KR20130077841A - 열 부하를 발산하는 셋탑 박스 - Google Patents

열 부하를 발산하는 셋탑 박스 Download PDF

Info

Publication number
KR20130077841A
KR20130077841A KR1020127033169A KR20127033169A KR20130077841A KR 20130077841 A KR20130077841 A KR 20130077841A KR 1020127033169 A KR1020127033169 A KR 1020127033169A KR 20127033169 A KR20127033169 A KR 20127033169A KR 20130077841 A KR20130077841 A KR 20130077841A
Authority
KR
South Korea
Prior art keywords
heat sink
circuit board
heat
source element
vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127033169A
Other languages
English (en)
Korean (ko)
Inventor
다린 브래들리 리터
미키 제이 헌트
마크 윌리엄 기신
로저 앤소니 디머
Original Assignee
톰슨 라이센싱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 톰슨 라이센싱 filed Critical 톰슨 라이센싱
Publication of KR20130077841A publication Critical patent/KR20130077841A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020127033169A 2010-05-19 2011-05-12 열 부하를 발산하는 셋탑 박스 Withdrawn KR20130077841A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34607310P 2010-05-19 2010-05-19
US61/346,073 2010-05-19
US40076710P 2010-08-02 2010-08-02
US61/400,767 2010-08-02
PCT/US2011/036171 WO2011146302A1 (en) 2010-05-19 2011-05-12 Set-top box having dissipating thermal loads

Publications (1)

Publication Number Publication Date
KR20130077841A true KR20130077841A (ko) 2013-07-09

Family

ID=44484817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127033169A Withdrawn KR20130077841A (ko) 2010-05-19 2011-05-12 열 부하를 발산하는 셋탑 박스

Country Status (7)

Country Link
US (1) US9220185B2 (enExample)
EP (1) EP2572562B1 (enExample)
JP (1) JP2013527615A (enExample)
KR (1) KR20130077841A (enExample)
CN (1) CN103262675B (enExample)
BR (1) BR112012029464A2 (enExample)
WO (1) WO2011146302A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491833B1 (ko) * 2014-11-16 2015-02-11 가온미디어 주식회사 포집 분산형 히트싱크
US9848507B2 (en) 2016-04-06 2017-12-19 Humax Co., Ltd. Heat dissipation module assembly and set-top box having the same
KR20220013367A (ko) * 2019-05-31 2022-02-04 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 온보드 메모리 마이크로컨트롤러를 위한 분리된 전도/대류 이중 히트 싱크

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2510764B1 (en) 2009-12-09 2016-11-16 Thomson Licensing Set-top box having microperforations
BR112012021430A2 (pt) 2010-02-25 2020-07-14 Thomson Licensing estojo de resfriamento radiante radioativo multicamada miniatura com prendedores de liberação rápida ocultos
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
KR20140061299A (ko) * 2011-03-09 2014-05-21 톰슨 라이센싱 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9317079B2 (en) 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
BR112014000762A2 (pt) 2011-07-14 2017-02-14 Thomson Licensing conversor set top bos tendo dissipador de calor snap-in e leitor de cartão inteligente com uma contenção para reter o dissipador de calor
KR101874551B1 (ko) 2011-10-19 2018-07-04 톰슨 라이센싱 블라인드 네비게이션을 위한 피드백을 갖는 원격 제어기
CN103547111B (zh) * 2012-07-09 2016-08-10 光宝电子(广州)有限公司 平面式散热结构及电子装置
ES2747480T3 (es) * 2013-06-27 2020-03-10 Interdigital Ce Patent Holdings Cubierta de dispositivo para gestión térmica
EP3033578A4 (en) * 2013-08-16 2017-03-22 Thomson Licensing Multi-layer heat spreader assembly with isolated convective fins
CN103491748B (zh) * 2013-09-17 2016-06-08 深圳市九洲电器有限公司 散热装置和机顶盒
CN105814738A (zh) * 2013-10-24 2016-07-27 汤姆逊许可公司 具有静电放电保护的紧凑无线天线安装
US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
JP6601055B2 (ja) * 2015-08-20 2019-11-06 富士通株式会社 プリント配線板、電子機器及び実装方法
US10356948B2 (en) 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
CN106848539B (zh) * 2017-01-19 2019-10-25 努比亚技术有限公司 一种天线装置
US11425843B2 (en) * 2017-08-08 2022-08-23 Nec Platforms, Ltd. Heat radiation structure
JP2019057656A (ja) * 2017-09-22 2019-04-11 ダイヤモンド電機株式会社 空冷機構付き電子機器
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
US11122707B2 (en) * 2018-07-12 2021-09-14 Arris Enterprises Llc Raised pathway heat sink
KR102845808B1 (ko) 2020-09-24 2025-08-13 삼성디스플레이 주식회사 표시 장치 및 이를 구비한 전자 기기
WO2022132244A1 (en) * 2020-12-15 2022-06-23 Arris Enterprises Llc Multisided heat spreader
US11800687B2 (en) * 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly
US12349317B2 (en) * 2022-04-26 2025-07-01 Dish Network L.L.C. Electronic assembly having thermal pad with polymer layer

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887147A (en) 1987-07-01 1989-12-12 Digital Equipment Corporation Thermal package for electronic components
JPH02307182A (ja) 1989-05-23 1990-12-20 Hitachi Maxell Ltd Ｉｃカードリーダ・ライタ
JP2758283B2 (ja) 1991-06-17 1998-05-28 株式会社東芝 ハードディスクパックの脱着機構
US6850252B1 (en) 1999-10-05 2005-02-01 Steven M. Hoffberg Intelligent electronic appliance system and method
JPH06227553A (ja) 1993-01-28 1994-08-16 Yazaki Corp ロック構造
US5620242A (en) 1993-04-19 1997-04-15 Motorola, Inc. Portable radio battery latch
JP3251734B2 (ja) 1993-08-18 2002-01-28 株式会社日立テレコムテクノロジー 電子装置の筐体構造
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
US5667397A (en) 1994-12-01 1997-09-16 The Whitaker Corporation Smart card connector
US5917236A (en) 1995-12-08 1999-06-29 Hewlett-Packard Company Packaging system for field effects transistors
JP3776169B2 (ja) 1996-06-13 2006-05-17 任天堂株式会社 電子機器の放熱構造
JPH10154390A (ja) 1996-11-20 1998-06-09 Nippon Columbia Co Ltd ディスク再生装置
US6049469A (en) 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US7082033B1 (en) 1998-02-13 2006-07-25 Micron Technology, Inc. Removing heat from integrated circuit devices mounted on a support structure
JP3597368B2 (ja) 1998-02-16 2004-12-08 アルプス電気株式会社 電子機器
US6021044A (en) 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
JP2000269671A (ja) 1999-03-19 2000-09-29 Toshiba Corp 電子機器
JP2000269675A (ja) 1999-03-19 2000-09-29 Sony Corp 放熱装置およびセット・トップ・ボックス
US6411522B1 (en) 1999-04-01 2002-06-25 Western Digital Ventures, Inc. Integrated computer module with EMI shielding plate
JP3982941B2 (ja) 1999-04-12 2007-09-26 富士通株式会社 記憶装置
US6382995B1 (en) 1999-05-20 2002-05-07 Itt Manufacturing Enterprises, Inc Smart card connector with retain and eject means
DE69937103T2 (de) 1999-06-08 2008-06-12 Molex Inc., Lisle Tragbare Chipkarten-Leseanordnung
CN1529273A (zh) 1999-07-02 2004-09-15 3M创新有限公司 智能卡读卡器
JP2001147061A (ja) 1999-09-08 2001-05-29 Sega Corp 冷却装置を有する電子機器
GB2355017B (en) 1999-09-23 2001-09-12 Lorenzo Battisti Porous element
US6212074B1 (en) 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
JP3923703B2 (ja) 2000-03-29 2007-06-06 ローム株式会社 放熱手段を有するプリント配線板
JP2001358482A (ja) 2000-04-14 2001-12-26 Matsushita Refrig Co Ltd 放熱モジュール
FR2809871B1 (fr) 2000-06-05 2002-07-19 Itt Mfg Entpr S Inc Connecteur electrique a lames de contact perfectionnees pour le raccordement d'une carte a circuit(s) integre(s)
US20020051338A1 (en) 2000-07-27 2002-05-02 Lixin Jiang Acoustic enclosure for an air cooled hard disk drive
DE10051159C2 (de) 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
JP2002134970A (ja) 2000-10-26 2002-05-10 Denso Corp 電子制御装置
US6524361B1 (en) 2000-10-26 2003-02-25 Hubbell Incorporated Micro-porous filter
EP1248507A1 (de) 2001-04-04 2002-10-09 Siemens Aktiengesellschaft Hochfrequenzmodul eines Audio-Gerätes mit optimierter Wärmeableitung
JP2002324989A (ja) * 2001-04-26 2002-11-08 Murata Mach Ltd 印刷回路基板の放熱構造
JP4057796B2 (ja) 2001-07-03 2008-03-05 株式会社東芝 非水電解質空気電池
US6735085B2 (en) 2002-08-15 2004-05-11 Hon Hai Precision Ind. Co., Ltd. Foldable retention device for land grid array connector assembly
JP2004186294A (ja) 2002-12-02 2004-07-02 Denso Corp 電子装置
JP4039316B2 (ja) 2003-06-09 2008-01-30 株式会社明電舎 電子機器の冷却構造
EP1508916B1 (en) 2003-08-07 2008-03-05 Harman Becker Automotive Systems GmbH Apparatus for cooling semiconductor devices attached to a printed circuit board
US7203065B1 (en) * 2003-11-24 2007-04-10 Ciena Corporation Heatsink assembly
US20050128710A1 (en) * 2003-12-15 2005-06-16 Beiteimal Abdlmonem H. Cooling system for electronic components
TWI256192B (en) 2004-04-15 2006-06-01 Acbel Polytech Inc Power adapter with heat sink device
FR2871022B1 (fr) 2004-05-25 2006-11-03 Valeo Electronique Sys Liaison Boitier pour circuits electriques ou electroniques
GB0413340D0 (en) 2004-06-15 2004-07-21 Pace Micro Tech Plc Improvements to electrical apparatus
US7215551B2 (en) 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
FR2875917B3 (fr) 2004-09-29 2007-01-05 Alvaro Lemos Dispositif d'aeration pliable pour la protection de micro-ordinateurs portables
TWI247574B (en) 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
US7791874B2 (en) 2004-12-30 2010-09-07 Microsoft Corporation Removable module for a console
JP2006229046A (ja) 2005-02-18 2006-08-31 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP4445409B2 (ja) 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
US7158380B2 (en) 2005-03-25 2007-01-02 Scientific-Atlanta, Inc. Heatsink for digital video recorder
US7350705B1 (en) 2005-03-28 2008-04-01 International Technologies & Systems Corp. Compact robust smart card reader
DE202005013758U1 (de) 2005-08-31 2006-01-19 Sampo Corp., Kuei Shan Hsiang Kühlmechanismus für ein tragbares digitales Fernsehgerät
US7272001B2 (en) 2005-09-09 2007-09-18 King Young Technology Co., Ltd. External conductive heat dissipating device for microcomputers
US8009426B2 (en) 2005-11-23 2011-08-30 Comcast Cable Holdings Llc Housing for protecting electronic components having vents
US20070177356A1 (en) 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
JP4742893B2 (ja) * 2006-02-03 2011-08-10 日本電気株式会社 発熱デバイスの実装装置およびその放熱装置
US7450387B2 (en) 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
GB2436170A (en) 2006-03-17 2007-09-19 Amstrad Plc Cooling or heating device in a chip card reader
US7664198B2 (en) 2006-03-21 2010-02-16 Kyocera Corporation System and method for broadcasting data over a wireless network using rateless codes
JP2008034474A (ja) * 2006-07-26 2008-02-14 Sharp Corp 伝熱シート及び基板装置
US7518875B2 (en) 2006-12-14 2009-04-14 International Business Machines Corporation Securing heat sinks to a device under test
CN101663673B (zh) 2007-05-04 2016-09-07 汤姆逊许可证公司 智能卡散热装置
DE202007006626U1 (de) 2007-05-09 2007-10-04 Hamburg Industries Co., Ltd., Shen Keng Verbindungseinrichtung
US8023260B2 (en) 2007-09-04 2011-09-20 Apple Inc. Assembly of an electronic device
WO2009057124A2 (en) 2007-11-01 2009-05-07 Innomedia Technologies Pvt. Ltd. A set-top-box cabinet for natural cooling of internal electronics
JP4857252B2 (ja) 2007-12-07 2012-01-18 株式会社日立製作所 電子機器
JP4473923B2 (ja) 2008-10-22 2010-06-02 株式会社東芝 電子機器
CN201352820Y (zh) 2009-02-10 2009-11-25 深圳创维数字技术股份有限公司 机顶盒机箱
FR2944408B1 (fr) 2009-04-14 2012-09-21 Eads Europ Aeronautic Defence Boitier pour carte electronique embarquee
KR101552357B1 (ko) 2009-05-29 2015-09-11 엘지이노텍 주식회사 튜너 모듈
CN201515429U (zh) 2009-09-22 2010-06-23 重庆迪特尔数字电视有限公司 数字电视机顶盒
EP2510764B1 (en) 2009-12-09 2016-11-16 Thomson Licensing Set-top box having microperforations
CN201571126U (zh) * 2009-12-14 2010-09-01 福建创频数码科技有限公司 一种新型机顶盒外壳
BR112012021430A2 (pt) 2010-02-25 2020-07-14 Thomson Licensing estojo de resfriamento radiante radioativo multicamada miniatura com prendedores de liberação rápida ocultos
US8620162B2 (en) 2010-03-25 2013-12-31 Apple Inc. Handheld electronic device with integrated transmitters
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
USD631449S1 (en) 2010-08-02 2011-01-25 Thomson Licensing Set top box
GB201016047D0 (en) 2010-09-24 2010-11-10 Pace Plc Means for heating dissipation for electrical and/or electronic apparatus
KR20140061299A (ko) 2011-03-09 2014-05-21 톰슨 라이센싱 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491833B1 (ko) * 2014-11-16 2015-02-11 가온미디어 주식회사 포집 분산형 히트싱크
US9848507B2 (en) 2016-04-06 2017-12-19 Humax Co., Ltd. Heat dissipation module assembly and set-top box having the same
KR20220013367A (ko) * 2019-05-31 2022-02-04 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 온보드 메모리 마이크로컨트롤러를 위한 분리된 전도/대류 이중 히트 싱크

Also Published As

Publication number Publication date
CN103262675A (zh) 2013-08-21
US20130063895A1 (en) 2013-03-14
JP2013527615A (ja) 2013-06-27
WO2011146302A1 (en) 2011-11-24
BR112012029464A2 (pt) 2017-03-01
CN103262675B (zh) 2016-03-30
US9220185B2 (en) 2015-12-22
EP2572562B1 (en) 2018-05-09
EP2572562A1 (en) 2013-03-27

Similar Documents

Publication Publication Date Title
KR20130077841A (ko) 열 부하를 발산하는 셋탑 박스
US5390078A (en) Apparatus for using an active circuit board as a heat sink
US7345885B2 (en) Heat spreader with multiple stacked printed circuit boards
US9095076B2 (en) Electronic device enclosures and heatsink structures with thermal management features
US20120307455A1 (en) Miniature multilayer radiative cooling case wtih hidden quick release snaps
US7133288B2 (en) Processor heat sink retention module and assembly
US20180310395A1 (en) MULTl-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS
US6982481B1 (en) System for dissipating heat and shielding electromagnetic radiation produced by an electronic device
JP2015537377A (ja) ヒートシンク取り付け装置及び方法
US10141627B2 (en) Compact wireless antennae mounting with electrostatic discharge protection
US20090310302A1 (en) Heat-dissipating structure having an external fan
KR20160086334A (ko) 인쇄 회로 기판에 대한 히트싱크 정렬
JP2006295193A (ja) 集積回路内の同時的スイッチングノイズを減少させるためのシステム及び方法
US6961241B2 (en) Electronic apparatus with natural convection structure
JP3224659U (ja) 拡張カードコネクタ及び拡張カードモジュールアセンブリ
JPH10117075A (ja) 電子機器の放熱装置
JPH11354695A (ja) 放熱機構およびこの放熱機構を有する情報処理装置
JP2008130762A (ja) 基板同士の接続構造

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20121218

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160503

Comment text: Request for Examination of Application

PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20170323

WITB Written withdrawal of application