ATE509053T1 - Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze - Google Patents

Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze

Info

Publication number
ATE509053T1
ATE509053T1 AT08854038T AT08854038T ATE509053T1 AT E509053 T1 ATE509053 T1 AT E509053T1 AT 08854038 T AT08854038 T AT 08854038T AT 08854038 T AT08854038 T AT 08854038T AT E509053 T1 ATE509053 T1 AT E509053T1
Authority
AT
Austria
Prior art keywords
dicyanadiamide
dimethylformamide
heat
epoxy resins
hardening agent
Prior art date
Application number
AT08854038T
Other languages
English (en)
Inventor
Joseph Gan
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Application granted granted Critical
Publication of ATE509053T1 publication Critical patent/ATE509053T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT08854038T 2007-11-29 2008-11-20 Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze ATE509053T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99117507P 2007-11-29 2007-11-29
PCT/US2008/084161 WO2009070488A1 (en) 2007-11-29 2008-11-20 Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins

Publications (1)

Publication Number Publication Date
ATE509053T1 true ATE509053T1 (de) 2011-05-15

Family

ID=40290743

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08854038T ATE509053T1 (de) 2007-11-29 2008-11-20 Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze

Country Status (8)

Country Link
US (1) US20100261837A1 (de)
EP (1) EP2217637B1 (de)
JP (1) JP2011505461A (de)
KR (1) KR101150311B1 (de)
CN (1) CN101925629B (de)
AT (1) ATE509053T1 (de)
TW (1) TWI452057B (de)
WO (1) WO2009070488A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110132646A1 (en) * 2009-06-12 2011-06-09 Icl-Ip America Inc. Flame retardant epoxy resin composition, prepreg and laminate thereof
WO2011011920A1 (en) * 2009-07-31 2011-02-03 Dow Global Technologies Inc. Amine-phenolic dual cure hardener blend for resin compositions
CN102858839B (zh) * 2010-04-23 2015-11-25 松下知识产权经营株式会社 环氧树脂组合物、预浸料、覆金属层叠板以及印制电路布线板
JP5866806B2 (ja) * 2010-05-31 2016-02-24 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板
WO2011152413A1 (ja) * 2010-05-31 2011-12-08 日立化成工業株式会社 プリプレグ、金属張積層板及び印刷配線板
JP5961923B2 (ja) * 2010-05-31 2016-08-03 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板
JP5909693B2 (ja) * 2010-11-24 2016-04-27 パナソニックＩｐマネジメント株式会社 高耐熱性エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
US9408296B2 (en) * 2010-12-28 2016-08-02 Mitsui Chemicals Tohcello, Inc. Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
RU2014110183A (ru) * 2011-08-18 2015-09-27 ДАУ ГЛОБАЛ ТЕКНОЛОДЖИЗ ЭлЭлСи Отверждаемые полимерные композиции
JP2013087253A (ja) * 2011-10-21 2013-05-13 Panasonic Corp エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
TWI513741B (zh) * 2011-12-27 2015-12-21 Nat Univ Chung Hsing 新穎磷系雙酚ａ型酚醛樹脂及其製造方法與應用
KR20160105779A (ko) * 2013-12-30 2016-09-07 블루 큐브 아이피 엘엘씨 저유전 상수를 가지는 무할로겐 에폭시 조성물
US9650306B2 (en) * 2014-04-17 2017-05-16 Gary David McKnight Compositions and methods comprising nitrification inhibitors containing a mixture of protic and aprotic solvent systems
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
CN106883377A (zh) * 2017-03-23 2017-06-23 苏州顶裕节能设备有限公司 一种利用生产tmpta废水制备的固化剂及其方法
TWI671355B (zh) * 2018-01-03 2019-09-11 Taiwan Union Technology Corporation 樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板、與印刷電路板
CN112724600A (zh) * 2020-12-28 2021-04-30 陕西生益科技有限公司 一种热固性树脂组合物、包含其的预浸料、层压板及印制电路板
CN118063741B (zh) * 2024-04-22 2024-07-09 广东粤港澳大湾区黄埔材料研究院 一种改性双氰胺固化剂及其制备方法和应用

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US403220A (en) * 1889-05-14 Ments
US2750395A (en) * 1954-01-05 1956-06-12 Union Carbide & Carbon Corp Diepoxides
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US5066735A (en) * 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
DE4010798A1 (de) * 1990-04-04 1991-10-10 Bodenseewerk Geraetetech Demodulatorbaustein und damit aufgebaute signalverarbeitungsschaltung
US5135993A (en) * 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
DE4111418A1 (de) * 1991-04-09 1992-10-15 Schering Ag Verfahren zur herstellung von faserverstaerkten traegermaterialien fuer den elektrosektor
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
US5670590A (en) * 1994-05-06 1997-09-23 Minnesota Mining And Manufacturing Company Energy polymerizable compositions, homopolymers and copolymers of oxazolines
GB9411367D0 (en) * 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US6613839B1 (en) * 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6153719A (en) * 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6054515A (en) * 1998-03-02 2000-04-25 Blount; David H. Flame retardant compounds and compositions
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
AU2089701A (en) * 1999-12-13 2001-06-18 Dow Chemical Company, The Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith
JP2001302768A (ja) * 2000-04-18 2001-10-31 Mitsubishi Gas Chem Co Inc ジシアンジアミド溶解剤
WO2002066485A2 (en) * 2001-02-15 2002-08-29 Pabu Services, Inc. Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
JP2003012765A (ja) * 2001-06-29 2003-01-15 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物
US6632860B1 (en) * 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
TW593526B (en) * 2001-09-20 2004-06-21 Wangsuen Su Jen Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
CN102653598B (zh) * 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
CN1989166B (zh) * 2004-11-30 2010-04-28 松下电工株式会社 预浸料用环氧树脂组合物、预浸料及多层印刷电路板
US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method

Also Published As

Publication number Publication date
US20100261837A1 (en) 2010-10-14
TW200930740A (en) 2009-07-16
TWI452057B (zh) 2014-09-11
KR20100100911A (ko) 2010-09-15
KR101150311B1 (ko) 2012-06-11
EP2217637B1 (de) 2011-05-11
WO2009070488A1 (en) 2009-06-04
CN101925629A (zh) 2010-12-22
JP2011505461A (ja) 2011-02-24
EP2217637A1 (de) 2010-08-18
CN101925629B (zh) 2012-11-28
HK1151810A1 (en) 2012-02-10

Similar Documents

Publication Publication Date Title
ATE509053T1 (de) Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze
DK2307359T3 (da) Blandinger indeholdende epoxyharpiks og blandinger af aminer og guanidin-derivater
ATE458764T1 (de) Modifizierte hydrocarbylphenol-aldehydharze als klebrigmacher und diese enthaltende kautschukzusammensetzungen
RU2017103513A (ru) Амин для низкоэмиссионных композиций эпоксидных смол
WO2014037222A3 (de) Härtbare zusammensetzungen auf der basis von epoxidharzen ohne benzylalkohol
PL2307358T3 (pl) Mieszaniny amin z pochodnymi guanidyny
BR112014031322A2 (pt) endureceddor líquido para endurecimento de resinas de epóxido (i)
WO2009008509A1 (ja) 無機粒子を含有した液状エポキシ樹脂形成用製剤
BR112017016180A2 (pt) composição de resina epóxi retardante de chamas, pré-impregnado e placa laminada que usa o mesmo
ATE508154T1 (de) Elektronische verpackung
PH12020550234A1 (en) Epoxy-oxetane compound, method for synthesizing same, and use of said compound
DK1996641T3 (da) Anvendelse af en substitueret guanidinforbindelse som en hærder for epoxyharpikser
DE602008001878D1 (de) Wärmehärtbare zusammensetzung
WO2008152011A9 (de) Katalysator für die härtung von epoxiden
MY196654A (en) Epoxy Resin Composition and Electronic Component Device
WO2011054945A3 (de) Verwendung von guanidin-derivaten als härtungsbeschleuniger für epoxidharze
DE50201090D1 (de) Vergussmasse auf der Basis duroplastischer Epoxidharze
TW200732366A (en) Thermosetting resin composition
WO2012093860A3 (ko) 프리프레그 및 이를 포함하는 프린트 배선판
TW200732362A (en) Phenol resin composition, cured article, resin composition for copper-clad laminate, copper-clad laminate, and novel phenol resin
MY158638A (en) 2-benzly-4-(3,4-dichlorophenyl)-5-methylimidazole compound
TW200704665A (en) Curable resin composition and process for producing bonded part obtained with the same
ATE548405T1 (de) Aktivator für epoxidharzzusammensetzungen
TH111539A (th) สารผสมตามสูตรไร้ไดเมธิลฟอร์มามีดที่ใช้ไดไซแอนไดอะมีดเป็นตัวกระทำการบ่มสำหรับเทอร์โมเซ็ตทิงอีพอกซีเรซิน
TW200732412A (en) Non-halogen composition having phosphor-containing epoxy resin

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 2217637

Country of ref document: EP