MX2022005934A - Materiales de interfaz termica y metodos de aplicacion. - Google Patents

Materiales de interfaz termica y metodos de aplicacion.

Info

Publication number
MX2022005934A
MX2022005934A MX2022005934A MX2022005934A MX2022005934A MX 2022005934 A MX2022005934 A MX 2022005934A MX 2022005934 A MX2022005934 A MX 2022005934A MX 2022005934 A MX2022005934 A MX 2022005934A MX 2022005934 A MX2022005934 A MX 2022005934A
Authority
MX
Mexico
Prior art keywords
thermal interface
component
methods
application
interface materials
Prior art date
Application number
MX2022005934A
Other languages
English (en)
Inventor
Radesh Jewram
Reid J Chesterfield
Ryan Verhulst
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of MX2022005934A publication Critical patent/MX2022005934A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

Un material de interfaz térmica suministrado como una mezcla de precursores de un solo componente que reacciona para formar un material sólido blando. Las partículas térmicamente conductoras se dispersan en la matriz polimérica reactiva dando como resultado un material compuesto con alta conductividad térmica. Se provee un inhibidor de reacción para que el sistema de un componente sea estable en almacenamiento y manipulación a temperatura ambiente, y curable a temperatura elevada. El material precursor no curado se dispensa fácilmente usando un equipo de bombeo automático convencional de un solo componente y, posteriormente, se cura en el lugar.
MX2022005934A 2019-11-19 2020-11-19 Materiales de interfaz termica y metodos de aplicacion. MX2022005934A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962937498P 2019-11-19 2019-11-19
PCT/US2020/061294 WO2021102149A1 (en) 2019-11-19 2020-11-19 Thermal interface materials and methods for application

Publications (1)

Publication Number Publication Date
MX2022005934A true MX2022005934A (es) 2022-06-22

Family

ID=75981071

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022005934A MX2022005934A (es) 2019-11-19 2020-11-19 Materiales de interfaz termica y metodos de aplicacion.

Country Status (7)

Country Link
US (1) US20220380547A1 (es)
EP (1) EP4061907A4 (es)
JP (1) JP2023501754A (es)
KR (1) KR20220100592A (es)
CN (1) CN115516060A (es)
MX (1) MX2022005934A (es)
WO (1) WO2021102149A1 (es)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US7030483B2 (en) * 2003-06-30 2006-04-18 Intel Corporation Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
EP2723816A1 (fr) * 2011-06-21 2014-04-30 Bluestar Silicones France Inhibiteurs de reaction d'hydrosilylation, et leur application pour la preparation de compositions silicones durcissables stables.
WO2017111945A1 (en) * 2015-12-22 2017-06-29 Intel Corporation Adhesive polymer thermal interface material with sintered fillers for thermal conductivity in micro-electronic packaging
US10501671B2 (en) * 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material

Also Published As

Publication number Publication date
WO2021102149A1 (en) 2021-05-27
EP4061907A4 (en) 2023-12-13
US20220380547A1 (en) 2022-12-01
EP4061907A1 (en) 2022-09-28
KR20220100592A (ko) 2022-07-15
JP2023501754A (ja) 2023-01-18
CN115516060A (zh) 2022-12-23

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