CN101684127A - 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂和树脂组合物 - Google Patents

咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂和树脂组合物 Download PDF

Info

Publication number
CN101684127A
CN101684127A CN200910148884A CN200910148884A CN101684127A CN 101684127 A CN101684127 A CN 101684127A CN 200910148884 A CN200910148884 A CN 200910148884A CN 200910148884 A CN200910148884 A CN 200910148884A CN 101684127 A CN101684127 A CN 101684127A
Authority
CN
China
Prior art keywords
resin
organic
monocarboxylic acid
imidazoles
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910148884A
Other languages
English (en)
Chinese (zh)
Inventor
熊谷正志
土田克之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of CN101684127A publication Critical patent/CN101684127A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200910148884A 2000-04-07 2001-02-06 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂和树脂组合物 Pending CN101684127A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP106274/2000 2000-04-07
JP2000106274 2000-04-07
JP226757/2000 2000-07-27
JP2000226757A JP3536014B2 (ja) 2000-04-07 2000-07-27 イミダゾール有機モノカルボン酸塩誘導体反応生成物及びその製造方法、並びにそれを用いる表面処理剤、樹脂添加剤および樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN01800142A Division CN1362961A (zh) 2000-04-07 2001-02-06 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂、树脂添加剂和树脂组合物

Publications (1)

Publication Number Publication Date
CN101684127A true CN101684127A (zh) 2010-03-31

Family

ID=26589668

Family Applications (2)

Application Number Title Priority Date Filing Date
CN01800142A Pending CN1362961A (zh) 2000-04-07 2001-02-06 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂、树脂添加剂和树脂组合物
CN200910148884A Pending CN101684127A (zh) 2000-04-07 2001-02-06 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂和树脂组合物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN01800142A Pending CN1362961A (zh) 2000-04-07 2001-02-06 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂、树脂添加剂和树脂组合物

Country Status (8)

Country Link
US (1) US6710181B2 (ja)
EP (1) EP1277757B1 (ja)
JP (1) JP3536014B2 (ja)
KR (1) KR100626493B1 (ja)
CN (2) CN1362961A (ja)
DE (1) DE60101910T2 (ja)
TW (1) TWI300779B (ja)
WO (1) WO2001077119A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105264013A (zh) * 2013-06-03 2016-01-20 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
CN110234718A (zh) * 2016-11-30 2019-09-13 莫门蒂夫性能材料股份有限公司 具有无机金属氧化物的耐磨涂层组合物

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003231734A (ja) * 2001-12-06 2003-08-19 Nikko Materials Co Ltd 有機カルボン酸塩組成物及びその製造方法並びにエポキシ樹脂用添加剤
JP4260418B2 (ja) 2001-12-07 2009-04-30 日鉱金属株式会社 塩基性シランカップリング剤有機カルボン酸塩組成物、その製造方法、並びにそれを含むエポキシ樹脂組成物
EP1538237B1 (en) * 2002-09-10 2009-09-30 Nippon Mining & Metals Co., Ltd. Method for metal plating and pre-treating agent
EP1679391A4 (en) * 2003-09-29 2009-11-25 Toray Industries TITANIUM OR TITANIUM ALLOY, COMPOSITION OF ADHESION RESIN, PREIMPREGNE AND COMPOSITE MATERIAL
US20070123681A1 (en) * 2003-10-10 2007-05-31 Nikko Materials Co., Ltd. Resin composition
JP4711415B2 (ja) * 2004-01-29 2011-06-29 Ｊｘ日鉱日石金属株式会社 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
JP5076392B2 (ja) * 2006-08-02 2012-11-21 旭硝子株式会社 硬化性組成物
JP5525699B2 (ja) * 2008-05-27 2014-06-18 株式会社Ｋｒｉ 高分子イオン性化合物
CN102618164A (zh) * 2010-08-03 2012-08-01 东莞市仁吉电子材料有限公司 印刷电路板基板中，增加导电体与非导电高分子介电层之间结合力的方法
US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
US8900491B2 (en) 2011-05-06 2014-12-02 International Business Machines Corporation Flame retardant filler
CA2808929C (en) 2011-06-22 2021-06-22 Dentsply International Inc. Polymerizable antibacterial/antimicrobial resins and use in dental compositions
US9186641B2 (en) 2011-08-05 2015-11-17 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
WO2017087925A1 (en) 2015-11-20 2017-05-26 Dentsply Sirona Inc. Orthodontic cement compositions and methods of use thereof
GB2561137B (en) * 2016-01-27 2019-08-07 Advanced Tech Inc Copper or copper alloy article comprising surface-modifed polyester-based resin and manufacturing method
JP6454858B2 (ja) * 2016-06-15 2019-01-23 株式会社新技術研究所 ポリエステル系樹脂を含む銅合金物品およびその製造方法
KR102084119B1 (ko) * 2017-12-01 2020-03-03 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
CN113164329B (zh) 2018-11-20 2023-10-03 登士柏希罗纳有限公司 用于牙科组合物的抗菌纳米凝胶和水解稳定的抗菌纳米凝胶的组合物和方法
CN114341401B (zh) * 2019-09-06 2024-04-05 四国化成工业株式会社 金属的表面处理液及其浓缩液、金属的表面处理液套组和表面处理方法以及印刷配线板的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5135711A (en) 1974-09-24 1976-03-26 Komatsu Shoichi Taisui hatsuyuseiojusurukami narabini sonoseizoho
JPS581853B2 (ja) 1977-06-17 1983-01-13 松下電器産業株式会社 選局装置
JPS587077A (ja) 1981-07-02 1983-01-14 東急建設株式会社 サツシの取付方法
JPH0768256B2 (ja) 1991-08-01 1995-07-26 株式会社ジャパンエナジー 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JPH09114096A (ja) 1995-10-16 1997-05-02 Toyo Ink Mfg Co Ltd ソルダーレジスト組成物
JPH10120690A (ja) 1996-10-23 1998-05-12 Japan Energy Corp 新規第四級イミダゾリウム塩誘導体及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105264013A (zh) * 2013-06-03 2016-01-20 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
US9905328B2 (en) 2013-06-03 2018-02-27 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
CN105264013B (zh) * 2013-06-03 2018-07-03 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
CN110234718A (zh) * 2016-11-30 2019-09-13 莫门蒂夫性能材料股份有限公司 具有无机金属氧化物的耐磨涂层组合物

Also Published As

Publication number Publication date
DE60101910T2 (de) 2004-11-18
JP2001348393A (ja) 2001-12-18
KR20020022643A (ko) 2002-03-27
WO2001077119A1 (fr) 2001-10-18
TWI300779B (ja) 2008-09-11
US20030088108A1 (en) 2003-05-08
CN1362961A (zh) 2002-08-07
DE60101910D1 (de) 2004-03-04
EP1277757A1 (en) 2003-01-22
EP1277757A4 (en) 2003-04-16
EP1277757B1 (en) 2004-01-28
JP3536014B2 (ja) 2004-06-07
US6710181B2 (en) 2004-03-23
KR100626493B1 (ko) 2006-09-20

Similar Documents

Publication Publication Date Title
CN101684127A (zh) 咪唑有机一元羧酸盐衍生物反应产物及其制备方法、以及使用它的表面处理剂和树脂组合物
EP0526847B1 (en) Novel imidazole-silane compounds, process for producing the same, and metal surface finishing agent containing the same
CN105358563B (zh) 唑硅烷化合物、表面处理液、表面处理方法及其利用
CN111108111B (zh) 四唑硅烷化合物、该化合物的合成方法及其利用
EP3608327A1 (en) Triazole silane compound, method for synthesizing said compound and use thereof
JP6445946B2 (ja) 銅箔用の表面処理液およびその利用
JP3555845B2 (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
WO2010097261A1 (en) Silane coupling agents for printed circuit boards
JP2000297094A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP2004010487A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP3436634B2 (ja) 表面処理剤および樹脂添加剤
JPH09295988A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JPH0539295A (ja) 金属表面処理剤
JP3202827B2 (ja) 新規アゾール系シラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JPH1192482A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JP3555802B2 (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
CN105695977A (zh) 使用高耐热有机硅氧烷成膜材料对电解铜箔进行表面处理的方法
JP5855363B2 (ja) 有機ケイ素化合物および該有機ケイ素化合物を使用する無電解めっきの前処理方法
JPH06177535A (ja) 金属表面処理剤
JPH10237079A (ja) 表面処理剤または樹脂への添加剤
JPH1192548A (ja) いおう含有有機ケイ素化合物の混合物からなる組成物、それを含む表面処理剤、および樹脂添加組成物
JP3202890B2 (ja) 新規トリカルボニル基含有ケイ素化合物およびそれを有効成分とする金属表面処理剤
JP5638472B2 (ja) 無電解めっきの前処理方法
JPH09295991A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤
JPH09295990A (ja) 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および添加剤

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20100331