CN103500735B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN103500735B
CN103500735B CN201310356421.3A CN201310356421A CN103500735B CN 103500735 B CN103500735 B CN 103500735B CN 201310356421 A CN201310356421 A CN 201310356421A CN 103500735 B CN103500735 B CN 103500735B
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CN
China
Prior art keywords
semiconductor chip
pattern
wiring
heat dissipation
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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CN201310356421.3A
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English (en)
Chinese (zh)
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CN103500735A (zh
Inventor
江川秀范
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
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Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN103500735A publication Critical patent/CN103500735A/zh
Application granted granted Critical
Publication of CN103500735B publication Critical patent/CN103500735B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201310356421.3A 2009-07-15 2010-06-30 半导体装置 Active CN103500735B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-166975 2009-07-15
JP2009166975A JP5325684B2 (ja) 2009-07-15 2009-07-15 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201010222675.2A Division CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Publications (2)

Publication Number Publication Date
CN103500735A CN103500735A (zh) 2014-01-08
CN103500735B true CN103500735B (zh) 2015-05-06

Family

ID=43464699

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置

Country Status (3)

Country Link
US (5) US8384230B2 (enExample)
JP (1) JP5325684B2 (enExample)
CN (4) CN103500735B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
JP5405679B2 (ja) * 2013-01-25 2014-02-05 ルネサスエレクトロニクス株式会社 半導体装置
JP2016115751A (ja) * 2014-12-12 2016-06-23 ラピスセミコンダクタ株式会社 半導体パッケージ
CN109068967B (zh) * 2016-05-10 2020-12-25 奥林巴斯株式会社 电子电路单元、摄像单元、摄像模块以及内窥镜
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR102628847B1 (ko) * 2019-06-12 2024-01-25 삼성디스플레이 주식회사 디스플레이 장치
JP6973861B2 (ja) * 2019-08-28 2021-12-01 Ｎｅｃプラットフォームズ株式会社 半導体装置、電子機器及び半導体装置の製造方法
TWI873949B (zh) * 2022-11-11 2025-02-21 財團法人工業技術研究院 模塑電子組件
JP2024169133A (ja) * 2023-05-25 2024-12-05 オムロン株式会社 基板及びモジュール

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JP3666318B2 (ja) * 1999-09-27 2005-06-29 セイコーエプソン株式会社 電気光学装置及びそれを用いた電子機器並びに表示駆動ｉｃ
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JP4176979B2 (ja) * 2001-09-27 2008-11-05 パイオニア株式会社 フラットパネル型表示装置
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KR100632807B1 (ko) * 2004-11-26 2006-10-16 삼성전자주식회사 반도체 칩 및 그를 포함하는 탭 패키지
JP4485460B2 (ja) * 2004-12-16 2010-06-23 三井金属鉱業株式会社 フレキシブルプリント配線板
JP2006269496A (ja) * 2005-03-22 2006-10-05 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基板、および半導体装置
JP2006286837A (ja) * 2005-03-31 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄ装置
KR100652519B1 (ko) 2005-07-18 2006-12-01 삼성전자주식회사 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
JP4781097B2 (ja) 2005-12-05 2011-09-28 ルネサスエレクトロニクス株式会社 テープキャリアパッケージ及びそれを搭載した表示装置
KR100987479B1 (ko) * 2005-12-19 2010-10-13 삼성전자주식회사 반도체 칩 및 이를 이용한 반도체 칩 패키지
KR100681398B1 (ko) * 2005-12-29 2007-02-15 삼성전자주식회사 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지
KR100729537B1 (ko) 2006-02-28 2007-06-18 주식회사 탑 엔지니어링 본딩 장비의 테잎 피딩 방법
JP4806313B2 (ja) * 2006-08-18 2011-11-02 Ｎｅｃ液晶テクノロジー株式会社 テープキャリア、液晶表示装置用テープキャリア、及び液晶表示装置
JP4283292B2 (ja) 2006-09-08 2009-06-24 シャープ株式会社 半導体装置用テープキャリア、および半導体装置の製造方法
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JP2004111996A (ja) * 1996-03-26 2004-04-08 Canon Inc 接続構造体及び表示装置

Also Published As

Publication number Publication date
US11244883B2 (en) 2022-02-08
CN101958295A (zh) 2011-01-26
US20140167258A1 (en) 2014-06-19
US8975762B2 (en) 2015-03-10
CN101958295B (zh) 2014-10-01
US20110012265A1 (en) 2011-01-20
US20130147039A1 (en) 2013-06-13
CN104037156A (zh) 2014-09-10
CN104332454A (zh) 2015-02-04
CN104332454B (zh) 2017-04-12
JP5325684B2 (ja) 2013-10-23
US20150123274A1 (en) 2015-05-07
US8384230B2 (en) 2013-02-26
HK1199554A1 (zh) 2015-07-03
HK1204507A1 (en) 2015-11-20
JP2011023528A (ja) 2011-02-03
US20200066611A1 (en) 2020-02-27
US8686574B2 (en) 2014-04-01
CN103500735A (zh) 2014-01-08
CN104037156B (zh) 2019-01-11

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