CN101312185B - 发光装置及其制造方法 - Google Patents

发光装置及其制造方法 Download PDF

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Publication number
CN101312185B
CN101312185B CN2008101314744A CN200810131474A CN101312185B CN 101312185 B CN101312185 B CN 101312185B CN 2008101314744 A CN2008101314744 A CN 2008101314744A CN 200810131474 A CN200810131474 A CN 200810131474A CN 101312185 B CN101312185 B CN 101312185B
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light
emitting device
emitting
mode
row
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Chinese (zh)
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CN101312185A (zh
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幡俊雄
小西正宏
英贺谷诚
森本泰司
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Xiamen Sanan Optoelectronics Technology Co Ltd
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Sharp Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/10—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances sulfides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

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CN2008101314744A 2007-03-23 2008-03-21 发光装置及其制造方法 Active CN101312185B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-077313 2007-03-23
JP2007077313A JP5089212B2 (ja) 2007-03-23 2007-03-23 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法
JP2007077313 2007-03-23

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CN2012100074754A Division CN102569280A (zh) 2007-03-23 2008-03-21 发光装置及其制造方法

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CN101312185A CN101312185A (zh) 2008-11-26
CN101312185B true CN101312185B (zh) 2012-02-29

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CN2012100074754A Pending CN102569280A (zh) 2007-03-23 2008-03-21 发光装置及其制造方法

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US (1) US7872418B2 (enExample)
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JP5354191B2 (ja) * 2009-06-30 2013-11-27 東芝ライテック株式会社 電球形ランプおよび照明器具
JP5379615B2 (ja) * 2009-09-09 2013-12-25 パナソニック株式会社 照明装置
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
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