CN101517700B - 用于制造可转移半导体结构、器件和器件构件的松脱策略 - Google Patents

用于制造可转移半导体结构、器件和器件构件的松脱策略 Download PDF

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CN101517700B
CN101517700B CN200780034881.7A CN200780034881A CN101517700B CN 101517700 B CN101517700 B CN 101517700B CN 200780034881 A CN200780034881 A CN 200780034881A CN 101517700 B CN101517700 B CN 101517700B
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substrate
layers
multilayer structure
functional
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CN101517700A (zh
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J·A·罗杰斯
R·G·诺奥
M·梅尔特
高興助
J·尹
E·梅纳德
A·J·巴卡
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University of Illinois System
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    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/16Photovoltaic cells having only PN heterojunction potential barriers
    • H10F10/163Photovoltaic cells having only PN heterojunction potential barriers comprising only Group III-V materials, e.g. GaAs/AlGaAs or InP/GaInAs photovoltaic cells
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B81C1/0046Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
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    • H10D62/815Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
    • H10D62/8161Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
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    • H10F77/1248Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
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    • H10P72/74Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
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CN200780034881.7A 2006-09-20 2007-09-20 用于制造可转移半导体结构、器件和器件构件的松脱策略 Active CN101517700B (zh)

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US82635406P 2006-09-20 2006-09-20
US60/826,354 2006-09-20
US94465307P 2007-06-18 2007-06-18
US60/944,653 2007-06-18
PCT/US2007/079070 WO2008036837A2 (en) 2006-09-20 2007-09-20 Release strategies for making transferable semiconductor structures, devices and device components

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US (4) US7932123B2 (https=)
EP (1) EP2064734B1 (https=)
JP (3) JP5319533B2 (https=)
KR (3) KR101430587B1 (https=)
CN (2) CN101517700B (https=)
MY (1) MY149190A (https=)
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WO (1) WO2008036837A2 (https=)

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US20080108171A1 (en) 2008-05-08
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US9349900B2 (en) 2016-05-24
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