CN103262675B - 能散失热负荷的机顶盒 - Google Patents

能散失热负荷的机顶盒 Download PDF

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Publication number
CN103262675B
CN103262675B CN201180032238.7A CN201180032238A CN103262675B CN 103262675 B CN103262675 B CN 103262675B CN 201180032238 A CN201180032238 A CN 201180032238A CN 103262675 B CN103262675 B CN 103262675B
Authority
CN
China
Prior art keywords
heat sink
circuit board
top box
heat
source element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180032238.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103262675A (zh
Inventor
D.B.里特
M.J.亨特
M.W.吉辛
R.A.迪默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THOMSON LICENSING CORP
Original Assignee
THOMSON LICENSING CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THOMSON LICENSING CORP filed Critical THOMSON LICENSING CORP
Publication of CN103262675A publication Critical patent/CN103262675A/zh
Application granted granted Critical
Publication of CN103262675B publication Critical patent/CN103262675B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201180032238.7A 2010-05-19 2011-05-12 能散失热负荷的机顶盒 Expired - Fee Related CN103262675B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34607310P 2010-05-19 2010-05-19
US61/346,073 2010-05-19
US40076710P 2010-08-02 2010-08-02
US61/400,767 2010-08-02
PCT/US2011/036171 WO2011146302A1 (en) 2010-05-19 2011-05-12 Set-top box having dissipating thermal loads

Publications (2)

Publication Number Publication Date
CN103262675A CN103262675A (zh) 2013-08-21
CN103262675B true CN103262675B (zh) 2016-03-30

Family

ID=44484817

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180032238.7A Expired - Fee Related CN103262675B (zh) 2010-05-19 2011-05-12 能散失热负荷的机顶盒

Country Status (7)

Country Link
US (1) US9220185B2 (enExample)
EP (1) EP2572562B1 (enExample)
JP (1) JP2013527615A (enExample)
KR (1) KR20130077841A (enExample)
CN (1) CN103262675B (enExample)
BR (1) BR112012029464A2 (enExample)
WO (1) WO2011146302A1 (enExample)

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EP2510764B1 (en) 2009-12-09 2016-11-16 Thomson Licensing Set-top box having microperforations
BR112012021430A2 (pt) 2010-02-25 2020-07-14 Thomson Licensing estojo de resfriamento radiante radioativo multicamada miniatura com prendedores de liberação rápida ocultos
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
KR20140061299A (ko) * 2011-03-09 2014-05-21 톰슨 라이센싱 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9317079B2 (en) 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
BR112014000762A2 (pt) 2011-07-14 2017-02-14 Thomson Licensing conversor set top bos tendo dissipador de calor snap-in e leitor de cartão inteligente com uma contenção para reter o dissipador de calor
KR101874551B1 (ko) 2011-10-19 2018-07-04 톰슨 라이센싱 블라인드 네비게이션을 위한 피드백을 갖는 원격 제어기
CN103547111B (zh) * 2012-07-09 2016-08-10 光宝电子(广州)有限公司 平面式散热结构及电子装置
ES2747480T3 (es) * 2013-06-27 2020-03-10 Interdigital Ce Patent Holdings Cubierta de dispositivo para gestión térmica
EP3033578A4 (en) * 2013-08-16 2017-03-22 Thomson Licensing Multi-layer heat spreader assembly with isolated convective fins
CN103491748B (zh) * 2013-09-17 2016-06-08 深圳市九洲电器有限公司 散热装置和机顶盒
CN105814738A (zh) * 2013-10-24 2016-07-27 汤姆逊许可公司 具有静电放电保护的紧凑无线天线安装
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JP6601055B2 (ja) * 2015-08-20 2019-11-06 富士通株式会社 プリント配線板、電子機器及び実装方法
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CN106848539B (zh) * 2017-01-19 2019-10-25 努比亚技术有限公司 一种天线装置
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US11122707B2 (en) * 2018-07-12 2021-09-14 Arris Enterprises Llc Raised pathway heat sink
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KR102845808B1 (ko) 2020-09-24 2025-08-13 삼성디스플레이 주식회사 표시 장치 및 이를 구비한 전자 기기
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Also Published As

Publication number Publication date
CN103262675A (zh) 2013-08-21
US20130063895A1 (en) 2013-03-14
JP2013527615A (ja) 2013-06-27
WO2011146302A1 (en) 2011-11-24
BR112012029464A2 (pt) 2017-03-01
KR20130077841A (ko) 2013-07-09
US9220185B2 (en) 2015-12-22
EP2572562B1 (en) 2018-05-09
EP2572562A1 (en) 2013-03-27

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