Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device
  • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
  • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention relates to quiet set-top boxes having improved heat dissipating capabilities.
• An electronic device comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent.
• the contoured heatsink can have a planar peripheral portion and a central depression portion in which the planar peripheral portion
• the contoured heatsink can substantially overlie the circuit board and completely overlie the second heatsink.
• the second heatsink can be a finned heatsink or the second heatsink can be a contoured heatsink having a second planar peripheral portion and a second central depression in which the second planar peripheral portion surrounds at least a portion of the second central depression portion, and the second central depression portion contacts the second heat source element. If the second heatsink is a contoured heatsink, then the contoured heatsink can overlie less than half the circuit board and the second heatsink can overlie more than one-third of the circuit board.
• the device can comprise a frame that has a base and embosses, wherein the base is under the circuit board and the embosses contact and support the circuit board.
• the frame can have at least a first vertical side wall oriented along the first vertical outer wall and a second vertical side wall oriented along the second vertical outer wall in which the first vertical side wall has a first interior vent aligned with the first vent and the second vertical side wall has a second interior vent aligned with the second vent.
• the second heat source element can be a smart card reader and can be below the circuit board, wherein the circuit board can have heat passage via holes therethrough over the second heat source element and under the second heatsink where it contacts the circuit board or a thermal pad thereon.
• FIG. 1 shows a cross sectional interior view of the assembled set-top box according to a first embodiment of the invention with a front portion of the set-top box removed;
• Fig. 2 shows a perspective view of the underside of the main printed circuit board according to the invention
• Fig. 3 shows a perspective view of the upper side of the main printed circuit board according to the invention
• Fig. 4 shows a perspective view of the top broad heat sink on the main printed main printed circuit board according to a first embodiment of the invention
• Fig. 5 shows a cross sectional interior view of the assembled set-top box according to a second embodiment of the invention with a front portion of the set-top box removed.
• the invention is directed to arrangements for cooling an electronic assembly that generates a thermal load, for example a smart card reader, when the electronic assembly is disposed in a hostile thermal environment.
• a hostile thermal environment is one in which there is insufficient ventilation for adequate cooling, for example, a densely populated electronic box such as a set-top box, wherein desired design criteria are directed to compact, sleek designs with small footprints. Providing for sufficient cooling to dissipate thermal loads in such a set-top box is challenging under any circumstances.
• the cooling problem is exacerbated by including in a set- top box a low profile smart card reader that generates its own thermal load and that is mounted on the bottom side of a multilayer printed circuit board (PCB) disposed inside the set-top box. Dissipating the thermal load of the smart card reader is even more difficult due to a mounting location at the bottom of the set-top box, beneath a multilayer PCB on which are mounted other electronic components generating other thermal loads, and far removed from the top of the set-top box. With respect to conventional wisdom, placing the smart card reader in such a location is quite counter-intuitive.
• PCB printed circuit board
• An electronic assembly such as a smart card reader can be safely positioned in a hostile thermal environment as described above, in accordance with the inventive arrangements taught herein.
• the smart card reader contacts are located on the bottom of the smart card reader and push the smart card upward against the bottom printed circuit board surface. Since the card surface is in direct contact with the printed circuit board, a patch or area of many copper-plated thru-hole vias is advantageously added in the board at the location of the smart card contacts. Other highly thermally conductive metal can be used to plate the vias.
• a thermally conductive pad is advantageously placed on the patch of vias and a heat sink is advantageously placed on the pad.
• a top broad heat sink has proved to be an effective way to cool the main integrated circuit of the set-top box, but the smart card reader adds an additional thermal load that may not be dissipated by the conventional top broad heat sink.
• a finned convecting heat sink 58 advantageously radiates heat through convection to vents on the outer sides 34 of the outer cover 28 of a set-top box 1 .
• the first embodiment can be appreciated by particular reference to Figs. 1 - 4.
• Fig. 1 shows an internal view of the set-top box 1 in an assembled form with a front portion of the set-top box removed according to the first embodiment.
• Fig. 1 shows a top broad heat sink 10, which is an internal component.
• the top broad heat sink 10 can be a generally contoured plate that has a generally planar periphery 12 and a contoured central feature such as a pocket, central depression, notch, recess, multilevel depression, or mesa extending from and/or into a plane of the planar periphery.
• the central feature or central depression 1 1 can have side walls extending from the planar periphery and form an obtuse angle therewith.
• the contoured feature can have a flat bottom designed to contact the main integrated circuit and/or other heat generating component 17 on a main printed circuit board 13 which can be below it.
• Fig. 1 further shows a main printed circuit board 13 or the like, which can be generally flat.
• the main printed circuit board 13 can have a main integrated circuit 17 or the like in a central region and holes for mounting and/or securing the main printed circuit board 13 to a frame pan 18.
• the main integrated circuit and other heat generating or hot components 17 can contact the flat bottom or other portion of the central depression 1 1 of the top broad heat sink 10, which can be in thermal contact with the other heat generating or hot components through a thermal joint 27 which could be a pad.
• the main printed circuit board 13 is shown being mounted and/or secured to embosses 20 of the frame pan 18 by use of screws, bolts or solder pad joints 43 through the holes or contact points in the circuit board 13, wherein the main printed circuit board 13 is effectively contacting the frame pan 18.
• This contact can be thermal contact.
• Fig. 2 shows a perspective view of the underside of the main printed main printed circuit board 13 or the like.
• the main printed circuit board 13 can have in a central region of holes and associated pins 16 for primary or additional mounting and/or securing the main printed circuit board 13 to a frame pan 18.
• Other features of the main printed circuit board are shown in the figure which can include jack panel connectors 15 at one edge and a button cluster 14 at another edge. These edges can be opposing edges.
• Fig. 2 shows how the smart card reader 61 can be positioned on the main printed circuit board 13.
• Fig. 3 shows another perspective view of the upper side of the main printed main printed circuit board 13 or the like in contact with the frame 18.
• Fig. 3 shows the main printed circuit board 13 can have main integrated circuit or other heat generating component 17 in a central region and holes and associated pins 16 for mounting and/or securing the main printed circuit board 13 to a frame pan 18.
• the finned convecting heat sink 58 having a long dimension in the x-axis being 17.78 mm, a short dimension in the y-axis being 10.18 mm, and a height being 10.1 1 mm. Keeping these dimensions within 20% of the stated dimensions can be effective.
• the gaps between the fins are U-shaped or V-shaped in which the depths of the gaps are greater than half the height of the finned convecting heat sink 58.
• Fig. 4 shows a perspective view of the top broad heat sink 10 on the main printed main printed circuit board 13.
• the top broad heat sink 10 substantially covers the main printed main printed circuit board 13.
• Fig. 1 further shows how the smart card reader 61 can be in contact with the main printed circuit board 13 and immediately thereunder.
• the smart card reader 61 is shown having a smart card 64 inserted therein through a smart card entrance port 63 in one of the outer sides 34.
• the smart card reader 61 is shown being in contact with at least one thermal pad joint 62 that conducts heat generated by the smart card reader 61 to the finned convecting heat sink 58 which is also in contact with the main printed circuit board 13 and positioned immediately thereon.
• heat via holes 65 are shown being in the a main printed circuit board 13 to permit the heat from the smart card reader 61 to propagate to the finned convecting heat sink 58.
• the heat via holes 65 can be copper plated and the population of the heat via holes can be located substantially along and over the perimeter of the smart card reader 61 and uniformly distributed over the smart card reader 61 to optimize heat transfer from the smart card reader 61 . It is advantageous to have the total plan view area of the via holes exceeding one-half area the plan view area of the via hole region, which is the region where the finned convecting heat sink 58 or the second heat sink contacts circuit board or the thermal pad joint.
• the vias can have vertical walls and can have an aspect ratio, which is a width or diameter of the via hole to height ratio, of 0.5 to 10.
• the set-top box 1 in Fig. 1 can have an outer cover 28 that further includes an upper wall 31 , lower wall 32, and multiple outer sides 34.
• the exterior side of the lower wall 32 can include rubber feet 33 which can be at least 6 mm in height to ensure adequate air entry under the set-top box for improved thermal management.
• Fig. 1 also shows at least one proximal vent 59 in one of the outer sides
• the proximal vent 59 be positioned in one of the vertical outer sides 34 at a place that is closest to the finned convecting heat sink 58.
• At least one general vent 60 is shown which can be at other locations on other outer sides 34. The general vents 60 can further assist with the dissipation of heat.
• the frame pan 18 can have side walls 23 that have complementary vents 66 which can be aligned with the vents of the outer sides 34. Having the vents on the outer sides in the combination of top broad heat sink 10 and the finned convecting heat sink 58 eliminates or can eliminate the need for vents in the upper wall 31 .
• Fig. 1 further shows outer gaps 41 between the side walls 23 of the frame pan 18 and the outer side 34 of the outer cover 28; inner gaps 40 between the edge of the planar periphery 12 of the top broad heat sink 12 and the side walls 23 of the frame pan 18; bottom gap 42 between the lower wall 32 of the outer cover 28 and the base 22 of the frame pan 18; and upper gap 44 between the upper wall 31 of the outer cover 28 and the planar periphery 12 of the top broad heat sink 10.
• the bottom gap 42 and upper gap 44 prevent the outer cover 28 from overheating.
• a patch or area of many copper-plated thru-hole vias is advantageously added in the board at the location of the smart card contacts.
• a thermally conductive pad is advantageously placed on the patch of vias 62 and a heat sink is advantageously placed on the pad.
• a top broad heat sink has proved to be an effective way to cool the main integrated circuit of the set-top box, but the smart card reader adds an additional thermal load that cannot be dissipated by the conventional top broad heat sink.
• the finned heat sink and proximal vents have enhanced the thermal management of the set-top box.
• the top broad radiating heat sink previously embodied as a unitary heat sink, is advantageously split or divided into two parts or two separate heat sinks.
• One of the two parts is in thermal contact with the main integrated circuit in the set-top box.
• the other of the two parts is in thermal contact with the smart card through the patch or area of vias.
• Fig. 5 shows an internal view of the set-top box 1 in an assembled form with a front portion of the set-top box removed according to the second embodiment.
• Fig. 5 shows first top broad heat sink 10a, which is an internal component.
• the top broad heat sink 10a can be a generally contoured plate that has a generally planar periphery 12a and a contoured central feature such as a pocket, central depression, notch, recess, multilevel depression, or mesa extending from and/or into a plane of the planar periphery, wherein the planar periphery 12a preferably only surrounds part of the or central depression 1 1 a.
• the planar periphery 12a surrounds 3 sides of the central depression 1 1 a.
• the central feature or central depression 1 1 a can have side walls extending from the planar periphery and form an obtuse angle therewith.
• the contoured feature can have a flat bottom designed to contact the main integrated circuit and/or other heat generating component 17 on a main printed circuit board 13 which can be below it.
• Fig. 5 also shows the second top broad heat sink 10b, which is an internal component.
• the top broad heat sink 10b can also be a generally contoured plate that has a generally planar periphery 12b and a contoured central feature such as a pocket, central depression, notch, recess, multilevel depression, mesa extending from and/or into a plane of the planar periphery, wherein the planar periphery 12b preferably only surrounds part of the central depression 1 1 b. In the one embodiment, the planar periphery 12b surrounds 3 sides of the central depression 1 1 b.
• the central feature or central depression 1 1 b can have side walls extending from the planar periphery and form an obtuse angle therewith.
• the contoured feature can have a flat bottom designed to contact the main printed circuit board 13 in the region where the smart card reader 61 is located.
• the smart card reader 61 is shown being in contact with at least one thermal pad joint 62 that conducts heat generated by the smart card reader 61 to the second top broad heat sink 10b which is also in contact with the main printed circuit board 13 and thereon.
• heat transmissive via holes 65 are positioned in the main printed circuit board 13 to permit the heat from the smart card reader 61 to propagate to the second top broad heat sink 10b.
• the heat via holes 65 can be copper plated and the population of the heat via holes can be located substantially along the perimeter of the smart card reader 61 and uniformly distributed over the smart card reader 61 to optimize heat transfer from the smart card reader 61 .
• the vias can have the same characteristics and dimensional aspects in this embodiment as in the first embodiment.
• the main printed circuit board 13, frame pan 18 and the outer cover 28 are generally the same as in the first embodiment of the invention.
• the frame pan 18 also can have complementary vents 66 which can be aligned with the vents 60 of the outer sides 34, wherein the edges of planar peripheries 12a, 12b run along the outer sides 34.
• the invention is intended to apply, for example, to heat source elements such as hard drives, smart card readers, integrated circuits, and light sources that could be used to light buttons. Further, when a heatsink is said to be contacting a heat source element, this can imply through direct contact or contact through an intermediary component such as via holes and/or thermal pads or thermal joints.
• vent can imply a single vent opening or multiple localized vent openings; the expression “substantially overlying” is intended to mean completely overlying or overlying at 90% of a surface of a structure; the expression “planar peripheral portion” can mean that the portion is completely planar or can include portions which are generally planar, but may have some raised portions or groves which may be needed to add structural integrity or may be needed to accommodate components in the set-top box.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Thermal Sciences (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

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Publications (1)

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Family Applications (1)

Country Status (7)

Cited By (10)

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Citations (4)

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• 2011
  • 2011-05-12 BR BR112012029464A patent/BR112012029464A2/pt not_active Application Discontinuation
  • 2011-05-12 CN CN201180032238.7A patent/CN103262675B/zh not_active Expired - Fee Related
  • 2011-05-12 WO PCT/US2011/036171 patent/WO2011146302A1/en not_active Ceased
  • 2011-05-12 JP JP2013511224A patent/JP2013527615A/ja active Pending
  • 2011-05-12 KR KR1020127033169A patent/KR20130077841A/ko not_active Withdrawn
  • 2011-05-12 US US13/698,868 patent/US9220185B2/en not_active Expired - Fee Related
  • 2011-05-12 EP EP11724317.0A patent/EP2572562B1/en not_active Not-in-force

Patent Citations (4)

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