CN102460750A - 金属基板和光源装置 - Google Patents

金属基板和光源装置 Download PDF

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Publication number
CN102460750A
CN102460750A CN2010800239845A CN201080023984A CN102460750A CN 102460750 A CN102460750 A CN 102460750A CN 2010800239845 A CN2010800239845 A CN 2010800239845A CN 201080023984 A CN201080023984 A CN 201080023984A CN 102460750 A CN102460750 A CN 102460750A
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CN
China
Prior art keywords
light source
layer
metal substrate
white
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800239845A
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English (en)
Chinese (zh)
Inventor
佐藤义人
新居信广
松井纯
山田绅月
铃木秀次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
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Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of CN102460750A publication Critical patent/CN102460750A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2010800239845A 2009-06-02 2010-06-02 金属基板和光源装置 Pending CN102460750A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009132967 2009-06-02
JP2009-132967 2009-06-02
PCT/JP2010/059395 WO2010140640A1 (ja) 2009-06-02 2010-06-02 金属基板及び光源装置

Publications (1)

Publication Number Publication Date
CN102460750A true CN102460750A (zh) 2012-05-16

Family

ID=43297773

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800239845A Pending CN102460750A (zh) 2009-06-02 2010-06-02 金属基板和光源装置

Country Status (5)

Country Link
US (1) US8742432B2 (https=)
EP (1) EP2439797A4 (https=)
JP (2) JP2011014890A (https=)
CN (1) CN102460750A (https=)
WO (1) WO2010140640A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103872217A (zh) * 2014-03-14 2014-06-18 苏州晶品光电科技有限公司 大功率led光源封装体
JP2019091943A (ja) * 2014-12-25 2019-06-13 日亜化学工業株式会社 半導体装置および半導体装置の製造方法

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TWI446495B (zh) 2011-01-19 2014-07-21 旭德科技股份有限公司 封裝載板及其製作方法
JP5673190B2 (ja) * 2011-02-18 2015-02-18 日亜化学工業株式会社 発光装置
TWI437930B (zh) * 2011-05-03 2014-05-11 旭德科技股份有限公司 封裝載板及其製作方法
CN103078040B (zh) 2011-08-22 2016-12-21 Lg伊诺特有限公司 发光器件封装件和光装置
JP5812845B2 (ja) * 2011-12-19 2015-11-17 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
US9263658B2 (en) 2012-03-05 2016-02-16 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US9240524B2 (en) * 2012-03-05 2016-01-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR101306247B1 (ko) * 2012-05-11 2013-09-17 (주)포인트엔지니어링 백라이트 유닛용 광소자 제조 방법 및 이에 의해 제조된 광소자와 그 어레이
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KR102098831B1 (ko) * 2012-06-07 2020-04-08 시코쿠 케이소쿠 코교 가부시키가이샤 Led 조명 모듈 및 led 조명 장치
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KR102131309B1 (ko) * 2013-10-01 2020-07-07 엘지이노텍 주식회사 형광체 및 이를 포함하는 발광소자 패키지
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JP6344689B2 (ja) * 2013-07-16 2018-06-20 パナソニックＩｐマネジメント株式会社 基板、発光装置、照明用光源、および照明装置
CN105684170B (zh) * 2013-08-09 2019-09-03 株式会社光波 发光装置
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JP2015065236A (ja) * 2013-09-24 2015-04-09 東芝ライテック株式会社 発光モジュールおよび照明装置
JP6183118B2 (ja) * 2013-09-30 2017-08-23 日亜化学工業株式会社 発光装置
JP6332933B2 (ja) * 2013-10-01 2018-05-30 三菱電機株式会社 発光ユニットの製造方法
KR20150074421A (ko) * 2013-12-24 2015-07-02 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광 장치
JP2015192096A (ja) * 2014-03-28 2015-11-02 豊田合成株式会社 発光装置
JP5859050B2 (ja) * 2014-03-31 2016-02-10 株式会社ソディック 発光ダイオードモジュール
JP6497615B2 (ja) * 2015-03-04 2019-04-10 パナソニックＩｐマネジメント株式会社 実装基板及びそれを用いたｌｅｄモジュール
JPWO2016171121A1 (ja) * 2015-04-22 2018-03-01 Dic株式会社 樹脂分散体、微粒子、及びそれらの製造方法
TWM521008U (zh) * 2016-01-27 2016-05-01 光寶科技股份有限公司 車燈裝置及其發光模組
CN105977364A (zh) * 2016-07-20 2016-09-28 广州硅能照明有限公司 多层led光引擎结构及其加工方法
US10692663B2 (en) 2018-05-31 2020-06-23 Darfon Electronics Corp. Light source board, manufacturing method thereof, and luminous keyboard using the same
US10895372B2 (en) * 2018-05-31 2021-01-19 Darfon Electronics Corp. Light source board, manufacturing method thereof, and luminous keyboard using the same
US10720289B1 (en) * 2019-02-20 2020-07-21 Darfon Electronics Corp. Light emitting keyboard and lighting board thereof
EP3973748B1 (en) * 2019-05-23 2024-04-24 Signify Holding B.V. Stable pcb for solid state light source application
CN114223066A (zh) * 2019-08-28 2022-03-22 京瓷株式会社 发光元件搭载用封装件以及发光装置
EP4053892A4 (en) 2019-10-30 2023-11-29 Kyocera Corporation Light-emitting element mounting package and light-emitting device
JPWO2022024932A1 (https=) 2020-07-29 2022-02-03
CN114520281B (zh) 2020-11-20 2024-07-16 隆达电子股份有限公司 发光装置、背光板及显示面板
JP2022190310A (ja) * 2021-06-14 2022-12-26 セイコーエプソン株式会社 波長変換部材および発光装置
US12259112B2 (en) 2021-06-22 2025-03-25 Darfon Electronics Corp. Illuminating circuit structure
US12061353B2 (en) 2022-04-08 2024-08-13 Darfon Electronics Corp. Backlit module and key for backlit keyboard
US12394580B2 (en) 2022-04-08 2025-08-19 Darfon Electronics Corp. Luminous keyboard and illuminant board thereof

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Publication number Priority date Publication date Assignee Title
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JP2019091943A (ja) * 2014-12-25 2019-06-13 日亜化学工業株式会社 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
US8742432B2 (en) 2014-06-03
JP2013038452A (ja) 2013-02-21
EP2439797A4 (en) 2015-03-04
JP2011014890A (ja) 2011-01-20
JP5177319B2 (ja) 2013-04-03
US20120138990A1 (en) 2012-06-07
EP2439797A1 (en) 2012-04-11
WO2010140640A1 (ja) 2010-12-09

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Application publication date: 20120516