JPWO2022024932A1 - - Google Patents

Info

Publication number
JPWO2022024932A1
JPWO2022024932A1 JP2022540252A JP2022540252A JPWO2022024932A1 JP WO2022024932 A1 JPWO2022024932 A1 JP WO2022024932A1 JP 2022540252 A JP2022540252 A JP 2022540252A JP 2022540252 A JP2022540252 A JP 2022540252A JP WO2022024932 A1 JPWO2022024932 A1 JP WO2022024932A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022540252A
Other languages
Japanese (ja)
Other versions
JPWO2022024932A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022024932A1 publication Critical patent/JPWO2022024932A1/ja
Publication of JPWO2022024932A5 publication Critical patent/JPWO2022024932A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022540252A 2020-07-29 2021-07-21 Pending JPWO2022024932A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020128333 2020-07-29
PCT/JP2021/027374 WO2022024932A1 (ja) 2020-07-29 2021-07-21 配線基板、発光素子搭載用パッケージおよび発光装置

Publications (2)

Publication Number Publication Date
JPWO2022024932A1 true JPWO2022024932A1 (https=) 2022-02-03
JPWO2022024932A5 JPWO2022024932A5 (https=) 2023-04-14

Family

ID=80036866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022540252A Pending JPWO2022024932A1 (https=) 2020-07-29 2021-07-21

Country Status (5)

Country Link
US (1) US20230282791A1 (https=)
EP (1) EP4191660A4 (https=)
JP (1) JPWO2022024932A1 (https=)
CN (1) CN116134605A (https=)
WO (1) WO2022024932A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119008655B (zh) * 2024-10-24 2025-05-23 京东方华灿光电(浙江)有限公司 改善胶材脱离的发光器件及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155860B2 (ja) * 1993-04-20 2001-04-16 電気化学工業株式会社 金属ベース回路基板及び製造方法
JP4165195B2 (ja) * 2002-11-25 2008-10-15 松下電工株式会社 金属コア基板及び金属コア配線板
JP4527714B2 (ja) * 2003-02-07 2010-08-18 パナソニック株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2011014890A (ja) 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
JP5561279B2 (ja) * 2009-09-02 2014-07-30 パナソニック株式会社 プリント配線板、ビルドアップ多層基板とその製造方法
KR101931395B1 (ko) * 2011-02-18 2018-12-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 발광 반도체 디바이스
JP6119610B2 (ja) * 2011-11-02 2017-04-26 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、配線板、半硬化エポキシ樹脂組成物の製造方法及び硬化エポキシ樹脂組成物の製造方法
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
KR102032952B1 (ko) * 2015-11-16 2019-10-16 주식회사 엘지화학 반도체 소자의 빌드 업 방법
JP2021150428A (ja) * 2020-03-18 2021-09-27 日機装株式会社 半導体発光装置

Also Published As

Publication number Publication date
EP4191660A1 (en) 2023-06-07
US20230282791A1 (en) 2023-09-07
EP4191660A4 (en) 2024-08-14
WO2022024932A1 (ja) 2022-02-03
CN116134605A (zh) 2023-05-16

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