JP5252451B2 - 電子デバイス製造チャンバ及びその形成方法 - Google Patents
電子デバイス製造チャンバ及びその形成方法 Download PDFInfo
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- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229920002313 fluoropolymer Polymers 0.000 claims description 4
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- 239000011347 resin Substances 0.000 claims description 4
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- 239000010959 steel Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
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- 230000006835 compression Effects 0.000 claims 1
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- 238000012546 transfer Methods 0.000 description 26
- 239000000758 substrate Substances 0.000 description 23
- 230000032258 transport Effects 0.000 description 18
- 230000033001 locomotion Effects 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
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- 229920000307 polymer substrate Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Structure Of Receivers (AREA)
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Description
[発明の相互参照]
本出願は、2004年6月2日に出願された「半導体デバイス製造ツール及びそれを用いた方法(SEMICONDUCTORDEVICE MANUFACTURINGTOOL ANDMETHOD FORUSING THESAME)」というタイトルの米国特許仮出願番号60/576、902(名簿番号8840/L)及び2004年7月12日に出願された「電子デバイス製造ツール及びそれを用いた方法(ELECTRONICDEVICE MANUFACTURINGTOOL ANDMETHOD FORUSING THESAME)」というタイトルの米国特許仮出願番号60/587、109(名簿番号8840/L2)に対して優先権を主張する。これらの仮出願は、その全体を参照として本明細書に組み入れる。
[発明の背景]
図1は、本発明のいくつかの実施形態に係る第1の例示的なマルチピース電子デバイス製造チャンバの平面図である。図1を参照して、該マルチピース電子デバイス製造チャンバ101は、電子デバイス製造中に、基板を輸送する移送チャンバである。該移送チャンバは、電子デバイス製造中に、1つ以上の処理チャンバ及び/又はロードロック103に結合されている。該移送チャンバは、電子デバイスの製造中に、該処理チャンバ及び/又はロードロック103の間で基板107を輸送するエンドエフェクタ105を含んでもよい。基板107は、例えば、ガラスプレート、ポリマー基板、半導体ウェハ等を含んでもよい。
更に、マルチピース電子デバイス製造チャンバ101の各ピース109〜113は、従来のマシニングセンタ又はショップで製造してもよい。そのため、マルチピース電子デバイス製造チャンバ101の製造者は、複数の従来のマシニングセンタ又はショップのうちの1つ以上を選択して、マルチピース電子デバイス製造チャンバ101の各ピース109〜113を製造することができる。複数のマシニングセンタ又はショップの間の競争は、マルチピース電子デバイス製造チャンバ101の製造者がより良い価格を得るのを可能にする。対照的に、マルチピース電子デバイス製造チャンバ101と同様のより大きな基板を収容できる寸法を有する1ピース電子デバイス製造チャンバを製造するマシニングセンタ又はショップの数は限定される。マシニングセンタ又はショップのこの限定された数は、縮小された競争をもたらす。縮小された競争により、該製造者は、マルチピース半導体製造チャンバ101に対してよりも、このような1ピースチャンバの製造に対してより多く支払う可能性がある。更に、このような1ピースチャンバは、地上輸送規制及び/又は航空輸送規制に従わないため、このような1ピースチャンバの製造者は、警察による護衛、「特大荷物」標識等の特別な便宜を得て、該デバイスを輸送する必要がある可能性がある。マルチピース電子デバイス製造チャンバ101は、このような便宜は必要ない。
図7は、本発明に係る電子デバイス製造チャンバ支持体701の等角図である。図7を参照して、電子デバイス製造チャンバ支持体701は、ベースフレーム703を含む。ベースフレーム703の1つ以上の部分は、(例えば、床アンカー704を介して固定して)床に取付けてもよい。
Claims (15)
- 1つ以上のスライド機構を有する電子デバイス製造チャンバ支持体と、
前記1つ以上のスライド機構に結合された電子デバイス製造チャンバと、
を備え、
前記1つ以上のスライド機構のそれぞれが、前記電子デバイス製造チャンバの膨張に適応し、かつ前記電子デバイス製造チャンバが、前記電子デバイス製造チャンバ支持体の位置からずれることを防ぐスライドベアリングとエラストママウントとを含む装置。 - 前記1つ以上のスライド機構は、圧縮により、電子デバイス製造チャンバの膨張に適応する、請求項1に記載の装置。
- 電子デバイス製造チャンバを支持する装置であって、
1つ以上の支持部材と、
前記電子デバイス製造チャンバに結合し、電子デバイス製造チャンバの膨張に適応し、それにより、前記電子デバイス製造チャンバが、ベースフレーム上の位置からずれるのを防ぐように適合されたスライドベアリングとエラストママウントとをそれぞれに含む1つ以上のスライド機構と、
を含むベースフレームを備える、装置。 - 前記1つ以上のスライド機構は、更に、電子デバイス製造チャンバの膨張に応答して、圧縮するように適合されている、請求項3に記載の装置。
- 前記スライドベアリングは軸とスリップディスクとを備え、該軸はスリップディスクに取り付けられている請求項1に記載の装置。
- 前記スリップディスクは低摩擦フルオロポリマー樹脂で被覆された下部及び側部を有する請求項5に記載の装置。
- 前記スライドベアリングは鋼鉄を含む請求項1に記載の装置。
- 前記電子デバイス製造チャンバ支持体は、1つ以上のスライド機構の一つを受けるように適合された1つ以上の底部を備える請求項1に記載の装置。
- 前記エラストママウントは対の取付プレートと該取付プレートの間に挟まれた柔軟な材料を含む請求項1に記載の装置。
- 前記柔軟な材料が加硫処理弾性ゴムか一又は複数の金属ばねのいずれかを含む請求項9に記載の装置。
- 前記スライドベアリングは軸とスリップディスクとを備え、該軸はスリップディスクに取り付けられている請求項3に記載の装置。
- 前記スリップディスクは低摩擦フルオロポリマー樹脂で被覆された下部及び側部を有する請求項11に記載の装置。
- 前記スライドベアリングは鋼鉄を含む請求項3に記載の装置。
- 前記1つ以上の支持部材は、1つ以上のスライド機構の一つを受けるように適合された1つ以上の底部をそれぞれ備える請求項3に記載の装置。
- 前記エラストママウントは対の取付プレートと該取付プレートの間に挟まれた柔軟な材料を含む請求項3に記載の装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57690204P | 2004-06-02 | 2004-06-02 | |
US60/576,902 | 2004-06-02 | ||
US58710904P | 2004-07-12 | 2004-07-12 | |
US60/587,109 | 2004-07-12 |
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JP2005163072A Division JP4771748B2 (ja) | 2004-06-02 | 2005-06-02 | 電子デバイス製造チャンバ及びその形成方法 |
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JP2009212532A JP2009212532A (ja) | 2009-09-17 |
JP5252451B2 true JP5252451B2 (ja) | 2013-07-31 |
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JP2005163072A Active JP4771748B2 (ja) | 2004-06-02 | 2005-06-02 | 電子デバイス製造チャンバ及びその形成方法 |
JP2006197034A Pending JP2006319363A (ja) | 2004-06-02 | 2006-07-19 | 電子デバイス製造チャンバ及びその形成方法本出願は、2004年6月2日に出願された「半導体デバイス製造ツール及びそれを用いた方法(semiconductordevicemanufacturingtoolandmethodforusingthesame)」というタイトルの米国特許仮出願番号60/576、902(名簿番号8840/l)及び2004年7月12日に出願された「電子デバイス製造ツール及びそれを用いた方法(electronicdevicemanufacturingtoolandmethodforusingthesame)」というタイトルの米国特許仮出願番号60/587、109(名簿番号8840/l2)に対して優先権を主張する。これらの仮出願は、その全体を参照として本明細書に組み入れる。 |
JP2007006783U Expired - Fee Related JP3137060U (ja) | 2004-06-02 | 2007-08-31 | 電子デバイス製造チャンバ及びその形成方法 |
JP2009144477A Active JP5252451B2 (ja) | 2004-06-02 | 2009-06-17 | 電子デバイス製造チャンバ及びその形成方法 |
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JP2005163072A Active JP4771748B2 (ja) | 2004-06-02 | 2005-06-02 | 電子デバイス製造チャンバ及びその形成方法 |
JP2006197034A Pending JP2006319363A (ja) | 2004-06-02 | 2006-07-19 | 電子デバイス製造チャンバ及びその形成方法本出願は、2004年6月2日に出願された「半導体デバイス製造ツール及びそれを用いた方法(semiconductordevicemanufacturingtoolandmethodforusingthesame)」というタイトルの米国特許仮出願番号60/576、902(名簿番号8840/l)及び2004年7月12日に出願された「電子デバイス製造ツール及びそれを用いた方法(electronicdevicemanufacturingtoolandmethodforusingthesame)」というタイトルの米国特許仮出願番号60/587、109(名簿番号8840/l2)に対して優先権を主張する。これらの仮出願は、その全体を参照として本明細書に組み入れる。 |
JP2007006783U Expired - Fee Related JP3137060U (ja) | 2004-06-02 | 2007-08-31 | 電子デバイス製造チャンバ及びその形成方法 |
Country Status (5)
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US (1) | US20060051507A1 (ja) |
JP (4) | JP4771748B2 (ja) |
KR (2) | KR100727499B1 (ja) |
CN (2) | CN101866828B (ja) |
TW (2) | TWI298895B (ja) |
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JP2009212532A (ja) | 2009-09-17 |
CN101866828A (zh) | 2010-10-20 |
KR100727499B1 (ko) | 2007-06-13 |
CN101866828B (zh) | 2013-03-20 |
JP2006114874A (ja) | 2006-04-27 |
JP2006319363A (ja) | 2006-11-24 |
JP3137060U (ja) | 2007-11-08 |
TW200618043A (en) | 2006-06-01 |
KR101108366B1 (ko) | 2012-01-25 |
JP4771748B2 (ja) | 2011-09-14 |
TWI298895B (en) | 2008-07-11 |
TWM290610U (en) | 2006-05-11 |
CN103199039A (zh) | 2013-07-10 |
CN103199039B (zh) | 2016-01-13 |
KR20070005537A (ko) | 2007-01-10 |
KR20060049499A (ko) | 2006-05-19 |
US20060051507A1 (en) | 2006-03-09 |
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