CN103676366B - 具有减小的驱动器电路架的显示器 - Google Patents
具有减小的驱动器电路架的显示器 Download PDFInfo
- Publication number
- CN103676366B CN103676366B CN201310360237.6A CN201310360237A CN103676366B CN 103676366 B CN103676366 B CN 103676366B CN 201310360237 A CN201310360237 A CN 201310360237A CN 103676366 B CN103676366 B CN 103676366B
- Authority
- CN
- China
- Prior art keywords
- display
- circuit
- layer
- film transistor
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010409 thin film Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 claims description 25
- 239000013078 crystal Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 2
- 239000011435 rock Substances 0.000 abstract description 21
- 239000004033 plastic Substances 0.000 abstract description 12
- 229920003023 plastic Polymers 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 11
- 230000005611 electricity Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/42—Arrangements for providing conduction through an insulating substrate
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Liquid Crystal (AREA)
Abstract
本发明涉及一种具有减小的驱动器电路架的显示器。一种电子设备显示器可具有滤色器层、薄膜晶体管层和液晶材料层。显示器可具有显示器盖层,如玻璃或塑料层。粘合剂可用于将上偏振器附接到显示器盖层。薄膜晶体管层可具有带有相对的上表面和下表面的基板。薄膜晶体管电路可在上表面上形成。显示器驱动器集成电路可安装到下表面或柔性印刷电路,并可使用导线接合线耦合到薄膜晶体管电路。贯穿薄膜晶体管层基板形成的贯通孔可用于将薄膜晶体管电路耦合到显示器驱动器集成电路。
Description
优先权
本申请要求于2012年8月31日提交的美国专利申请No.13/600,862的优先权,其全部内容通过引用而被合并于此。
技术领域
本发明一般涉及电子设备,更具体地涉及具有显示器的电子设备。
背景技术
电子设备通常包括显示器。例如,蜂窝电话机和便携式计算机通常包括向用户呈现信息的显示器。电子设备可具有诸如由塑料或金属形成的壳体之类的壳体。如显示组件的电子设备的组件可安装在该壳体内。
整合显示器到电子设备的壳体中是具有挑战的。尺寸和重量通常是设计电子设备的重要考虑因素。如果不小心,显示器可能笨重或被过大的边界包围。
因此,期望能够为电子设备提供改进的显示器。
发明内容
一种电子设备可设有具有上偏振器和下偏振器的显示器。该显示器可具有滤色器层、薄膜晶体管层、和插入在滤色器层和薄膜晶体管层之间的液晶材料层。滤色器层和薄膜晶体管层可插入在上偏振器和下偏振器之间。该显示器可具有诸如玻璃层或塑料层之类的显示器盖层。粘合剂可用于将上偏振器附接到显示器盖层。
该薄膜晶体管层可具有诸如玻璃层之类的具有相对的上表面和下表面的基板。薄膜晶体管电路可形成在上表面上。显示器驱动器集成电路可安装到下表面或柔性印刷电路。导线接合线可用来将薄膜晶体管电路耦合到下表面上的显示器驱动器集成电路,或可用来将薄膜晶体管电路耦合到已经安装有显示器驱动器集成电路的柔性印刷电路。
可通过薄膜晶体管层基板形成贯通孔。贯通孔可用来耦合将显示器驱动器集成电路到薄膜晶体管电路,或用来将薄膜晶体管电路耦合到已经安装有显示器驱动器集成电路的柔性印刷电路。
本发明的进一步的特征、性质和各种优势将通过下面附图和优选的实施例的具体描述变得清晰。
附图说明
图1是根据本发明的实施例的诸如具有显示器的膝上型计算机之类的说明性电子设备的透视图。
图2是根据本发明的实施例的诸如具有显示器的手持电子设备之类的说明性电子设备的透视图。
图3是根据本发明的实施例的诸如具有显示器的平板计算机之类的说明性电子设备的透视图。
图4是根据本发明的实施例的具有显示器的说明性电子设备的示意图。
图5是根据本发明的实施例的说明性显示器的横截面侧视图。
图6是根据本发明的实施例的说明性显示器的横截面侧视图,其具有已被用于将薄膜晶体管层的上表面上的薄膜晶体管电路与薄膜晶体管层的下表面上的柔性印刷电路结构互连的导线接合连接。
图7是根据本发明的实施例的说明性显示器的横截面侧视图,其中驱动器集成电路已被安装在薄膜晶体管层的下表面上,以及其中导线接合连接已被用于将薄膜晶体管层的上表面上的薄膜晶体管电路连接到显示器驱动器集成电路。
图8是根据本发明的实施例的具有显示器的说明性电子设备的横截面侧视图,其中柔性印刷电路总线用于将驱动器集成电路连接到薄膜晶体管层的上表面上的迹线,以及其中光学透明的粘合剂用于将显示器层附接到玻璃盖层。
图9是根据本发明的实施例的说明性显示器的横截面侧视图,其中通孔从薄膜晶体管层的上表面贯穿到其下表面,以及其中使用柔性印刷电路将显示器驱动器电路耦合到通孔。
图10是根据本发明的实施例的说明性显示器的横截面侧视图,其中通孔从薄膜晶体管层的上表面贯穿到其下表面,以及其中显示器驱动器电路安装到下表面上的通孔。
具体实施方式
电子设备可包括显示器。显示器可用于向用户显示图像。图1、2和3中示出可具有显示器的说明性电子设备。
图1示出电子设备10可有膝上型计算机的形状,具有上壳体12A和下壳体12B,下壳体12B具有如键盘16和触摸板18的组件。设备10可有铰链结构20,其使上壳体12A在方向22上绕旋转轴24相对下壳体12B旋转。显示器14可安装在上壳体12A中。有时被称为显示器壳体或显示器盖的上壳体12A,可通过绕旋转轴24向下壳体12B旋转而被放置于闭合位置。
图2示出电子设备10可以是如蜂窝电话、音乐播放器、游戏设备、导航单元、或其他紧凑型设备的手持设备。在此类设备10的配置中,壳体12可以有相对的前表面和后表面。显示器14可安装在壳体12的前表面上。如果需要,显示器14可有显示器盖层或其它包括用于如按钮26的组件的开口的外部层。开口也可形成在显示器盖层或其他的显示器层中以容纳扬声器端口(例如,参看图2中的扬声器端口28)。
图3示出电子设备10可以是平板计算机。在图3的电子设备10中,壳体12可以有相对的平面状的前表面和后表面。显示器14可安装在壳体12的前表面。如图3所示,显示器14可有带开口以容纳按钮26(作为一个例子)的盖层或其它外部层(例如,滤色器层或薄膜晶体管层)。
图1、2和3中示出的设备10的说明性配置仅为说明性的。通常,电子设备10可为膝上型计算机、包含嵌入式计算机的计算机监视器、平板计算机、蜂窝电话机、媒体播放器、或其它手持或便携式电子设备、如腕表设备、挂件设备、耳机或听筒设备的小设备、或其它可穿戴或微型设备、电视机、不包含嵌入式计算机的计算机显示器、游戏设备、导航设备、如其中具有显示器的电子装置安装在亭子或汽车中的系统之类的嵌入式系统、实现两个或多个此类功能的设备、或其他电子装置。
有时被称为壳子的设备10的壳体12可由诸如塑料、玻璃、陶瓷、碳纤维复合材料及其他纤维复合材料、金属(例如,加工铝、不锈钢、或其他金属)、其他材料、或这些材料的组合之类的材料形成。设备10可使用一体结构形成,其中壳体12的大部分或全部是由单一结构元件(例如,一块经过加工的金属件或一块成型的塑料)形成,或可由多个壳体结构(例如,已被安装到内部框架元件或其他内部壳体结构的外壳体结构)形成。
显示器14可以是包含触摸传感器的触摸敏感显示器或对触摸不敏感。显示器14的触摸传感器可以由电容式触摸传感器电极阵列、电阻式触摸阵列、基于声波触摸的触摸传感器结构、光学触摸、或基于力的触摸技术、或其他合适的触摸传感器组件形成。
通常,设备10的显示器包括由发光二极管(LED)、有机发光二极管(OLED)、等离子体单元、电润湿像素、电泳像素、液晶显示器(LCD)组件、或其他合适的图像像素结构形成的像素。在一些情况下,可能需要使用LCD组件形成显示器14,所以在此处有时描述其中显示器14是液晶显示器的显示器14的配置作为例子。还可能需要为如显示器14的显示器提供背光结构,所以在此处有时描述包括背光单元的显示器14的配置作为例子。如果需要,其他类型的显示器技术可用于设备10中。液晶显示器结构和背光结构在设备10中的使用仅为说明性的。
显示器盖层可覆盖显示器14的表面或如滤色器层、薄膜晶体管层之类的显示器层,或显示器的其他部分被用作显示器14的最外层(或接近最外层)。例如,由偏振器层覆盖的滤色器层或薄膜晶体管层可形成设备10的最外层。显示器盖层或其他外显示器层可由透明玻璃板、透明塑料层、或其他透明构件形成。
触摸传感器组件,如由透明材料(如铟锡氧化物)形成的电容式触摸传感器电极阵列,可在显示器盖层的底面上形成,可在分离的显示器层(如玻璃或聚合物触摸传感器基板)上形成,或可集成到其他显示器层(例如,诸如薄膜晶体管层之类的基板层)中。
图4是示出可用于电子设备10的说明性配置的示意图。如图4所示,电子设备10可包括控制电路29。控制电路29可包括用于控制设备10的操作的存储和处理电路。例如,控制电路29可例如包括如硬盘驱动存储器、非易失性存储器(如,被配置为形成固态驱动器的闪存或其他电可编程只读存储器)、易失性存储器(如,静态或动态随机访问存储器)等的存储设备。控制电路29可包括基于一个或多个微处理器、微控制器、数字信号处理器、基带处理器、电源管理单元、音频编解码芯片、特定用途集成电路等的处理电路。
控制电路29可用于在设备10上运行软件,例如操作系统软件和应用软件。使用此软件,控制电路29可在显示器14上向电子设备10的用户呈现信息。当在显示器14上向用户呈现信息时,传感器信号和其他信息被控制电路29用于调整用于显示器14的背光照明的强度。
输入-输出电路30可用于允许向设备10提供数据并允许从设备10向外部设备提供数据。输入-输出电路30可包括通信电路32。通信电路32可包括使用设备10的数据端口支持通信的有线通信电路。通信电路32还可包括无线通信电路(例如,使用天线发送和接收无线射频信号的电路)。
输入-输出电路30还可包括输入-输出设备34。用户可通过输入输出设备34提供命令以控制设备10的操作,并可使用输入-输出设备34的输出资源从设备10接收状态信息和其他输出。
输入-输出设备34可包括传感器和状态指示器36,如环境光传感器、接近传感器、温度传感器、压力传感器、磁传感器、加速度传感器,和发光二极管以及其他用于收集关于设备10的操作的环境的信息并向设备10的用户提供关于设备10的状态的信息的组件。
音频组件38可包括向设备10的用户呈现声音的扬声器和音频发生器以及用于收集用户音频输入的麦克风。
显示器14可用于向用户呈现如文本、视频和静态图像的图像。传感器36可包括形成为显示器14中的一个层的触摸传感器阵列。
可使用按钮和其他输入-输出组件40收集用户输入,其他输入-输出组件40如触摸板传感器、按钮、操纵杆、点击轮、滚轮、触摸传感器(如显示器14中的传感器36)、键区、键盘、振动器、照相机和其他输入-输出组件。
图5中示出用于设备10的显示器14(例如,图1、2或3中的设备或其他合适的电子设备的显示器14)的说明性配置的横截面侧视图。如图5所示,显示器14可包括背光结构,如产生背光44的背光单元42。在操作中,背光44向外传播(在图5的方位中垂直向上)并通过显示器层46中的显示器像素结构。这照亮任何由显示器像素形成的图像以供用户观看。例如,背光44可在方向50上照亮观看者48正观看的显示器层46上的图像。
可在如塑料底盘结构和/或金属底盘结构的底盘结构中安装显示器层46以形成用于安装在壳体12中的显示器模块或可将显示器层46直接安装在壳体12中(例如,通过将显示器层46堆叠到壳体12中的凹进部位中)。显示器层46可形成液晶显示器或可用于形成其他类型的显示器。
在显示器层46用于形成液晶显示器的配置中,显示器层46可包括如液晶层52的液晶层。液晶层52可被夹在如显示器层58和56的显示器层之间。显示器层56和58可被插入在下偏振器层60和上偏振器层54之间。
层58和56可由如玻璃透明层或塑料透明层的透明基板层形成。层56和58可为如薄膜晶体管层和/或滤色器层的层。导电迹线、滤色器元件、晶体管、和其他电路和结构可形成在层58和56的基板上(例如,以形成薄膜晶体管层和/或滤色器层)。触摸传感器电极还可被整合进如层58和56的层中,和/或形成在其他的基板上。
在一种说明性配置中,层58可以是薄膜晶体管层,其包括薄膜晶体管阵列和用于向液晶层52施加电场从而在显示器14上显示图像的相关电极(显示器像素电极)。层56可以是包括用于为显示器14提供显示彩色图像的能力的滤色器元件阵列的滤色器层。如果需要,滤色器层56和薄膜晶体管层58的位置可反转,以使薄膜晶体管层在滤色器层之上。
在设备10的显示器14的操作期间,可用控制控制电路29(例如,一个或多个集成电路,如图5的印刷电路66上的组件68)产生要显示在显示器14的信息(例如,显示数据)。要被显示的信息可使用信号路径从电路68传送到显示器驱动器集成电路62,信号路径如由柔性印刷电路64中的导电金属迹线形成的信号路径(作为示例)。
显示器驱动器集成电路62可安装到薄膜晶体管层驱动器架82或设备10的其它地方。如柔性印刷电路64的柔性印刷电路线缆可用于在印刷电路66和薄膜晶体管层60之间路由信号。如果需要,显示器驱动器集成电路62可安装在印刷电路66或柔性印刷电路64上。印刷电路66可由刚性印刷电路板(例如,玻璃纤维填充的环氧树脂层)或柔性印刷电路(例如,聚酰亚胺柔性片或其它柔性聚合物层)形成。
背光结构42可包括如光导板78的光导板。光导板78可由如透明玻璃或塑料的透光材料形成。在背光结构42的操作期间,如光源72的光源可产生光74。例如,光源72可以是发光二极管阵列。
来自光源72的光74可耦合进入光导板78的边缘表面76,并可由于全内反射原理横向贯穿分布在光导板78中。光导板78可包括光散射特征,如凹点或凸点。光散射特征可位于光导板78的上表面和/或相对的下表面上。
从光导板78向上散射的光74可作为显示器14的背光44。向下散射的光74可由反射器80反射回向上的方向。反射器80可由如白塑料层或其它光亮的材料之类的反射性材料形成。
为增强背光结构42的背光性能,背光结构42可包括光学膜70。光学膜70可包括帮助匀化背光44并进而减少热区的漫射层、增强离轴观看的补偿膜、和校准背光44的亮度增强膜(有时称为转向膜)。光学膜70可重叠在如光导板78和反射器80的背光单元42中的其它结构上。例如,如果从图5的方向50观察(即,以顶视图观察)光导板78有矩形底部,则光学膜70和反射器80可有与匹配的矩形底部。
图6是当期望最小化显示器14的非活动边界区域的宽度时,可用于显示器14的结构的说明性配置的横截面侧视图。如图6所示,显示器14可具有如薄膜晶体管层58上的架82(即,层58的未被滤色器层56覆盖的部分)的架。通过将驱动器集成电路62安装在柔性印刷电路64上,可最小化薄膜晶体管层58的架82的尺寸。
薄膜晶体管层58可包括显示器像素阵列。显示器像素可被在相交的栅极线和数据线的网格上路由的信号控制。每个显示器像素可包含向液晶层52的相关部分施加电场的电极结构。显示器像素内可提供薄膜晶体管以控制由电极结构施加的电场。薄膜晶体管、栅极线、数据线、其他导电线、和其他在薄膜晶体管层58的上表面上形成的薄膜电路(例如,栅极线驱动器电路)被示出为图6的薄膜晶体管电路106。
电路106可在如基板108的基板上形成。基板108由透明玻璃或塑料或其他透明介电层的板形成。基板108可具有相对的平面的上表面和下表面。薄膜电路106可在基板108的上表面上形成。薄膜电路106可包括如导电栅极线和数据线的导电线以及其他被用于在薄膜晶体管层58上分布信号的导电线。薄膜晶体管层58上的导电线(例如,金属迹线或作为薄膜晶体管电路106的一部分形成在薄膜晶体管基板108的上表面上的其他导电材料)在图6中被示出为线96。
如图6的显示器驱动器集成电路62的显示器驱动器集成电路可安装在如柔性印刷电路64的基板上。柔性印刷电路64可如图6所示附接到薄膜晶体管层基板108的下表面或可安装到设备10中的其他支持结构。
柔性印刷电路64可包括一个或多个导电线100(如金属迹线)的层。导电线100可作为在显示器驱动器集成电路62和薄膜晶体管电路106之间分布信号的信号线。导电线100可包括形成信号总线的并行信号路径。每个导电线100可耦合到相应的信号路径,如导线接合线92中的一个。
每个导线接合线92可有相对的第一端和第二端。每个导线接合线92的第一端可使用相应的导线接合连接98耦合到柔性印刷电路62中的迹线100的相应的一个迹线。每个导线接合线92的第二端可连接到薄膜晶体管层基板108的上表面上的薄膜晶体管电路106中的迹线96的相应的一个迹线。可使用导线接合工具形成导线接合线(导线接合)92。在导线接合操作期间,导线接合工具的导线接合头和/或薄膜晶体管层58被布置以使导线接合92从薄膜晶体管层58的上表面延伸到薄膜晶体管层58的下表面(例如,柔性印刷电路64的暴露的下表面)。
黑色掩蔽材料90可在滤色器层56和薄膜晶体管层58之间的、显示器14的非活动外围(边界)周围形成。黑色掩蔽材料90有时被称为不透明掩蔽材料,可由包含碳黑或其它吸收可见光的材料的聚合物形成。黑色掩蔽材料90可被构图以形成作为不透明边界的带,该不透明边界环绕显示器14的矩形外围,与非活动的显示组件(例如,显示驱动器电路、薄膜晶体管架等)重叠,并帮助向如图5所示的观察者48的观察者隐藏这些组件。黑色掩蔽材料90可沉积在围绕显示器14的包含用于显示器14的显示器像素的中央矩形部分的矩形环状中。
图7中示出另一种可用于形成具有精简非活动边界区域的显示器的说明性配置。如图7所示,如一个或多个显示器驱动器集成电路62的显示器驱动器电路可安装在薄膜晶体管层基板108的下表面上。导电线102可形成在薄膜晶体管层基板108的下表面上(例如,以形成柔性印刷电路线缆可附接到的焊盘)。导线接合线92可用来形成如导线接合连接98的与显示器驱动器集成电路62的直接连接,和/或用来通过形成与下表面导电线102的连接(如连接98′)来形成与显示器驱动器集成电路62的连接。在导线接合线92在导电线102上终止的配置中,导电线102可用来将线92连接到驱动器集成电路62(例如,通过使用焊料球以倒装芯片方式将驱动器集成电路62安装到由导电线102形成的焊料焊盘)。每个导线接合线92可具有如图7所示的导线接合94的连接,利用导线接合94,导线连接到薄膜晶体管层58的上表面上的导电线。
如图8的横截面侧视图所示,另一种最小化薄膜晶体管层驱动器架82的尺寸的方法包括将显示器驱动器集成电路62安装在柔性印刷电路64上(例如,使用焊料或集成电路62的电路和导电线100之间的其他连接)并使用柔性印刷电路64中的导电线100以在显示器驱动器集成电路62和导电线96以及薄膜晶体管基板层108的上表面上的其它薄膜晶体管电路106之间路由信号。迹线100可使用导电粘合剂(非均匀性导电膜)、焊接、焊接连接、板间连接器、或其他连接机制耦合到迹线96。因为显示器驱动器集成电路62不需要置于薄膜晶体管层58的架82上,所以架82的尺寸(因此显示器14在架82附近的非活动边界部分的宽度)可被最小化。
如图8的显示器14和设备10的其他显示器14的显示器可具有可选的显示器盖层,例如显示器盖层110。显示器盖层110可由透明玻璃层、透明塑料层、透明陶瓷层,或其他透明的材料形成。例如,显示器盖层110的厚度可为0.1到5毫米(作为示例)。
如果需要,光学透明的粘合剂(如粘合剂104)可用于将显示器盖层110附接到上偏振器54的最外层表面。当显示器盖层110以此种方式附接到显示器14的层时,显示器盖层110在设备10的使用期间可表现出减少的破裂可能性,使得能够减小显示器盖层110的厚度。如果需要,显示器盖层110可由相对硬的材料(如,玻璃)形成以抵抗刮划。黑色掩蔽层90可在显示器盖层110的外围形成以防止设备10的用户观察到内部设备结构(如驱动器架82)。
如果需要,通孔结构可用来减少或消除薄膜晶体管层58上的架82的需求。图9中示出了通过消除薄膜晶体管架82来最小化显示器的非活动边界宽度的显示器14的说明性配置。如图9所示,通孔112可在薄膜晶体管层58的上表面和下表面之间形成。当以此种方式路由信号通过薄膜晶体管层58时,架82可被消除。
通孔112,有时被称为通孔结构、金属通孔、或贯通孔,可用来将薄膜晶体管电路106中的导电线(如导电线96)连接到柔性印刷电路64的电路(例如,到柔性印刷电路的导电线,如导电线100)。通孔112可包括贯穿基板108的孔和完全或部分地填充孔的金属或其他导电材料。焊料、导电粘合剂、或其他导电材料可用来将通孔112的金属耦合到柔性印刷电路64的导电线100的金属。焊料或其他导电材料还可用于将驱动器电路(如显示器驱动器集成电路62)安装到柔性印刷电路64的迹线100。
柔性印刷电路64可包括一个或多个弯曲(如图9中的直角弯曲114)。如图9中的说明性配置,柔性印刷电路64可具有平放在基板108的下表面上的部分和从基板108以直角延伸的部分(例如,在图9的布置中垂直向下)。这类布置可使得显示器驱动器集成电路62沿着设备10的壳体12中的壳体侧壁的内表面安装。
通孔112可通过在薄膜晶体管基板108中钻开口来形成(例如,使用激光蚀刻或其他孔形成技术)。在薄膜晶体管层基板108形成开口后,金属或其他导电材料可在开口内形成(例如,使用物理气相沉积、化学气相沉积、电化学沉积、或其他合适的制造技术)。如果需要,可以通过在玻璃形成操作过程中,在薄膜晶体管层108内嵌入金属导线形成通孔112。
如图10所示,显示器驱动器集成电路62可直接安装到薄膜晶体管基板层108的下表面。焊料、导电粘合剂、或其他导电材料可用来将显示器驱动器集成电路62的电路互连到通孔112的金属。金属焊盘可在基板108的下表面上(例如,在通孔112上或连接到通孔112)和/或显示器驱动器集成电路62上形成。焊料、导电粘合剂、或其他导电材料可插入在基板108上和显示器驱动器集成电路62上的金属焊盘之间。
根据一个实施例,提供一种显示器,包括:滤色器层;具有薄膜晶体管电路并且具有带有相对的第一表面和第二表面的基板的薄膜晶体管层,其中薄膜晶体电路形成在第一表面上;插入在滤色器层和薄膜晶体管层之间的液晶材料层;和安装在第二表面上的显示器驱动器集成电路,其中基板具有从第一表面贯穿到第二表面并将薄膜晶体管电路耦合到显示器驱动器集成电路的通孔。
根据另一个实施例,基板包括玻璃,并且其中通孔包括嵌入在玻璃中的导线。
根据另一个实施例,基板包括玻璃,并且其中通孔包括玻璃中的激光钻的孔。
根据另一个实施例,基板包括玻璃。
根据一个实施例,提供一种显示器,包括:滤色器层;具有薄膜晶体管电路并且具有带有相对的第一表面和第二表面的基板的薄膜晶体管层,其中薄膜晶体电路形成在第一表面上;插入在滤色器层和薄膜晶体管层之间的液晶材料层;柔性印刷电路;和安装在柔性印刷电路上的显示器驱动器集成电路,其中柔性印刷电路安装到第二表面上,并且其中基板具有从第一表面贯穿到第二表面并将薄膜晶体管电路耦合到柔性印刷电路的通孔。
根据另一个实施例,柔性印刷电路有平放在第二表面上的第一部分和从第二表面以直角延伸出来的第二部分,并且其中显示器驱动器电路安装在第二部分上。
根据另一个实施例,基板包括玻璃。
根据另一个实施例,基板包括玻璃,并且其中通孔包括玻璃中的激光钻的孔。
根据另一个实施例,基板包括玻璃。
根据另一个实施例,通孔包括嵌入在玻璃中的导线。
根据一个实施例,提供一种显示器,包括:滤色器层;具有薄膜晶体管电路的薄膜晶体管层;插入在滤色器层和薄膜晶体管层之间的液晶材料层,其中薄膜晶体管层具有不被滤色器层覆盖的架区域;显示器驱动器集成电路;和在架区域中的薄膜晶体管电路和显示器驱动器集成电路之间延伸的导线接合线。
根据另一个实施例,薄膜晶体管层具有带有上表面和下表面的基板,其中薄膜晶体管电路形成在上表面上,以及其中显示器驱动器集成电路安装在下表面上。
根据另一个实施例,显示器进一步包括在非活动边界区域中的、插入在滤色器层和薄膜晶体管层之间的黑色掩蔽层。
根据一个实施例,提供一种显示器,包括:滤色器层;具有薄膜晶体管电路的薄膜晶体管层;插入在滤色器层和薄膜晶体管层之间的液晶材料层,其中薄膜晶体管层具有不被滤色器层覆盖的架区域;柔性印刷电路;安装在柔性印刷电路上的显示器驱动器集成电路;和在架区域中的薄膜晶体管电路和柔性印刷电路之间延伸以在显示器驱动器集成电路和薄膜晶体管电路之间形成信号路径的导线接合线。
根据另一个实施例,薄膜晶体管层具有带有上表面和下表面的基板,其中薄膜晶体管电路形成在上表面上,以及其中柔性印刷电路包括安装在下表面上上的至少一部分。
根据另一个实施例,显示器进一步包括在非活动边界区域中的、插入在滤色器层和薄膜晶体管层之间的黑色掩蔽层。
根据一个实施例,提供一种显示器,包括:滤色器层;具有薄膜晶体管电路的薄膜晶体管层;插入在滤色器层和薄膜晶体管层之间的液晶材料层,其中薄膜晶体管层具有不被滤色器层覆盖的架区域;显示器驱动器集成电路;和柔性印刷电路,其中显示器驱动器集成电路安装在柔性印刷电路上,并且其中柔性印刷电路附接到薄膜晶体管层的架区域,并具有从显示器驱动器集成电路向薄膜晶体管电路传送信号的导电线。
根据另一个实施例,显示器进一步包括滤色器层上的偏振器、玻璃层、和将玻璃层附接到偏振器的粘合剂层。
根据另一个实施例,显示器进一步包括附加的偏振器,其中滤色器层和薄膜晶体管层插入在偏振器和附加的偏振器之间。
根据另一个实施例,显示器进一步包括与架区域重叠的玻璃层上的黑色掩蔽材料。
上文仅示出了本发明的原理,本领域技术人员在不背离本发明的范围和精神的情况下可做出各种修改。
Claims (10)
1.一种显示器,具有活动区域,所述活动区域被非活动边界区域环绕,所述显示器包括:
滤色器层;
薄膜晶体管层,具有薄膜晶体管电路并且具有带有相对的第一表面和第二表面的基板,其中薄膜晶体电路形成在第一表面上;
插入在滤色器层和薄膜晶体管层之间的液晶材料层;和
安装在第二表面上的显示器驱动器集成电路,其中所述滤色器层重叠所述显示器的非活动边界区域中的所述显示器驱动器集成电路,其中基板具有从第一表面贯穿到第二表面并将薄膜晶体管电路耦合到显示器驱动器集成电路的贯通孔。
2.如权利要求1所述的显示器,其中基板包括玻璃,以及其中该贯通孔包括嵌入在玻璃中的导线。
3.如权利要求1所述的显示器,其中基板包括玻璃,以及其中该贯通孔包括玻璃中的激光钻的孔。
4.如权利要求1所述的显示器,其中基板包括玻璃。
5.一种显示器,包括:
滤色器层;
薄膜晶体管层,具有薄膜晶体管电路并且具有带有相对的第一表面和第二表面的基板,其中薄膜晶体电路形成在第一表面上;
插入在滤色器层和薄膜晶体管层之间的液晶材料层;
柔性印刷电路,所述柔性印刷电路具有安装到第二表面的第一部分,和从第二表面延伸出来的第二部分,其中所述第一部分和第二部分由所述柔性印刷电路的弯曲部分连接;和
安装在柔性印刷电路的第二部分上的显示器驱动器集成电路,其中基板具有从第一表面贯穿到第二表面并将薄膜晶体管电路耦合到柔性印刷电路的贯通孔。
6.如权利要求5所述的显示器,其中所述第二部分以直角从第二表面延伸出来。
7.如权利要求6所述的显示器,其中基板包括玻璃。
8.如权利要求5所述的显示器,其中基板包括玻璃,以及其中该贯通孔包括玻璃中的激光钻的孔。
9.如权利要求5所述的显示器,其中基板包括玻璃。
10.如权利要求9所述的显示器,其中该贯通孔包括嵌入在玻璃中的导线。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/600,862 | 2012-08-31 | ||
US13/600,862 US9454025B2 (en) | 2012-08-31 | 2012-08-31 | Displays with reduced driver circuit ledges |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103676366A CN103676366A (zh) | 2014-03-26 |
CN103676366B true CN103676366B (zh) | 2017-06-09 |
Family
ID=50187112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310360237.6A Active CN103676366B (zh) | 2012-08-31 | 2013-08-19 | 具有减小的驱动器电路架的显示器 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9454025B2 (zh) |
KR (1) | KR101722292B1 (zh) |
CN (1) | CN103676366B (zh) |
TW (1) | TWI630438B (zh) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10261370B2 (en) | 2011-10-05 | 2019-04-16 | Apple Inc. | Displays with minimized border regions having an apertured TFT layer for signal conductors |
US9286826B2 (en) | 2011-10-28 | 2016-03-15 | Apple Inc. | Display with vias for concealed printed circuit and component attachment |
US9359251B2 (en) | 2012-02-29 | 2016-06-07 | Corning Incorporated | Ion exchanged glasses via non-error function compressive stress profiles |
US9226347B2 (en) | 2012-06-25 | 2015-12-29 | Apple Inc. | Displays with vias |
US9214507B2 (en) | 2012-08-17 | 2015-12-15 | Apple Inc. | Narrow border organic light-emitting diode display |
US11079309B2 (en) | 2013-07-26 | 2021-08-03 | Corning Incorporated | Strengthened glass articles having improved survivability |
JP6105459B2 (ja) | 2013-12-17 | 2017-03-29 | 株式会社ジャパンディスプレイ | 液晶表示装置及び電子機器 |
US9517968B2 (en) | 2014-02-24 | 2016-12-13 | Corning Incorporated | Strengthened glass with deep depth of compression |
TWI697403B (zh) | 2014-06-19 | 2020-07-01 | 美商康寧公司 | 無易碎應力分布曲線的玻璃 |
KR102300035B1 (ko) * | 2014-07-28 | 2021-09-08 | 엘지전자 주식회사 | 투명 디스플레이 장치 |
KR102322762B1 (ko) | 2014-09-15 | 2021-11-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR101706706B1 (ko) | 2014-09-18 | 2017-02-15 | 주식회사 아세아텍 | 승용이앙기용 써레 동력전달장치 |
TWI749406B (zh) | 2014-10-08 | 2021-12-11 | 美商康寧公司 | 含有金屬氧化物濃度梯度之玻璃以及玻璃陶瓷 |
TWM518786U (zh) * | 2014-10-17 | 2016-03-11 | 瑞鼎科技股份有限公司 | 內嵌式觸控面板 |
TWI579754B (zh) * | 2014-10-17 | 2017-04-21 | 瑞鼎科技股份有限公司 | 內嵌式互電容觸控面板及其佈局 |
US10150698B2 (en) | 2014-10-31 | 2018-12-11 | Corning Incorporated | Strengthened glass with ultra deep depth of compression |
JP6839077B2 (ja) | 2014-11-04 | 2021-03-03 | コーニング インコーポレイテッド | 深部非脆弱性応力プロファイル及びその作成方法 |
CN105652551A (zh) * | 2014-11-12 | 2016-06-08 | 广州奥翼电子科技有限公司 | 柔性电子纸显示屏及其制作方法 |
CN104409656B (zh) * | 2014-11-27 | 2017-02-22 | 京东方科技集团股份有限公司 | 一种有机电致发光器件及其制备方法、显示装置 |
KR102145553B1 (ko) * | 2015-01-06 | 2020-08-18 | 삼성전자주식회사 | 디스플레이 모듈 및 이를 포함하는 멀티 디스플레이 장치 |
US10192950B2 (en) * | 2015-01-06 | 2019-01-29 | Samsung Electronics Co., Ltd. | Display module and multi-display device including the same |
KR102315671B1 (ko) * | 2015-01-19 | 2021-10-21 | 삼성디스플레이 주식회사 | 표시 장치 |
US9678588B2 (en) * | 2015-01-28 | 2017-06-13 | Sony Corporation | Wire-bonded borderless display |
KR102321611B1 (ko) | 2015-03-10 | 2021-11-08 | 삼성디스플레이 주식회사 | 표시 장치 및 휴대용 단말기 |
US10067583B2 (en) | 2015-03-31 | 2018-09-04 | Sony Corporation | Virtual borderless display |
US10204535B2 (en) * | 2015-04-06 | 2019-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
KR102369089B1 (ko) * | 2015-04-17 | 2022-03-02 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
US10170711B2 (en) | 2015-05-05 | 2019-01-01 | Apple Inc. | Display with vias to access driver circuitry |
CN104851892A (zh) * | 2015-05-12 | 2015-08-19 | 深圳市华星光电技术有限公司 | 窄边框柔性显示装置及其制作方法 |
US11613103B2 (en) | 2015-07-21 | 2023-03-28 | Corning Incorporated | Glass articles exhibiting improved fracture performance |
US10579106B2 (en) | 2015-07-21 | 2020-03-03 | Corning Incorporated | Glass articles exhibiting improved fracture performance |
KR102393206B1 (ko) | 2015-12-11 | 2022-05-03 | 코닝 인코포레이티드 | 금속 산화물 농도 구배를 포함하는 융합-형성가능한 유리계 제품 |
JP2017111296A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社ジャパンディスプレイ | 表示装置 |
KR20240019381A (ko) | 2016-04-08 | 2024-02-14 | 코닝 인코포레이티드 | 두 영역을 포함하는 응력 프로파일을 포함하는 유리-계 물품, 및 제조 방법 |
US10017417B2 (en) | 2016-04-08 | 2018-07-10 | Corning Incorporated | Glass-based articles including a metal oxide concentration gradient |
DE102017103788A1 (de) | 2016-05-31 | 2017-05-04 | Lpkf Laser & Electronics Ag | Erzeugung von metallisierten Durchgangslöchern im Randbereich eines TFT-Displays |
KR102532769B1 (ko) * | 2016-06-10 | 2023-05-17 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102512413B1 (ko) * | 2016-06-30 | 2023-03-20 | 엘지디스플레이 주식회사 | 터치 디스플레이 장치, 백 라이트 유닛 및 가요성 인쇄회로 |
US11011555B2 (en) | 2016-10-12 | 2021-05-18 | Shaoher Pan | Fabricating integrated light-emitting pixel arrays for displays |
US10467952B2 (en) * | 2016-10-12 | 2019-11-05 | Shaoher Pan | Integrated light-emitting diode arrays for displays |
US10445048B2 (en) | 2016-12-30 | 2019-10-15 | Shaoher Pan | Larger displays formed by multiple integrated LED array micro-displays |
CN106896599A (zh) * | 2017-03-10 | 2017-06-27 | 惠科股份有限公司 | 显示面板及其显示装置 |
US20180267345A1 (en) * | 2017-03-15 | 2018-09-20 | HKC Corporation Limited | Display device and display panel thereof |
KR102351372B1 (ko) * | 2017-07-06 | 2022-01-14 | 삼성전자주식회사 | 디스플레이를 구비한 전자장치 |
CN107479228B (zh) * | 2017-09-11 | 2020-08-25 | 京东方科技集团股份有限公司 | 显示模组及显示模组的制备方法 |
CN107633777A (zh) * | 2017-10-12 | 2018-01-26 | 深圳市创显光电有限公司 | 一种led显示装置及其制造方法 |
US10642079B2 (en) | 2017-10-25 | 2020-05-05 | Apple Inc. | Displays with delamination stopper and corrosion blocking structures |
CN108089382A (zh) * | 2017-12-28 | 2018-05-29 | 惠州市华星光电技术有限公司 | 一种液晶面板及显示装置 |
US10437402B1 (en) | 2018-03-27 | 2019-10-08 | Shaoher Pan | Integrated light-emitting pixel arrays based devices by bonding |
US10325894B1 (en) | 2018-04-17 | 2019-06-18 | Shaoher Pan | Integrated multi-color light-emitting pixel arrays based devices by bonding |
KR102535148B1 (ko) * | 2018-07-18 | 2023-05-22 | 삼성전자주식회사 | 디스플레이 패널 및 이를 이용한 대형 디스플레이 장치 |
CN108957812B (zh) * | 2018-07-24 | 2020-06-30 | 武汉华星光电技术有限公司 | 液晶显示装置的制作方法及液晶显示装置 |
TWI676849B (zh) * | 2018-10-15 | 2019-11-11 | 友達光電股份有限公司 | 顯示裝置 |
KR102657713B1 (ko) * | 2019-01-18 | 2024-04-16 | 삼성디스플레이 주식회사 | 표시 장치용 보호 부재, 이를 포함하는 표시 장치 및 표시 장치용 보호 부재의 제조 방법 |
CN109887948B (zh) | 2019-03-08 | 2021-11-09 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN111755620A (zh) * | 2019-03-27 | 2020-10-09 | 力晶积成电子制造股份有限公司 | 半导体封装 |
CN111752054A (zh) * | 2019-03-29 | 2020-10-09 | 北京小米移动软件有限公司 | 显示模组、终端及制备方法 |
TWI696868B (zh) * | 2019-05-21 | 2020-06-21 | 友達光電股份有限公司 | 顯示面板及顯示面板製作方法 |
CN110320689A (zh) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | 显示装置及其制备方法 |
CN110568682B (zh) * | 2019-08-08 | 2020-12-25 | 深圳市华星光电半导体显示技术有限公司 | 一种显示面板及显示装置 |
EP3785897B1 (en) | 2019-08-29 | 2021-12-29 | SHPP Global Technologies B.V. | Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers |
US11011669B2 (en) | 2019-10-14 | 2021-05-18 | Shaoher Pan | Integrated active-matrix light emitting pixel arrays based devices |
US10847083B1 (en) | 2019-10-14 | 2020-11-24 | Shaoher Pan | Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding |
KR20210059076A (ko) | 2019-11-13 | 2021-05-25 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20210135384A (ko) | 2020-05-04 | 2021-11-15 | 삼성디스플레이 주식회사 | 표시 장치 |
CN113644181B (zh) * | 2020-05-11 | 2024-04-16 | 京东方科技集团股份有限公司 | 发光基板及其制造方法、显示装置 |
US11871517B1 (en) | 2020-05-11 | 2024-01-09 | Apple Inc. | Electronic devices with stacked circuitry |
CN114967250A (zh) * | 2022-06-22 | 2022-08-30 | 南昌勤胜电子科技有限公司 | 一种液晶显示模组及液晶显示模组的制备方法 |
CN117518640A (zh) * | 2023-12-07 | 2024-02-06 | 惠科股份有限公司 | 显示装置及显示面板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102187272A (zh) * | 2008-08-28 | 2011-09-14 | 株式会社普利司通 | 信息显示装置 |
Family Cites Families (137)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2933655A (en) | 1957-01-31 | 1960-04-19 | Sylvania Electric Prod | Electronic equipment packaging |
US4085302A (en) | 1976-11-22 | 1978-04-18 | Control Data Corporation | Membrane-type touch panel |
US4066855B1 (en) | 1976-11-22 | 1997-05-13 | St Clair Intellectual Property | Vented membrane-type touch panel |
US4431270A (en) | 1979-09-19 | 1984-02-14 | Sharp Kabushiki Kaisha | Electrode terminal assembly on a multi-layer type liquid crystal panel |
US4487993A (en) | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
US5235457A (en) | 1987-09-24 | 1993-08-10 | Washington University | Kit for converting a standard microscope into a single aperture confocal scanning epi-illumination microscope |
JPH04116625A (ja) | 1990-09-07 | 1992-04-17 | Seiko Epson Corp | 液晶表示装置等における駆動回路実装構造 |
US5276382A (en) | 1991-08-20 | 1994-01-04 | Durel Corporation | Lead attachment for electroluminescent lamp |
JPH05142556A (ja) | 1991-11-22 | 1993-06-11 | Seiko Epson Corp | 液晶表示装置等における駆動回路実装構造 |
US5483261A (en) | 1992-02-14 | 1996-01-09 | Itu Research, Inc. | Graphical input controller and method with rear screen image detection |
US5880411A (en) | 1992-06-08 | 1999-03-09 | Synaptics, Incorporated | Object position detector with edge motion feature and gesture recognition |
US5488204A (en) | 1992-06-08 | 1996-01-30 | Synaptics, Incorporated | Paintbrush stylus for capacitive touch sensor pad |
US5235451A (en) | 1992-09-09 | 1993-08-10 | Litton Systems Canada Limited | Liquid crystal display module |
US5592199A (en) | 1993-01-27 | 1997-01-07 | Sharp Kabushiki Kaisha | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
WO1994022102A1 (en) | 1993-03-16 | 1994-09-29 | Ht Research, Inc. | A chassis for a multiple computer system |
US5436744A (en) * | 1993-09-03 | 1995-07-25 | Motorola Inc. | Flexible liquid crystal display with integrated driver circuit and display electrodes formed on opposite sides of folded substrate |
US5493096A (en) | 1994-05-10 | 1996-02-20 | Grumman Aerospace Corporation | Thin substrate micro-via interconnect |
US5493069A (en) | 1994-08-31 | 1996-02-20 | Heraeus Sensor Gmbh | Method of ultrasonically welding together two conductors |
JP3219674B2 (ja) | 1995-03-09 | 2001-10-15 | キヤノン株式会社 | 液晶表示装置 |
US5644327A (en) | 1995-06-07 | 1997-07-01 | David Sarnoff Research Center, Inc. | Tessellated electroluminescent display having a multilayer ceramic substrate |
US6091194A (en) | 1995-11-22 | 2000-07-18 | Motorola, Inc. | Active matrix display |
US5825352A (en) | 1996-01-04 | 1998-10-20 | Logitech, Inc. | Multiple fingers contact sensing method for emulating mouse buttons and mouse operations on a touch sensor pad |
US5835079A (en) | 1996-06-13 | 1998-11-10 | International Business Machines Corporation | Virtual pointing device for touchscreens |
US5844781A (en) | 1996-09-16 | 1998-12-01 | Eaton Corporation | Electrical device such as a network protector relay with printed circuit board seal |
JPH10261854A (ja) | 1997-03-21 | 1998-09-29 | Sharp Corp | プリント配線板及びその製造方法 |
JP2850906B1 (ja) | 1997-10-24 | 1999-01-27 | 日本電気株式会社 | 有機el素子およびその製造方法 |
US6310610B1 (en) | 1997-12-04 | 2001-10-30 | Nortel Networks Limited | Intelligent touch display |
EP2256605B1 (en) | 1998-01-26 | 2017-12-06 | Apple Inc. | Method and apparatus for integrating manual input |
US7663607B2 (en) | 2004-05-06 | 2010-02-16 | Apple Inc. | Multipoint touchscreen |
US8479122B2 (en) | 2004-07-30 | 2013-07-02 | Apple Inc. | Gestures for touch sensitive input devices |
US6897855B1 (en) | 1998-02-17 | 2005-05-24 | Sarnoff Corporation | Tiled electronic display structure |
US7075502B1 (en) | 1998-04-10 | 2006-07-11 | E Ink Corporation | Full color reflective display with multichromatic sub-pixels |
US6072233A (en) | 1998-05-04 | 2000-06-06 | Micron Technology, Inc. | Stackable ball grid array package |
US6188391B1 (en) | 1998-07-09 | 2001-02-13 | Synaptics, Inc. | Two-layer capacitive touchpad and method of making same |
JP4542637B2 (ja) | 1998-11-25 | 2010-09-15 | セイコーエプソン株式会社 | 携帯情報機器及び情報記憶媒体 |
JP2000172191A (ja) * | 1998-12-04 | 2000-06-23 | Fujitsu Ltd | 平面表示装置 |
US6498592B1 (en) | 1999-02-16 | 2002-12-24 | Sarnoff Corp. | Display tile structure using organic light emitting materials |
US20020085158A1 (en) * | 1999-05-17 | 2002-07-04 | Karl M. Armagost | Ball grid array mounted liquid crystal display panels |
US6239982B1 (en) | 1999-06-23 | 2001-05-29 | Visteon Global Technologies, Inc. | Electronic device having a single-sided circuit board |
JP2001092381A (ja) | 1999-09-27 | 2001-04-06 | Nec Corp | 有機elディスプレイおよびその製造方法 |
JP4345153B2 (ja) | 1999-09-27 | 2009-10-14 | ソニー株式会社 | 映像表示装置の製造方法 |
US6421033B1 (en) | 1999-09-30 | 2002-07-16 | Innovative Technology Licensing, Llc | Current-driven emissive display addressing and fabrication scheme |
US20010015788A1 (en) | 1999-12-27 | 2001-08-23 | Makiko Mandai | Displaying system for displaying information on display |
JP2001215528A (ja) | 2000-02-03 | 2001-08-10 | Matsushita Electric Ind Co Ltd | 周辺駆動回路内蔵型液晶表示パネル |
US6560117B2 (en) | 2000-06-28 | 2003-05-06 | Micron Technology, Inc. | Packaged microelectronic die assemblies and methods of manufacture |
JP2002040472A (ja) | 2000-07-31 | 2002-02-06 | Seiko Epson Corp | 液晶装置の製造方法および液晶装置と電子機器 |
JP3646639B2 (ja) | 2000-09-14 | 2005-05-11 | セイコーエプソン株式会社 | 基板の実装構造体、電気光学装置及び電子機器 |
JP2002116454A (ja) | 2000-10-10 | 2002-04-19 | Seiko Epson Corp | 液晶装置および電子機器 |
US6801174B2 (en) | 2000-12-04 | 2004-10-05 | Sony Corporation | Display device, producing method of electronic apparatus and display device |
JP3593975B2 (ja) | 2000-12-04 | 2004-11-24 | ソニー株式会社 | ディスプレイ装置、電子機器およびディスプレイ装置の製造方法 |
US6657132B2 (en) | 2001-03-15 | 2003-12-02 | Micron Technology, Inc. | Single sided adhesive tape for compound diversion on BOC substrates |
JP2002341785A (ja) | 2001-05-11 | 2002-11-29 | Fuji Electric Co Ltd | ドライバic実装モジュール |
JP3800984B2 (ja) | 2001-05-21 | 2006-07-26 | ソニー株式会社 | ユーザ入力装置 |
US7002562B2 (en) | 2001-07-12 | 2006-02-21 | Intel Corporation | Interconnecting large area display panels |
JP3607647B2 (ja) | 2001-08-09 | 2005-01-05 | 株式会社東芝 | マトリックス型表示パネル |
JP2003173237A (ja) | 2001-09-28 | 2003-06-20 | Ricoh Co Ltd | 情報入出力システム、プログラム及び記憶媒体 |
US6690387B2 (en) | 2001-12-28 | 2004-02-10 | Koninklijke Philips Electronics N.V. | Touch-screen image scrolling system and method |
US7245500B2 (en) | 2002-02-01 | 2007-07-17 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
JP2003255850A (ja) | 2002-03-05 | 2003-09-10 | Pioneer Electronic Corp | 表示パネル基板及び表示装置 |
JP4515035B2 (ja) | 2002-03-14 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
US6809337B2 (en) | 2002-04-22 | 2004-10-26 | Intel Corporation | Liquid crystal display devices having fill holes and electrical contacts on the back side of the die |
TWI240842B (en) | 2002-04-24 | 2005-10-01 | Sipix Imaging Inc | Matrix driven electrophoretic display with multilayer back plane |
US6849935B2 (en) | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
US11275405B2 (en) | 2005-03-04 | 2022-03-15 | Apple Inc. | Multi-functional hand-held device |
US20040022996A1 (en) | 2002-08-02 | 2004-02-05 | Jenkins William G. | Dyeing of cationic dyeable bi-constituent fiber with anionic or acid dyes |
GB0302550D0 (en) | 2003-02-05 | 2003-03-12 | Cambridge Display Tech Ltd | Organic optoelectronic device |
JP3897173B2 (ja) | 2003-05-23 | 2007-03-22 | セイコーエプソン株式会社 | 有機el表示装置及びその製造方法 |
JP2005049685A (ja) | 2003-07-30 | 2005-02-24 | Nippon Seiki Co Ltd | 表示装置 |
TWI297095B (en) | 2003-10-02 | 2008-05-21 | Au Optronics Corp | Bonding pad structure for a display and fabrication method thereof |
US20070002009A1 (en) | 2003-10-07 | 2007-01-04 | Pasch Nicholas F | Micro-electromechanical display backplane and improvements thereof |
TWI316152B (en) | 2003-12-16 | 2009-10-21 | Toppoly Optoelectronics Corp | Flexible printed circuit board (fpc) for liquid crystal display (lcd) module |
KR20050093595A (ko) | 2004-03-20 | 2005-09-23 | 주식회사 에스아이 플렉스 | 선택도금에 의한 양면연성 인쇄회로기판의 제조방법 |
EP1810334B1 (en) | 2004-11-11 | 2011-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for Manufacturing a Semiconductor Device |
TWM268600U (en) | 2004-12-10 | 2005-06-21 | Innolux Display Corp | Structure of chip on glass and liquid crystal display device using the structure |
EP1866979B1 (en) | 2005-04-05 | 2016-11-02 | Flexenable Limited | Pixel driver circuit for active matrix display |
JPWO2006120858A1 (ja) | 2005-05-10 | 2008-12-18 | 松下電器産業株式会社 | 画像形成装置 |
KR101148199B1 (ko) | 2005-07-05 | 2012-05-23 | 삼성전자주식회사 | 커넥터 및 이를 갖는 액정 표시 장치와 그 체결방법 |
KR100695016B1 (ko) | 2005-08-11 | 2007-03-16 | 삼성전자주식회사 | 백라이트 유닛과 이를 포함하는 액정표시장치 |
US7791700B2 (en) * | 2005-09-16 | 2010-09-07 | Kent Displays Incorporated | Liquid crystal display on a printed circuit board |
US20070080360A1 (en) | 2005-10-06 | 2007-04-12 | Url Mirsky | Microelectronic interconnect substrate and packaging techniques |
JP2007173652A (ja) | 2005-12-23 | 2007-07-05 | Mitsubishi Electric Corp | 薄膜トランジスタ装置およびその製造方法、ならびに、該薄膜トランジスタ装置を備えた表示装置 |
JP2007220569A (ja) | 2006-02-20 | 2007-08-30 | Harison Toshiba Lighting Corp | 有機el発光装置 |
KR100765262B1 (ko) | 2006-07-12 | 2007-10-09 | 삼성전자주식회사 | 표시장치 |
US7622859B2 (en) | 2006-07-31 | 2009-11-24 | Motorola, Inc. | Electroluminescent display having a pixel array |
JP2008033094A (ja) | 2006-07-31 | 2008-02-14 | Toppan Printing Co Ltd | 表示装置 |
TWI312587B (en) | 2006-08-10 | 2009-07-21 | Au Optronics Corp | Organic light emitting display devices and methods for fabricating the same |
US7796397B2 (en) | 2006-08-23 | 2010-09-14 | Panasonic Corporation | Electronic components assembly and method for producing same |
US8148259B2 (en) | 2006-08-30 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US8362488B2 (en) | 2006-09-12 | 2013-01-29 | Sipix Imaging, Inc. | Flexible backplane and methods for its manufacture |
US7977170B2 (en) | 2006-10-03 | 2011-07-12 | Eastman Kodak Company | Flexible substrate with electronic devices and traces |
KR100809608B1 (ko) | 2006-12-15 | 2008-03-04 | 삼성전자주식회사 | 신호 왜곡을 줄일 수 있는 연결 구조체 |
TWI370284B (en) | 2007-03-20 | 2012-08-11 | Fujitsu Ltd | Layered display device and fabrication method of the same |
CN101636689A (zh) | 2007-03-20 | 2010-01-27 | 富士通株式会社 | 层叠型显示元件及其制造方法 |
JP5194704B2 (ja) | 2007-10-17 | 2013-05-08 | 富士通株式会社 | 表示パネル及びそれを備えた積層型表示素子 |
JP4670855B2 (ja) | 2007-11-08 | 2011-04-13 | セイコーエプソン株式会社 | 表示装置および時計 |
WO2009089105A1 (en) | 2008-01-04 | 2009-07-16 | Nanolumens | Flexible display |
TW201001624A (en) | 2008-01-24 | 2010-01-01 | Soligie Inc | Silicon thin film transistors, systems, and methods of making same |
JP2009229754A (ja) | 2008-03-21 | 2009-10-08 | Citizen Finetech Miyota Co Ltd | 液晶表示装置 |
JP5396734B2 (ja) | 2008-03-28 | 2014-01-22 | 大日本印刷株式会社 | 有機半導体素子、有機半導体素子の製造方法、および表示装置 |
KR100949339B1 (ko) | 2008-05-06 | 2010-03-26 | 삼성모바일디스플레이주식회사 | 양면 발광형 유기발광 표시장치 |
JP5502289B2 (ja) | 2008-05-14 | 2014-05-28 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
US8508495B2 (en) | 2008-07-03 | 2013-08-13 | Apple Inc. | Display with dual-function capacitive elements |
TWI475282B (zh) | 2008-07-10 | 2015-03-01 | Semiconductor Energy Lab | 液晶顯示裝置和其製造方法 |
US8338936B2 (en) | 2008-07-24 | 2012-12-25 | Infineon Technologies Ag | Semiconductor device and manufacturing method |
JP2010039211A (ja) | 2008-08-05 | 2010-02-18 | Fujitsu Ltd | 表示装置及びその製造方法 |
WO2010071089A1 (en) | 2008-12-17 | 2010-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electronic device |
EP2418537A4 (en) | 2009-04-08 | 2012-11-21 | Sharp Kk | LIQUID CRYSTAL DISPLAY DEVICE, METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE, COMPOSITION FOR FORMATION OF PHOTOPOLYMER FILM, AND COMPOSITION FOR FORMATION OF LIQUID CRYSTAL LAYER |
KR101549260B1 (ko) * | 2009-04-20 | 2015-09-02 | 엘지디스플레이 주식회사 | 액정표시장치 |
US8456586B2 (en) | 2009-06-11 | 2013-06-04 | Apple Inc. | Portable computer display structures |
US20110012845A1 (en) | 2009-07-20 | 2011-01-20 | Rothkopf Fletcher R | Touch sensor structures for displays |
JP2011042531A (ja) | 2009-08-21 | 2011-03-03 | Tokyo Electron Ltd | ガラス基板の穴あけ方法 |
KR101065409B1 (ko) | 2009-11-04 | 2011-09-16 | 삼성모바일디스플레이주식회사 | 유기 발광 조명 장치 |
US8743309B2 (en) * | 2009-11-10 | 2014-06-03 | Apple Inc. | Methods for fabricating display structures |
US8551283B2 (en) | 2010-02-02 | 2013-10-08 | Apple Inc. | Offset control for assembling an electronic device housing |
KR101073563B1 (ko) * | 2010-02-08 | 2011-10-14 | 삼성모바일디스플레이주식회사 | 표시 장치 및 이의 제조 방법 |
KR101028327B1 (ko) | 2010-04-15 | 2011-04-12 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법 및 발광소자 패키지 |
US8599353B2 (en) | 2010-05-28 | 2013-12-03 | 3M Innovative Properties Company | Display comprising a plurality of substrates and a plurality of display materials disposed between the plurality of substrates that are connected to a plurality of non-overlapping integral conductive tabs |
US8253914B2 (en) | 2010-06-23 | 2012-08-28 | Microsoft Corporation | Liquid crystal display (LCD) |
US20120009973A1 (en) | 2010-07-12 | 2012-01-12 | Sony Ericsson Mobile Communications Ab | Module Connection in a Printed Wiring Board |
KR101394540B1 (ko) | 2010-07-29 | 2014-05-14 | 삼성디스플레이 주식회사 | 표시 장치 및 유기 발광 표시 장치 |
US8766858B2 (en) | 2010-08-27 | 2014-07-01 | Apple Inc. | Antennas mounted under dielectric plates |
US8467177B2 (en) | 2010-10-29 | 2013-06-18 | Apple Inc. | Displays with polarizer windows and opaque masking layers for electronic devices |
US20120235969A1 (en) | 2011-03-15 | 2012-09-20 | Qualcomm Mems Technologies, Inc. | Thin film through-glass via and methods for forming same |
US8816977B2 (en) | 2011-03-21 | 2014-08-26 | Apple Inc. | Electronic devices with flexible displays |
US8623575B2 (en) | 2011-06-17 | 2014-01-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display panel, color filter and manufacturing method thereof |
US20130002685A1 (en) | 2011-06-30 | 2013-01-03 | Qualcomm Mems Technologies, Inc. | Bonded double substrate approach to solve laser drilling problems |
US8804347B2 (en) | 2011-09-09 | 2014-08-12 | Apple Inc. | Reducing the border area of a device |
US9756733B2 (en) | 2011-10-04 | 2017-09-05 | Apple Inc. | Display and multi-layer printed circuit board with shared flexible substrate |
US10261370B2 (en) | 2011-10-05 | 2019-04-16 | Apple Inc. | Displays with minimized border regions having an apertured TFT layer for signal conductors |
US8947627B2 (en) | 2011-10-14 | 2015-02-03 | Apple Inc. | Electronic devices having displays with openings |
US9286826B2 (en) | 2011-10-28 | 2016-03-15 | Apple Inc. | Display with vias for concealed printed circuit and component attachment |
US9894781B2 (en) | 2012-06-06 | 2018-02-13 | Apple Inc. | Notched display layers |
US9226347B2 (en) | 2012-06-25 | 2015-12-29 | Apple Inc. | Displays with vias |
US9214507B2 (en) | 2012-08-17 | 2015-12-15 | Apple Inc. | Narrow border organic light-emitting diode display |
TWI517769B (zh) | 2013-03-06 | 2016-01-11 | 湧德電子股份有限公司 | 一種濾波元件與印刷電路板的焊接構造與焊接方法 |
US9312517B2 (en) | 2013-03-15 | 2016-04-12 | Apple Inc. | Electronic device displays with border masking layers |
US9430228B2 (en) | 2013-12-16 | 2016-08-30 | International Business Machines Corporation | Verification of backward compatibility of software components |
-
2012
- 2012-08-31 US US13/600,862 patent/US9454025B2/en active Active
-
2013
- 2013-08-06 TW TW102128156A patent/TWI630438B/zh active
- 2013-08-19 KR KR1020130097812A patent/KR101722292B1/ko active IP Right Grant
- 2013-08-19 CN CN201310360237.6A patent/CN103676366B/zh active Active
-
2016
- 2016-09-21 US US15/272,295 patent/US9997578B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102187272A (zh) * | 2008-08-28 | 2011-09-14 | 株式会社普利司通 | 信息显示装置 |
Also Published As
Publication number | Publication date |
---|---|
US20140063393A1 (en) | 2014-03-06 |
US20170012095A1 (en) | 2017-01-12 |
US9997578B2 (en) | 2018-06-12 |
CN103676366A (zh) | 2014-03-26 |
TWI630438B (zh) | 2018-07-21 |
US9454025B2 (en) | 2016-09-27 |
TW201411230A (zh) | 2014-03-16 |
KR101722292B1 (ko) | 2017-03-31 |
KR20140029196A (ko) | 2014-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103676366B (zh) | 具有减小的驱动器电路架的显示器 | |
US9780159B2 (en) | Narrow border organic light-emitting diode display | |
CN105164578B (zh) | 漏光减少的液晶显示器 | |
KR101614852B1 (ko) | 반전된 박막 트랜지스터 층을 갖는 디스플레이 | |
CN103676266B (zh) | 具有低反射静电屏蔽的显示器 | |
US9116267B2 (en) | Backlight structures and assemblies for electronic device displays | |
US8994906B2 (en) | Display with multilayer and embedded signal lines | |
KR20200048205A (ko) | 플렉서블 회로 필름 및 이를 포함하는 전자 기기 | |
US9400349B2 (en) | Electronic device with display chassis structures | |
US9103512B2 (en) | Electronic device with display backlight alignment structures | |
WO2021082805A1 (zh) | 电子设备 | |
JP2006243428A (ja) | 表示装置および表示装置の製造方法、液晶表示装置および液晶表示装置の製造方法、電子機器 | |
US9140925B2 (en) | Display with reduced border |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |