JP2008235824A5 - - Google Patents
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- Publication number
- JP2008235824A5 JP2008235824A5 JP2007077313A JP2007077313A JP2008235824A5 JP 2008235824 A5 JP2008235824 A5 JP 2008235824A5 JP 2007077313 A JP2007077313 A JP 2007077313A JP 2007077313 A JP2007077313 A JP 2007077313A JP 2008235824 A5 JP2008235824 A5 JP 2008235824A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- light
- sealing body
- body layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 133
- 229910052751 metal Inorganic materials 0.000 claims description 100
- 239000002184 metal Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 67
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 36
- 239000008393 encapsulating agent Substances 0.000 claims description 33
- 238000000926 separation method Methods 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 24
- 238000007747 plating Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 18
- 239000003566 sealing material Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- -1 gallium nitride compound Chemical class 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 229910052693 Europium Inorganic materials 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007077313A JP5089212B2 (ja) | 2007-03-23 | 2007-03-23 | 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 |
| US12/051,602 US7872418B2 (en) | 2007-03-23 | 2008-03-19 | Light emitting device and method for manufacturing the same |
| CN2012100074754A CN102569280A (zh) | 2007-03-23 | 2008-03-21 | 发光装置及其制造方法 |
| CN2008101314744A CN101312185B (zh) | 2007-03-23 | 2008-03-21 | 发光装置及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007077313A JP5089212B2 (ja) | 2007-03-23 | 2007-03-23 | 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008235824A JP2008235824A (ja) | 2008-10-02 |
| JP2008235824A5 true JP2008235824A5 (enExample) | 2010-05-06 |
| JP5089212B2 JP5089212B2 (ja) | 2012-12-05 |
Family
ID=39773983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007077313A Active JP5089212B2 (ja) | 2007-03-23 | 2007-03-23 | 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7872418B2 (enExample) |
| JP (1) | JP5089212B2 (enExample) |
| CN (2) | CN101312185B (enExample) |
Families Citing this family (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
| TW201022576A (en) * | 2008-12-11 | 2010-06-16 | Advanced Connectek Inc | Light emitting diode lamp source module |
| DE102009008738A1 (de) | 2009-02-12 | 2010-08-19 | Osram Opto Semiconductors Gmbh | Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung |
| JP5680278B2 (ja) | 2009-02-13 | 2015-03-04 | シャープ株式会社 | 発光装置 |
| JP5330889B2 (ja) * | 2009-04-14 | 2013-10-30 | 電気化学工業株式会社 | 照明用ｌｅｄモジュール |
| US8337030B2 (en) * | 2009-05-13 | 2012-12-25 | Cree, Inc. | Solid state lighting devices having remote luminescent material-containing element, and lighting methods |
| US8922106B2 (en) * | 2009-06-02 | 2014-12-30 | Bridgelux, Inc. | Light source with optics to produce a spherical emission pattern |
| JP2011009298A (ja) | 2009-06-23 | 2011-01-13 | Citizen Electronics Co Ltd | 発光ダイオード光源装置 |
| JP5354191B2 (ja) * | 2009-06-30 | 2013-11-27 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
| JP5379615B2 (ja) * | 2009-09-09 | 2013-12-25 | パナソニック株式会社 | 照明装置 |
| JP5623062B2 (ja) | 2009-11-13 | 2014-11-12 | シャープ株式会社 | 発光装置およびその製造方法 |
| KR20110086648A (ko) * | 2010-01-15 | 2011-07-29 | 엘지이노텍 주식회사 | 발광 모듈, 백라이트 유닛 및 표시 장치 |
| JP2011151268A (ja) | 2010-01-22 | 2011-08-04 | Sharp Corp | 発光装置 |
| JP2011204897A (ja) * | 2010-03-25 | 2011-10-13 | Toshiba Lighting & Technology Corp | 発光モジュール |
| KR101192181B1 (ko) * | 2010-03-31 | 2012-10-17 | (주)포인트엔지니어링 | 광 소자 디바이스 및 그 제조 방법 |
| JP2011222858A (ja) * | 2010-04-13 | 2011-11-04 | Cirocomm Technology Corp | 発光ダイオード（ｌｅｄ）電球のライト芯材の製造方法およびその構造 |
| CN101846256A (zh) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led光源 |
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| USD645418S1 (en) * | 2010-05-14 | 2011-09-20 | Makoto Morikawa | Light source of light emitting diode |
| USD657757S1 (en) * | 2010-05-14 | 2012-04-17 | Panasonic Corporation | Light source of light emitting diode |
| JP2012004519A (ja) * | 2010-05-17 | 2012-01-05 | Sharp Corp | 発光装置および照明装置 |
| JP2011249573A (ja) * | 2010-05-27 | 2011-12-08 | 三菱電機照明株式会社 | 発光装置及び波長変換シート及び照明装置 |
| USD642998S1 (en) * | 2010-06-15 | 2011-08-09 | Advanced Optoelectronic Technology, Inc. | LED module |
| USD654444S1 (en) * | 2010-06-15 | 2012-02-21 | Advanced Optoelectronic Technology, Inc. | LED module |
| DE102010026344A1 (de) * | 2010-07-07 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Leuchtdiode |
| CN102483201B (zh) | 2010-07-20 | 2015-08-19 | 松下电器产业株式会社 | 灯泡型灯 |
| US20140001494A1 (en) * | 2010-08-05 | 2014-01-02 | Advanced Optoelectronic Technology, Inc. | Light emitting diode |
| CN102375314B (zh) * | 2010-08-09 | 2013-12-04 | 台达电子工业股份有限公司 | 光源系统及其适用的投影机 |
| CN104091815A (zh) * | 2010-10-12 | 2014-10-08 | 晶元光电股份有限公司 | 发光元件 |
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| USD707192S1 (en) | 2010-11-18 | 2014-06-17 | Cree, Inc. | Light emitting device |
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| JP6403390B2 (ja) * | 2014-01-24 | 2018-10-10 | 三菱電機株式会社 | 照明ランプの製造方法 |
| JP2014099650A (ja) * | 2014-02-03 | 2014-05-29 | Sharp Corp | 発光装置および発光装置の製造方法 |
| JP2014140076A (ja) * | 2014-04-17 | 2014-07-31 | Sharp Corp | 発光装置 |
| CN105431953B (zh) * | 2014-06-05 | 2018-03-16 | 上海富迪照明电器有限公司 | 基于固态荧光材料的嵌入式白光led封装结构及其制作方法 |
| JP5827387B2 (ja) * | 2014-08-22 | 2015-12-02 | シャープ株式会社 | 発光装置 |
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| WO2016143261A1 (ja) * | 2015-03-11 | 2016-09-15 | パナソニックＩｐマネジメント株式会社 | 発光装置、発光装置の製造方法 |
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| US11212901B2 (en) * | 2019-01-29 | 2021-12-28 | Xiamen Eco Lighting Co. Ltd. | Light apparatus |
| JP7449271B2 (ja) * | 2019-02-21 | 2024-03-13 | デンカ株式会社 | 蛍光体基板、発光基板、照明装置、蛍光体基板の製造方法及び発光基板の製造方法 |
| JP7620229B2 (ja) * | 2022-04-28 | 2025-01-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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| SG155768A1 (en) | 2002-03-22 | 2009-10-29 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
| JP4280038B2 (ja) | 2002-08-05 | 2009-06-17 | 日亜化学工業株式会社 | 発光装置 |
| TW200414572A (en) * | 2002-11-07 | 2004-08-01 | Matsushita Electric Industrial Co Ltd | LED lamp |
| KR100691143B1 (ko) * | 2003-04-30 | 2007-03-09 | 삼성전기주식회사 | 다층 형광층을 가진 발광 다이오드 소자 |
| US20050225222A1 (en) * | 2004-04-09 | 2005-10-13 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
| JP2006135225A (ja) * | 2004-11-09 | 2006-05-25 | Toshiba Corp | 発光装置 |
| JP2006295084A (ja) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | 発光ダイオードのパッケージ構造 |
| JP4692059B2 (ja) * | 2005-04-25 | 2011-06-01 | パナソニック電工株式会社 | 発光装置の製造方法 |
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2007
- 2007-03-23 JP JP2007077313A patent/JP5089212B2/ja active Active
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2008
- 2008-03-19 US US12/051,602 patent/US7872418B2/en active Active
- 2008-03-21 CN CN2008101314744A patent/CN101312185B/zh active Active
- 2008-03-21 CN CN2012100074754A patent/CN102569280A/zh active Pending
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