TW201441058A - 模製列印桿 - Google Patents

模製列印桿 Download PDF

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TW201441058A
TW201441058A TW103105118A TW103105118A TW201441058A TW 201441058 A TW201441058 A TW 201441058A TW 103105118 A TW103105118 A TW 103105118A TW 103105118 A TW103105118 A TW 103105118A TW 201441058 A TW201441058 A TW 201441058A
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fluid
die
print bar
print
dies
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TW103105118A
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TWI531480B (zh
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Chien-Hua Chen
Michael W Cumbie
Silam J Choy
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Hewlett Packard Development Co
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Impression-Transfer Materials And Handling Thereof (AREA)
  • Pens And Brushes (AREA)

Abstract

在一範例中，一列印桿包括模製於一長形單塊體部中之多個列印頭晶粒。該等晶粒係大體上端對端地沿著該體部的一長度配置，以及該體部內具有一通道，其中流體可經由該通道直接通至該等晶粒。

Description

模製列印桿 發明領域
本發明係有關一種模製列印桿。
發明背景
封裝於一噴墨筆或列印桿中之每個列印頭包括將墨水運送至射出腔室之小通道。在支持該筆或列印桿上的該(等)列印頭晶粒的一結構中，墨水透過通路從墨水供應源分配到該等晶粒通道。會希望縮小各個列印頭晶粒的尺寸，例如，降低該晶粒的花費並因此降低該筆或列印桿之花費。然而，使用較小的晶粒會需要改變支持該等晶粒之較大結構，包括分配墨水至該等晶粒之通路。
依據本發明之一可行實施例，係特地提出一種列印桿，其包含模製於一長形單塊體部中之多個列印頭晶粒，該等晶粒係大體上端對端地沿著該體部的一長度配置，以及該體部內具有一通道，其中流體可經由該通道直接通至該等晶粒。
10‧‧‧結構
12‧‧‧微裝置、列印頭晶粒
12A、12B‧‧‧微裝置
14‧‧‧體部、模製物
16、16A、16B‧‧‧流體流動路徑、通道
18‧‧‧通路
20、26‧‧‧表面
22‧‧‧導體、傳導線跡
23‧‧‧黏接墊
24‧‧‧電氣端子
28‧‧‧系統
30‧‧‧流體源
32‧‧‧流體推動器
34‧‧‧列印機
36‧‧‧列印桿
37‧‧‧列印頭
38‧‧‧列印基材
40‧‧‧調整器
42‧‧‧基材運輸機構
44‧‧‧供應器
46‧‧‧控制器
48‧‧‧列
50‧‧‧射出腔室
52‧‧‧小孔
54‧‧‧歧管
56‧‧‧埠
58‧‧‧基材
60、62‧‧‧小孔板
64‧‧‧撓曲電路
66‧‧‧保護層、載體
68‧‧‧載體晶圓
70‧‧‧釋開帶
72‧‧‧開口
74‧‧‧模製工具
78‧‧‧晶粒、條帶
80‧‧‧蓋體
102~116‧‧‧步驟
圖1和2、圖3和4、圖5和6以及圖7和8描繪一新的 模製流體流動結構之一範例，其中一微裝置係嵌設於具有直接連到該裝置的一流體流動路徑之一模製物中。
圖9係描繪流體流動系統之一方塊圖，該流體流動系統實現諸如顯示於圖1~8中的該等範例中的一者之一新的流體流動結構。
圖10係描繪一噴墨列印機之一方塊圖，該噴墨列印機實現針對一寬基底列印桿中的列印頭之一新的流體流動結構的一範例。
圖11~16描繪一噴墨列印桿，其實現針對一列印頭晶粒之一新的流體流動結構的一範例，例如可能用於圖10的列印機中。
圖17~21係描繪用以製造一新的列印頭晶粒流體流動結構之過程的一範例之截面圖。
圖22係圖17~21中所顯示的過程之一流程圖。
圖23~27係描繪用以製造諸如圖11~16中所顯示的列印桿之一新的噴墨列印桿之一晶圓等級程序的一範例之立體圖。
圖28係取自圖23之細部圖。
圖29~31描繪針對一列印頭晶粒之一新的流體流動結構之其它範例。
在整個圖式中，相同部份的號碼指示出相同或類似的部份。該等圖式不必然按比例。某些部份的相對大小係誇張化以更清楚地描繪出所顯示的範例。
利用一寬基底列印桿總成之噴墨列印機已經被發展來幫助增加列印速度和降低列印成本。傳統的寬基底列印桿總成包括多個部份，其將列印流體從該列印流體供應源運送到小的列印頭晶粒，其中該列印流體係從該等小列印頭晶粒射出到紙上或其它列印基材。當降低該等列印頭晶粒的尺寸和空間對於降低成本持續變得重要時，從較大的供應組件流通的列印流體變得更小，更緊縮空間的晶粒需要實際上會增加成本之複雜流動結構和製造過程。
一個新的流體流動結構已被發展來能夠使用較小的列印頭晶粒和更緊密的晶粒電路，以幫助降低基材寬噴墨列印機中之成本。實現該新結構的一範例之一列印桿包括模製於可模製材料的一長形單塊體部內之多個列印頭晶粒。模製於該體部中之列印流體通道將列印流體直接運載到各個晶粒中之流體流動通路。模製實際上使用以製造外部流體連接和用以將該等晶粒附接至其它結構的各個晶粒的尺寸成長，從而能夠使用較小的晶粒。該等列印頭和列印流體通道能夠於晶圓等級模製，以形成具有內建列印流體通道之一新的、複合的列印頭晶圓，消除需要在一矽基材中形成該等列印流體通道並能夠使用較薄的晶粒。
該新的流體流動結構並不限於列印桿或用於噴墨列印之其他類型的列印頭結構，亦可在其他裝置中實現和可用於其他流體流動應用。因此，在一範例中，該新的結構包括嵌設於一模製物中的一微裝置，該模製物具有一通道或其他路徑來供流體直接流進該裝置中或流到該裝置 上。舉例而言，該微裝置能夠是一電子裝置、一機械裝置、或一微電機系統(MEMS)裝置。該流體流動例如可為流進該微裝置中或在其上流動之一冷卻流體、或是流入一列印頭晶粒或其他流體分配微裝置中之流體。
顯示於圖式中並於下文描述的這些和其他範例例示但並未限制本發明，本發明係由此描述文件後之申請專利範圍所界定。
如同在本文件中所使用地，一「微裝置」表示具有小於或等於30mm的一或更多一外尺寸之一裝置；「薄」表示小於或等於650μm之一厚度；一「長薄片」表示一薄的微裝置具有至少為三的一長寬(L/W)比；一「列印頭」和一「列印頭晶粒」表示用於從一或更多開口分配流體之一噴墨列印機的部件或其他噴墨型分配器的部件。一列印頭包括一或更多列印頭晶粒。「列印頭」和「列印頭晶粒」不限於以墨水和其他列印流體列印，而是也包括其他流體及/或用於列印以外用途之噴墨類型分配。
圖1和2係分別為繪示一新的流體流動結構10之一範例的立視和平視截面圖。參照圖1和2，結構10包括模製於塑膠或其他可模製材料的一單塊體部14內之一微裝置12。一模製體部14在本文也被表示為一模製物14。微裝置12例如可為一電子裝置、一機械裝置、或一微電機系統(MEMS)裝置。一通道或其他合適流體流動路徑16係被模製於體部14內，並與微裝置12接觸，致使通道16中的流體能夠直接地流進裝置12或流到裝置12上(或是兩者)。在此 範例中，通道16係連接至微裝置12中的流體流動通路18，並且對微裝置12的外表面20暴露。
在另一範例中，於圖3和4中顯示，在模製物14中的流動路徑16允許空氣或其他流體沿著微裝置12的一外表面20流動到例如冷卻裝置12。並且，在此範例中，在電氣端子24連接至裝置12之信號跡線或其他導體22係被模製進模製物14內。在另一範例中，於圖5和6中顯示，微裝置12係與相對於通道16之一暴露表面26模製進體部14中。在另一範例中，於圖7和8中顯示，微裝置12A和12B係與流體流動通道16A和16B模製進體部14內。在此範例中，流動通道16A與外側裝置12A的邊緣接觸，而流動通道16B與內側裝置12B的底部接觸。
圖9係繪示實作例如圖1~8中顯示的流動結構10中的一者之一新的流體流動結構10的一系統28之一方塊圖。參照圖9，系統28包括一流體源30，其可操作地連接到一流體推動器32，該流體推動器32係組配來將流體移動至結構10中的流動路徑16。一流體源30可包括例如大氣作為空氣的一來源，以冷卻一電子微裝置12或用於一列印頭微裝置12之一列印流體供應器。流體推動器32表現為一泵、一風扇、重力或用以將流體從源30移動至流動結構10之任何其他合適的機構。
圖10係繪示實作一基材寬列印桿36中的一新的流體流動結構10之一範例的一噴墨列印機34之一方塊圖。參照圖10，列印機34包括跨距一列印基材38的寬度之列印 桿36、與列印桿36相關聯之流動調整器40、一基材運輸機構42、墨水或其他列印流體供應器44、和一列印機控制器46。控制器46表示為(多個)規劃處理器和相關聯的記憶體，以及需要去控制一列印機10的可操作元件之電子電路和構件。列印桿36包括列印頭37之佈置，其用以將列印流體分配在紙張的一薄片或連續織物、或是其他列印基材38。如同下文所詳細描述地，各個列印頭37包括在具有通道16的一模製物中之一或更多個列印頭晶粒，以將列印流體直接進送到該(等)晶粒。每個列印頭晶粒經過一流體路徑自供應器44接收列印流體，進入並經過流體調整器40和列印桿36中的通道16。
圖11~16繪示實作一新的流體流動結構10的一範例之一噴墨列印桿36，其例如可在圖10中所示之列印機34中使用。首先參照圖11的平面圖，列印頭37係嵌設於一長形單塊模製物14中並且配置成以一錯開組態大體上端對端地呈多列48，該組態中在各個列中的該等列印頭與該列中的另一列印頭重疊。雖然例如針對列印四個不同顏色而言，顯示出錯開的列印頭37之四個列48，然而其他合適的組態亦係可能。
圖12係取用沿著圖11中的線12-12的一截面圖。圖13~15係自圖12之細節圖，以及圖16係顯示圖12~14中的列印頭晶粒流動結構10的某些特徵之佈局的一平面檢視圖。現在參照圖11~15，在所顯示的範例中，各個列印頭37包括一對列印頭晶粒12，每個各具有兩列射出腔室50和 對應的小孔52，列印流體係透過該等小孔52自腔室50射出。在模製物14中的各個通道16供應列印流體給每個列印頭晶粒12。可能有用於列印頭37之其他合適的組態。舉例來說，較多或較少的列印頭晶粒12可被用於較多或較少的射出腔室50及通道16。(雖然列印桿36和列印頭37在圖12~15中面朝上，然而當安裝於一列印機中時，列印桿36和列印頭37通常面朝下，如圖10的方塊圖中所描繪者。)
列印流體從一歧管54流入各個射出腔室50，該歧管54係在射出腔室50的兩列之間沿著每個晶粒12縱向延伸。列印流體經過多個埠56進送至歧管54，該等埠56係連接至在晶粒表面20的一列印流體供應通道16。如所示地，列印流體供應通道16實質上比列印流體埠56寬，以從該流體調整器或運送列印流體進入列印桿36的其他部件之較大、寬鬆間隔的通路，運送列印流體至列印頭晶粒12中之較小、緊密間隔的列印流體埠56。因此，列印流體供應通道16能夠幫助降低或甚至消除在某些傳統列印頭中之一分立的「扇出(fan-out)」需要和其他流體路由結構需求。此外，如所示地，直接對通道16暴露列印頭晶粒表面20的一實質區域允許通道中的列印頭流體來在列印期間幫助冷卻晶粒12。
僅為了方便來清楚顯示射出腔室50、小孔52、歧管54和埠56，圖11~15中的一列印頭晶粒12之理想化表示描繪為三層58、60、62。一實際的噴墨列印頭晶粒12係形成在具有未示於圖11~15中的層和元件之一矽基材58之 一典型複雜的積體電路(IC)結構。舉例而言，在各個射出腔室50，於基材58上形成的一熱射出器元件或一壓電射出器元件(未示出)係被致動來從小孔52射出墨水或其他列印流體的液滴或液流。
模製流體結構10幫助能夠使用長、窄且非常薄的列印頭晶粒12。舉例來說，已顯示的是大約26mm長和500μm寬之一100μm厚的列印頭晶粒12能夠被模製於一500μm厚的體部14內，以取代一傳統500μm厚的矽列印頭晶粒。相較於在一矽基材中形成進送通道，將通道16模製於體部14內不僅較便宜且較容易，而且也比在一較薄的晶粒12中形成列印流體埠56較便宜且較簡單。舉例而言，一100μm厚的列印頭晶粒12中之埠56可藉由不是特別針對較厚基材的乾式蝕刻和其他合適的微加工技術所形成。非形成傳統槽件，而是將一高密度陣列的直接或稍微成漸縮通過的埠56微加工至一薄的矽、玻璃或其他基材58，會留下一較強健的基材，同時仍然提供充足的列印流體流。漸縮的埠56幫助空氣泡泡移動自歧管54和射出腔室50離開，該等歧管和腔室例如於被施加到基材58的一單塊或多層式小孔板60/62中形成。預期的是，流動晶粒處理設備與微裝置模製工具和技術，能夠適於如50μm的薄度並具有最高達150的一長/寬比之模製晶粒12，以及適於模製或以其他方式形成如30μm的窄度之通道16。並且，該模製物14提供一有效但不昂貴的結構，其中多行的此種晶粒長薄片能夠在一單一、單塊體部中獲支持。
圖17~21描繪用以製造一新的列印頭流體流動結構10之一之範例程序。圖22係繪示於圖17~21中的程序之一流程圖。參照圖17，具有傳導線跡22和保護層66之一撓曲電路64係以一熱釋開帶70層疊於一載體68上，另或是被施加於載體68(圖22中的步驟102)。如圖18和19中所顯示地，列印頭晶粒12係往下安置在載體68上的開口72中的小孔側(圖22中的步驟104)，以及導體22係黏接至晶粒12上的一電氣端子24(圖22中的步驟106)。在圖20中，一模製工具74在列印頭晶粒12周圍的一模製物14內形成通道16(圖22中的步驟108)。一漸縮的通道16在某些應用中可為想要的，以促使模製工具74之釋開或是增加扇出(fan-out)(或是兩者)。在模製之後，列印頭流動結構10係自載體68釋開(圖22中的步驟110)，以形成圖21中所示之完成部件，其中導體22係由層66所覆蓋且由模製物14所圍繞。在例如於圖20中所示之一轉換模製程序中，通道16係被模製於體部14中。在另外的製造程序中，可能會想要在模製圍繞列印頭晶粒12的體部14之後，形成通道16。
一單一列印頭晶粒12和通道16之模製係於圖17~21中顯示，而多個列印頭晶粒和列印流體通道能夠在晶圓等級同時模製。圖23~28繪示用以製造列印桿36之一範例晶圓等級程序。參照圖23，列印頭37係設置在多個列印桿的一圖案中之一玻璃或其它合適的載體晶圓68上。(雖然一「晶圓(wafer)」在產業中有時用於表示一圓形基材，然而一「平板(panel)」係包括任何形狀的基材。)如參 照圖17和圖22中的步驟102上文所述者，在首先施加或形成導體22和晶粒開口72之圖案之後，列印頭37通常將會被安置在載體68上。
在圖23中顯示的範例中，各具有四列的列印頭37之五組晶粒78係佈置於載體晶圓66上，以形成五個列印桿。用於在信紙或A4尺寸的基材上列印並具有四行列印頭37之一基材寬列印條，例如為大約230mm長和16mm寬。如此，五個晶粒組合78可被佈置於如圖23中所示之一單一270mm乘以90mm的載體晶圓上。再次，在顯示的範例中，一陣列的導體22延伸至黏接墊23靠近列印頭37的每一行之邊緣。導體22和黏接墊23係可在圖28的細節圖中更清楚見到。(對個別射出腔室或射出腔室的群組傳導信號線跡，例如圖21中的導體22，係被省略，以不使其他結構特徵模糊。)
圖24係沿著圖23中的24-24線採用的四行列印頭37中之一組合的一特寫截面圖。為了清楚，省略斷面線。圖23和24顯示在圖23的步驟102~112完成之後，製程過程中的晶圓結構。圖25顯示在圖23中圍繞列印頭晶粒12模製具有通道16之體部14的模製步驟114之後，圖24之部分。個別的列印桿的條帶78係在圖26中分離，以及在圖27中自載體68釋開，以形成五個個別的列印桿36(圖23中的步驟116)。雖然可使用任何合適的模製技術，然而目前用於半導體裝置封包技術之晶圓等級模製工具和技術的測試建議可能對於例如那些在圖21和27中所示之列印頭晶粒流體結 構10的製造上適於有成本效率。
一更硬的模製物14可於當一堅硬(或至少較不可撓曲)列印桿36係想要固持列印頭晶粒12時使用。一較不硬的模製物14可於當想要一可撓曲列印桿時使用，舉例來說，當另一支持結構在一單一平面中堅硬地固持該列印桿時，或是當想要一飛平面列印桿組態時。並且，雖然預期到的是模製體部14通常會是模製為一單塊部件，但是體部14能夠被模製為多於一個的部件。
圖29~31繪示用於一列印頭晶粒12的一新的流體流動結構10之其他範例。在這些範例中，通道16係沿著列印頭晶粒12的各側模製於體部14內，例如使用諸如上文參照圖17~21描述的一轉換模製程序。列印流體從通道16流經過埠56，直接地從通道16側向地進入各個射出腔室50。在圖30的範例中，小孔板62係在模製體部14之後施加，以關閉通道16。在圖31的範例中，一蓋體80係形成在小孔板62上方，以關閉通道16。雖然顯示出部分界定通道16之一分立蓋體80，但是模製於體部14中的一整合蓋體80亦可被使用。
如同在本說明的開始所注意到地，圖式中所顯示與上文所描述的範例係例示但不會限制本發明。有可能有其它範例。因此，前述描述應不會被詮釋為限制本發明的範圍，其是由後附的申請專利範圍所界定。
10‧‧‧結構
16‧‧‧通道
34‧‧‧列印機
36‧‧‧列印桿
37‧‧‧列印頭
38‧‧‧列印基材
40‧‧‧調整器
42‧‧‧基材運輸機構
44‧‧‧供應器
46‧‧‧控制器

Claims (15)

  1. 一種列印桿，其包含模製於一長形單塊體部中之多個列印頭晶粒，該等晶粒係大體上端對端地沿著該體部的一長度配置，以及該體部內具有一通道，其中流體可經由該通道直接通至該等晶粒。
  2. 如請求項1之列印桿，其中每個晶粒包含一薄型晶粒。
  3. 如請求項2之列印桿，其中每個薄型晶粒包含一晶粒長薄片。
  4. 如請求項3之列印桿，其中每個晶粒包括：連接至該通道之多個孔洞，使得列印流體能夠從該通道直接流進該等孔洞中；連接至該等孔洞之一歧管，使得列印流體能夠從該等孔洞直接流進該歧管中；以及連接至該歧管之多個射出腔室，使得列印流體能夠從該歧管流進該等射出腔室。
  5. 如請求項4之列印桿，其中：每個孔洞係從該通道處的一較寬部分漸縮至該歧管處的一窄部分；以及該通道係模製於該體部內，並從遠離該等孔洞的一較寬部分漸縮至該等孔洞處的一較窄部分。
  6. 如請求項3之列印桿，其中：該等晶粒長薄片係以一錯開組態呈跨越該體部的該長度的多列配置，其中各個列中的該等晶粒長薄片與 該列中的另一晶粒長薄片重疊；以及該通道包括各允許流體直接通到該等晶粒長薄片中的一或更多者之多個通道。
  7. 如請求項6之列印桿，其中：每個晶粒長薄片包括具有流體可通過而從該晶粒長薄片分配的小孔之一前面、相對於該前面的一背面、以及在該前面和背面之間的側邊；以及沿著每個晶粒長薄片的至少一側邊置設之一通道。
  8. 如請求項6之列印桿，其中：每個晶粒長薄片包括具有流體可通過而從該晶粒長薄片分配的小孔之一前面、相對於該前面的一背面、以及在該前面和背面之間的側邊；以及沿著每個晶粒長薄片的該背面置設之一通道。
  9. 如請求項6之列印桿，其中該單塊體部支持該等晶粒長薄片於一單一平面中。
  10. 一種列印桿，其包含圍繞薄型列印頭晶粒模製之一模製體部，該模製體部內具有多個通道，其中流體可經過該等通道直接通至該等晶粒，以及該等晶粒係以一錯開組態大體上端對端地呈多列配置，其中每一列中的該等晶粒與該列中的另一晶粒重疊。
  11. 如請求項10之列印桿，其中該體部包含支持該體部內之該等晶粒於一單一平面中的一單塊體部。
  12. 如請求項10之列印桿，其中每個晶粒包括一電氣端子，且該列印桿進一步包含連接至該等端子之導體，該體部 圍繞該等導體、以及該等端子模製。
  13. 一種列印桿，其包含：多個列印頭晶粒長薄片，每個晶粒長薄片包括射出腔室、可供流體經過而通至該等射出腔室之通路、具有可供流體經過而從該等射出腔室射出的小孔之一前面、以及相對於該前面的一背面；以及一模製物，其部分包封該等晶粒，而讓其中之多個通道直接連接至該等晶粒長薄片中的該等通路。
  14. 如請求項14之列印桿，其中該等通道係模製於該模製物內。
  15. 一種列印桿，其包含嵌設於一單塊模製物中之多個薄型列印頭晶粒，該模製物包括可供流體經過而直接通至該等晶粒之多個通道。
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EP2961609A4 (en) 2017-06-28
CN105121171B (zh) 2017-11-03
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KR101940945B1 (ko) 2019-01-21
US10933640B2 (en) 2021-03-02
EP2961614B1 (en) 2020-01-15
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RU2015140751A (ru) 2017-03-31
KR20180127529A (ko) 2018-11-28
US20180304633A1 (en) 2018-10-25

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