觀墨水供應通路之流體性扇出(fluidic fan-out)。
依據本發明之一實施例，係特地提出一種列印頭，其包含：一列印頭晶粒，其具有一前部份，流體可沿著其從該晶粒配送，該晶粒嵌入一模製物中，該模製物中具有一通路，流體可經過其通往該晶粒的一背部份，該晶粒的前部份曝露於該模製物外且該晶粒的背部份除在該通路處外係被該模製物所覆蓋；一外部電接頭，其電性連接至該列印頭晶粒且曝露於該模製物外以連接至該列印頭外部的電路；及一電子裝置，其埋入該模製物中且電性連接至一外部接頭。。
10‧‧‧噴墨印表機
12‧‧‧列印桿
14‧‧‧列印頭
16‧‧‧列印媒體
18‧‧‧流調節器
20‧‧‧列印媒體運送機構
22‧‧‧墨水或其他列印流體供應物
24‧‧‧印表機控制器
26‧‧‧模製物
28‧‧‧ASIC或其他非列印頭晶粒電子裝置/SMD
30‧‧‧較厚部份/較寬部份
32‧‧‧均勻較薄的部份/較窄部 份
34‧‧‧列印頭晶粒/列印頭晶粒切片
36‧‧‧通路
38‧‧‧入口
40‧‧‧PCB導體
42‧‧‧印刷電路板(PCB)
44‧‧‧IC部份/積體電路(IC)結構
46‧‧‧矽基材
48‧‧‧結合引線
50,52‧‧‧終端
54‧‧‧外部接頭
56‧‧‧包封劑/環氧樹脂或其他適當的保護材料
58‧‧‧平蓋
60‧‧‧未中斷的平面性表面
62‧‧‧流體配送孔口
63‧‧‧銲球
64‧‧‧載體
66,92‧‧‧開口
68‧‧‧列印桿載體總成
70‧‧‧頂槽
72‧‧‧模製工具
74‧‧‧底槽
76‧‧‧釋放膜
77,83‧‧‧箭頭
78‧‧‧環氧樹脂或其他適當的模 製化合物
79‧‧‧製程中(in process)列印桿總成
80‧‧‧墨水匣
81‧‧‧鋸部
82‧‧‧列印頭總成
84‧‧‧匣殼體
86‧‧‧墨水埠
88‧‧‧電接頭
90‧‧‧撓性電路
102,104,106,108,110,112,114,116,118‧‧‧步驟
圖1是顯示一噴墨印表機之方塊圖，其實行一新模製列印桿的一範例；圖2及3分別是顯示一模製列印桿的一範例之立 體前視及後視圖，其諸如有可能使用於圖1所示的印表機中；圖4及5分別是沿著圖2的線4-4及5-5所取之剖視圖；圖6是圖5的細部；圖7至9是圖2的細部；圖10至17顯示一用以製造一模製列印桿、諸如圖2所示的列印桿之範例程序；圖18是圖10至17所示的程序之流程圖；圖19顯示一墨水匣，其實行一新模製列印頭總成的一範例；圖20及21分別是圖19所示的墨水匣中之列印頭總成的立體前視及後視圖；圖22是圖20的前側細部圖；圖23是圖21的後側細部圖；圖24是沿著圖20的線24-24所取之剖視圖；圖25是圖24的細部。
相同的元件號碼代表各圖中相同或相似的元件。圖式未必依照實際尺度。部分元件的相對尺寸放大以更清楚地例示所顯示的範例。
描述
傳統的噴墨列印頭係需要從微觀墨水配送腔室至巨觀墨水供應通路之流體性扇出(fluidic fan-out)。惠普公 司(Hewlett-Packard)已經開發出新的模製噴墨列印頭，其將配送腔室所需要的晶粒尺寸與流體性扇出所需要的間隔之間的連接予以打斷，而能夠使用微小列印頭晶粒「切片(slivers)」，諸如2013年6月17日提申名為「列印頭」的國際專利申請案第PCT/US2013/046065號、及2013年2月28日提申名為「模製列印桿」的PCT/US2013/028216所描述者，其各整體以參考方式併入本文中。在部分列印應用中可能欲在一列印桿中利用一ASIC(特殊應用積體電路)，以供印表機控制器與列印桿之間作高速輸入/輸出暨進行部分邏輯功能。一種將ASIC覆晶結合至一模製晶粒封裝體形成一POP(封裝體疊加)封裝體之傳統的積體電路封裝程序係未能對於一模製列印桿良好地運作，原由在於模製物的背部份上不具有UBM(底凸塊金屬化)。
為此，已經開發一新模製列印桿，其中模製物厚度係變動以容納在列印桿中使用一ASIC。可變厚度模製物係容許將ASIC整合在模製物中而不在列印頭晶粒切片的區域中增加列印桿的厚度。一嵌入模製物中的印刷電路板係可用來將ASIC連接至列印頭晶粒及列印桿外部的電路，並藉此避免需要在模製物中形成UBM或其他配線。
新的可變厚度模製物之範例並不限於列印桿或使用ASIC，而是可在其他列印頭結構或總成中或以其他電子裝置實行。圖中所顯示及本文所描述的範例係示範而未限制本發明，本發明在此描述後的申請專利範圍中被界定。
如本文件所用，「列印頭」及「列印頭晶粒」係 指用於配送流體之一噴墨印表機或其他噴墨型配送器的部份，且一晶粒「切片」係指一具有50或更大的長度寬度比值之列印頭晶粒。一列印頭係包括單一列印頭晶粒或多重的列印頭晶粒。「列印頭」及「列印頭晶粒」並不限於以墨水列印而是亦包括其他流體的噴墨型配送及/或列印以外的使用技術。
圖2是顯示一噴墨印表機10的方塊圖，其實行一模製列印桿12的一範例。參照圖1，印表機10係包括一列印桿12，其具有橫跨一列印媒體16的寬度之列印頭14的一配置，與列印桿12聯結之流調節器18，一列印媒體運送機構20，墨水或其他列印流體供應物22，及一印表機控制器24。控制器24係代表程式化、處理器及相聯結的記憶體、以及控制一印表機10的操作性元件所需要之電子電路及組件。列印桿12包括列印頭14的一配置，其各具有嵌入一模製物26中之單一列印頭晶粒或多重列印頭晶粒，以供將列印流體配送至一頁片或連續網膜的紙或其他列印媒體16上。列印桿12亦包括嵌入模製物26中之一ASIC或其他非列印頭晶粒電子裝置28。如下文參照圖4至9所詳述，模製物26的厚度係變動以在一較厚部份30容納ASIC 28、同時仍在橫跨列印頭14長度之列印區中保持一均勻的較薄部份32。
圖2及3分別是立體前及後視圖，其顯示諸如有可能使用於圖1所示的印表機10中之一模製列印桿12的一範例。圖4至9是圖2的剖面及細部圖(在圖7中，省略了引線結合件上的保護覆蓋物以顯示下方的連接件。在圖8中，顯示 出覆蓋住引線結合件的包封劑，且在圖9中，顯示出覆蓋住包封劑的保護蓋)。參照圖2至9，列印桿12係包括嵌入一單體性模製物中且以一交錯組態配置於沿著列印桿長度方向的一列中之多重列印頭14，其中各列印頭重疊於一相鄰的列印頭。雖然以一交錯組態顯示十個列印頭14，可使用更多或更少個列印頭14及/或呈現一不同組態。範例並不限於一媒體寬列印桿。範例亦有可能在具有較少個模製列印頭之一掃瞄型噴墨筆中或一列印頭總成中實行，或甚至在單一模製列印頭中實行。
各列印頭14係包括嵌入模製物26中之列印頭晶粒34以及形成於模製物26中之通路36，以將列印流體直接攜載至對應的列印頭晶粒34。在圖示範例中，如圖4清楚所見，通路36將列印流體直接攜載至位於各晶粒34的背部份處之入口38。雖然對於各列印頭14顯示側向地橫越模製物26而彼此平行地配置之四個晶粒34，以例如供列印四個不同墨水顏色。可能具有更多或更少個列印頭晶粒34及/或呈現其他組態。如上述，藉由開發新的模製噴墨列印頭係能夠使用微小列印頭晶粒「切片」，諸如2003年6月17日提申名為「列印頭晶粒」的國際專利申請案第PCT/US2013/046065號所描述者。本文所描述的模製列印頭結構及電互連件係特別良好適合於此等微小晶粒切片34在列印頭14中之實行。
在圖示範例中，如圖6的細部清楚所見，用以將各列印頭晶粒34連接至外部電路之電導體40係繞佈經過一 印刷電路板(PCB)42。印刷電路板亦常稱為印刷電路板總成(PCA)。特別參照圖6，一噴墨列印頭晶粒34係為形成於一矽基材46上之一典型複雜的積體電路(IC)結構44。PCB導體40將電信號攜載至各晶粒34的IC部份44中之射出器(ejector)及/或其他元件。在圖示範例中，PCB導體40經由結合引線48連接至各列印頭晶粒34中的電路。各結合引線48連接至分別位於列印頭晶粒34的前部份及PCB 42之結合墊或其他適當的終端50、52。因此，PCB導體42將列印頭晶粒34連接至曝露的接頭54以供連接至列印桿12外部的電路。
雖然可能具有其他的導體繞佈組態，一PCB係提供用於模製列印頭中的導體繞佈之一相對便宜且高度具調適性的平台。類似地，雖然可採用結合引線以外的連接器，結合引線總成工具建置係易於取得且容易調適用於列印頭14及列印桿12之製造。結合引線48可如圖5及8所示被一環氧樹脂或其他適當的保護材料56所覆蓋。可如圖9所示添加一平蓋58以在結合引線48上形成一較平、較低輪廓的保護覆蓋物。並且，在圖示範例中，列印頭晶粒34的曝露前部份係共面於模製物26及PCB 42的相鄰表面，以呈現出圍繞各晶粒34中的流體配送孔口62之一未中斷的平面性表面60(圖7中省略包封劑56及蓋58且圖8中省略蓋58，以更清楚顯示下方的結構)。
現在特別參照圖2、3、5及6，列印桿12包括在列印桿12背部份處嵌入模製物26中之兩個非列印頭晶粒電子 裝置28。在圖示範例中，如圖6清楚所見，裝置28係安裝至PCB 42的背表面且以銲球63直接地連接至PCB導體40。因此，裝置28在圖5及6中表示成表面安裝裝置(SMD)28。雖然對於裝置28可能有其他的安裝技術，表面安裝係為所欲以利於模製。有可能被整合至一噴墨列印桿12中的電子裝置28係例如包括：ASIC，EEPROM，電壓調節器，及被動信號調控裝置。
模製物26的厚度係作變動以在一較厚部份30處容納SMD 28，且同時仍在橫跨列印頭14長度的列印區中維持一均勻較薄的部份32。也就是說，模製物26的輪廓係界定沿著晶粒切片34的一較窄部份32及位於SMD 28處的一較寬部份30。雖然圖2及3中顯示兩個SMD 28，可能有更多或更少個裝置28及/或具有其他的安裝技術。並且，雖然裝置28在此範例中被定位於列印桿12的背部，以容許具有一實質扁平的前列印桿表面，在部分應用中可能欲將裝置28定位於列印桿12的前部或是列印桿12前部與背部兩者。預期裝置28通常將被定位於列印桿的一端，以有助於在覆蓋住流體配送孔口62的區域之列印區中維持模製物26的一均勻較薄部份32。
現在將參照圖10至17及圖18的流程圖描述一用以製造一列印桿12之範例程序。首先參照圖10，一預插佈有SMD 28之PCB 42係以一熱卷帶或其他適當的可釋放式黏劑被放置於一載體64上(圖18的步驟102)。然後，如圖11及12所示，列印頭晶粒切片34在PCB 42的開口66內側以面 朝下被放置於載體64上(圖18的步驟104)。預期使多重列印桿在一載體晶圓或面板64上被佈局且模製在一起並在模製之後被切單成為個別的列印桿。然而，圖10至12中僅顯示一載體面板64中具有一列印桿的製程中部份之一部分。
參照圖13，列印桿載體總成68係裝載至一模製工具72的頂槽70中(圖18的步驟106)。底槽74可依所需或所欲而襯墊有一釋放膜76，以利後續從模製工具釋放該部份。在圖14中，一環氧樹脂或其他適當的模製化合物78係被配送至底槽74中(圖18的步驟108)，且在圖15中，槽72及74如箭頭77所示被合併以形成圖16所示之製程中(in process)列印桿總成79(圖18的步驟110)。在圖16中，製程中模製的列印桿總成79係從模製工具72以及模製物26中切割或以其他方式形成的通路36被移除，概括如圖16的鋸部81及箭頭83所示(圖18的步驟112及114)。製程中結構係在圖17中從載體64被釋放(圖18的步驟116)。列印頭晶粒切片例如如圖6所示藉由引線結合被連接至PCB導體以形成列印桿12(圖18的步驟118)。
圖18的步驟之執行次序係可異於所顯示者。例如，在部分的製造序列中，可能欲在將PCB置於載體上之前將列印頭晶粒放置於載體上。並且，在部分實行方式中可能欲同時進行二或更多個步驟。例如，在部分製造序列中可能可以在步驟114中與步驟110中模製部份同時地形成通路。
圖19顯示一墨水匣80，其係實行一新模製列印頭 總成82的一範例。圖20及21分別是圖19所示的墨水匣80中之列印頭總成82的立體前及後視圖。圖22至25是圖19至21的細部及剖視圖。首先參照圖19，墨水匣80係包括由一匣殼體84所支撐之一模製列印頭總成82。匣80經過一墨水埠86被流體性連接至一墨水供應物且經由電接頭88被電性連接至一控制器或其他外部電路。接頭88形成於一被附裝至殼體32之所謂「撓性電路」90中。嵌入撓性電路90中的微小引線(未圖示)、常稱為跡線或信號跡線係將接頭88連接至列印頭總成82上之對應的接頭54。列印頭總成82的前面係沿著匣殼體84底部經過撓性電路90中的一開口92被曝露。
現在亦參照圖20至25，列印頭總成82包括多重的列印頭14，其各具有嵌入一單體性模製物26中之列印頭晶粒切片34。形成於模製物26中之通路36係將列印流體直接攜載至對應的列印頭晶粒34之背部份。如同在上述的列印桿範例中，PCB導體40將各晶粒34的IC部份44中之射出器及/或其他元件連接至外部接頭54。然而，在此範例中，用以將各晶粒34連接至PCB導體40之引線結合件係位於晶粒34的背部份且被埋入模製物26中。亦在此範例中，SMD 28以結合引線48被連接至PCB導體。如圖23及25清楚所見，各結合引線48係埋入模製物26中。在此脈絡中，「背」部份係指遠離列印頭總成82的前面，俾使電連接件可被完全包封於模製物26中。此組態係容許晶粒34、模製物26及PCB 42的前面在列印頭14的列印區域中形成橫越列印頭總成82的前面94之單一未中斷的平面性表面。此組態係容許具有大 致受保護不曝露於墨水之機械性強健的連接，原因在於沿著晶粒的前面不具有電連接，且列印頭可製成扁平且藉此盡量減少有可能干擾到列印頭至紙的間隔及/或加蓋與養護之突出結構。
申請專利範例中所用的「一」係指一或更多。
如同此描述開始所陳述，圖中所示及上文所描述的範例係示範而非限制本發明。其他範例亦為可能。因此，上文描述不應被詮釋為限制了在下列申請專利範圍中所界定之本發明的範圍。
12‧‧‧列印桿
14‧‧‧列印頭
26‧‧‧模製物
28‧‧‧ASIC或其他非列印頭晶粒電子裝置/SMD
30‧‧‧較厚部份/較寬部份
32‧‧‧均勻較薄的部份/較窄部
34‧‧‧列印頭晶粒/列印頭晶粒切片
36‧‧‧通路
42‧‧‧印刷電路板(PCB)
58‧‧‧平蓋

Claims (14)

  1. 一種列印頭，其包含：一列印頭晶粒，其具有一前部份，流體可沿著該前部份從該晶粒配送，該晶粒嵌入一模製物中，該模製物中具有一通路，流體可經過該通路通往該晶粒的一背部份，該晶粒的前部份曝露於該模製物外且該晶粒的背部份除在該通路處外係被該模製物所覆蓋；一外部電接頭，其電性連接至該列印頭晶粒且曝露於該模製物外以連接至該列印頭外部的電路；及一電子裝置，其埋入該模製物中且電性連接至一外部接頭。
  2. 如請求項1之列印頭，其中：該模製物的一厚度從該列印頭晶粒周圍的一較小厚度變動至遠離該列印頭晶粒的一較大厚度；及該電子裝置埋入該模製物的較厚部份中。
  3. 如請求項2之列印頭，其中：該列印頭晶粒包含多重的列印頭晶粒；該模製物包含單一的單體性模製物，其中各具有多重通路，該流體可經過該多重通路直接通往該等列印頭晶粒的一或多者之背部份；及該外部接頭係包含多重的外部接頭且各列印頭晶粒電性連接至一外部接頭。
  4. 如請求項3之列印頭，其進一步包含一嵌入該模製物中 之印刷電路板且其中：各列印頭晶粒經過該印刷電路板中的一導體連接至一外部接頭；接近該等列印頭晶粒之該印刷電路板的一前部份係曝露於該模製物外；及該電子裝置在該印刷電路板的一背部份處被埋入該模製物中且經過該印刷電路板中的一導體被連接至一外部接頭。
  5. 一種列印桿，其包括如請求項4之一列印頭。
  6. 一種列印流體匣，其包括如請求項4之一列印頭。
  7. 一種列印桿，其包含：多重列印頭晶粒的一配置；一電子裝置，其位於晶粒的該配置之一端；及一單體性模製物，其覆蓋該等晶粒及該電子裝置，俾使位於各晶粒的一前部份之流體配送孔口曝露於該模製物外，且位於各晶粒的一背部份之一流體入口曝露於該模製物中的一通路，該模製物的一輪廓係界定沿著該等晶粒的一較窄部份及位於該電子裝置的一較寬部份。
  8. 如請求項7之列印桿，其中位於該較寬部份之該模製物的一厚度係大於位於該較窄部份之該模製物的一厚度。
  9. 如請求項7之列印桿，其進一步包含一印刷電路板，該印刷電路板中具有連接至該等晶粒及該電子裝置之導體，該模製物係覆蓋該印刷電路板，俾使該模製物及印 刷電路板一起形成一曝露的平面性表面，該曝露的平面性表面係圍繞該等晶粒各者的前部處之該等配送孔口。
  10. 如請求項9之列印桿，其中：該電子裝置包含一特殊應用積體電路，其安裝至該印刷電路板的一背表面；位於該等晶粒中的流體配送孔口係在該模製物的一前部份處曝露；及該特殊應用積體電路埋入該模製物的一背部份中。
  11. 如請求項9之列印桿，其中各列印頭晶粒包含一列印頭晶粒切片，且該等晶粒切片以一其中使一晶粒切片重疊於一相鄰的晶粒切片之交錯組態沿著該模製物概括呈端點對端點式配置。
  12. 如請求項9之列印桿，其中：各晶粒係在該印刷電路板的一前部份經過該模製物外的一連接或在該印刷電路板的一背部份經過該模製物內的一連接被電性連接至該印刷電路板；及該電子裝置在該印刷電路板的背部份經過該模製物內的一連接被電性連接至該印刷電路板。
  13. 一種用於製造一模製列印頭總成之方法，其包含：使一印刷電路板設有一安裝在該印刷電路板的一背表面上之電子裝置；提供一列印頭晶粒，其具有沿著該列印頭晶粒的一前表面曝露之流體配送孔口；將該印刷電路板前表面往下放置在一載體上； 將該列印頭晶粒前表面往下放置在該載體上；將該電子裝置、及該列印頭晶粒模製於該印刷電路板上方，俾使該模製物沿著該列印頭晶粒為較窄且在該電子裝置處為較寬；及形成一通路，其經過該模製物來到該列印頭晶粒的一背部處之一流體入口。
  14. 如請求項14之方法，其進一步包含將該列印頭晶粒連接至該印刷電路板中的一導體。
TW103143477A 2013-02-28 2014-12-12 Printhead,print bar,printing fluid cartridge and method for making a molded printhead assembly TWI562901B (en)

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