CN101257973B - 固化催化剂、组合物、电子器件和相关方法 - Google Patents
固化催化剂、组合物、电子器件和相关方法 Download PDFInfo
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- CN101257973B CN101257973B CN200680022834.6A CN200680022834A CN101257973B CN 101257973 B CN101257973 B CN 101257973B CN 200680022834 A CN200680022834 A CN 200680022834A CN 101257973 B CN101257973 B CN 101257973B
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
- B01J31/0235—Nitrogen containing compounds
- B01J31/0237—Amines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
- B01J31/0235—Nitrogen containing compounds
- B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
- B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
- B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
- Catalysts (AREA)
- Polymerization Catalysts (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/167,847 | 2005-06-23 | ||
| US11/167,847 US8048819B2 (en) | 2005-06-23 | 2005-06-23 | Cure catalyst, composition, electronic device and associated method |
| PCT/US2006/022587 WO2007001803A2 (en) | 2005-06-23 | 2006-06-09 | Cure catalyst, composition, electronic device and associated method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102704518A Division CN102786665A (zh) | 2005-06-23 | 2006-06-09 | 固化催化剂、组合物、电子器件和相关方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101257973A CN101257973A (zh) | 2008-09-03 |
| CN101257973B true CN101257973B (zh) | 2014-07-30 |
Family
ID=37074187
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200680022834.6A Expired - Fee Related CN101257973B (zh) | 2005-06-23 | 2006-06-09 | 固化催化剂、组合物、电子器件和相关方法 |
| CN2012102704518A Pending CN102786665A (zh) | 2005-06-23 | 2006-06-09 | 固化催化剂、组合物、电子器件和相关方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102704518A Pending CN102786665A (zh) | 2005-06-23 | 2006-06-09 | 固化催化剂、组合物、电子器件和相关方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8048819B2 (enExample) |
| EP (2) | EP2283922A3 (enExample) |
| JP (1) | JP2008544067A (enExample) |
| KR (1) | KR101391784B1 (enExample) |
| CN (2) | CN101257973B (enExample) |
| BR (1) | BRPI0612009A2 (enExample) |
| RU (1) | RU2008102366A (enExample) |
| WO (1) | WO2007001803A2 (enExample) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100017712A (ko) * | 2007-05-09 | 2010-02-16 | 다우 글로벌 테크놀로지스 인크. | 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법 |
| MX2007012559A (es) * | 2007-05-23 | 2008-11-24 | Mi Llc | Uso de emulsiones de epoxi directas para estabilizacion en la cava de pozos. |
| CA2606537C (en) | 2007-05-23 | 2010-12-21 | M-I Llc | Use of invert epoxy emulsions for wellbore stabilization |
| EP2152773A1 (en) * | 2007-05-29 | 2010-02-17 | Dow Global Technologies Inc. | Isocyanate-epoxy formulations for improved cure control |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| CN101772553A (zh) | 2007-08-02 | 2010-07-07 | 陶氏环球技术公司 | 热固性阻尼材料 |
| TW200922959A (en) * | 2007-10-26 | 2009-06-01 | Dow Global Technologies Inc | Epoxy resin composition containing isocyanurates for use in electrical laminates |
| ATE509053T1 (de) * | 2007-11-29 | 2011-05-15 | Dow Global Technologies Llc | Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze |
| WO2009070458A1 (en) * | 2007-11-29 | 2009-06-04 | Dow Global Technologies Inc. | Microwave heatable monovinyl aromatic polymers |
| KR101571184B1 (ko) * | 2008-01-08 | 2015-11-23 | 다우 글로벌 테크놀로지스 엘엘씨 | 복합재 제품을 위한 높은 Tg의 에폭시 시스템 |
| US7629203B2 (en) * | 2008-03-31 | 2009-12-08 | Intel Corporation | Thermal interface material for combined reflow |
| KR20160007668A (ko) | 2008-04-14 | 2016-01-20 | 블루 큐브 아이피 엘엘씨 | 분말 피복 분야에 유용한 에폭시-이미다졸 촉매 |
| WO2010025165A1 (en) * | 2008-08-28 | 2010-03-04 | Dow Global Technologies Inc. | Phosphorus-containing compounds and polymeric compositions comprising same |
| CN102307924B (zh) | 2008-12-16 | 2013-06-05 | 陶氏环球技术有限责任公司 | 用于制造电层压材料的均匀二马来酰亚胺-三嗪-环氧树脂组合物 |
| CN102272252B (zh) * | 2009-01-06 | 2014-05-28 | 陶氏环球技术有限责任公司 | 环氧树脂的金属稳定剂和分散方法 |
| US20120010329A1 (en) | 2009-02-24 | 2012-01-12 | Hunter Gary A | Curable epoxy resin compositions and cured products therefrom |
| KR20120036887A (ko) | 2009-05-27 | 2012-04-18 | 다우 글로벌 테크놀로지스 엘엘씨 | 중합체성 글리시딜 에테르 반응성 희석제 |
| WO2011005420A1 (en) | 2009-06-22 | 2011-01-13 | Dow Global Technologies Inc. | Hardener composition for epoxy resins |
| KR20120099416A (ko) | 2009-09-22 | 2012-09-10 | 다우 글로벌 테크놀로지스 엘엘씨 | 에피설파이드 수지의 제조 공정 |
| WO2011037895A1 (en) | 2009-09-25 | 2011-03-31 | Dow Global Technologies Llc | Curable epoxy resin compositions and composites made therefrom |
| CN102549069B (zh) | 2009-09-30 | 2015-06-10 | 陶氏环球技术有限责任公司 | 环氧树脂组合物 |
| JP5527600B2 (ja) * | 2009-10-07 | 2014-06-18 | 日立化成株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品装置 |
| KR20120097511A (ko) | 2009-11-12 | 2012-09-04 | 다우 글로벌 테크놀로지스 엘엘씨 | 폴리옥사졸리돈 수지 |
| KR20120101096A (ko) | 2009-12-02 | 2012-09-12 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| US8937114B2 (en) | 2009-12-02 | 2015-01-20 | Dow Global Technologies Llc | Coating compositions |
| CN102666638B (zh) | 2009-12-02 | 2015-01-14 | 陶氏环球技术有限责任公司 | 复合材料组合物 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20060293172A1 (en) | 2006-12-28 |
| BRPI0612009A2 (pt) | 2010-10-13 |
| KR101391784B1 (ko) | 2014-05-07 |
| WO2007001803A2 (en) | 2007-01-04 |
| EP2283922A2 (en) | 2011-02-16 |
| US8048819B2 (en) | 2011-11-01 |
| KR20080034438A (ko) | 2008-04-21 |
| JP2008544067A (ja) | 2008-12-04 |
| WO2007001803A3 (en) | 2007-03-15 |
| EP1926554A2 (en) | 2008-06-04 |
| RU2008102366A (ru) | 2009-07-27 |
| CN102786665A (zh) | 2012-11-21 |
| CN101257973A (zh) | 2008-09-03 |
| EP2283922A3 (en) | 2013-07-03 |
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