CN103298887A - 高温稳定的导热材料 - Google Patents

高温稳定的导热材料 Download PDF

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Publication number
CN103298887A
CN103298887A CN2012800052058A CN201280005205A CN103298887A CN 103298887 A CN103298887 A CN 103298887A CN 2012800052058 A CN2012800052058 A CN 2012800052058A CN 201280005205 A CN201280005205 A CN 201280005205A CN 103298887 A CN103298887 A CN 103298887A
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China
Prior art keywords
component
composition
heat
group
silicon
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CN2012800052058A
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Chinese (zh)
Inventor
德瑞布·埃都·巴瓦格尔
凯利·梅辛
伊丽莎白·伍德
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Dow Silicones Corp
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Dow Corning Corp
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45563525&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN103298887(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Priority to CN201811365168.7A priority Critical patent/CN109401333A/zh
Publication of CN103298887A publication Critical patent/CN103298887A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2012800052058A 2011-01-26 2012-01-10 高温稳定的导热材料 Pending CN103298887A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811365168.7A CN109401333A (zh) 2011-01-26 2012-01-10 高温稳定的导热材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161436214P 2011-01-26 2011-01-26
US61/436,214 2011-01-26
PCT/US2012/020699 WO2012102852A1 (en) 2011-01-26 2012-01-10 High temperature stable thermally conductive materials

Related Child Applications (1)

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CN201811365168.7A Division CN109401333A (zh) 2011-01-26 2012-01-10 高温稳定的导热材料

Publications (1)

Publication Number Publication Date
CN103298887A true CN103298887A (zh) 2013-09-11

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CN2012800052058A Pending CN103298887A (zh) 2011-01-26 2012-01-10 高温稳定的导热材料
CN201811365168.7A Pending CN109401333A (zh) 2011-01-26 2012-01-10 高温稳定的导热材料

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Country Status (7)

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US (2) US9598575B2 (https=)
EP (1) EP2668239B1 (https=)
JP (1) JP6048416B2 (https=)
KR (1) KR101866299B1 (https=)
CN (2) CN103298887A (https=)
TW (1) TWI620797B (https=)
WO (1) WO2012102852A1 (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
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CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
CN105705599A (zh) * 2013-09-18 2016-06-22 道康宁公司 树脂-线性有机硅氧烷嵌段共聚物的组合物
CN109689571A (zh) * 2016-09-09 2019-04-26 3M创新有限公司 热界面材料
CN111051435A (zh) * 2017-09-15 2020-04-21 陶氏东丽株式会社 硬化性有机聚硅氧烷组合物及图案形成方法
CN111051433A (zh) * 2017-07-24 2020-04-21 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111225946A (zh) * 2017-09-27 2020-06-02 莫门蒂夫性能材料股份有限公司 包含离子改性硅氧烷的热界面组合物
CN112334542A (zh) * 2018-06-27 2021-02-05 美国陶氏有机硅公司 热间隙填料及其在电池管理系统中的应用
CN112437788A (zh) * 2019-06-24 2021-03-02 富士高分子工业株式会社 耐热性导热性组合物及耐热性导热性片材
WO2021179276A1 (en) * 2020-03-13 2021-09-16 Ddp Specialty Electronic Materials Us, Llc Thermal interface material comprising magnesium hydroxide
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
CN113661215A (zh) * 2020-02-13 2021-11-16 富士高分子工业株式会社 耐热性有机硅树脂组合物及耐热性有机硅树脂复合材料
TWI788587B (zh) * 2018-10-26 2023-01-01 日商信越化學工業股份有限公司 熱傳導性矽氧組成物及其硬化物

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CN106661331B (zh) * 2014-03-06 2020-10-23 汉高股份有限及两合公司 单晶氧化铝填充的管芯粘结膏
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JP6395153B2 (ja) * 2014-11-04 2018-09-26 日本タングステン株式会社 コーティング膜、その製造方法およびコーティング膜形成方法
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JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
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CN111094458B (zh) 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
WO2019021826A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
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JP6646643B2 (ja) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
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EP3527615A1 (en) * 2018-02-16 2019-08-21 Venator Germany GmbH Thermoconductive filler particles and polymer compositions containing them
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
CN109261207B (zh) * 2018-09-26 2021-05-28 合肥国轩高科动力能源有限公司 光催化材料及其制法和在废旧锂电池电解液处理中的应用
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KR102693604B1 (ko) * 2018-12-29 2024-08-12 다우 글로벌 테크놀로지스 엘엘씨 MgO 충전제를 함유하는 열전도성 조성물 및 상기 조성물이 사용되는 방법 및 장치
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CN114539781A (zh) * 2020-11-25 2022-05-27 深圳先进电子材料国际创新研究院 一种导热凝胶及其制备方法
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