CN103500735B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN103500735B
CN103500735B CN201310356421.3A CN201310356421A CN103500735B CN 103500735 B CN103500735 B CN 103500735B CN 201310356421 A CN201310356421 A CN 201310356421A CN 103500735 B CN103500735 B CN 103500735B
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CN
China
Prior art keywords
semiconductor chip
pattern
wiring
heat dissipation
wiring substrate
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Active
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CN201310356421.3A
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English (en)
Chinese (zh)
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CN103500735A (zh
Inventor
江川秀范
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication of CN103500735A publication Critical patent/CN103500735A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CN201310356421.3A 2009-07-15 2010-06-30 半导体装置 Active CN103500735B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-166975 2009-07-15
JP2009166975A JP5325684B2 (ja) 2009-07-15 2009-07-15 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201010222675.2A Division CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Publications (2)

Publication Number Publication Date
CN103500735A CN103500735A (zh) 2014-01-08
CN103500735B true CN103500735B (zh) 2015-05-06

Family

ID=43464699

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

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Application Number Title Priority Date Filing Date
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Country Status (3)

Country Link
US (5) US8384230B2 (enExample)
JP (1) JP5325684B2 (enExample)
CN (4) CN103500735B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
JP5405679B2 (ja) * 2013-01-25 2014-02-05 ルネサスエレクトロニクス株式会社 半導体装置
JP2016115751A (ja) * 2014-12-12 2016-06-23 ラピスセミコンダクタ株式会社 半導体パッケージ
CN109068967B (zh) * 2016-05-10 2020-12-25 奥林巴斯株式会社 电子电路单元、摄像单元、摄像模块以及内窥镜
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR102628847B1 (ko) * 2019-06-12 2024-01-25 삼성디스플레이 주식회사 디스플레이 장치
JP6973861B2 (ja) * 2019-08-28 2021-12-01 Ｎｅｃプラットフォームズ株式会社 半導体装置、電子機器及び半導体装置の製造方法
TWI873949B (zh) * 2022-11-11 2025-02-21 財團法人工業技術研究院 模塑電子組件
JP2024169133A (ja) * 2023-05-25 2024-12-05 オムロン株式会社 基板及びモジュール

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JP2004111996A (ja) * 1996-03-26 2004-04-08 Canon Inc 接続構造体及び表示装置

Also Published As

Publication number Publication date
CN103500735A (zh) 2014-01-08
US20130147039A1 (en) 2013-06-13
US8686574B2 (en) 2014-04-01
CN104037156B (zh) 2019-01-11
US8384230B2 (en) 2013-02-26
US20200066611A1 (en) 2020-02-27
CN104037156A (zh) 2014-09-10
US8975762B2 (en) 2015-03-10
US20140167258A1 (en) 2014-06-19
CN104332454A (zh) 2015-02-04
US20150123274A1 (en) 2015-05-07
JP2011023528A (ja) 2011-02-03
HK1199554A1 (en) 2015-07-03
US11244883B2 (en) 2022-02-08
HK1204507A1 (en) 2015-11-20
CN101958295B (zh) 2014-10-01
JP5325684B2 (ja) 2013-10-23
US20110012265A1 (en) 2011-01-20
CN104332454B (zh) 2017-04-12
CN101958295A (zh) 2011-01-26

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Address after: Tokyo, Japan

Patentee after: Renesas Electronics Corporation

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Patentee before: Renesas Electronics Corporation