CN101866828B - 电子装置制造室及其形成方法 - Google Patents

电子装置制造室及其形成方法 Download PDF

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Publication number
CN101866828B
CN101866828B CN2010101949025A CN201010194902A CN101866828B CN 101866828 B CN101866828 B CN 101866828B CN 2010101949025 A CN2010101949025 A CN 2010101949025A CN 201010194902 A CN201010194902 A CN 201010194902A CN 101866828 B CN101866828 B CN 101866828B
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China
Prior art keywords
chamber
device manufacturing
component
electron device
manufacturing chamber
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Expired - Lifetime
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CN2010101949025A
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English (en)
Chinese (zh)
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CN101866828A (zh
Inventor
S·库利塔
W·T·布劳尼干
M·伊纳贾瓦
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Structure Of Receivers (AREA)
  • Forging (AREA)
CN2010101949025A 2004-06-02 2005-06-01 电子装置制造室及其形成方法 Expired - Lifetime CN101866828B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US57690204P 2004-06-02 2004-06-02
US60/576,902 2004-06-02
US58710904P 2004-07-12 2004-07-12
US60/587,109 2004-07-12

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200510103895.2A Division CN1767147B (zh) 2004-06-02 2005-06-01 电子装置制造室及其形成方法

Publications (2)

Publication Number Publication Date
CN101866828A CN101866828A (zh) 2010-10-20
CN101866828B true CN101866828B (zh) 2013-03-20

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010101949025A Expired - Lifetime CN101866828B (zh) 2004-06-02 2005-06-01 电子装置制造室及其形成方法
CN201310051306.5A Expired - Lifetime CN103199039B (zh) 2004-06-02 2005-06-01 电子装置制造室及其形成方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201310051306.5A Expired - Lifetime CN103199039B (zh) 2004-06-02 2005-06-01 电子装置制造室及其形成方法

Country Status (5)

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US (1) US20060051507A1 (enExample)
JP (4) JP4771748B2 (enExample)
KR (2) KR100727499B1 (enExample)
CN (2) CN101866828B (enExample)
TW (2) TWI298895B (enExample)

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US6562671B2 (en) * 2000-09-22 2003-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and manufacturing method thereof
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KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
WO2006130811A2 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Electronic device manufacturing chamber and methods of forming the same
CN101495671A (zh) * 2006-04-11 2009-07-29 应用材料公司 用于形成太阳能电池板的系统结构及其方法
US20080025821A1 (en) * 2006-07-25 2008-01-31 Applied Materials, Inc. Octagon transfer chamber
US20080289284A1 (en) * 2007-03-01 2008-11-27 Suhail Anwar Process chamber and load-lock split frame construction
US20090060687A1 (en) * 2007-08-28 2009-03-05 White John M Transfer chamber with rolling diaphragm
US20100021273A1 (en) * 2008-07-28 2010-01-28 Applied Materials, Inc. Concrete vacuum chamber
US9484243B2 (en) * 2014-04-17 2016-11-01 Lam Research Corporation Processing chamber with features from side wall
JP6755169B2 (ja) * 2016-12-15 2020-09-16 東京エレクトロン株式会社 輸送用架台および輸送方法
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
CN114800578B (zh) * 2022-06-28 2022-10-25 江苏邑文微电子科技有限公司 晶圆传输设备及其控制方法

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Also Published As

Publication number Publication date
JP2006114874A (ja) 2006-04-27
JP3137060U (ja) 2007-11-08
CN103199039A (zh) 2013-07-10
US20060051507A1 (en) 2006-03-09
KR20060049499A (ko) 2006-05-19
CN103199039B (zh) 2016-01-13
TWM290610U (en) 2006-05-11
KR101108366B1 (ko) 2012-01-25
JP5252451B2 (ja) 2013-07-31
TW200618043A (en) 2006-06-01
KR20070005537A (ko) 2007-01-10
JP2006319363A (ja) 2006-11-24
JP4771748B2 (ja) 2011-09-14
KR100727499B1 (ko) 2007-06-13
JP2009212532A (ja) 2009-09-17
CN101866828A (zh) 2010-10-20
TWI298895B (en) 2008-07-11

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