CN116134605A - 布线基板、发光元件搭载用封装件以及发光装置 - Google Patents

布线基板、发光元件搭载用封装件以及发光装置 Download PDF

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Publication number
CN116134605A
CN116134605A CN202180060551.5A CN202180060551A CN116134605A CN 116134605 A CN116134605 A CN 116134605A CN 202180060551 A CN202180060551 A CN 202180060551A CN 116134605 A CN116134605 A CN 116134605A
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CN
China
Prior art keywords
resin layer
insulating resin
metal substrate
wiring board
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180060551.5A
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English (en)
Chinese (zh)
Inventor
冈本和弘
山元泉太郎
松本有平
大川佳英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN116134605A publication Critical patent/CN116134605A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202180060551.5A 2020-07-29 2021-07-21 布线基板、发光元件搭载用封装件以及发光装置 Pending CN116134605A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020128333 2020-07-29
JP2020-128333 2020-07-29
PCT/JP2021/027374 WO2022024932A1 (ja) 2020-07-29 2021-07-21 配線基板、発光素子搭載用パッケージおよび発光装置

Publications (1)

Publication Number Publication Date
CN116134605A true CN116134605A (zh) 2023-05-16

Family

ID=80036866

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180060551.5A Pending CN116134605A (zh) 2020-07-29 2021-07-21 布线基板、发光元件搭载用封装件以及发光装置

Country Status (5)

Country Link
US (1) US20230282791A1 (https=)
EP (1) EP4191660A4 (https=)
JP (1) JPWO2022024932A1 (https=)
CN (1) CN116134605A (https=)
WO (1) WO2022024932A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119008655A (zh) * 2024-10-24 2024-11-22 京东方华灿光电(浙江)有限公司 改善胶材脱离的发光器件及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179224A (ja) * 2002-11-25 2004-06-24 Matsushita Electric Works Ltd 金属コア基板及び金属コア配線板
CN102484951A (zh) * 2009-09-02 2012-05-30 松下电器产业株式会社 印刷电路板、积层多层基板及其制造方法
JP2014093355A (ja) * 2012-11-01 2014-05-19 Ajinomoto Co Inc プリント配線板の製造方法
KR20170057155A (ko) * 2015-11-16 2017-05-24 주식회사 엘지화학 반도체 소자의 빌드 업 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155860B2 (ja) * 1993-04-20 2001-04-16 電気化学工業株式会社 金属ベース回路基板及び製造方法
JP4527714B2 (ja) * 2003-02-07 2010-08-18 パナソニック株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2011014890A (ja) 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
KR101931395B1 (ko) * 2011-02-18 2018-12-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 발광 반도체 디바이스
JP6119610B2 (ja) * 2011-11-02 2017-04-26 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、配線板、半硬化エポキシ樹脂組成物の製造方法及び硬化エポキシ樹脂組成物の製造方法
JP2021150428A (ja) * 2020-03-18 2021-09-27 日機装株式会社 半導体発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179224A (ja) * 2002-11-25 2004-06-24 Matsushita Electric Works Ltd 金属コア基板及び金属コア配線板
CN102484951A (zh) * 2009-09-02 2012-05-30 松下电器产业株式会社 印刷电路板、积层多层基板及其制造方法
JP2014093355A (ja) * 2012-11-01 2014-05-19 Ajinomoto Co Inc プリント配線板の製造方法
KR20170057155A (ko) * 2015-11-16 2017-05-24 주식회사 엘지화학 반도체 소자의 빌드 업 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119008655A (zh) * 2024-10-24 2024-11-22 京东方华灿光电(浙江)有限公司 改善胶材脱离的发光器件及其制备方法
CN119008655B (zh) * 2024-10-24 2025-05-23 京东方华灿光电(浙江)有限公司 改善胶材脱离的发光器件及其制备方法

Also Published As

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EP4191660A1 (en) 2023-06-07
JPWO2022024932A1 (https=) 2022-02-03
US20230282791A1 (en) 2023-09-07
EP4191660A4 (en) 2024-08-14
WO2022024932A1 (ja) 2022-02-03

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